Electronic module, crimping mechanism, test device, and work machine
By designing a temperature control unit and a conveying unit in the electronic module, the temperature control and heat dissipation of the electronic components are achieved, which solves the testing problems in low and high temperature environments, extends the service life of the electronic components and improves the test efficiency.
Patent Information
- Application Number
- CN202410451580.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-10-21
AI Technical Summary
Existing testing equipment cannot test electronic components in low or high temperature environments, which makes it impossible to ensure the quality of electronic components at the factory. Furthermore, electronic components are easily damaged in high-heat environments and lack effective heat dissipation design.
An electronic module is designed, which includes a temperature control unit and a conveying unit. A temperature control space is constructed by multiple panels, and openings are provided to convey fluid for heat exchange. In combination with heat conducting parts and heat sinks, temperature control and heat dissipation of electronic components are achieved.
It improves the test reliability of electronic components in different temperature environments, extends the service life of electronic components, and improves testing and crimping efficiency through automated control of fluid delivery.
Smart Images

Figure CN120820780A_ABST