High voltage mos device pin forming apparatus and method

Abstract

This invention discloses a high-voltage MOS device lead forming apparatus and method, including a cabinet, a feeding mechanism, an extrusion forming mechanism, a receiving mechanism, and a control unit. The top of the cabinet is set as an inclined plane; the feeding mechanism is located at the top of the inclined plane; the extrusion forming mechanism is located in the middle of the inclined plane; the receiving mechanism is located at the bottom of the inclined plane, and the receiving mechanism includes a rotating part, a clamping part, and a counting drive part. The clamping part is arranged around the outer surface of the rotating part, and the counting drive part is inserted and connected to the middle of the rotating part; the control unit is located on the side of the inclined plane, and the control unit is used to control the unloading of the feeding mechanism through photoelectric sensing signals. This invention, through the setting of the counting drive part, under the automatic counting setting of photoelectric sensing, can collect the corresponding number of finished products according to actual needs, thereby achieving quantitative counting and collection, avoiding errors from manual counting, and ensuring the accuracy of counting and collection.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing equipment, and in particular to a high-voltage MOS device pin forming apparatus and method. Background Technology

[0002] In modern electronic devices, high-voltage MOSFETs are widely used in power management, high-frequency switching, and inverters due to their superior switching characteristics and high voltage withstand capability. With continuous technological advancements, higher demands are being placed on the performance and reliability of high-voltage MOSFETs. In their fabrication process, lead forming, as a critical step, directly affects the overall performance and lifespan of the device.

[0003] In the lead forming process of high-voltage MOS devices, a dedicated lead forming device is usually required. Existing lead forming devices have automatic feeding, automatic extrusion forming, and automatic collection functions. These devices achieve smooth flow of MOS devices by setting the feeding mechanism, extrusion forming mechanism, and collection mechanism on the center line of the same inclined plane and utilizing gravity: first, the MOS device is fed from the feeding mechanism, then it is formed by the extrusion forming mechanism, and finally it falls into the collection mechanism for collection under the action of gravity.

[0004] However, existing lead forming devices have certain shortcomings in the material receiving process. Specifically, existing equipment cannot automatically control the number of receiving boxes based on the actual quantity of materials received, instead relying on manual counting or program-controlled motor settings. The manual method not only wastes human resources but is also prone to errors, affecting the quality and accuracy of quantitative material receiving; while program control makes equipment operation and debugging extremely cumbersome. Therefore, this solution proposes a lead forming device and method for high-voltage MOS devices. Summary of the Invention

[0005] The purpose of this invention is to provide a high-voltage MOS device pin forming apparatus and method to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-voltage MOS device lead forming apparatus, comprising:

[0007] The cabinet has a sloping top and a discharge baffle at the top of the sloping top.

[0008] The feeding mechanism is located at the top of the inclined plane and above the unloading baffle. The feeding mechanism works with the unloading baffle to unload the MOS device to be formed.

[0009] An extrusion molding mechanism is disposed in the middle of the inclined plane and below the discharge baffle. The extrusion molding mechanism is used for the pin pressing and discharge guidance of the MOS device after it passes through the discharge baffle.

[0010] A material receiving mechanism is provided at the bottom of the inclined plane. The material receiving mechanism includes a rotating part, a clamping part, and a counting drive part. The clamping part is arranged around the outer surface of the rotating part, and the counting drive part is inserted and connected to the middle of the rotating part. The counting drive part is used to drive the rotating part to rotate by counting.

[0011] The control unit is located on the side of the inclined plane and uses photoelectric sensing signals to control the unloading of the feeding mechanism.

[0012] Preferably, one end of the bottom of the cabinet is provided with casters, the other end of the bottom of the cabinet is provided with support feet, and the unloading baffle is provided with an unloading port in the middle. The unloading mechanism is used to unload the MOS device to be formed through the unloading port.

[0013] Preferably, the feeding mechanism includes:

[0014] A placement frame is fixedly connected to the top of the inclined plane, and a push opening is provided at the bottom of the placement frame. The push opening, the discharge port, and the discharge guide of the extrusion molding mechanism are on the same center line.

[0015] A pressure rod is inserted into the middle of the placement frame. A pressure spring is provided between the middle of the pressure rod and the top of the inner wall of the placement frame. The pressure rod is pressed close to the top of the placement frame by the pressure spring.

[0016] Preferably, the feeding mechanism further includes:

[0017] A pusher cylinder is located at the top of the inclined plane and on one side of the bottom of the placement frame. The output end of the pusher cylinder is horizontally connected to the side of the push port.

[0018] A photoelectric sensor is disposed at the top of the inclined plane and below the discharge port. The photoelectric sensor is used to measure the photosensitive interval passing through the discharge port. The output terminal of the photoelectric sensor is electrically connected to the receiving terminal of the control unit.

[0019] Preferably, the control unit includes a controller, the output of which is electrically connected to the drive end of the pusher cylinder, the controller is used for output control of the extrusion molding mechanism, and a buzzer is electrically connected to the output of the controller.

[0020] Preferably, the extrusion molding mechanism includes:

[0021] A support frame, wherein a pressing cylinder is provided at the top of the support frame, the output end of the pressing cylinder extends to the bottom of the support frame, and a forming mold is provided at the output end of the pressing cylinder;

[0022] The material guide rail is fixedly connected to the top of the inclined plane and aligned with the unloading port, and the material guide rail passes through the bottom of the support frame;

[0023] The first and second material-blocking cylinders are symmetrically arranged along the center of the inclined plane. The output ends of the first and second material-blocking cylinders are respectively provided with a first baffle and a second baffle. The first and second baffles are used to block the material guide track, and the area of ​​the material guide track blocked by the first and second baffles is used for pressing down the forming mold. The output end of the second material-blocking cylinder is fixedly connected to a toggle tooth block, which is inserted and connected inside the cabinet, and is used to aggle the counting drive unit.

[0024] Preferably, the counting drive unit includes:

[0025] Limit switch, the limit switch is installed inside the cabinet, and the output terminal of the limit switch is electrically connected to the rotating part;

[0026] The lower toothed plate is inserted and connected inside the cabinet. A counting rod is fixedly connected to the top of the lower toothed plate. The top of the counting rod is inserted and connected to the inclined surface. A plug is fixedly connected to the bottom of the lower toothed plate. The plug is used to press and trigger the limit switch after the lower toothed plate moves down.

[0027] A rotating rod is rotatably connected inside the cabinet. One end of the rotating rod is fixedly connected to a toggle gear, the outer wall of which meshes with the tooth wall of the lower insert plate. The other end of the rotating rod is fixedly connected to a ratchet disc, which meshes with the toggle gear block in a counterclockwise direction.

[0028] Preferably, the bottom of the inclined surface has a rotating opening, and the rotating part includes:

[0029] A rotating belt is rotatably connected to a rotating opening. Multiple sets of clamping parts are arranged around the outer ring wall of the rotating belt, and teeth are provided on the side of the inner ring wall of the rotating belt.

[0030] A drive roller, wherein multiple drive rollers are respectively inserted and connected to both ends of the rotating belt, the outer wall of the drive roller meshes with the teeth, and a support rod is inserted and connected to the middle of the drive roller;

[0031] A drive motor is installed inside a cabinet. The control terminal of the drive motor is electrically connected to the output terminal of a limit switch. A coupling is provided at the output terminal of the drive motor. The end of the coupling away from the drive motor is connected to one of the support rods.

[0032] Preferably, the clamping part includes:

[0033] The blocking blocks are arranged symmetrically in the horizontal direction, with opposite sides of the blocking blocks in contact with each other, and the ends of the blocking blocks that are far apart from each other being fixed to the outer ring wall of the rotating belt. Each of the blocking blocks is provided with a stop bar in the middle.

[0034] The clamping blocks are arranged horizontally and symmetrically, and the clamping blocks and the blocking blocks are symmetrically arranged along the horizontal longitudinal direction. The clamping blocks are configured as angled, and one end of the clamping block is fixedly connected to the outer ring wall of the rotating belt.

[0035] A processing method for a high-voltage MOS device lead forming apparatus, comprising the following steps:

[0036] The first step is to arrange and install the collection boxes of finished MOS devices on the outer ring wall of the rotating part through the clamping part;

[0037] The second step involves first opening the clamping space of the feeding mechanism, then placing the MOS devices to be formed, filled with material boxes, vertically arranged within the clamping space. At this point, the MOS devices in the bottommost material box slide downwards along the slope under gravity, unloading and passing through the unloading baffle before entering the extrusion molding mechanism. During unloading, photoelectric sensors determine the unloading status of the MOS devices, thereby controlling the feeding mechanism and the entire machine. The unloading status includes:

[0038] When the time interval between light obstruction and no light is detected is 2-3 seconds, the bottom material box stops discharging. At this time, the pusher cylinder is triggered to quickly push out the bottom material box.

[0039] When the time interval between light obstruction and detection is 4-6 seconds, no material transfer of MOS devices is detected, triggering a continuous alarm from the buzzer.

[0040] The machine should be stopped immediately if no light obstruction is detected for more than 6 seconds.

[0041] The third step involves the MOS devices to be formed being partially blocked in the pin pressing area of ​​the extrusion molding mechanism. After being formed by pin pressing, they continue to fall down the slope under the influence of gravity.

[0042] The fourth step involves setting the number of MOS devices to be loaded into each finished product collection box via the counting drive unit. The molded MOS devices are guided into the finished product collection box. When triggered by the pressing stroke, the set collection amount is reached. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next finished product collection box enters the receiving position to collect the materials. After resetting the number to be collected, a new round of finished product collection begins.

[0043] The technical effects and advantages of this invention are as follows:

[0044] (1) The present invention has designed the structure of the receiving mechanism. By setting the counting drive unit and combining the material blocking setting of the extrusion molding mechanism, under the premise of quantitative processing of material feeding, the material feeding action is used to drive the counting drive unit, so that the counting drive unit drives the rotating part to rotate under the mechanical operation setting, so that the next group of material can be collected. Under such structural and operational design, the device can collect the corresponding number of finished products according to actual needs, thereby realizing quantitative counting and collection. This avoids the error of manual counting and ensures the accuracy of counting and collection. At the same time, the counting drive unit can adjust and set the counting quantity in real time through the pull-up operation, making the device operation more convenient and flexible.

[0045] (2) The present invention has a clamping part arranged around the outer ring wall of the rotating part. First, the empty finished product collection box is arranged and clamped by the clamping part. Then, under the drive of the counting drive part, the rotating part drives the clamping part at the corresponding position to move, thereby realizing the switching of the corresponding finished product collection box, and thus ensuring that the device can stably realize the counting and collection of finished products.

[0046] (3) The present invention has designed a feeding mechanism and monitors the stability of the feeding process by photoelectric sensing, thereby ensuring the stable unloading of the MOS device to be formed, and thus ensuring that the MOS device to be formed can be stably fed and collected after extrusion molding. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0048] Figure 2 This is a side view of the overall structure of the present invention.

[0049] Figure 3 This is a front view of the overall structure of the present invention.

[0050] Figure 4 This is a schematic diagram of the overall structure connection of the present invention without the lower cylinder part.

[0051] Figure 5 This is a front view of the overall structure of the present invention with the lower cylinder removed.

[0052] Figure 6 This is a schematic diagram of the material receiving mechanism of the present invention.

[0053] Figure 7 This is a rear view of the material receiving mechanism of the present invention.

[0054] Figure 8 This is a schematic diagram showing the structural connection between the rotating part and the clamping part of the present invention.

[0055] Figure 9 This is a schematic diagram of the counting drive unit of the present invention.

[0056] In the diagram: 1. Cabinet; 101. Casters; 102. Support legs; 103. Unloading baffle; 2. Placement rack; 201. Pressing rod; 202. Pressing spring; 203. Pushing cylinder; 204. Photoelectric sensor; 3. Support frame; 301. Pressing cylinder; 302. Forming mold; 4. Guide rail; 5. First blocking cylinder; 501. First baffle; 6. Second blocking cylinder; 601. Second baffle; 602. 7. Actuating gear block; 8. Controller; 9. Buzzer; 10. Rotating belt; 11. Gear teeth; 12. Block; 13. Stopping block; 14. Stop bar; 15. Clamping block; 16. Drive roller; 17. Supporting rotating rod; 18. Drive motor; 19. Coupling; 10. Limit switch; 11. Lower insert gear plate; 12. Counting lever; 13. Inserting rod; 14. Rotating rod; 15. Actuating gear; 16. Ratchet. Detailed Implementation

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] Example 1: The present invention provides as follows Figure 1-9 The high-voltage MOS device lead forming apparatus shown includes:

[0059] Cabinet 1 has a sloping top and a discharge baffle 103 at the top of the sloping top. One end of the bottom of cabinet 1 is equipped with casters 101 and the other end of the bottom of cabinet 1 is equipped with support feet 102. The discharge baffle 103 has a discharge port in the middle.

[0060] It should be noted that the caster wheel 101 is located at the bottom of the cabinet 1 near the back. The caster wheel 101 allows the front of the cabinet 1 to be tilted up, which can then be used to move the entire unit. The support foot 102 is fixed at the bottom of the cabinet 1 near the front. When the cabinet 1 is placed flat and stable, the bottom of the support foot 102 touches the ground, thus allowing the entire unit to be placed and used.

[0061] The feeding mechanism is located at the top of the inclined plane and above the unloading baffle 103. The feeding mechanism works with the unloading baffle 103 to unload the MOS device to be formed. The feeding mechanism is used to feed the MOS device to be formed through the unloading port.

[0062] Specifically, the feeding mechanism includes:

[0063] Placement rack 2 is fixedly connected to the top of the inclined plane. The bottom of placement rack 2 is provided with a push opening. The push opening, the discharge port and the discharge guide of the extrusion molding mechanism are on the same center line.

[0064] It should be noted that the placement rack 2 has an N-shaped structure, with the push opening located at the bottom and extending through one side of the placement rack 2. In this design, the end of the placement rack 2 away from the unloading baffle 103 is an open structure, which allows for material loading through this open area.

[0065] A pressure rod 201 is inserted into the middle of the placement rack 2. A pressure spring 202 is provided between the middle of the pressure rod 201 and the top of the inner wall of the placement rack 2. The pressure rod 201 is pressed close to the top of the placement rack 2 by the pressure spring 202.

[0066] It should be noted that both ends of the pressure rod 201 adopt a disc-shaped structure that exceeds the radius of the rod body. The pressure spring 202 is set under the constraint of one of the disc-shaped structures and the inner wall of the top of the placement frame 2. The pressure spring 202 always keeps pressing down on the pressure rod 201, so that the pressure rod 201 always moves towards the inclined surface of the cabinet 1.

[0067] The feeding mechanism also includes:

[0068] The pusher cylinder 203 is located at the top of the inclined plane and on one side of the bottom of the placement frame 2. The output end of the pusher cylinder 203 is connected to the side of the push port in a horizontal direction.

[0069] It should be noted that a guide support block is provided on the top of the inclined surface of the cabinet 1. This guide support block is used to support and guide the sliding of the output end of the push cylinder 203. In this way, the output of the push cylinder 203 causes the bottom push port of the placement rack 2 to push and sweep, so that the material box pressed down at the bottom of the placement rack 2 will be pushed out of the placement rack 2, thereby enabling the replacement of the material box.

[0070] Photoelectric sensor 204 is located at the top of the inclined plane and below the discharge port. Photoelectric sensor 204 is used to measure the light-sensing interval passing through the discharge port. Photoelectric sensor 204 is a reflective photoelectric sensor used to detect the light-blocking state. When photoelectric sensor 204 is not blocked, the timer is started; if the light is blocked again in the middle, the timer is immediately reset. In this scheme, photoelectric sensor 204 is used to detect the light blocking passing through the discharge port.

[0071] The extrusion molding mechanism is located in the middle of the inclined plane and below the discharge baffle 103. The extrusion molding mechanism is used for the pin pressing and discharge guidance of the MOS device after passing through the discharge baffle 103.

[0072] The control unit is located on the side of the inclined plane. The control unit uses photoelectric sensing signals to control the unloading of the feeding mechanism. The output end of the photoelectric sensor 204 is electrically connected to the receiving end of the control unit.

[0073] Specifically, the control unit includes a controller 7, the output of which is electrically connected to the drive end of the pusher cylinder 203. The controller 7 is used for output control of the extrusion molding mechanism, and a buzzer 701 is electrically connected to the output of the controller 7.

[0074] It should be noted that the controller 7 is electrically connected to the photoelectric sensor 204, buzzer 701, pusher cylinder 203, pressing cylinder 301, first baffle cylinder 5, second baffle cylinder 6, and drive motor 12. The controller 7 also includes a stop control module, which is communicatively connected to the pressing cylinder 301, first baffle cylinder 5, second baffle cylinder 6, and drive motor 12 for interrupt control of these structures. Specifically, the photoelectric sensor 204 is electrically connected to the digital input pin of the controller 7, the control terminal of the pusher cylinder 203 is electrically connected to the digital output pin of the controller 7, and the buzzer 701 is electrically connected to another output pin of the controller 7. The output of the stop control module has a higher priority than the output pin.

[0075] Specifically, the extrusion molding mechanism includes:

[0076] The support frame 3 has a pressing cylinder 301 on its top. The output end of the pressing cylinder 301 extends to the bottom of the support frame 3. The output end of the pressing cylinder 301 is provided with a forming mold 302. The forming mold 302 is detachably and fixedly connected to the output end of the pressing cylinder 301. It can be replaced according to the shape that the pin needs to be pressed into.

[0077] The guide rail 4 is fixedly connected to the top of the inclined plane with the unloading port aligned with it, and the guide rail 4 is inserted under the support frame 3. The guide rail 4 has through holes at both ends in the area below the forming mold 302. By blocking the through holes, the area below the forming mold 302 is blocked. When the MOS device to be formed is in this area, after being blocked, the forming mold 302 presses down to form the pins.

[0078] The first and second blocking cylinders 5 and 6 are symmetrically arranged along the center of the inclined plane. The output ends of the first and second blocking cylinders 5 and 6 are respectively provided with a first baffle 501 and a second baffle 601. The first baffle 501 and the second baffle 601 are used to block the guide rail 4, and the area of ​​the guide rail 4 blocked by the first baffle 501 and the second baffle 601 is used for pressing down the forming mold 302. The output end of the second blocking cylinder 6 is fixedly connected to a toggle tooth block 602, which is inserted into the cabinet 1 and is used to aggle the counting drive unit.

[0079] It should be noted that the first baffle 5 and the second baffle 6 drive the first baffle 501 and the second baffle 601 to intersect the guide rail 4, and the intersect interval between the two is 2s. The first baffle 501 and the second baffle 601 are intersecting with the guide rail 4 for only 1s. The distance between the first baffle 501 and the second baffle 601 is a constant value, so as to ensure that the MOS device in one pressing operation is quantitative.

[0080] The material receiving mechanism is located at the bottom of the inclined plane. The material receiving mechanism includes a rotating part, a clamping part, and a counting drive part. The clamping part is arranged around the outer surface of the rotating part, and the counting drive part is inserted and connected to the middle of the rotating part. The counting drive part is used to drive the rotating part to rotate through the counting setting.

[0081] The counting drive unit includes:

[0082] Limit switch 13 is installed inside cabinet 1, and the output terminal of limit switch 13 is electrically connected to the rotating part;

[0083] The lower toothed plate 14 is inserted and connected inside the cabinet 1. The top of the lower toothed plate 14 is fixedly connected to a counting rod 1401. The top of the counting rod 1401 is inserted and connected to the inclined surface. The outer wall of the counting rod 1401 can be set with a scale, so as to measure the downward movement distance by the scale value above the exposed inclined surface. The counting rod 1401 and the inclined surface form a damped insertion. The sliding friction between the two insertions is used to lift the lower toothed plate 14 in a non-powered state. The bottom end of the lower toothed plate 14 is fixedly connected to a rod 1402. After the rod 1402 moves down with the lower toothed plate 14, it is used to press the trigger limit switch 13.

[0084] Rotating rod 15 is rotatably connected inside cabinet 1. One end of rotating rod 15 is fixedly connected to a toggle gear 1501. The outer wall of toggle gear 1501 meshes with the tooth wall of lower insert plate 14. The other end of rotating rod 15 is fixedly connected to a ratchet disk 1502. The ratchet disk 1502 meshes with toggle block 602 in a counterclockwise direction for transmission.

[0085] It should be noted that since the number of MOS devices formed each time is a fixed value, after the second baffle 601 is driven to unload, the fixed number of MOS devices fall to the finished product collection box for collection.

[0086] In this scheme, one output operation of the second material-stopping cylinder 6 means one material discharge. Therefore, when it drives the actuating tooth block 602 to perform one horizontal reciprocating movement, it will engage with the ratchet disk 1502. Since the ratchet disk 1502 can only perform counterclockwise engagement, one reciprocating motion of the actuating tooth block 602 can only drive the ratchet disk 1502 to rotate counterclockwise by one tooth gap.

[0087] After the ratchet 1502 rotates counterclockwise, it drives the rotating rod 15 to rotate synchronously. At this time, when the actuating gear 1501 rotates counterclockwise, it drives the lower insert plate 14 to move downward through meshing transmission. The lower insert plate 14 is lifted and pulled by the counting pull rod 1401 and the damping of the inclined plane. Therefore, the lower insert plate 14 can move downward under meshing. When the lower insert plate 14 moves, it drives the counting pull rod 1401 to move downward. It can be seen that the counting pull rod 1401 controls the downward movement distance of the lower insert plate 14 by the distance of the exposed top of the inclined plane. After the lower insert plate 14 moves downward continuously, it is until the insert rod 1402 inserts and presses the limit switch 13, which triggers the limit switch 13. The limit switch 13 sends the trigger signal to the control terminal of the drive motor 12, and the drive motor 12 starts.

[0088] Specifically, a rotating opening is provided at the bottom of the inclined plane, and the rotating part includes:

[0089] A rotating belt 8 is rotatably connected to the rotating opening. Multiple clamping parts are arranged around the outer ring wall of the rotating belt 8. The central area of ​​the rotating belt 8 is light-transmitting. The counting drive unit is inserted into the inner ring wall of the rotating belt 8. Teeth 801 are provided on the side of the inner ring wall of the rotating belt 8. The rotating belt 8 and the teeth 801 are made of the same material and both are flexible to ensure the circumferential rotation in the curled state. In this scheme, the rotating belt 8 is made of light-transmitting polycarbonate, which has good transparency and strength and is suitable for conveyor belts that require high impact resistance and thermal stability, so as to facilitate light penetration and assist the counting drive unit in photosensitive counting.

[0090] Drive roller 11, multiple drive rollers 11 are respectively inserted and connected to both ends of rotating belt 8. The outer wall of drive roller 11 meshes with teeth 801. A support rotating rod 1101 is inserted and connected to the middle of drive roller 11. An external protruding tooth is provided at the end of drive roller 11. The external protruding tooth is adapted to teeth 801 to ensure that a stable meshing transmission is formed between drive roller 11 and rotating belt 8.

[0091] The drive motor 12 is installed inside the cabinet 1. The control terminal of the drive motor 12 is electrically connected to the output terminal of the limit switch 13. The output terminal of the drive motor 12 is equipped with a coupling 1201. The end of the coupling 1201 away from the drive motor 12 is connected to one of the support rods 1101. The drive motor 12 is used to receive the trigger signal of the limit switch 13. After receiving the trigger signal, the drive motor 12 performs one operation. The angle of rotation is the same each time, and the distance that the rotating belt 8 moves is exactly the distance between the two sets of blocking blocks 9.

[0092] Specifically, the clamping section includes:

[0093] The blocking blocks 9 are arranged symmetrically in the horizontal direction. The opposite sides of the blocking blocks 9 are in contact with each other, and the ends of the blocking blocks 9 that are far apart from each other are fixed to the outer ring wall of the rotating belt 8. Each of the blocking blocks 9 has a stop bar 901 in the middle.

[0094] In this design, two blocking blocks 9 form a group, with one end not connected to the rotating belt 8, and the other end not connected to the rotating belt 8 fitting together. In this design, the blocking blocks 9 are L-shaped, so the two blocking blocks 9 together form a U-shape to surround and block the finished product collection box. The baffle 901 is designed so that it can be inserted into one end of the finished product collection box, preventing the collected MOS devices from falling out, while also helping to clamp and position the finished product collection box.

[0095] Clamping blocks 10, multiple sets of clamping blocks 10 are arranged horizontally symmetrically, and multiple sets of clamping blocks 10 and multiple sets of blocking blocks 9 are symmetrical along the horizontal longitudinal direction. The clamping blocks 10 are set in a folded shape, and one end of the clamping block 10 is fixedly connected to the outer ring wall of the rotating belt 8.

[0096] It should be noted that the clamping blocks 10 in this scheme are also used in pairs, and correspond to the two blocking blocks 9 in the same group. The clamping blocks 10 are made of elastic material. After their bottom is fixed to the rotating belt 8, the space on the opposite side of the two clamping blocks 10 can be adjusted by flipping their top, so as to use elastic recovery to clamp the finished product collection box.

[0097] Example 2: This invention provides a processing method for a high-voltage MOS device lead forming apparatus, using the high-voltage MOS device lead forming apparatus of Example 1. The processing method includes the following steps:

[0098] The first step is to arrange and install the collection boxes of finished MOS devices on the outer ring wall of the rotating part through the clamping part;

[0099] First, insert one end of the finished product collection box between a set of blocking blocks 9, and insert the baffle 901 into the inner wall of the box. Then, pull open the tops of the two clamping blocks 10 in the same set, and clamp the other end of the box in the space opened by the two clamping blocks 10.

[0100] The second step involves first opening the clamping space of the feeding mechanism, then placing the MOS devices to be formed, filled with material boxes, vertically arranged within the clamping space. At this point, the MOS devices in the bottommost material box slide downwards along the slope under gravity and are unloaded, passing through the unloading baffle 103 before entering the extrusion molding mechanism. During the unloading process, photoelectric sensors determine the unloading status of the MOS devices, thereby controlling the feeding mechanism and the entire machine. The unloading status includes:

[0101] When the time interval between light obstruction and no light blockage is felt is 2-3 seconds, the bottom material box will stop discharging. At this time, the pusher cylinder 203 is triggered to quickly push out the bottom material box.

[0102] When the time interval between light obstruction and detection is 4-6 seconds, no material transfer of MOS device is detected, triggering the 701 buzzer to continuously alarm;

[0103] The machine should be stopped immediately if no light obstruction is detected for more than 6 seconds.

[0104] The third step involves the MOS devices to be formed being shielded in batches in the pin pressing area of ​​the extrusion molding mechanism. After being formed by pin molding, they continue to fall along the inclined plane under the action of gravity. When the first baffle 501 and the second baffle 601 are in the same position intersecting with the guide rail 4, the pressing cylinder 301 outputs to drive the molding die 302 to cut and extrude the pins of the MOS devices. After that, the second baffle 601 retracts first, and the formed MOS devices fall down for collection.

[0105] The fourth step involves setting the number of MOS devices to be loaded into each finished product collection box via the counting drive unit. The molded MOS devices are guided into the finished product collection box. When triggered by the pressing stroke, the set collection amount is reached. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next finished product collection box enters the receiving position to collect the materials. After resetting the number to be collected, a new round of finished product collection begins.

[0106] It should be noted that the operating principle of the counting control is as follows: pulling the counting lever 1401 upwards adjusts the vertical distance between the lower insert plate 14 and the limit switch 13. In order for the insert lever 1402 to insert downwards and trigger the limit switch 13, the number of times the actuating gear 1501 moves the lower insert plate 14 can be adjusted. At this time, the number of times the ratchet disk 1502 is moved is adjusted, which in turn adjusts the output of the second feed cylinder 6, thereby adjusting the feeding amount of the finished MOS device.

[0107] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A lead forming apparatus for a high-voltage MOS device, characterized in that, include: The top of the cabinet (1) is set as an inclined surface, and the top of the inclined surface is provided with a discharge baffle (103). The feeding mechanism is located at the top of the inclined plane and above the unloading baffle (103). The feeding mechanism works with the unloading baffle (103) to unload the MOS device to be formed. An extrusion molding mechanism is provided in the middle of the inclined plane and below the discharge baffle (103). The extrusion molding mechanism is used for the pin pressing and discharge guidance of the MOS device after it passes through the discharge baffle (103). A material receiving mechanism is provided at the bottom of the inclined plane. The material receiving mechanism includes a rotating part, a clamping part, and a counting drive part. The clamping part is arranged around the outer surface of the rotating part, and the counting drive part is inserted and connected to the middle of the rotating part. The counting drive part is used to drive the rotating part to rotate by counting. The counting drive unit includes: Limit switch (13), the limit switch (13) is installed in the cabinet (1), and the output end of the limit switch (13) is electrically connected to the rotating part; The lower toothed plate (14) is inserted and connected inside the cabinet (1). The top of the lower toothed plate (14) is fixedly connected to a counting rod (1401). The top of the counting rod (1401) is inserted and connected to the inclined surface. The bottom of the lower toothed plate (14) is fixedly connected to a plug rod (1402). The plug rod (1402) is used to press the trigger limit switch (13) after the lower toothed plate (14) moves down. Rotating rod (15), the rotating rod (15) is rotatably connected to the cabinet (1), one end of the rotating rod (15) is fixedly connected to a toggle gear (1501), the outer wall of the toggle gear (1501) meshes with the tooth wall of the lower insert plate (14), the other end of the rotating rod (15) is fixedly connected to a ratchet disc (1502), the ratchet disc (1502) meshes with the toggle tooth block (602) in the counterclockwise direction for transmission; The control unit is located on the side of the inclined plane and uses photoelectric sensing signals to control the unloading of the material feeding mechanism.

2. The high-voltage MOS device lead forming apparatus according to claim 1, characterized in that, One end of the bottom of the cabinet (1) is provided with a caster wheel (101), and the other end of the bottom of the cabinet (1) is provided with a support foot (102). The unloading baffle (103) has an unloading port in the middle. The unloading mechanism is used to unload the MOS device to be formed through the unloading port.

3. The high-voltage MOS device lead forming apparatus according to claim 2, characterized in that, The feeding mechanism includes: Placement rack (2), the placement rack (2) is fixedly connected to the top of the inclined plane, the bottom of the placement rack (2) is provided with a push opening, the push opening, the discharge port and the discharge guide of the extrusion molding mechanism are on the same center line; A pressure rod (201) is inserted into the middle of the placement rack (2). A pressure spring (202) is provided between the middle of the pressure rod (201) and the top of the inner wall of the placement rack (2). The pressure rod (201) is pressed close to the top of the placement rack (2) by the pressure spring (202).

4. The high-voltage MOS device lead forming apparatus according to claim 3, characterized in that, The feeding mechanism also includes: The pusher cylinder (203) is located at the top of the inclined plane and on one side of the bottom of the placement frame (2). The output end of the pusher cylinder (203) is connected to the side of the push port in a horizontal direction. A photoelectric sensor (204) is disposed at the top of the inclined plane and below the discharge port. The photoelectric sensor (204) is used to measure the photosensitive interval passing through the discharge port. The output end of the photoelectric sensor (204) is electrically connected to the receiving end of the control unit.

5. The high-voltage MOS device lead forming apparatus according to claim 4, characterized in that, The control unit includes a controller (7), the output end of which is electrically connected to the drive end of the pusher cylinder (203). The controller (7) is used for output control of the extrusion molding mechanism. The output end of the controller (7) is electrically connected to a buzzer (701).

6. The high-voltage MOS device lead forming apparatus according to claim 5, characterized in that, The extrusion molding mechanism includes: A support frame (3) is provided with a pressing cylinder (301) at the top of the support frame (3), the output end of the pressing cylinder (301) extends to the bottom of the support frame (3), and a forming mold (302) is provided at the output end of the pressing cylinder (301). The guide rail (4) is aligned with the unloading port and fixedly connected to the top of the inclined surface, and the guide rail (4) is inserted under the support frame (3); The first material blocking cylinder (5) and the second material blocking cylinder (6) are symmetrically arranged along the center of the inclined plane. The output ends of the first material blocking cylinder (5) and the second material blocking cylinder (6) are respectively provided with a first baffle (501) and a second baffle (601). The first baffle (501) and the second baffle (601) are used to block the guide rail (4), and the area of ​​the guide rail (4) blocked by the first baffle (501) and the second baffle (601) is used for pressing down the forming mold (302). The output end of the second material blocking cylinder (6) is fixedly connected with a toggle tooth block (602). The toggle tooth block (602) is inserted and connected in the cabinet (1), and the toggle tooth block (602) is used to toggle the counting drive unit.

7. The high-voltage MOS device lead forming apparatus according to claim 1, characterized in that, The bottom of the inclined surface has a rotating opening, and the rotating part includes: Rotating belt (8), the rotating belt (8) is rotatably connected to the rotating opening, and multiple sets of clamping parts are arranged around the outer ring wall of the rotating belt (8), and teeth (801) are provided on the side of the inner ring wall of the rotating belt (8). Drive roller (11), multiple drive rollers (11) are respectively inserted and connected to both ends of the rotating belt (8), the outer wall of the drive roller (11) meshes with the teeth (801), and a support rotating rod (1101) is inserted and connected to the middle of the drive roller (11). A drive motor (12) is installed inside the cabinet (1). The control end of the drive motor (12) is electrically connected to the output end of the limit switch (13). A coupling (1201) is provided at the output end of the drive motor (12). The end of the coupling (1201) away from the drive motor (12) is connected to one of the support rods (1101).

8. The high-voltage MOS device lead forming apparatus according to claim 7, characterized in that, The clamping part includes: The blocking blocks (9) are arranged symmetrically in the horizontal direction. The opposing sides of the blocking blocks (9) are in contact with each other, and the ends of the blocking blocks (9) that are far apart from each other are fixed to the outer ring wall of the rotating belt (8). A stop bar (901) is provided in the middle of each of the blocking blocks (9). Clamping blocks (10), multiple sets of clamping blocks (10) are arranged horizontally symmetrically, and multiple sets of clamping blocks (10) are symmetrical with multiple sets of blocking blocks (9) along the horizontal longitudinal direction. The clamping blocks (10) are set in a folded shape, and one end of the clamping block (10) is fixedly connected to the outer ring wall of the rotating belt (8).

9. A method for processing a high-voltage MOS device lead forming apparatus, comprising the high-voltage MOS device lead forming apparatus according to claim 5, characterized in that, The processing method includes the following steps: The first step is to arrange and install the collection boxes of finished MOS devices on the outer ring wall of the rotating part through the clamping part; The second step involves first opening the clamping space of the feeding mechanism, then placing the MOS devices to be formed, filled with material boxes, vertically arranged within the clamping space of the feeding mechanism. At this point, the MOS devices to be formed in the lowest material box slide downwards along the slope under gravity and are unloaded, passing through the unloading baffle (103) before entering the extrusion molding mechanism. During the unloading process, photoelectric sensing is used to determine the unloading status of the MOS devices to be formed, thereby controlling the feeding mechanism and the entire machine. The unloading status includes: When the time interval between light blocking and no light blocking is 2-3 seconds, the bottom material box stops discharging. At this time, the push cylinder (203) is triggered to quickly push out the bottom material box. When the time interval between light blocking and no light blocking is 4-6 seconds, no material transfer of MOS device is detected, triggering the buzzer (701) to continuously alarm; The machine should be stopped immediately if no light obstruction is detected for more than 6 seconds. The third step involves the MOS devices to be formed being partially blocked in the pin pressing area of ​​the extrusion molding mechanism. After being formed by pin pressing, they continue to fall down the slope under the influence of gravity. The fourth step involves setting the number of MOS devices to be loaded into each finished product collection box via the counting drive unit. The molded MOS devices are guided into the finished product collection box. When triggered by the pressing stroke, the set collection amount is reached. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next finished product collection box enters the receiving position to collect the materials. After resetting the number to be collected, a new round of finished product collection begins.

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