Semiconductor circuit structure and manufacturing method thereof
CN120857564APending Publication Date: 2025-10-28INVENTION & COLLABORATION LABORATORY INC
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202510532479.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-28
- Filing Date
- 2025-04-25
- Publication Date
- 2025-10-28
Smart Images

Figure CN120857564A_ABST
Abstract
A semiconductor circuit structure includes a semiconductor substrate having an original semiconductor surface, an active region within the semiconductor substrate, and a transistor formed in the active region. The transistor includes a gate structure, a first spacer adjacent a first sidewall of the gate structure, and a second spacer adjacent a second sidewall of the gate structure. Wherein the thermal conductivity of the first gap wall or the second gap wall is higher than that of silicon nitride (Si3N4).
Need to check novelty before this filing date? Find Prior Art