Temperature control method and device for loudspeaker, electronic equipment and storage medium

Abstract

The present application relates to a temperature control method and device for a loudspeaker, an electronic device and a storage medium. A temperature control method for a loudspeaker can include determining an ambient temperature of a loudspeaker; updating model parameters of a temperature control model for the loudspeaker based on the ambient temperature; and performing temperature control of the loudspeaker using the temperature control model based on the updated model parameters.

Description

Technical Field

[0001] This application relates to methods and apparatus for temperature control of loudspeakers, electronic devices, and computer-readable storage media. Background Technology

[0002] With the trend towards thinner and lighter electronic devices such as mobile phones, tablets, music players, and televisions, the density of internal components has increased, making heat dissipation more challenging. Prolonged high-power operation of speakers within these devices can cause excessively high voice coil temperatures. This not only leads to frequency response curve shifts and distortion, resulting in degraded sound quality, but can also cause the voice coil to burn out and / or nearby structural components, such as the diaphragm, to melt, causing irreversible physical damage. Therefore, temperature control of speakers is becoming increasingly important.

[0003] Currently, several temperature control algorithms have been proposed, such as controlling the speaker temperature by controlling the power of the speaker drive signal. However, existing temperature control algorithms still have many shortcomings. Some temperature control algorithms do not consider the ambient temperature of the speaker, or set the ambient temperature to a hypothetical fixed value, such as room temperature of 20°C, or the maximum value of the normal ambient temperature range of 0-45°C, i.e., 45°C. This results in poor temperature control accuracy. On the one hand, the set fixed temperature value may differ from the actual ambient temperature; on the other hand, the temperature control algorithm does not consider changes in ambient temperature, so the accuracy of the algorithm itself may not be high. These factors can all lead to poor temperature control accuracy, thus affecting the speaker's sound quality. For example, when the ambient temperature is set to a fixed value of 45°C, it may be higher than the actual ambient temperature, which will cause a large over-protection, resulting in an unnecessary decrease in speaker loudness and damage to overall sound quality.

[0004] Some temperature control systems take into account the ambient temperature of the speaker when performing speaker temperature control. For example, they use a dedicated temperature sensor placed near the speaker's voice coil to measure the ambient temperature, or they use an audio power amplifier chip to collect the current and voltage data of the drive signal applied to the speaker's voice coil, calculate the voice coil resistance, and determine the voice coil temperature based on the resistance-temperature relationship. The measured temperature is then provided to the temperature control algorithm to perform temperature control on the speaker. However, using a dedicated temperature sensor for the speaker or having the audio power amplifier chip provide feedback current and voltage data incurs additional costs, making it less suitable for implementation in low-cost electronic devices. Furthermore, the temperature control algorithm does not consider changes in ambient temperature, so the accuracy of speaker temperature control may be poor under certain ambient temperatures, affecting the speaker's sound quality. Summary of the Invention

[0005] To address the aforementioned problems, this invention is proposed. One aspect of this invention provides a temperature control method for a loudspeaker, wherein the parameters of a temperature control model / algorithm are updated based on the ambient temperature of the loudspeaker. In other words, the temperature control model can have different model parameter values ​​for different ambient temperatures, thus maintaining high accuracy across the entire ambient temperature range, which is beneficial for achieving precise temperature control. Furthermore, in some embodiments of this invention, when there is no dedicated temperature sensor for the loudspeaker, and the audio power amplifier chip driving the loudspeaker cannot provide current and voltage data for the drive signal, the ambient temperature of the loudspeaker can be selectively estimated using sensing data from other temperature sensors integrated into the electronic device. Therefore, this invention is applicable to low-cost electronic devices.

[0006] According to one embodiment, a temperature control method for a loudspeaker may include: determining the ambient temperature of the loudspeaker; updating model parameters of a temperature control model for the loudspeaker based on the ambient temperature; and performing temperature control on the loudspeaker using the updated model parameters.

[0007] In one example, the method includes repeatedly performing the steps of determining the ambient temperature of the speaker and updating the model parameters of the temperature control model at predetermined time intervals or in response to predetermined events, thereby performing temperature control on the speaker based on the most recently updated model parameters.

[0008] In one example, determining the ambient temperature of a speaker includes: acquiring sensing data from one or more temperature sensors disposed in an electronic device including the speaker; and estimating the ambient temperature of the speaker based on the sensing data from the one or more temperature sensors, wherein the one or more temperature sensors are disposed outside the speaker and not in direct contact with the speaker, and the one or more temperature sensors are, offline determined, the ones with the smallest error between their temperature sensing data and the ambient temperature of the speaker during operation of the electronic device, including in a heating scenario.

[0009] In one example, the temperature control model includes multiple sets of model parameters set for multiple predetermined ambient temperature values. Updating the model parameters for the temperature control model of the speaker based on the ambient temperature includes one of the following methods: determining a predetermined ambient temperature among the multiple predetermined ambient temperature values ​​that is closest to the ambient temperature, and selecting a set of model parameters corresponding to the closest predetermined ambient temperature; or determining a predetermined ambient temperature among the multiple predetermined ambient temperature values ​​that is greater than the ambient temperature and closest to the ambient temperature, and selecting a set of model parameters corresponding to the closest predetermined ambient temperature; or determining a first predetermined ambient temperature among the multiple predetermined ambient temperature values ​​that is closest to the ambient temperature and smaller than the ambient temperature, and a second predetermined ambient temperature that is greater than the ambient temperature, and using an interpolation algorithm to calculate a set of model parameters corresponding to the ambient temperature based on a first set of model parameters corresponding to the first predetermined ambient temperature and a second set of model parameters corresponding to the second predetermined ambient temperature.

[0010] In one example, performing temperature control on the speaker using the temperature control model based on updated model parameters includes controlling the gain of the drive signal provided to the speaker according to the temperature control model, such that when the drive signal is used to drive the speaker, the temperature of the speaker does not exceed the maximum allowable temperature.

[0011] In one example, controlling the gain of the drive signal provided to the loudspeaker according to the temperature control model includes: predicting the maximum allowable loudspeaker power at the ambient temperature according to the temperature control model; determining a gain adjustment factor for the drive signal provided to the loudspeaker based on the maximum loudspeaker power; and adjusting the gain of the drive signal based on the gain adjustment factor so that the power of the drive signal does not exceed the maximum loudspeaker power.

[0012] In one example, controlling the gain of the drive signal provided to the loudspeaker according to the temperature control model includes: determining the power of the drive signal provided to the loudspeaker; predicting, according to the temperature control model, the temperature rise of the loudspeaker when the drive signal with that power is used to drive the loudspeaker; determining the temperature value of the loudspeaker based on the ambient temperature and the temperature rise; determining a gain adjustment factor of the drive signal based on at least one of the temperature rise and the temperature value; and adjusting the gain of the drive signal based on the gain adjustment factor such that when the drive signal is used to drive the loudspeaker, the temperature of the loudspeaker does not exceed a maximum permissible temperature.

[0013] In one example, the method further includes smoothing the gain adjustment factor before adjusting the gain of the drive signal based on the gain adjustment factor.

[0014] According to another embodiment, a temperature control device for a loudspeaker may include: a temperature determination module for determining the ambient temperature of the loudspeaker; a parameter update module for updating model parameters of a temperature control model for the loudspeaker based on the ambient temperature; and a temperature control module for performing temperature control on the loudspeaker using the updated model parameters.

[0015] In one example, the temperature determination module and the parameter update module repeatedly perform the steps of determining the ambient temperature of the speaker and updating the model parameters of the temperature control model at predetermined time intervals or in response to predetermined events, so that the temperature control module performs temperature control on the speaker based on the most recently updated model parameters.

[0016] In one example, the temperature determination module includes: an acquisition unit for acquiring sensing data from one or more temperature sensors disposed in an electronic device including the speaker; and a temperature estimation unit for estimating the ambient temperature of the speaker based on the sensing data from the one or more temperature sensors, wherein the one or more temperature sensors are disposed outside the speaker and do not directly contact the speaker, and the one or more temperature sensors are, offline determined, the one or more temperature sensors whose temperature sensing data has the smallest error with the ambient temperature of the speaker during operation of the electronic device, including in a heating scenario.

[0017] In one example, the temperature control model includes multiple sets of model parameters set for multiple predetermined ambient temperature values. In another example, the parameter update module includes: a first determining unit for determining the predetermined ambient temperature closest to the ambient temperature among the multiple predetermined ambient temperature values, and a first selecting unit for selecting a set of model parameters corresponding to the closest predetermined ambient temperature. In another example, the parameter update module includes: a second determining unit for determining the predetermined ambient temperature that is greater than the ambient temperature and closest to the ambient temperature among the multiple predetermined ambient temperature values, and a second selecting unit for selecting a set of model parameters corresponding to the closest predetermined ambient temperature. In another example, the parameter update module includes: a third determining unit, used to determine a first predetermined ambient temperature that is closest to and smaller than the ambient temperature and a second predetermined ambient temperature that is larger than the ambient temperature among the plurality of predetermined ambient temperature values; a third selecting unit, used to select a first set of model parameters corresponding to the first predetermined ambient temperature and a second set of model parameters corresponding to the second predetermined ambient temperature; and a third calculation unit, used to calculate a set of model parameters corresponding to the ambient temperature based on the first set of model parameters and the second set of model parameters using an interpolation algorithm.

[0018] In one example, the temperature control module is configured to control the gain of the drive signal provided to the speaker according to the temperature control model, such that when the speaker is driven using the drive signal, the temperature of the speaker does not exceed the maximum allowable temperature.

[0019] In one example, the temperature control module includes: a first determining unit for determining the power of a drive signal provided to a loudspeaker; a prediction unit for predicting, based on the temperature control model, the maximum allowable loudspeaker power at the ambient temperature; a second determining unit for determining a gain adjustment factor for the drive signal based on the power of the drive signal and the maximum loudspeaker power; and an adjusting unit for adjusting the gain of the drive signal based on the gain adjustment factor so that the power of the drive signal does not exceed the maximum loudspeaker power.

[0020] In one example, the temperature control module includes: a first determining unit for determining the power of a drive signal provided to the speaker; a prediction unit for predicting, based on the temperature control model, the temperature rise of the speaker when the drive signal with that power is used to drive the speaker; a second determining unit for determining the temperature value of the speaker based on the ambient temperature and the temperature rise; a third determining unit for determining a gain adjustment factor of the drive signal based on at least one of the temperature rise and the temperature value; and an adjusting unit for adjusting the gain of the drive signal based on the gain adjustment factor, such that when the drive signal is used to drive the speaker, the temperature of the speaker does not exceed a maximum permissible temperature.

[0021] In one example, the temperature control module further includes a gain smoothing unit for smoothing the gain adjustment factor before the adjustment unit adjusts the gain of the drive signal based on the gain adjustment factor.

[0022] According to another embodiment, an electronic device may include: a speaker; and the temperature control device for the speaker described above.

[0023] According to another embodiment, an electronic device may include: one or more processors; and one or more memories storing instructions that, when executed by the one or more processors, cause the electronic device to perform the temperature control method for a speaker described above.

[0024] According to another embodiment, a computer-readable storage medium is provided that may store instructions that, when executed by a device, cause the device to perform the above-described temperature control method for a loudspeaker.

[0025] The above and other features and advantages of the present invention will become apparent from the following description of exemplary embodiments taken in conjunction with the accompanying drawings. Attached Figure Description

[0026] Figure 1 This is a flowchart of a temperature control method for a loudspeaker according to an embodiment of the present invention.

[0027] Figure 2 It is a graph showing the speaker ambient temperature curve estimated based on sensing data from a selected temperature sensor and the speaker ambient temperature curve calculated based on current and voltage data.

[0028] Figure 3 This is a flowchart of a method for determining ambient temperature according to an embodiment of the present invention.

[0029] Figure 4 This is a temperature rise curve of the speaker voice coil at an ambient temperature.

[0030] Figure 5 This is a flowchart of a method for performing temperature control of a loudspeaker using a temperature control model according to an embodiment of the present invention.

[0031] Figure 6 This is a flowchart of a method for performing temperature control of a loudspeaker using a temperature control model according to another embodiment of the present invention.

[0032] Figure 7 This is a block diagram of a loudspeaker temperature control device according to an embodiment of the present invention.

[0033] Figure 8 This is a block diagram of a temperature determination module according to an embodiment of the present invention.

[0034] Figure 9A , 9B 9C and 9C are block diagrams of a parameter update module according to an embodiment of the present invention.

[0035] Figure 10A and 10B These are block diagrams of a temperature control module according to an embodiment of the present invention.

[0036] Figure 11 This is a block diagram of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0037] To facilitate a better understanding of the principles of the present invention, exemplary embodiments of the invention will be described below in conjunction with the accompanying drawings. It should be understood that the embodiments described below are only a part of the embodiments of the present invention, and not all of them. Other embodiments that can be obtained by those skilled in the art based on the teachings of this application should also fall within the scope of protection defined by the claims of this application.

[0038] Figure 1 This is a flowchart of a temperature control method 100 for a speaker according to an embodiment of the present invention. The temperature control method 100 can be applied to any electronic device with a speaker, such as a mobile phone, tablet, music player, television, or other electronic device with a built-in speaker. For ease of description, various embodiments of the present invention are described below using a mobile phone as an example; however, it should be understood that electronic devices to which the various embodiments of the present invention can be applied are not limited to mobile phones. Figure 1 As shown, the temperature control method 100 may include a step 110 of determining the ambient temperature of the speaker, a step 120 of updating the model parameters of the temperature control model for the speaker based on the determined ambient temperature of the speaker, and a step 130 of performing temperature control on the speaker using the temperature control model based on the updated model parameters. Each step will be described in detail below.

[0039] In step 110, various methods can be used to determine the ambient temperature of the speaker. In this application, ambient temperature refers to the temperature of the environment in which the speaker is located, particularly the temperature of the environment in which the speaker's voice coil (also called the moving coil) is located. In some embodiments, the ambient temperature of the speaker can be determined by measuring the temperature of the environment in which the voice coil is located, or the temperature of the voice coil can be measured as the ambient temperature. As an example, the speaker itself may include a dedicated temperature sensor, such as a thermistor, thermocouple, or other type of temperature sensor, which can be placed near the voice coil, for example, in or near the cavity housing the voice coil, to measure the ambient temperature of the speaker. As another example, the audio drive signal provided to the speaker's voice coil is generally provided by a drive circuit, such as an audio power amplifier chip. If the audio power amplifier chip provides current and voltage data for the drive signal, the resistance of the voice coil can be calculated based on this current and voltage data, and the voice coil temperature can be determined as the ambient temperature of the speaker based on the relationship between the voice coil resistance and temperature.

[0040] In other embodiments, if the speaker itself does not have a dedicated temperature sensor for measuring ambient temperature, and the speaker's drive circuitry, such as an audio power amplifier chip, cannot provide current and voltage data for the drive signal, then one or more other temperature sensors within the electronic device can be used to estimate the speaker's ambient temperature. These "other" temperature sensors can be located outside the speaker and not in direct contact with it; that is, they are not dedicated to the speaker but are temperature sensors integrated into the electronic device for other purposes. Before using these one or more other temperature sensors to estimate the speaker's ambient temperature, one or more temperature sensors that can be used to characterize the speaker's ambient temperature can be pre-selected / determined from a plurality of temperature sensors integrated into the electronic device, and a speaker ambient temperature estimation model can be established. This process will be described in detail below.

[0041] In one embodiment, one or more optimal temperature sensors and related ambient temperature estimation models for characterizing the speaker's ambient temperature in an electronic device can be pre-determined through offline testing; that is, the data processing method. Taking a mobile phone as an example, most mobile phones have multiple built-in thermistors as temperature sensors to monitor the temperature of various components, such as battery temperature, camera module temperature, display temperature, charging circuit temperature, and casing temperature. The casing temperature can further include the front casing temperature, back casing temperature, and mid-frame temperature. Therefore, existing temperature sensor data sources can be used to approximately characterize the speaker's ambient temperature, such as the temperature of the environment where the speaker's voice coil is located. Considering that the number and location of internal temperature sensors vary among different mobile phone models, and their relative distance from the speaker also differs, it is necessary to select one or more temperature data sources from all available mobile phone data sources whose readings are closest to the speaker voice coil temperature. Furthermore, considering that some temperature sensors are easily affected by the rapid heating of surrounding components, such as camera photography and video recording, and fast battery charging, the heating of these components does not cause a significant change in the internal ambient temperature of the speaker, leading to temperature readings that deviate significantly from the actual ambient temperature of the speaker voice coil in a short period. Therefore, it is necessary to preprocess the selected temperature data, such as removing outliers under special operating conditions or smoothing the data, to ensure that the speaker ambient temperature can be estimated as accurately as possible from one or more selected temperature sensor data sources under any mobile phone operating condition. To determine the optimal temperature data source and data preprocessing method for speaker ambient temperature estimation for a specific mobile phone, one embodiment of this application proposes the following offline experimental steps.

[0042] First, a low-amplitude (i.e., low-power) pilot signal, such as a 100mV 20Hz single-frequency signal, can be continuously played using the phone's built-in speaker. In the laboratory, an external acquisition device is connected to the speaker's drive signal input and output terminals to collect the voltage and current data of the speaker's drive signal. The speaker voice coil temperature T is then calculated using the following formula 1. spk (n). When playing a small-amplitude pilot signal, the voice coil generates little heat and will not cause the voice coil temperature to rise. Therefore, the calculated voice coil temperature T at this time is... spk (n) can be considered as its ambient temperature T spk_ambient (n).

[0043]

[0044] Among them, R dc (n) represents the voltage V collected in real time. rms_20Hz (n) and current I rms_20Hz(n) The calculated DC impedance of the voice coil, R0 is the reference value of the DC impedance of the voice coil measured at a specific temperature T0 (usually 25℃) during loudspeaker production line calibration, a is the temperature rise coefficient of the voice coil material, usually 0.00393, and n represents the signal sampling sequence index.

[0045] While the speaker continuously plays the pilot signal, the phone, with its screen off and without any other operation (i.e., no temperature change), is placed in a temperature chamber. The temperature chamber is set sequentially to 10℃, 20℃, 30℃, and 40℃ and maintained for 30 minutes. During this process, data from all the phone's built-in temperature sensors are continuously collected and stored. The data from the k-th temperature sensor is denoted as T. sense_k (n), where n is the sampling sequence index, and n = 0 to N-1, meaning there are a total of N sample data. Calculate the temperature T of each sensor. sense_k (n) and the ambient temperature of the voice coil T spk_ambient Let e ​​be the average temperature error between (n) and the average temperature error of the k-th temperature sensor. k As shown in Formula 2 below, the average temperature errors of all temperature sensors are sorted from smallest to largest. The top L sensors with the smallest errors are initially determined as the sensor data sources for subsequent speaker ambient temperature estimation, where L is an integer greater than or equal to 1, preferably an integer greater than 1. Through this step, the L temperature sensors in the phone's built-in temperature sensors whose readings are closest to the speaker ambient temperature can be determined when the ambient temperature changes.

[0046]

[0047] Next, while the pilot signal is continuously played through the speaker, the phone is placed in an environment with a room temperature of 20°C, such as a 20°C temperature chamber. Several scenarios that cause the phone to overheat are then performed, such as recording video for 10 minutes, fast charging for 10 minutes, downloading a movie or continuously reading / writing a large file for 10 minutes, etc. During this process, data from the L temperature sensors with the smallest error determined in the previous step are continuously collected and stored. Let the data from the i-th sensor be T. sense_i (n), the total number of samples is M, i.e., n = 0 to M-1, and the mean error is calculated with the ambient temperature data of the speaker at the corresponding time. The mean temperature error of the i-th temperature sensor is E. i As shown in Formula 3 below, the average temperature error E of the L temperature sensors is... iThe sensors are sorted from smallest to largest to determine the top m temperature sensors with the smallest errors among the L sensors. These m sensors are then used as the final sensor data sources for estimating the speaker's ambient temperature. Here, m is an integer greater than or equal to 1, and m is less than or equal to L. Through this step, the m temperature sensors with the smallest errors between their readings (i.e., temperature sensing data) and the speaker's ambient temperature during the operation of the electronic device, including under various heating scenarios, are ultimately selected for estimating the speaker's ambient temperature.

[0048]

[0049] Finally, we can observe the temperature data and temperature error of the m temperature sensors identified above in scenarios where the phone is prone to overheating. We can then select an appropriate data processing method to process the temperature data from the m sensors to further reduce the average temperature error when the phone heats up rapidly, and determine the final predicted ambient temperature T for the speaker. ambient The output expression (n) is the model or algorithm used to estimate the speaker ambient temperature from the readings of these m temperature sensors. Equation 4 below shows an example of the speaker ambient temperature output expression using mean filtering, Equation 5 shows an example of the speaker ambient temperature output expression using median filtering, where Median() represents the median filtering function, and Equation 6 shows an example of the speaker ambient temperature output expression using piecewise filtering. It is understood that these expressions are given only as examples, and embodiments of the present invention can also employ other data processing methods to estimate the speaker ambient temperature from the readings of m temperature sensors.

[0050]

[0051] T ambient (n) = Median(T) sense_1 (n),T sense_2 (n),...T sense_m (n)) (Formula 5)

[0052]

[0053] It is understood that the above steps can be performed offline in a laboratory for a specific model of mobile phone, and the determined m temperature sensors and the related expressions (such as formulas 4, 5 or 6) for estimating the ambient temperature of the speaker using the readings of these m temperature sensors can be applied to that specific model of mobile phone. Figure 2 The image shows the ambient temperature prediction curve T obtained by averaging the readings of three temperature sensors from a certain mobile phone model: the front cover, the back cover, and the charging port. ambient(n), and the speaker voice coil temperature curve T calculated from the current (I) and voltage (V) data of the speaker drive signal when only a small-amplitude pilot signal is played (equivalent to being silent, and the speaker does not heat up). spk (n), the two largely overlap in non-heating scenarios. Furthermore, after a video is played at normal high volume causing the speaker to heat up rapidly, and then played at silent mode, the speaker temperature slowly drops back to the ambient temperature value, which also largely coincides with the ambient temperature curve estimated based on temperature sensor data. From Figure 2 The results show that the ambient temperature T estimated using the selected internal temperature sensor... ambient (n) can accurately characterize the ambient temperature of the loudspeaker, or more specifically, the ambient temperature of the loudspeaker voice coil.

[0054] Figure 3 A method for determining the ambient temperature of a loudspeaker according to an embodiment of this application is shown. Figure 1 Perform step 110 as shown. (Refer to...) Figure 3 In step 112, sensing data from m temperature sensors (where m is an integer greater than or equal to 1) determined through the aforementioned offline experiments can be acquired. In step 114, the ambient temperature of the speaker can be estimated based on the acquired sensing data from the m temperature sensors using an expression determined through the aforementioned offline experiments, such as, but not limited to, any one of formulas 4-6. As mentioned above, the selected m temperature sensors can be located outside the speaker in the electronic device and do not directly contact the speaker; that is, they are not temperature sensors specifically designed for the speaker, but rather temperature sensors built into the electronic device for other purposes. Furthermore, the selected m temperature sensors are those that, as determined through the aforementioned offline experiments, have the smallest error between their temperature sensing data and the speaker's ambient temperature during the operation of the electronic device, including during heat-generating scenarios such as playing videos at high volume or fast charging.

[0055] Return to reference Figure 1 In step 120, the model parameters for the speaker temperature control model can be updated based on the determined ambient temperature of the speaker. According to one embodiment of the invention, the speaker temperature control model may include multiple sets of model parameters set for multiple preset ambient temperature values, so that during operation of the electronic device, based on, for example, the most suitable set of model parameters can be selected / determined, i.e., the model parameters can be updated, according to the ambient temperature most recently determined in step 110. To better understand the principles of the invention, some speaker temperature control models will be described herein as examples; however, it should be understood that the invention is not limited to any specific speaker temperature control model.

[0056] In one embodiment, a temperature control model based on temperature rise prediction can be used, as shown below.

[0057] As shown in Equation 7:

[0058]

[0059] Among them, T ambient (n) represents the ambient temperature of the loudspeaker's voice coil, dT spk (n), dT spk (n-1) and dT spk (n-2) represent the speaker voice coil relative to the ambient temperature T for the nth sample and the first two samples, respectively. ambient The temperature rise of (n), P(n), P(n-1), and P(n-2) are the instantaneous power of the speaker drive signal at the nth sample and the first two samples, respectively, T. spk (n) represents the current sampled voice coil temperature, and [α1,α2,β0,β1,β2] represents the model coefficients.

[0060] When establishing the temperature control model based on temperature rise prediction as shown in Formula 7, multiple different preset ambient temperature values ​​T can be considered in advance. ambient (n) determines different model coefficients [α1, α2, β0, β1, β2]. In one embodiment, the mobile phone can be placed in a temperature chamber, and different temperature chamber temperatures such as 0°C, 10°C, 20°C, 30°C, and 45°C can be set. A temperature rise test sound source composed of single frequency, pink noise, and music can be played. An external acquisition device is connected to the speaker input and output terminals to acquire the voltage and current data of the speaker drive signal, calculate the voice coil resistance, and thus determine the voice coil temperature, thereby obtaining the speaker temperature rise curve at that ambient temperature. Figure 4 An example of a loudspeaker temperature rise curve measured at an ambient temperature of 30°C is shown, where the horizontal axis represents time corresponding to the sampling index n, and the vertical axis represents the loudspeaker voice coil temperature. Figure 4 It can be seen that the heating trend of the loudspeaker is quite similar to that of the second-order exponential model. Therefore, the heating model expression can be set as a discrete recursive expression of the second-order exponential model, as shown in Equation 7 above. It should be understood that the heating model is not limited to the second-order exponential model; other models such as the first-order exponential model, the third-order and higher-order exponential models, or logarithmic models can also be used. Figure 4 Sampling times n and T spk (n), T ambientSubstituting the known quantities (n) into the heating model expression in Formula 7, and performing least-squares system identification or using other parameter identification methods, the five heating model parameters [α1, α2, β0, β1, β2] of the current speaker at an ambient temperature of 30°C can be determined. Similarly, model parameters at multiple preset ambient temperatures can be determined. For example, model parameters at ambient temperatures of 0°C, 10°C, 20°C, 30°C, and 45°C can be obtained, as shown in Table 1 below. It should be understood that the model expressions, number of parameters, parameter values, and number and values ​​of preset ambient temperatures given herein are examples, and the present invention is not limited to these specific examples.

[0061] Table 1: Model parameters of the heating model under different ambient temperatures

[0062] 0℃ Tmodel_1 0.1 0.05 0.01 0.05 0.002 10℃ Tmodel_2 0.15 0.06 0.015 0.06 0.004 20℃ Tmodel_3 0.2 0.07 0.02 0.07 0.006 30℃ Tmodel_4 0.25 0.08 0.025 0.08 0.008 45℃ Tmodel_5 0.3 0.09 0.03 0.09 0.01

[0063] In another embodiment, a temperature control model based on a maximum power threshold can be used. In this model, a corresponding maximum power threshold can be set for multiple preset ambient temperatures. The maximum power threshold indicates that at that ambient temperature, when a drive signal with the maximum power threshold is applied to the speaker voice coil, the temperature of the speaker voice coil will rise to the maximum allowable temperature. In other words, at a predetermined ambient temperature, only drive signals with power lower than the maximum power threshold can be applied to the speaker. In one embodiment, a mobile phone can be placed in a temperature chamber, and different temperature chamber temperatures can be set, such as 0°C, 10°C, 20°C, 30°C, and 45°C. A temperature rise test sound source composed of a combination of single-frequency, pink noise, and music can be played. An external acquisition device is connected to the speaker's input and output terminals to collect the voltage and current data of the speaker drive signal, calculate the voice coil resistance, and thus determine the voice coil temperature. If, during the playback of the test audio source, the highest temperature of the voice coil falls below the maximum permissible temperature Tmax (e.g., 100°C or another value), the output gain of the power amplifier can be increased accordingly (i.e., the volume increased), and the test audio source can be played again until the highest temperature of the voice coil reaches the maximum permissible temperature Tmax. The maximum power of the test signal at this point is recorded as the maximum power threshold Pmax corresponding to that ambient temperature. Table 2 below shows examples of the maximum power threshold Pmax for speakers determined for different ambient temperatures. It should be understood that the values ​​shown in Table 2 are merely examples, and the present invention is not limited to these specific values.

[0064] Table 2: Maximum power threshold of loudspeakers under different ambient temperatures

[0065] 0℃ 2 10℃ 1.8 20℃ 1.6 30℃ 1.4 45℃ 1.2

[0066] Return to reference Figure 1In step 120, various methods can be used to select the model parameters of the temperature control model based on the speaker's ambient temperature. As an example, among a plurality of preset ambient temperature values ​​in the model, the preset ambient temperature closest to the ambient temperature value determined in step 110 can be determined, and a set of model parameters corresponding to the closest preset ambient temperature can be selected. For example, when using the temperature control model based on temperature rise prediction as shown in Formula 7, if the determined ambient temperature value is 24℃, then according to Table 1, the closest preset ambient temperature is 20℃, therefore a set of parameters [α1, α2, β0, β1, β2] numbered Tmodel_3 can be selected; if using the temperature control model based on the maximum power threshold as shown in Table 2, then according to Table 2, the preset ambient temperature closest to the ambient temperature value of 24℃ is 20℃, therefore the corresponding maximum power threshold Pmax can be selected as 1.6 watts.

[0067] It can be noted that in the above example, since the closest preset ambient temperature is lower than the determined actual ambient temperature, it may lead to underprotection. That is, when a signal with the selected maximum power threshold is applied to the speaker voice coil, the maximum temperature of the voice coil may slightly exceed the maximum allowable temperature Tmax. Therefore, in another example, the preset ambient temperature that is greater than and closest to the determined actual ambient temperature among multiple preset ambient temperature values ​​can be determined, and a set of model parameters corresponding to the determined preset ambient temperature can be selected. For example, when using the temperature control model based on temperature rise prediction as shown in Equation 7, if the determined ambient temperature is 24°C, then according to Table 1, the preset ambient temperature that is greater than 24°C and closest to it is 30°C. Therefore, a set of parameters [α1, α2, β0, β1, β2] numbered Tmodel_4 can be selected. If the temperature control model based on the maximum power threshold shown in Table 2 is used, then according to Table 2, the preset ambient temperature that is greater than the ambient temperature value of 24°C and closest to it is 30°C. Therefore, the corresponding maximum power threshold Pmax can be selected as 1.4 watts.

[0068] Similarly, it can be noted that in the above example, since the selected preset ambient temperature is higher than the determined actual ambient temperature, it may lead to a certain degree of overprotection, that is, limiting the power of the drive signal applied to the speaker voice coil too low. Therefore, in another embodiment, an interpolation algorithm can be used to determine the model parameters. Specifically, among a plurality of preset ambient temperature values, a first preset ambient temperature that is closest to and smaller than the determined actual ambient temperature and a second preset ambient temperature that is larger than it can be determined. Then, an interpolation algorithm is used to calculate a set of model parameters corresponding to the determined actual ambient temperature based on a first set of model parameters corresponding to the first preset ambient temperature and a second set of model parameters corresponding to the second preset ambient temperature. For example, when the temperature control model based on temperature rise prediction shown in Formula 7 is used, the set of parameters corresponding to the ambient temperature of 24°C calculated by the interpolation algorithm is [0.22, 0.074, 0.022, 0.074, 0.0068]; if the temperature control model based on the maximum power threshold shown in Table 2 is used, then the maximum power threshold Pmax corresponding to the ambient temperature of 24°C calculated by the interpolation algorithm is 1.52 watts. Since the interpolation algorithm is known, the relevant calculation process will not be described in detail here. It can be understood that when the model parameters corresponding to the ambient temperature are determined through the interpolation algorithm, more precise speaker temperature control can be achieved.

[0069] Return to reference Figure 1 After updating the model parameters of the temperature control model according to the ambient temperature in step 120 (i.e., selecting or calculating model parameters corresponding to the ambient temperature), in step 130, temperature control of the speaker can be performed using the temperature control model based on the updated model parameters. Generally, performing temperature control of the speaker may include controlling the gain of the speaker drive signal according to the temperature control model, that is, controlling the power of the speaker drive signal, so that when the drive signal is used to drive the speaker voice coil, the temperature of the speaker voice coil does not exceed the maximum allowable temperature to ensure normal operation of the speaker.

[0070] Understandably, the specific temperature control process for a speaker can vary depending on the temperature control model used. Figure 5 This is a flowchart illustrating a method for performing temperature control on a loudspeaker when using a temperature control model based on temperature rise prediction. This method can be executed at the loudspeaker temperature control step 130 described above. (Refer to...) Figure 5 In step 131, the power of the drive signal supplied to the speaker can be determined. For example, the drive signal can be sampled, the mean square value (RMS) of the drive signal within a certain time window can be obtained by the mean square value (RMS) detection unit, and the power of the drive signal can be calculated according to the following formula 8:

[0071]

[0072] Among them, R dc (n-1) is the DC impedance value of the speaker in the previous sample, which can be derived from the speaker voice coil temperature estimation formula (i.e., Formula 1 above), as shown in Formula 9 below, where T spk (n-1) represents the speaker voice coil temperature at the previous sampling time. Of course, other methods can also be used to determine the power of the drive signal; this invention is not limited to the examples described herein.

[0073]

[0074] In step 132, the temperature rise of the speaker can be predicted based on the temperature control model with updated model parameters when the drive signal is used to drive the speaker; then in step 133, the speaker temperature value is determined, i.e., the temperature reached after the temperature rise from the ambient temperature. For example, the temperature rise dT can be calculated using Equation 7. spk (n) and speaker temperature T spk (n).

[0075] In step 134, a gain adjustment factor for the drive signal can be determined based on at least one of the speaker temperature rise value and the speaker temperature value. It can be understood that, based on the predicted speaker temperature T... spk (n) adjusts the speaker drive signal to ensure that the speaker temperature does not exceed the maximum allowable temperature. In one embodiment, a proportional-integral-derivative (PID) controller can be used, for example, to calculate parameter M according to the following formula 10.

[0076]

[0077] Where, ΔT=T spk (n)-(T max -T offset (T) represents the voice coil temperature. spk (n) and the critical temperature for starting temperature control (T) max -T offset The difference between T and T offset The specified temperature control activation threshold is set when the temperature rises to a point below the maximum allowable temperature T. max The difference is T offset When temperature control is activated, its typical value range is [0,20]; the proportional factor K p The typical value range of is [0.01, 1], and the integration factor K i The typical value range for is [0.0001, 0.01], and the differential factor K d The typical value range for K is [0.01, 0.1]. Adjusting the above K... p Ki and K d The parameters can change the speed of the PID temperature control.

[0078] After determining the parameter M, the gain adjustment factor gain(n) can be calculated according to the following formula 11.

[0079]

[0080] Where min() is the function that outputs the smaller value, P input (n) represents the driving signal power value determined according to Formula 8, p max The maximum rated power specified in the speaker's datasheet or a power threshold arbitrarily specified by the user, typically p max It can be set to a relatively large value, such as 2w to 4w, to ensure that the loudness of the speaker is sufficiently high at low and normal temperatures. The gain adjustment factor gain(n) determined according to Formula 11 ensures that the speaker's voice coil temperature does not exceed (T... max -T offset The power is limited to the specified p. max Below the threshold, once the voice coil temperature exceeds the critical temperature control temperature (T... max -T offset Then, the aforementioned power threshold p is adaptively reduced. max That is: when T spk (n) Exceeds the critical temperature (T) max -T offset The more p, the larger the value of parameter M. max The smaller the coefficient 1 / (1+M) before the term, the lower the original power threshold p. max Automatic attenuation further limits the speaker's real-time output power, thereby preventing the speaker temperature from exceeding T. max It should be understood that the formula for calculating the gain adjustment factor given here is merely an example. Based on the principles taught here, other formulas can also be used to calculate the gain adjustment factor, as long as the speaker temperature is prevented from exceeding the maximum permissible temperature T. max That's all.

[0081] In some embodiments, optionally, to prevent drastic changes in the drive signal gain, the calculated gain adjustment factor can be smoothed at step 135. For example, in one embodiment, a gain smoothing module with an adjustable time constant can be connected in series after the gain adjustment factor calculation unit, so that the gain adjustment factor changes smoothly to the calculated gain adjustment factor value over a period of time, which can avoid deterioration in sound quality caused by drastic changes in gain.

[0082] Finally, in step 136, the gain of the speaker drive signal can be adjusted based on the determined gain adjustment factor so that when the drive signal is used to drive the speaker, the speaker temperature does not exceed the maximum allowable temperature. For example, a multiplier can be placed in the transmission path of the drive signal to multiply the drive signal by the smoothed gain adjustment factor, and then the adjusted drive signal can be output to the speaker.

[0083] The above describes an example of performing temperature control on a loudspeaker when using a temperature control model based on temperature rise prediction. Figure 6 This is a flowchart of a method for performing temperature control on a loudspeaker when using a temperature control model based on the prediction of the maximum power threshold. It can also be performed at the loudspeaker temperature control step 130 above. Figure 6 Some steps in the process may be related to Figure 5 The steps are similar to those in the previous section, and will be briefly described here.

[0084] Reference Figure 6 In step 137, the power of the drive signal supplied to the speaker voice coil can be determined. For example, the drive signal can be sampled, the mean square value (RMS) of the drive signal within a certain time window can be obtained by the mean square value (RMS) detection unit, and the power P of the drive signal can be calculated according to the following formula 12. input (n):

[0085]

[0086] Where R can be the rated impedance value of the speaker voice coil.

[0087] In step 138, the maximum permissible loudspeaker power P at the current ambient temperature can be predicted based on the temperature control model. max (n), where the current ambient temperature can be determined in step 110 as described above. When using a temperature control model based on a maximum power threshold, as shown in Table 2 above, the maximum power threshold corresponding to the current ambient temperature can be determined, which has already been discussed above regarding... Figure 1 Step 120, as shown, has been described in detail and will not be repeated here. In other words, the maximum power threshold determined when updating the model parameters in step 120 can be used as the maximum speaker power allowed at the current ambient temperature, as determined in step 138.

[0088] In step 139, the power of the driving signal P can be used as a basis. input (n) and the maximum allowable speaker power P max (n), which determines the gain adjustment factor used for the speaker drive signal. In one embodiment, the gain adjustment factor gain(n) can be calculated according to the following formula 13.

[0089]

[0090] In step 140, optionally, the calculated gain adjustment factor can be smoothed to prevent drastic changes in the drive signal gain from affecting the sound quality. For example, in one embodiment, a gain smoothing module with an adjustable time constant can be connected in series after the gain adjustment factor calculation unit, so that the gain adjustment factor smoothly changes to the calculated gain adjustment factor value over a period of time.

[0091] Finally, in step 141, the gain of the speaker drive signal can be adjusted based on the determined gain adjustment factor so that the power of the speaker drive signal does not exceed the maximum allowable power, thereby ensuring that the speaker temperature does not exceed the maximum allowable temperature T. max .

[0092] Return to reference Figure 1 The steps of the temperature control method 100 for a speaker have been described above. It is understood that during operation of the electronic device, the steps of determining the speaker's ambient temperature and updating the temperature control model parameters can be repeatedly performed. For example, these steps can be repeated at predetermined periods (i.e., at predetermined time intervals), or in response to specific events (e.g., events that cause the electronic device to heat up, such as fast charging, playing video or music at high volume, etc.), thereby enabling the aforementioned temperature control process for the speaker to be performed based on the latest temperature control model parameters.

[0093] Figure 7 A functional block diagram of a loudspeaker temperature control device 200 according to an embodiment of the present invention is shown. The temperature control device 200 can be implemented in an electronic device having a built-in loudspeaker to implement the above-described... Figure 1-6 The speaker temperature control method is described above. Given the detailed description of the speaker temperature control method above, a brief description of the various functional modules in the temperature control device 200 will be provided here. It should be understood that the various functional modules included in the temperature control device 200 can be implemented through hardware, software, or a combination of hardware and software.

[0094] Reference Figure 7The speaker temperature control device 200 may include: a temperature determination module 210 for determining the ambient temperature of the speaker; a parameter update module 220 for updating the model parameters of the speaker temperature control model based on the speaker ambient temperature; and a temperature control module 230 for performing temperature control on the speaker using the speaker temperature control model based on the updated model parameters. For example, the temperature determination module 210 may be configured to perform step 110 of the temperature control method 100 described above, the parameter update module 220 may be configured to perform step 120, and the temperature control module 230 may be configured to perform step 130. In one embodiment, the temperature determination module 210 and the parameter update module 220 may repeatedly perform the steps of determining the speaker ambient temperature and updating the temperature control model parameters at predetermined time intervals or in response to predetermined events, so that the temperature control module 230 can perform temperature control on the speaker based on the most recently updated model parameters.

[0095] Figure 8 A functional block diagram of a temperature determination module according to an embodiment of the present invention is shown. Figure 8 As shown, the temperature determination module 210 may include: an acquisition unit 212, configured to acquire sensing data from one or more temperature sensors disposed in an electronic device including a speaker; and a temperature estimation unit 214, configured to estimate the ambient temperature of the speaker based on the sensing data from the one or more temperature sensors. For example, the acquisition unit 212 may be configured to perform step 112 described above, and the temperature estimation unit 214 may be configured to perform step 114 described above. The one or more temperature sensors may be disposed outside the speaker and not in direct contact with the speaker; in other words, the one or more temperature sensors are not dedicated to the speaker. For example, they may be sensors disposed in the cavity of the speaker to house the voice coil or near the voice coil to sense the voice coil temperature. In one embodiment, the one or more temperature sensors may be the ones with the smallest error between their temperature sensing data and the ambient temperature of the speaker during operation of the electronic device, including in heating scenarios, from among a plurality of temperature sensors of the electronic device determined offline.

[0096] Figure 9A , Figure 9B and Figure 9C Functional block diagrams of a parameter update module according to an embodiment of the present invention are shown. As previously described, the loudspeaker temperature control model may include multiple sets of model parameters set for multiple predetermined ambient temperature values. The parameter update module can update the model parameters of the loudspeaker temperature control model based on the loudspeaker ambient temperature, that is, select or determine model parameters adapted to the current loudspeaker ambient temperature. First, refer to... Figure 9AIn one embodiment, the parameter update module 220 may include: a first determining unit 221, configured to determine, among a plurality of predetermined ambient temperature values, the predetermined ambient temperature closest to the speaker's ambient temperature; and a first selecting unit 222, configured to select a set of model parameters corresponding to the closest predetermined ambient temperature. In another embodiment, such as Figure 9B As shown, the parameter update module 220 may include: a second determining unit 223, configured to determine, among a plurality of predetermined ambient temperature values, the predetermined ambient temperature that is greater than and closest to the speaker ambient temperature; and a second selecting unit 224, configured to select a set of model parameters corresponding to the closest predetermined ambient temperature. In another embodiment, as... Figure 9C As shown, the parameter update module 220 may include: a third determining unit 225, used to determine a first predetermined ambient temperature that is closest to and smaller than the speaker ambient temperature and a second predetermined ambient temperature that is larger than the speaker ambient temperature among a plurality of predetermined ambient temperature values; a third selecting unit 226, used to select a first set of model parameters corresponding to the first predetermined ambient temperature and a second set of model parameters corresponding to the second predetermined ambient temperature; and a third calculation unit 227, used to calculate a set of model parameters corresponding to the speaker ambient temperature based on the first set of model parameters and the second set of model parameters using an interpolation algorithm.

[0097] In some embodiments, the temperature control module 230 may be configured to control the gain of the speaker drive signal according to a speaker temperature control model, such that when the speaker is driven using the drive signal, the speaker temperature will not exceed the maximum allowable temperature. Figure 10A and Figure 10B Functional block diagrams of a temperature control module according to an embodiment of the present invention are shown. First, refer to… Figure 10A In one embodiment, the temperature control module 230 may include: a first determining unit 231, configured to determine the power of a drive signal provided to the speaker; a prediction unit 232, configured to predict the maximum allowable speaker power at the ambient temperature based on a temperature control model; a second determining unit 233, configured to determine a gain adjustment factor for the speaker drive signal based on the power of the drive signal and the maximum allowable speaker power; and an adjusting unit 235, configured to adjust the gain of the speaker drive signal based on the determined gain adjustment factor, such that the power of the drive signal does not exceed the maximum allowable speaker power. Optionally, in one example, the temperature control module 230 may further include a gain smoothing unit 234, configured to smooth the gain adjustment factor before the adjusting unit 235 adjusts the gain of the speaker drive signal based on the determined gain adjustment factor, to avoid speaker sound quality degradation caused by drastic changes in the drive signal gain. In one embodiment, each of the units 231 to 235 in the temperature control module 230 may be configured to perform the above-mentioned... Figure 6Steps 137 to 141 are described.

[0098] In another embodiment, such as Figure 10B As shown, the temperature control module 230 includes: a first determining unit 236, configured to determine the power of the drive signal provided to the speaker; a prediction unit 237, configured to predict the temperature rise of the speaker when the drive signal is used to drive the speaker according to a temperature control model; a second determining unit 238, configured to determine the temperature value of the speaker based on the ambient temperature of the speaker and the predicted temperature rise; a third determining unit 239, configured to determine a gain adjustment factor for the drive signal based on at least one of the temperature rise and the speaker temperature value; and an adjusting unit 241, configured to adjust the gain of the speaker drive signal based on the gain adjustment factor, such that the speaker temperature does not exceed the maximum allowable temperature when the drive signal is used to drive the speaker. Optionally, the temperature control module 230 may further include a gain smoothing unit 240, configured to smooth the gain adjustment factor before the adjusting unit 241 adjusts the gain of the speaker drive signal based on the determined gain adjustment factor, to avoid a decrease in speaker sound quality caused by drastic changes in the gain of the drive signal. In one embodiment, each of the units 236 to 241 in the temperature control module 230 may be configured to perform the above-mentioned... Figure 5 Steps 131 to 136 are described.

[0099] An embodiment of the present invention also provides an electronic device having a built-in speaker, which includes the above-mentioned reference. Figures 7 to 10B The described speaker temperature control device is used to control the temperature of the speaker. Such electronic devices may include, but are not limited to, mobile phones, televisions, tablets, laptops, music players, etc.

[0100] Figure 11 A block diagram of an electronic device according to an embodiment of the present invention is shown. Figure 11 As shown, the electronic device 300 may include one or more processors 310, and one or more memories 320 connected to the processors 310 via a bus 330. The electronic device 300 may also include other components connected to the processor via the bus 330, such as input / output devices, including but not limited to displays, keyboards, microphones, and speakers. The memory 320 may contain instructions 322, which, when executed by the processor 310, cause the electronic device 300 to perform the speaker temperature control method described above.

[0101] It should be understood that, in one embodiment, processor 310 may be the main processor of electronic device 300, such as a central processing unit (CPU), and memory 320 may be memory associated with the main processor of electronic device 300, such as random access memory (RAM) or read-only memory (ROM). The main processor may execute instructions in memory 320 to run the operating system of electronic device 300 and also perform the speaker temperature control method described above. In another embodiment, processor 310 may be a processor in audio power amplifier of electronic device 300, also referred to as a controller, such as a microcontroller unit (MCU), and memory 320 may be memory in audio power amplifier. Processor 310 may execute instructions in memory 320 to perform audio processing operations related to the speaker, including but not limited to the speaker temperature control method described above.

[0102] An embodiment of the present invention also provides a computer-readable medium storing computer-readable instructions. When the computer-readable medium is operated by a device, the device can perform the above-described speaker temperature control method. Examples of such computer-readable media include, but are not limited to, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable optical disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above devices.

[0103] It should be understood that the blocks in the figures can be implemented in various ways, including software, hardware, firmware, or any combination thereof. In some embodiments, one or more blocks may be implemented using software and / or firmware, such as machine-executable instructions stored in a storage medium. In addition to or in lieu of machine-executable instructions, some or all of the blocks in the figures may be implemented at least partially by one or more hardware logic units. For example, but not limited to, exemplary types of hardware logic units that may be used include field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-chips (SoCs), complex programmable logic devices (CPLDs), etc.

[0104] Furthermore, while the operations are described in a specific order, this should not be construed as requiring such operations to be performed in the specific order or sequence shown, or requiring all of the operations shown to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. Similarly, although several specific implementation details are included in the foregoing discussion, these details should not be construed as limiting the scope of this disclosure, but rather as descriptions of features specific to particular embodiments. Certain features described in the context of a single embodiment may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments.

[0105] Although the subject matter names have been described in language specific to structural features and / or methodological behavior, it should be understood that the subject matter names defined in the appended claims are not necessarily limited to the specific features or behaviors described above. Rather, the specific features and behaviors discussed above are disclosed as examples of implementing the claims.

Claims

1. A method for temperature control of a loudspeaker, comprising: Determine the ambient temperature of the speaker; Based on the ambient temperature, update the model parameters for the temperature control model of the speaker; as well as Based on the updated model parameters, the temperature control model is used to perform temperature control on the speaker. The temperature control model includes multiple sets of model parameters set for multiple predetermined ambient temperature values. Based on the ambient temperature, updating the model parameters for the temperature control model of the loudspeaker includes one of the following methods: Determine the ambient temperature that is closest to the ambient temperature among the plurality of predetermined ambient temperature values, and select a set of model parameters corresponding to the closest predetermined ambient temperature; Determine the predetermined ambient temperature that is greater than the ambient temperature and closest to the ambient temperature among the plurality of predetermined ambient temperature values, and select a set of model parameters corresponding to the closest predetermined ambient temperature; or Among the plurality of predetermined ambient temperature values, a first predetermined ambient temperature that is closest to and smaller than the ambient temperature and a second predetermined ambient temperature that is larger than the ambient temperature are determined. Then, an interpolation algorithm is used to calculate a set of model parameters corresponding to the ambient temperature based on a first set of model parameters corresponding to the first predetermined ambient temperature and a second set of model parameters corresponding to the second predetermined ambient temperature.

2. The method as described in claim 1, wherein, The steps of determining the ambient temperature of the loudspeaker and updating the model parameters of the temperature control model are repeatedly performed at predetermined time intervals or in response to predetermined events, thereby performing temperature control on the loudspeaker based on the most recently updated model parameters.

3. The method as described in claim 1, wherein, Determining the ambient temperature of the speaker includes: Acquire sensing data from one or more temperature sensors located in an electronic device including the speaker; and The ambient temperature of the speaker is estimated based on the sensing data from the one or more temperature sensors. The one or more temperature sensors are located outside the speaker and do not directly contact the speaker. The one or more temperature sensors are those that, among a plurality of temperature sensors of the electronic device determined offline, have the smallest error between their temperature sensing data and the ambient temperature of the speaker during operation of the electronic device, including in heating scenarios.

4. The method of claim 1, wherein, Based on the updated model parameters, performing temperature control of the speaker using the temperature control model includes: The gain of the drive signal provided to the loudspeaker is controlled according to the temperature control model so that when the loudspeaker is driven by the drive signal, the temperature of the loudspeaker does not exceed the maximum allowable temperature.

5. The method of claim 4, wherein, The gain of the drive signal provided to the speaker is controlled according to the temperature control model, including: Determine the power of the drive signal supplied to the speaker; The maximum allowable speaker power at the ambient temperature is predicted based on the temperature control model. Based on the power of the drive signal and the maximum speaker power, a gain adjustment factor for the drive signal is determined; and The gain of the drive signal is adjusted based on the gain adjustment factor so that the power of the drive signal does not exceed the maximum speaker power.

6. The method of claim 4, wherein, The gain of the drive signal provided to the speaker is controlled according to the temperature control model, including: Determine the power of the drive signal provided to the loudspeaker; The temperature control model predicts the temperature rise of the speaker when a drive signal with that power is used to drive the speaker. The temperature value of the speaker is determined based on the ambient temperature and the temperature rise. The gain adjustment factor of the drive signal is determined based on at least one of the temperature rise value and the temperature value; and The gain of the drive signal is adjusted based on the gain adjustment factor so that when the drive signal is used to drive the speaker, the temperature of the speaker does not exceed the maximum allowable temperature.

7. The method of claim 5 or 6, further comprising: Before adjusting the gain of the drive signal based on the gain adjustment factor, the gain adjustment factor is smoothed.

8. A temperature control device for a loudspeaker, comprising: Temperature determination module, used to determine the ambient temperature of the speaker; The parameter update module is used to update the model parameters of the temperature control model for the speaker based on the ambient temperature. as well as The temperature control module is used to perform temperature control on the speaker based on the updated model parameters and the temperature control model. The temperature control model includes multiple sets of model parameters set for multiple predetermined ambient temperature values. The parameter update module includes: A first determining unit is configured to determine, among the plurality of predetermined ambient temperature values, the predetermined ambient temperature closest to the ambient temperature; and a first selecting unit is configured to select a set of model parameters corresponding to the closest predetermined ambient temperature; or The second determining unit is used to determine, among the plurality of predetermined ambient temperature values, the predetermined ambient temperature that is greater than the ambient temperature and closest to the ambient temperature; and the second selecting unit is used to select a set of model parameters corresponding to the closest predetermined ambient temperature; or The third determining unit is used to determine, among the plurality of predetermined ambient temperature values, a first predetermined ambient temperature that is closest to and smaller than the ambient temperature and a second predetermined ambient temperature that is larger than the ambient temperature; the third selecting unit is used to select a first set of model parameters corresponding to the first predetermined ambient temperature and a second set of model parameters corresponding to the second predetermined ambient temperature; and the third calculating unit is used to use an interpolation algorithm to calculate a set of model parameters corresponding to the ambient temperature based on the first set of model parameters and the second set of model parameters.

9. The apparatus of claim 8, wherein, The temperature determination module and the parameter update module repeatedly execute the steps of determining the ambient temperature of the speaker and updating the model parameters of the temperature control model at predetermined time intervals or in response to predetermined events, so that the temperature control module performs temperature control on the speaker based on the most recently updated model parameters.

10. The apparatus of claim 8, wherein, The temperature determination module includes: Acquisition unit, configured to acquire sensing data from one or more temperature sensors disposed in an electronic device including the speaker; and A temperature estimation unit is used to estimate the ambient temperature of the speaker based on sensing data from the one or more temperature sensors. The one or more temperature sensors are located outside the speaker and do not directly contact the speaker. The one or more temperature sensors are those that, among a plurality of temperature sensors of the electronic device determined offline, have the smallest error between their temperature sensing data and the ambient temperature of the speaker during operation of the electronic device, including in heating scenarios.

11. The apparatus of claim 8, wherein, The temperature control module is configured to control the gain of the drive signal provided to the speaker according to the temperature control model, so that when the drive signal is used to drive the speaker, the temperature of the speaker does not exceed the maximum allowable temperature.

12. The apparatus of claim 11, wherein, The temperature control module includes: The first determining unit is used to determine the power of the drive signal provided to the loudspeaker; The prediction unit is used to predict the maximum allowable speaker power at the ambient temperature based on the temperature control model. The second determining unit is configured to determine a gain adjustment factor for the driving signal based on the power of the driving signal and the maximum speaker power; and An adjustment unit is configured to adjust the gain of the drive signal based on the gain adjustment factor so that the power of the drive signal does not exceed the maximum speaker power.

13. The apparatus of claim 11, wherein, The temperature control module includes: The first determining unit is used to determine the power of the driving signal provided to the loudspeaker; A prediction unit is configured to predict, based on the temperature control model, the temperature rise of the loudspeaker when a drive signal with that power is used to drive the loudspeaker; The second determining unit is used to determine the temperature value of the speaker based on the ambient temperature and the temperature rise value; The third determining unit is configured to determine the gain adjustment factor of the driving signal based on at least one of the temperature rise value and the temperature value; and An adjustment unit is configured to adjust the gain of the drive signal based on the gain adjustment factor, such that when the drive signal is used to drive the speaker, the temperature of the speaker does not exceed the maximum allowable temperature.

14. The apparatus of claim 12 or 13, wherein, The temperature control module also includes: A gain smoothing unit is used to smooth the gain adjustment factor before the adjustment unit adjusts the gain of the drive signal based on the gain adjustment factor.

15. An electronic device comprising: speaker; as well as The temperature control device for a loudspeaker according to any one of claims 8 to 14.

16. An electronic device comprising: One or more processors; as well as One or more memories storing instructions that, when executed by the one or more processors, cause the electronic device to perform the method of any one of claims 1 to 7.

17. A computer-readable storage medium having instructions stored thereon that, when executed by a means, cause the means to perform the method of any one of claims 1 to 7.

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