Right-angle topography processing method on integrated circuit carrier board and integrated circuit carrier board

Abstract

The application discloses a right-angle topography processing method on an integrated circuit carrier plate and the integrated circuit carrier plate. The method comprises the following steps: exposing a photosensitive dry film on a processing copper layer on a work plate according to exposure data, wherein the exposure data comprises outer layer circuit pattern exposure data and recessed groove pattern exposure data, the recessed groove pattern exposure data comprises a recessed groove target pattern after etching compensation, and the etching compensation method comprises the following steps: performing line width compensation on the inner wall and the slot end face of a preset recessed groove pattern to obtain an intermediate design pattern, performing arc compensation on the slot and the inner wall of the bottom of the intermediate design pattern, and performing arc compensation on the position on the inner wall of the intermediate design pattern and close to the inner wall of the bottom to obtain the recessed groove target pattern; and after developing, etching and removing the film, outer layer circuits and recessed grooves are obtained, and the angle at the edge of the recessed groove is greater than or equal to 89 degrees. The method solves the problem of excessive inner etching caused by fluid stagnation and improves the cutting precision of the carrier plate during cutting.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and more particularly to a method for processing right-angled shapes on an integrated circuit substrate and an integrated circuit substrate. Background Technology

[0002] Currently, in the processing of some high-precision sheet metal parts, it is necessary to grasp the U-shaped groove on the edge of the SET board, specifically the right-angle portion of the U-shaped groove, for cutting positioning. However, since the right-angle portion of the U-shaped groove is generally formed by etching, the existing etching process generally suffers from insufficient exchange of etching solution at the corners (i.e., the fluid boundary layer effect). This leads to an accelerated etching rate on the inner side of the corner, forming a concave rounded corner with a radius R > 5μm, thus making it impossible to achieve the right-angle shape of the U-shaped groove. This results in difficulty in positioning when identifying and grasping the right-angle portion, easy to report errors, and insufficient accuracy, ultimately failing to meet the requirements of high-precision cutting.

[0003] In view of this, the present invention is hereby proposed. Summary of the Invention

[0004] To overcome the above-mentioned defects, the present invention provides a method for processing right-angle morphology on an integrated circuit substrate and an integrated circuit substrate. This processing method is novel, simple and reasonable, and completely solves the problem of excessive internal etching caused by fluid retention. It enables the angle at the corner of the concave groove to reach more than 89°, which significantly improves the cutting accuracy when the substrate is cut in the subsequent process.

[0005] The technical solution adopted by this invention to solve its technical problem is: a method for processing right-angled topography on an integrated circuit substrate, comprising the following processing steps: S1: Provide a work board, and thicken the outer copper layer of the work board to a set copper thickness to obtain a processed copper layer; S2: Apply the photosensitive resist dry film onto the processed copper layer, and then expose the photosensitive resist dry film according to the exposure data; wherein, the exposure data includes the outer layer circuit pattern exposure data and the concave groove pattern exposure data, the concave groove pattern exposure data includes the concave groove target pattern after etching compensation, and the above etching compensation method is as follows: first, perform line width compensation on the inner wall and groove end face of the preset concave groove pattern to obtain the intermediate design pattern, then perform arc compensation on the groove opening and the inner wall of the groove bottom of the obtained intermediate design pattern, and perform arc subtraction compensation on the inner side wall of the obtained intermediate design pattern and the position close to its groove bottom inner wall, thereby obtaining the concave groove target pattern; S3: Develop the unexposed portion of the photoresist dry film, then etch away the portion of the processed copper layer that is exposed outside the photoresist dry film, and then remove the film to obtain the outer layer circuit and the concave groove; the angle at the corner of the concave groove is 89° or more.

[0006] As a further improvement of the present invention, in S2 above, the preset concave groove pattern is a right-angled U-shape; First, the inner wall and the end face of the groove of the preset concave groove pattern are compensated with a line width of T to obtain the intermediate design pattern. The calculation formula of the compensation value T is: T=EF×H1, where EF is the etching factor and H1 is the copper thickness of the processed copper layer. Next, dynamic arc compensation is applied to the groove opening of the intermediate design pattern to form fan-shaped patterns protruding on the opposite side walls of the groove opening. The radius of the fan-shaped pattern is T / 2, and the central angle is 90°. Dynamic arc compensation is also applied to the inner wall of the groove bottom of the intermediate design pattern to form an arc-shaped pattern protruding on the inner wall of the groove bottom. The height of the arc-shaped pattern is T / 2, and the radius of the circle it contains is 0.425×H2, where H2 is the groove width of the preset concave groove pattern. Furthermore, dynamic arc decompensation is applied to the inner side wall of the intermediate design pattern, near the inner wall of its groove bottom, to form concave arc-shaped patterns on the opposite two inner side walls of the intermediate design pattern, near the inner wall of its groove bottom. The central angle of the arc-shaped pattern is 60°~70°, and the radius of the circle it contains is 0.425×H2. At this point, the target concave groove pattern is obtained.

[0007] As a further improvement of the present invention, the centers of the two sector-shaped graphics are respectively located on the two opposite inner sidewalls of the intermediate design graphic, and one radius side of the two sector-shaped graphics is respectively flush with the slot end face of the intermediate design graphic. In addition, the two sector-shaped patterns are arranged in a mirror-symmetrical manner.

[0008] As a further improvement of the present invention, the two arc shapes are arranged in a mirror symmetry, and the center of the circle containing the two arc shapes and the center of the circle containing the bow shape are all located on the center line of the intermediate design shape.

[0009] As a further improvement of the present invention, each of the two arcuate shapes has a gap between it and one end of the bow-shaped shape.

[0010] As a further improvement of the present invention, the copper thickness of the processed copper layer is 60μm±5μm.

[0011] As a further improvement of the present invention, the angles at the four corners of the concave groove are all above 89°.

[0012] As a further improvement of the present invention, the concave groove is located at the edge of the SET plate of the working plate.

[0013] As a further improvement of the present invention, it also includes S4: performing conventional AOI inspection and surface treatment on the obtained outer layer circuit and the concave groove in sequence.

[0014] The present invention also provides an integrated circuit carrier board, including a board body and a concave groove formed on the board body by the right-angle morphology processing method of the integrated circuit carrier board described in the present invention.

[0015] The beneficial effects of this invention are as follows: Compared with the prior art, the method for processing right-angled topography on integrated circuit substrates provided by this invention has the following advantages: ① By optimizing the etching compensation method of the preset concave groove pattern, the problem of excessive internal etching caused by fluid retention can be completely solved, thereby achieving an angle of over 89° at the corners of the concave groove, which can significantly improve the cutting accuracy during subsequent substrate cutting. ② This application does not require changing the raw material formula of the existing etching solution, does not require adding production equipment and / or fixtures, and does not require changing the production cycle, etc. It is well adapted to existing processing lines and also effectively achieves cost reduction and efficiency improvement, promoting its widespread implementation. Attached Figure Description

[0016] Figure 1 This is a flowchart of the method for processing right-angled shapes on an integrated circuit substrate as described in Embodiment 1 of the present invention; Figure 2 This is a cross-sectional view of the work board described in Example 1; Figure 3 This is a schematic cross-sectional view of the first intermediate plate obtained after the anti-corrosion photosensitive dry film is applied to the working plate in Example 1. Figure 4 This is a schematic diagram of the intermediate design pattern obtained after compensating for the line width at the inner wall and end face of the groove in Example 1. Figure 5 This is a schematic diagram of the structure of the graphic obtained after applying arc-shaped compensation to the slot opening and the inner wall of the slot bottom in Example 1. Figure 6 This is a schematic diagram of the structure of the concave groove target pattern described in Example 1; Figure 7 This is a schematic cross-sectional view of the second intermediate plate obtained after exposure and development of the anti-corrosion photosensitive dry film in Example 1. Figure 8 for Figure 7 A top view of the second dry film pattern shown; Figure 9 This is a partial cross-sectional view of the integrated circuit substrate obtained in Example 1; Figure 10 for Figure 9 The top view of the concave groove shown.

[0017] Referring to the accompanying drawings, the following explanations are provided: 1. Working board; 10. Outer copper layer; 11. Insulating intermediate layer; 2. Processed copper layer; 3. Outer circuit; 4. Recessed groove; 5. Photosensitive dry film; 51. First dry film pattern; 52. Second dry film pattern; 520. Hollowed-out groove; 521. Fan-shaped part; 522. Bow-shaped part; 523. Arc-shaped part; 524. Planar part; B1, First intermediate plate; B2, Second intermediate plate; D1, Preset concave groove graphic; D2, Intermediate design graphic; D3, Line width compensation part; D4, Fan-shaped graphic; D5, Bow-shaped graphic; D6, Arc-shaped graphic; D7, Target graphic of concave groove. Detailed Implementation

[0018] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0019] Example 1

[0020] Please see the appendix Figure 1 To be continued Figure 10 As shown, this embodiment 1 provides a method for processing right-angled topography on an integrated circuit substrate, including the following processing steps: S1: Provide a work board 1, and thicken the outer copper layer of the work board 1 to a set copper thickness to obtain a processed copper layer 2.

[0021] Understandably, the specific implementation structure of the work plate 1 can be determined according to product design requirements, and this application does not impose any restrictions. However, for the convenience of explaining the concave groove processing method described in this application, this embodiment uses a double-sided work plate 1 as an example. For details, please refer to the appendix. Figure 2 As shown, the working board 1 provided in this embodiment has the following structure: it has an insulating intermediate layer 11 and two outer copper layers 10 stacked on opposite sides of the insulating intermediate layer 11. Further, the insulating intermediate layer 11 may be made of, but is not limited to, FR-4 material, and the thickness of the outer copper layer 10 may be, but is not limited to, 1 ounce.

[0022] Based on the structure of the aforementioned work board 1, conventional mechanical drilling of tool holes, deburring of hole openings / removal of adhesive residue from hole walls, copper plating of the entire board, outer copper plating, and grinding of the entire board are performed sequentially to thicken the outer copper layer 10 to the set copper thickness. It is understood that, for ease of description, this embodiment will collectively refer to the outer copper layer 10 and the electroplated copper layer thereon (obtained from the aforementioned outer copper plating process) as the processed copper layer 2 (see Appendix). Figure 3 (As shown).

[0023] Furthermore, the copper thickness of the processed copper layer 2 is optimally controlled to be 60μm±5μm, so that the exposure data of the concave groove pattern can be adjusted according to the copper thickness of the processed copper layer 2 in subsequent processes.

[0024] S2: First, the photosensitive dry film 5 (its thickness can be, but is not limited to, 25μm) is applied to the processed copper layer 2 using a vacuum laminator to obtain the first intermediate board B1. (See attached document for details.) Figure 3 As shown; then the photosensitive dry film 5 is exposed according to the exposure data, which includes the outer layer circuit pattern exposure data and the concave groove pattern exposure data. The outer layer circuit pattern is determined according to the circuit design requirements of the product. This embodiment does not impose any restrictions on it, and since it is not a key point of protection in this application, it will not be described in detail here. As for the concave groove pattern, this embodiment performs very special etching compensation on it (understandably, the concave groove pattern exposure data includes the concave groove target pattern after etching compensation) to ensure that the angle at the corner of the concave groove 4 obtained after etching in the subsequent process is above 89°, based on the concave groove target pattern, so as to achieve a good result for the cutting and processing of integrated circuit substrates.

[0025] Furthermore, the preferred method for etching compensation of the preset concave groove pattern in this embodiment is as follows: Step 1: Compensate the line width of the inner wall and the end face of the groove of the preset concave groove shape to obtain the intermediate design shape D2.

[0026] Specifically, taking the preset concave groove shape as a right-angled U-shape as an example (see appendix) Figure 4 (The part indicated by D1 in the middle) In this embodiment, the inner wall and the end face of the groove of the preset concave groove pattern D1 are first compensated with a line width of compensation value T to obtain the intermediate design pattern D2. The calculation formula of the compensation value T is: T=EF×H1, where EF is the etching factor (which can be calculated based on etching solution parameters or equipment parameters, etc.), and H1 is the copper thickness of the processed copper layer 2; Appendix Figure 4 The part indicated by mark D3 is the part that has undergone the above-mentioned line width compensation (which can be defined as the line width compensation part).

[0027] Step 2: Perform arc-shaped compensation on the groove opening and the inner wall of the groove bottom of the obtained intermediate design graphic D2, and perform arc-shaped decompensation on the inner side wall of the obtained intermediate design graphic D2 and the position close to the inner wall of its groove bottom, and then obtain the concave groove target graphic D7.

[0028] Specifically, in this embodiment, dynamic arc compensation is first applied to the slot of the intermediate design graphic D2 to achieve the formation of fan-shaped graphics D4 protruding from the opposite side walls of the slot of the intermediate design graphic D2 (see attached figure). Figure 5 As shown), the radius of the sector-shaped graphic D4 is T / 2 and the central angle is 90°, where the value of T is the compensation value T mentioned in the first step above; Next, dynamic arc compensation is applied to the inner wall of the groove bottom of the intermediate design graphic D2 to form an arc-shaped graphic D5 protruding from the inner wall of the groove bottom of the intermediate design graphic D2 (see also the appendix). Figure 5 As shown), the bow-shaped pattern D5 has a sagitta of T / 2 and a radius of 0.425 × H2, where H2 is the groove width of the preset concave groove pattern D1; Finally, dynamic arc-shaped compensation is applied to the inner wall of the intermediate design pattern D2, near the inner wall of its groove bottom, to form an arc-shaped pattern D6 recessed on both opposite inner walls of the intermediate design pattern D2, near the inner wall of its groove bottom (see Appendix). Figure 6 As shown), the central angle of the arc shape D6 is 60° to 70° (preferably 66° to 68°), and the radius of the circle is 0.425 × H2; then the concave groove target shape D7 is obtained.

[0029] Furthermore, during the second step described above, the centers of the two sector-shaped graphics D4 are located on the two opposite inner sidewalls of the intermediate design graphic D2, and one radius side of the two sector-shaped graphics D4 is flush with the slot end face of the intermediate design graphic D2, and the two sector-shaped graphics D4 are also arranged in a mirror symmetrical manner.

[0030] The two arc shapes D6 are arranged in a mirror image symmetrically, and the centers of the circles containing the two arc shapes D6, as well as the center of the circle containing the bow-shaped shape D5, are all located on the center line L0 of the intermediate design shape D2. In addition, each of the two arc shapes D6 has a gap between itself and the bow-shaped shape D5 near its end to accommodate process variations.

[0031] S3: First, develop away the unexposed portions of the photoresist dry film 5 to obtain the dry film pattern. As is well known, the specific shape of the dry film pattern is determined by the exposure data. Therefore, the dry film pattern includes a first dry film pattern 51 corresponding to the outer layer circuit pattern and a second dry film pattern 52 corresponding to the concave groove target pattern D7. See Appendix. Figure 7 As shown.

[0032] Understandably, based on the shape of the concave groove target pattern D7, the specific structure of the second dry film pattern 52 can be described as follows: Please refer to the appendix. Figure 8As shown, the second dry film pattern 52 is provided with a hollowed-out groove 520. On the opposite side walls of the groove opening of the hollowed-out groove 520, there are fan-shaped portions 521 (corresponding to the above-mentioned fan-shaped pattern D4). On the inner wall of the bottom of the hollowed-out groove 520, there are bow-shaped portions 522 (corresponding to the above-mentioned bow-shaped pattern D5). On the opposite two inner side walls of the hollowed-out groove 520, and near the inner wall of the bottom of the groove, there are concave arc portions 523 (corresponding to the above-mentioned arc portions D6). The portion on the opposite two inner side walls of the hollowed-out groove 520 that connects the fan-shaped portion 521 and the arc portion 523 is planar, and this planar portion is defined as the planar portion 524.

[0033] Furthermore, the two fan-shaped portions 521 are arranged in a mirror symmetry, and the two arc portions 523 are also arranged in a mirror symmetry. The center of the circle containing the two arc portions 523 and the center of the circle containing the bow-shaped portion 522 are both located on the center line of the hollow groove 520.

[0034] After the development process is completed, the second intermediate plate B2 is obtained (see attached document). Figure 7 (As shown), then the portion of the processed copper layer 2 on the second intermediate board B2 that exposes the photosensitive dry film is etched away, followed by film removal, to obtain the outer layer circuit 3 and the concave groove 4. See attached drawing. Figure 9 As shown; wherein, the concave groove 4 is located at the edge of the SET plate of the working plate 1, and the angles of the four corners of the concave groove 4 are all above 89°, as shown in the appendix. Figure 10 As shown.

[0035] Supplement: The specific processing methods for the above-mentioned developing, etching and stripping processes can all adopt conventional technical means in the circuit board field, so they will not be described in detail here.

[0036] In addition, it is understood that by optimizing the etching compensation method of the preset concave groove pattern, this embodiment can accelerate the renewal of the etching solution by means of the fan-shaped portion 521 and the bow-shaped portion 522 on the formed second dry film pattern 52, thereby completely solving the problem of excessive internal etching caused by fluid retention, and achieving an angle of more than 89° at the corner of the concave groove.

[0037] S4: Perform conventional AOI inspection and surface treatment on the obtained outer layer circuit 3 and concave groove 4 in sequence (e.g., plate a nickel-gold protective layer on the outer layer circuit 3).

[0038] In addition, in actual operation, this embodiment also includes performing conventional SET molding, electrical performance testing and finished product inspection on the board obtained after completing the above S1 to S4 processing in order to obtain the finished integrated circuit substrate.

[0039] As can be seen from the above, compared with the prior art, the right-angle topography processing method on the integrated circuit substrate provided in this application has the following advantages: ① By optimizing the etching compensation method of the preset concave groove pattern, the problem of excessive internal etching caused by fluid retention can be completely solved, thereby achieving an angle of over 89° at the corner of the concave groove, which can significantly improve the cutting accuracy during subsequent substrate cutting. ② This application does not require changing the raw material formula of the existing etching solution, does not require adding production equipment and / or fixtures, and does not require changing the production cycle, etc. It is well adapted to the existing processing production line and also effectively achieves cost reduction and efficiency improvement, promoting its widespread implementation.

[0040] Example 2

[0041] This embodiment 2 provides an integrated circuit carrier board, including a board body and a concave groove formed on the board body by the right-angle morphology processing method on the integrated circuit carrier board described in embodiment 1 above.

[0042] Furthermore, this embodiment 2 does not impose any restrictions on the specific structure of the board body, which can be determined according to product design requirements; however, it is understood that the board body is provided with at least an inner layer circuit, an outer layer circuit, and a solder resist layer, etc.; the concave groove is provided at the SET board edge of the board body for cutting and positioning.

[0043] Understandably, based on the characteristics of the concave groove, the integrated circuit carrier provided in this embodiment 2 can accurately identify and grab the corner parts on the concave groove during the cutting process, thereby significantly improving the cutting accuracy.

[0044] Finally, the prefixes "first," "second," etc., in the component names in this application specification (such as first intermediate plate, second intermediate plate, etc.) are only for clarity of description and are not intended to limit the scope of implementation of this invention.

[0045] Many specific details have been set forth in the foregoing description to provide a thorough understanding of the present invention. However, the above description is merely a preferred embodiment of the present invention, and the present invention can be implemented in many other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed above. Furthermore, any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, shall still fall within the protection scope of the present invention.

Claims

1. A method for processing right-angled topography on an integrated circuit substrate, characterized in that: The processing steps include the following: S1: Provide a work board (1), thicken the outer copper layer of the work board (1) to a set copper thickness, and obtain a processed copper layer (2). S2: Apply the photosensitive resist dry film onto the processed copper layer (2), and then expose the photosensitive resist dry film according to the exposure data; wherein, the exposure data includes the outer layer circuit pattern exposure data and the concave groove pattern exposure data, the concave groove pattern exposure data includes the concave groove target pattern after etching compensation, and the above etching compensation method is: first, perform line width compensation on the inner wall and groove end face of the preset concave groove pattern to obtain the intermediate design pattern, and then perform dynamic arc compensation on the groove opening of the intermediate design pattern. The process involves: 1) forming fan-shaped patterns protruding on opposite side walls of the groove in the intermediate design pattern; 2) dynamically compensating for the arc shape at the bottom inner wall of the groove in the intermediate design pattern; 3) forming an arc shape protruding on the bottom inner wall of the groove in the intermediate design pattern; and 4) dynamically compensating for the arc shape at the inner side wall of the intermediate design pattern and near the bottom inner wall of the groove in the intermediate design pattern; and 5) forming a circular arc shape at the opposite inner side walls of the intermediate design pattern and near the bottom inner wall of the groove in the intermediate design pattern, thus obtaining the concave groove target pattern. S3: Develop the unexposed portion of the photoresist dry film, then etch away the portion of the processed copper layer (2) that is exposed outside the photoresist dry film, and then remove the film to obtain the outer layer circuit (3) and the concave groove (4); the angle at the corner of the concave groove (4) is 89° or more.

2. The method for processing right-angled topography on an integrated circuit substrate according to claim 1, characterized in that: In S2 above, the preset concave groove pattern is a right-angled U-shape; First, the inner wall and the end face of the groove of the preset concave groove pattern are compensated with a line width of T to obtain the intermediate design pattern. The calculation formula of the compensation value T is: T=EF×H1, where EF is the etching factor and H1 is the copper thickness of the processed copper layer (2). The radius of the sector-shaped pattern is T / 2 and the central angle is 90°; the sag of the arc-shaped pattern is T / 2 and the radius of the circle it belongs to is 0.425×H2, where H2 is the groove width of the preset concave groove pattern; the central angle of the arc-shaped pattern is 60°~70° and the radius of the circle it belongs to is 0.425×H2.

3. The method for processing right-angled topography on an integrated circuit substrate according to claim 2, characterized in that: The centers of the two sector shapes are located on the two opposite inner walls of the middle design shape, and one radius side of each of the two sector shapes is flush with the slot end face of the middle design shape. In addition, the two sector-shaped patterns are arranged in a mirror-symmetrical manner.

4. The method for processing right-angled topography on an integrated circuit substrate according to claim 2, characterized in that: The two arc shapes are arranged in a mirror image symmetrically, and the center of the circle containing the two arc shapes and the center of the circle containing the bow shape are all located on the center line of the intermediate design shape.

5. The method for processing right-angled topography on an integrated circuit substrate according to claim 4, characterized in that: The two arc-shaped figures each have a gap between them and one end of the bow-shaped figure.

6. The method for processing right-angled topography on an integrated circuit substrate according to claim 2, characterized in that: The copper thickness of the processed copper layer (2) is 60μm±5μm.

7. The method for processing right-angled topography on an integrated circuit substrate according to claim 2, characterized in that: The angles at the four corners of the concave groove (4) are all above 89°.

8. The method for processing right-angled topography on an integrated circuit substrate according to claim 1, characterized in that: The concave groove (4) is located at the edge of the SET plate of the working plate (1).

9. The method for processing right-angled topography on an integrated circuit substrate according to claim 1, characterized in that: It also includes S4: performing conventional AOI inspection and surface treatment on the obtained outer layer circuit (3) and the concave groove (4) in sequence.

10. An integrated circuit substrate, characterized in that: It includes a board body and a concave groove formed on the board body by the right-angle morphology processing method on the integrated circuit carrier as described in any one of claims 1-9.

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