Novel diamond water cooling head and manufacturing method thereof

CN120857412APending Publication Date: 2025-10-28HANGZHOU DIANZI UNIV
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Patent Information

Application Number
CN202510706890.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-29
Publication Date
2025-10-28

AI Technical Summary

Technical Problem

Existing copper water cooling heads are prone to corrosion and have low heat transfer efficiency in high heat flux density environments, and are difficult to adapt to the heat dissipation requirements of high power and high heat source density.

Method used

The water cooling head is made of diamond material, combined with the connection structure of diamond and copper composite materials, and designed with symmetrical channel microchannels. It is fixed with an aluminum base plate to form a multi-gradient heat dissipation structure.

Benefits of technology

It improves thermal conductivity, reduces thermal resistance, enhances corrosion resistance and oxidation resistance, adapts to the heat dissipation requirements of high power and high heat source density, extends service life, and reduces maintenance costs.

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Abstract

The invention discloses a novel diamond water-cooling head and a manufacturing method thereof, the novel diamond water-cooling head comprises a diamond water-cooling plate, a connection structure and a water nozzle, the connection structure is made of diamond and copper composite materials and is used for connecting the diamond water-cooling plate and the water nozzle; the diamond water cooling plate is provided with a micro-channel with symmetrical channels, and the micro-channel is connected with the connecting structure in a sealing manner to form a sealing structure of a water channel; the water nozzle is connected with the connecting structure and used for connecting cooling liquid. The heat conduction performance is greatly improved by relying on the ultrahigh heat conduction coefficient of the diamond and designing a connection structure.
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Citation Information

Patent Citations

  • Water-cooling heat dissipation structure

    CN222483960U