超高电极基板及其加工方法
By using a composite substrate structure and laser grooving and hole-filling electroplating processes, the problems of uneven and recessed electrodes in existing technologies have been solved, enabling the processing of large-size and ultra-thick electrodes and improving the reliability of substrate products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGSU PROVISION ELECTRONICS CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-17
AI Technical Summary
Existing packaging substrate processing technology cannot meet the production requirements for millimeter-level electrode height and thickness, resulting in uneven electrode surfaces and depression defects.
Using a composite substrate structure, insulating layers and copper foil layers are stacked, and large-size, ultra-thick electrodes are fabricated using laser sintering and hole-filling electroplating processes. Electrode pillars are then obtained by combining laser sintering and hole-filling electroplating processes and surface treatment is performed to ensure that the electrode surface is flat.
It enables the processing of large-size, ultra-thick electrodes with a smooth, un-dented electrode surface, significantly improving the reliability of substrate products.
Smart Images
Figure CN120857359B_ABST