A chassis heat dissipation device

Abstract

This invention discloses a chassis heat dissipation device, which is installed throughout the equipment chassis and includes a vortex tube, a radiator, an intake pipe, and an exhaust pipe. The vortex tube is located outside the equipment chassis and has a compressed gas inlet along its vertical direction. Both ends of the vortex tube have a hot air outlet and a cold air outlet along their horizontal directions, respectively. The radiator is located inside the equipment chassis and contacts high-power components. Both the intake pipe and the exhaust pipe are sealed and penetrate the side wall of the equipment chassis. The intake end of the intake pipe is connected to the cold air outlet, and the exhaust end of the intake pipe is connected to the intake end of the radiator, allowing the cooling gas generated by the vortex tube to enter the radiator. The exhaust end of the radiator is connected to the intake end of the exhaust pipe, and the exhaust end of the exhaust pipe is located outside the equipment chassis, allowing the hot air in the radiator to be discharged externally. This invention features a compact structure, convenient operation, and significant cooling effect, meeting the heat dissipation requirements of high-power devices under special operating conditions.

Description

Technical Field

[0001] This invention belongs to the field of cooling technology for high-power audio and video transmission equipment, and specifically relates to a chassis heat dissipation device. Background Technology

[0002] Most high-power devices on the market use either air cooling or water cooling for heat dissipation. Air cooling primarily uses one or more fans to blow air onto heat-generating components, carrying away heat to achieve the purpose of cooling. When using air cooling, it is necessary to have openings in the device's casing as channels for air intake and exhaust, thus forming an airflow path. Fans then use this path to push airflow over the heatsink of heat-generating components (such as the CPU), thereby removing the heat generated by the device.

[0003] Water cooling utilizes a special device and structure, employing a water pump to propel a liquid sealed within conduits, creating a circulation to achieve heat exchange. Specifically, existing water cooling solutions include components such as a water pump, conduits, a heatsink, and a fan. A special heat-conducting liquid is sealed inside the conduits. The bottom of the water pump has a metal (copper) section that contacts the heat-generating device (e.g., CPU), transferring heat to the liquid and propelling it to the heatsink. The heatsink features numerous flat tube structures, and a fan is mounted on it. When the liquid, carrying heat, enters the flat tubes, the fan pushes air to carry away the heat. Therefore, the liquid returning from the flat tubes to the water pump is cooled. Ultimately, water cooling solutions still rely on fans to remove heat generated by the device through airflow, requiring openings in the casing for air intake and exhaust.

[0004] Since these are high-power devices, they generate a significant amount of heat. Passive cooling methods or special structural components that conduct heat from the heat-generating components to the metal casing are insufficient to meet the cooling requirements. Furthermore, because high-power devices operate under specific conditions, such as high-temperature, high-humidity, and high-dust environments, they need to be waterproof, dustproof, and explosion-proof, thus prohibiting the creation of openings in the casing. Therefore, when the use of fans is not permitted under specific operating conditions, existing cooling solutions are inadequate. Summary of the Invention

[0005] The technical problem this invention aims to solve is to address the inadequacy of existing heat dissipation solutions in meeting the heat dissipation requirements of high-power equipment under extreme conditions such as high temperature, high humidity, and high dust levels. This invention provides a compact, easy-to-operate, and highly effective chassis heat dissipation device. To achieve the above objective, this invention can adopt the following technical solution: A chassis cooling device is disclosed, which is installed throughout the equipment chassis and includes a vortex tube, a radiator, an intake pipe, and an exhaust pipe. The vortex tube is located outside the equipment chassis and has a compressed gas inlet along the vertical direction. Hot air outlet and cold air outlet are respectively located at both ends of the vortex tube along the horizontal direction. The radiator is located inside the equipment chassis and contacts high-power components. Both the intake pipe and the exhaust pipe are sealed and penetrate the side wall of the equipment chassis. The intake end of the intake pipe is connected to the cold air outlet, and the exhaust end of the intake pipe is connected to the intake end of the radiator, so that the cooling gas generated by the vortex tube enters the radiator to achieve heat exchange and cooling of the high-power components. The exhaust end of the radiator is connected to the intake end of the exhaust pipe, and the exhaust end of the exhaust pipe is located outside the equipment chassis to allow the hot air generated by the radiator to be discharged externally.

[0006] As a further improvement of the present invention, the heat sink includes an upper housing and a lower housing with the same structure, and the upper housing and the lower housing are detachably connected.

[0007] As a further improvement of the present invention, both the upper and lower housings are provided with cooling channels, and the two ends of the radiator are respectively provided with air pipe connectors to realize the entry and exit of gas into and out of the cooling channels.

[0008] As a further improvement of the present invention, the cooling channel includes multiple parallel cooling branches.

[0009] As a further improvement of the present invention, each of the four vertices of the upper and lower housings is provided with a first mounting hole, and fasteners are screwed into the first mounting holes to realize the connection and fixation of the heat sink and the high-power component.

[0010] As a further improvement of the present invention, both the upper housing and the lower housing are provided with a plurality of second mounting holes on their inner sides, and fasteners are screwed into the second mounting holes to achieve connection and fixation between the upper housing and the lower housing.

[0011] As a further improvement of the present invention, sealing plugs are provided at the connection points between the air intake pipe and the exhaust pipe and the side wall of the equipment chassis.

[0012] As a further improvement of the present invention, the sealing plug is made of rubber or silicone.

[0013] As a further improvement of the present invention, a multi-port connector is provided between the air intake end of the air intake pipe and the cold air discharge port to realize the parallel connection of multiple radiators to the vortex tube.

[0014] As a further improvement of the present invention, the high-power component is fixed in the equipment chassis by screw posts, and a thermally conductive silicone grease film is applied between the high-power component and the heat sink.

[0015] Compared with the prior art, the advantages of the present invention are as follows: The chassis cooling device of the present invention, by placing a vortex tube outside the equipment chassis and placing a heat sink inside the equipment chassis in direct contact with high-power components, and sealing both the intake pipe and exhaust pipe through the side wall of the equipment chassis, allows the cooling gas generated by the vortex tube to enter the heat sink for heat exchange and cooling of the high-power components. The hot air generated in the heat sink is discharged to the outside of the equipment chassis through the exhaust pipe. By using high-pressure gas and vortex cooling effect, the equipment chassis can be cooled without opening ventilation holes. Moreover, due to the excellent cooling capacity of the vortex tube (down to -45°C), it can meet the cooling needs of almost all high-power equipment on the market. Attached Figure Description

[0016] Figure 1 This is a schematic diagram illustrating the working principle of a vortex cooler. Figure 2 This is a schematic diagram illustrating the structural principle of the heat dissipation device in a specific embodiment of the present invention; Figure 3 This is a schematic diagram of the heat sink structure in a specific embodiment of the present invention; Figure 4 This is a schematic diagram of the internal structure of the heat sink in a specific embodiment of the present invention; Figure 5 This is a schematic diagram of a structure in a specific embodiment of the present invention, showing multiple heat sinks connected in parallel. Figure 6 This is a schematic diagram of the heat dissipation process in a specific embodiment of the present invention; Legend: 100. Equipment chassis; 1. Vortex tube; 2. High-power component; 3. Main chip; 4. Heat sink; 41. Upper shell; 42. Lower shell; 43. Air pipe connector; 44. First mounting hole; 45. Second mounting hole; 46. Cooling channel; 461. Cooling branch; 5. Inlet pipe; 6. Exhaust pipe; 7. Sealing plug; 8. Screw post; 9. T-joint; 11. Compressed gas inlet; 12. Hot gas exhaust port; 13. Cold gas exhaust port. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific preferred embodiments, but this does not limit the scope of protection of the present invention.

[0018] In the description of this invention, it should be understood that the terms "side", "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more unless otherwise explicitly specified.

[0020] Example like Figures 2 to 4 As shown, the heat dissipation device of the present invention is installed throughout the equipment chassis 100. The equipment chassis 100 is used in extreme working conditions of high temperature, high humidity, and high dust. Since heat dissipation holes cannot be opened on the outer casing of the chassis, high-pressure gas can be provided, with a gas source pressure of not less than 0.6 MPa. It includes a vortex tube 1, a radiator 4, an inlet pipe 5, and an exhaust pipe 6. The vortex tube 1 is located outside the equipment chassis 100. A compressed gas inlet 11 is provided vertically on the vortex tube 1, and hot air outlet 12 and cold air outlet 13 are respectively provided horizontally at both ends of the vortex tube 1. The radiator 4 is located inside the equipment chassis 100 and contacts the high-power component 2 to remove the heat generated by the high-power component 2. Both the intake pipe 5 and the exhaust pipe 6 are sealed and penetrate the side wall of the equipment casing 100. The intake end of the intake pipe 5 is connected to the cold air discharge port 13, and the exhaust end of the intake pipe 5 is connected to the intake end of the radiator 4, so that the cooling gas generated by the vortex tube 1 enters the radiator 4 to achieve heat exchange and cooling of the high-power component 2. The exhaust end of the radiator 4 is connected to the intake end of the exhaust pipe 6, and the exhaust end of the exhaust pipe 6 is located outside the equipment casing 100, so that the hot air generated by the radiator 4 is discharged. like Figure 1As shown, the working principle of the vortex tube is as follows: After compressed air is injected into the vortex chamber of the vortex tube 1, the airflow rotates at a speed of up to one million revolutions per minute and flows towards the hot air outlet of the vortex tube 1. A portion of the airflow flows out through a control valve, while the remaining gas is blocked and rotates in the opposite direction at the same speed within the original airflow ring, flowing towards the cold air end of the vortex tube. During this process, the two airflows exchange heat; the inner ring airflow becomes very cold and flows out from the cold air end of the vortex tube, while the outer ring airflow becomes very hot and flows out from the hot air end of the vortex tube 1.

[0021] Temperature regulation and control are achieved by adjusting the pressure of the hot airflow through a hot-end pressure regulating valve. Higher exhaust pressure results in a larger temperature difference between the hot and cold air exiting the vortex tube, leading to higher hot air temperatures and lower cold air temperatures. Conversely, lower exhaust pressure results in a smaller temperature difference, resulting in lower hot air temperatures and lower cold air temperatures. This further enables the regulation and control of the equipment chassis temperature.

[0022] like Figure 1 As shown, in this embodiment, the high-power component 2 is fixed inside the equipment chassis 100 by screw posts 8. A thin film of thermally conductive silicone grease is applied between the high-power component 2 and the heat sink 4, so that the heat generated by the high-power component 2 is quickly transferred to the heat sink 4. Specifically, the high-power component 2 is a PCB board, and the heat sink 4 is connected to the top surface of the high-power component 2 by copper pillar screws or spring pins to dissipate the heat generated by the main chip 3 of the PCB board.

[0023] like Figure 3 As shown, the radiator 4 includes an upper housing 41 and a lower housing 42 with the same structure. The upper housing 41 and the lower housing 42 are detachably connected to facilitate the processing of the internal gas flow channels.

[0024] like Figure 4 As shown, both the upper shell 41 and the lower shell 42 are provided with cooling channels 46. The left and right ends of the upper shell 41 and the lower shell 42 are respectively threaded into the air pipe connectors 43 to realize the entry and exit of gas into the cooling channels 46.

[0025] Furthermore, the cooling channel 46 includes three parallel cooling branches 461 to increase the contact area with the high-power component 2 and increase the heat exchange area.

[0026] like Figure 4 As shown, the upper housing 41 and the lower housing 42 are provided with first mounting holes 44 at the four vertices. Copper pillar screws or spring nails are screwed into the first mounting holes 44 to connect and fix the radiator 4 to the high-power component 2.

[0027] like Figure 4As shown, both the upper housing 41 and the lower housing 42 have multiple second mounting holes 45 on their inner sides. Copper pillar screws or spring pins are screwed into the second mounting holes 45 to connect and fix the upper housing 41 and the lower housing 42. It can be understood that in order to ensure the sealing of the cooling channel 46, a sealing element is provided between the upper housing 41 and the lower housing 42 to achieve a sealed connection between the upper housing 41 and the lower housing 42.

[0028] like Figure 1 As shown, sealing plugs 7 are provided at the connection points between the air intake pipe 5 and the exhaust pipe 6 and the side wall of the equipment housing 100. Furthermore, the sealing plugs 7 are made of high-temperature resistant rubber or silicone to prevent dust and moisture from entering the equipment housing 100.

[0029] like Figure 5 As shown, a T-junction 9 is provided between the air intake end of the air intake pipe 5 and the cold air outlet 13 to enable the two heat sinks 4 to be connected in parallel to the vortex tube 1. It can be understood that if there are two or more high-heat-generating chips in the same chassis, and the pressure of the high-pressure air source is high enough and the cooling of the vortex tube 1 is low enough, a multi-way connector can be connected to the cold air outlet end of the vortex tube 1 to split the cold air and achieve the purpose of cooling multiple chips at the same time.

[0030] like Figure 6 As shown, the working process of the heat dissipation device in this embodiment is as follows: a high-pressure air source injects compressed air through the compressed gas inlet 11 into the vortex chamber of the vortex tube 1. The resulting high-temperature gas is discharged through the hot gas outlet 12, while the low-temperature gas is transported to the radiator 4 through the cold gas outlet 13 and the inlet pipe 5 to absorb the heat generated by the high-power component 2. The heat-exchanged gas is discharged to the outside of the equipment casing 100 through the exhaust pipe 6. In this embodiment, the heat dissipation device, with the vortex tube 1 and the high-pressure air source, does not require external mechanical work and can achieve a temperature drop as low as -45°C solely by relying on the gas dynamics characteristics. It does not require heat dissipation holes on the product casing, nor does it rely on other electronic components and circuits. It is a purely mechanical structure and can adapt to extreme working conditions of high temperature, high humidity, and high dust.

[0031] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the spirit and technical essence of the invention. Therefore, any simple modifications, equivalent substitutions, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, shall still fall within the scope of protection of the present invention.

Claims

1. A chassis heat dissipation device, wherein the heat dissipation device is disposed throughout the equipment chassis (100), characterized in that, The system includes a vortex tube (1), a radiator (4), an intake pipe (5), and an exhaust pipe (6). The vortex tube (1) is located outside the equipment housing (100). A compressed gas inlet (11) is provided on the vortex tube (1) in the vertical direction. Hot air outlet (12) and cold air outlet (13) are provided at both ends of the vortex tube (1) in the horizontal direction, respectively. The radiator (4) is located inside the equipment housing (100) and is in contact with the high-power component (2). The intake pipe (5) is located inside the equipment housing (100) and is in contact with the high-power component (2). Both the intake pipe (5) and the exhaust pipe (6) are sealed through the side wall of the equipment chassis (100). The intake end of the intake pipe (5) is connected to the cold air discharge port (13), and the exhaust end of the intake pipe (5) is connected to the intake end of the radiator (4) so ​​that the cooling gas generated by the vortex tube (1) enters the radiator (4) to realize the heat exchange and cooling of the high-power component (2). The exhaust end of the radiator (4) is connected to the intake end of the exhaust pipe (6), and the exhaust end of the exhaust pipe (6) is located outside the equipment chassis (100). The radiator (4) includes an upper housing (41) and a lower housing (42) with the same structure, and the upper housing (41) and the lower housing (42) are detachably connected; Cooling channels (46) are provided in both the upper shell (41) and the lower shell (42). Gas pipe connectors (43) are provided at both ends of the radiator (4) to allow gas to enter and exit the cooling channels (46). The cooling channel (46) includes multiple parallel cooling branches (461). The upper housing (41) and the lower housing (42) are provided with first mounting holes (44) at the four vertices. Fasteners are screwed into the first mounting holes (44) to connect and fix the radiator (4) to the high-power component (2). The upper housing (41) and the lower housing (42) are provided with multiple second mounting holes (45) on their inner sides. Fasteners are screwed into the second mounting holes (45) to achieve connection and fixation between the upper housing (41) and the lower housing (42). The air intake end of the air intake pipe (5) is provided with a multi-port connector between the air intake end and the cold air discharge port (13) so as to realize that multiple radiators (4) are connected in parallel to the vortex tube (1). When the high-pressure gas source injects compressed air into the vortex chamber of the vortex tube (1) through the compressed gas inlet (11), the generated high-temperature gas is discharged through the hot gas outlet (12), and the low-temperature gas is transported to the radiator (4) through the cold gas outlet (13) and the inlet pipe (5) to absorb the heat generated by the high-power component (2). The gas after heat exchange is discharged to the outside of the equipment chassis (100) through the exhaust pipe (6).

2. The chassis heat dissipation device according to claim 1, characterized in that, The air inlet pipe (5) and the exhaust pipe (6) are both provided with sealing plugs (7) at the connection points with the side wall of the equipment housing (100).

3. The chassis heat dissipation device according to claim 2, characterized in that, The sealing plug (7) is made of rubber or silicone.

4. The chassis heat dissipation device according to claim 1, characterized in that, The high-power component (2) is fixed inside the equipment chassis (100) by screw posts (8), and a thermally conductive silicone grease film is applied between the high-power component (2) and the heat sink (4).

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