Semiconductor circuit structure and manufacturing method thereof

CN120857564APending Publication Date: 2025-10-28INVENTION & COLLABORATION LABORATORY INC
0 Cites 0 Cited by

Patent Information

Application Number
CN202510532479.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-06-28
Filing Date
2025-04-25
Publication Date
2025-10-28

Smart Images

  • Figure CN120857564A_ABST
    Figure CN120857564A_ABST
Patent Text Reader

Abstract

A semiconductor circuit structure includes a semiconductor substrate having an original semiconductor surface, an active region within the semiconductor substrate, and a transistor formed in the active region. The transistor includes a gate structure, a first spacer adjacent a first sidewall of the gate structure, and a second spacer adjacent a second sidewall of the gate structure. Wherein the thermal conductivity of the first gap wall or the second gap wall is higher than that of silicon nitride (Si3N4).
Need to check novelty before this filing date? Find Prior Art