One-time optical LED lamp structure capable of improving heat dissipation and manufacturing method of one-time optical LED lamp structure

Abstract

The invention provides a primary optical LED lamp structure capable of improving heat dissipation and a manufacturing method thereof, the primary optical LED lamp structure comprises a copper substrate, the front surface of the copper substrate is provided with a die bonding area and a first positive and negative electrode bonding pad, the die bonding area is a through groove and prevents short circuit of the die bonding area, the periphery of the first positive and negative electrode bonding pad on the front surface is etched with a first groove, and the first groove is matched with the first positive and negative electrode bonding pad; the solder paste can only be welded with the LED chip on the first positive and negative electrode bonding pad after being melted, and the first groove plays a role in correcting deviation; the front surface of the copper substrate is coated with a high-reflection layer, the high-reflection layer covers the non-first positive and negative electrode bonding pad, the primary optical lens is connected with the first groove and the die bonding area of the copper substrate in an embedded mode, and the second positive and negative electrode bonding pad is arranged on the back face of the first positive and negative electrode bonding pad. The heat of the LED chip is directly conducted from the first positive and negative electrode bonding pad to the second positive and negative electrode bonding pad and then is directly conducted with the external environment, so that the heat dissipation is better.

Description

Technical Field

[0001] This invention relates to the field of LED technology, and more specifically, to a primary optical LED lamp structure for improving heat dissipation and a method for manufacturing the same. Background Art

[0002] In the field of LED lighting, traditional aluminum substrate packaging faces three major technical bottlenecks:

[0003] Low heat dissipation efficiency: The thermal resistance of the insulating adhesive on the surface of the aluminum substrate is high (>0.2W / m·K), and heat cannot be dissipated quickly, resulting in an increase in LED junction temperature (>100℃) and a 50% acceleration in lifespan degradation;

[0004] Uncontrolled chip displacement: Thermal stress during reflow soldering causes LED chip displacement (displacement > 5μm), resulting in dead LEDs or distorted light spots.

[0005] Existing technologies such as CN106252338A use copper substrates to improve thermal conductivity, but they do not solve the chip displacement problem. Summary of the Invention

[0006] The present invention aims to provide a primary optical LED lamp structure and its manufacturing method for improving heat dissipation, comprising: a copper substrate 10, the front surface of which is provided with a die-bonding region 20 and first positive and negative electrode pads 30. The die-bonding region 20 is a through-groove used to fix the LED chip 100 and separate the first positive and negative electrode pads 30 to prevent short circuits. The first positive and negative electrode pads 30 are used to solder the positive and negative electrodes of the LED chip 100. A first trench 40 is etched around the first positive and negative electrode pads 30 on the front surface, which cooperates with the first positive and negative electrode pads 30 so that the solder paste can only be soldered to the LED chip 100 on the first positive and negative electrode pads 30 after melting. The first trench 40 plays a role in correcting deviation. The front surface of the copper substrate 10 is coated with a high-reflectivity layer, which covers the non-first positive and negative electrode pads 30 and is encapsulated by a primary optical lens 90. The primary optical lens 90 is fitted and connected to the first trench 40 and the die bonding area 20 of the copper substrate 10, so that the primary optical lens 90 wraps the copper substrate 10 and the LED chip 100, which can prevent or reduce the risk of the primary optical lens 90 falling off. The back of the copper substrate 10 is provided with a second positive and negative electrode pad 50, which is placed on the back of the first positive and negative electrode pad 30 for connection to the PCB board below. The heat of the LED chip 100 is directly conducted from the first positive and negative electrode pad 30 to the second positive and negative electrode pad 50 and then directly conducted to the external environment, which is better for heat dissipation. The remaining part of the back of the copper substrate 10, except for the second positive and negative electrode pad 50, is etched with a recessed area 60, and a reinforcing substrate 70 is bonded to the recessed area 60 to prevent the LED chip 100 from cracking with the copper substrate 10 during subsequent processing.

[0007] A primary optical LED lamp structure for improved heat dissipation, characterized by comprising: a copper substrate 10, the front surface of which is provided with a die-bonding region 20 and first positive and negative electrode pads 30; the die-bonding region 20 is a through groove used to fix an LED chip 100 and separate the first positive and negative electrode pads 30; the first positive and negative electrode pads 30 are used to solder the positive and negative electrodes of the LED chip 100; a first trench 40 is etched around the periphery of the first positive and negative electrode pads 30 on the front surface, which cooperates with the first positive and negative electrode pads 30 so that after the solder paste melts, it can only be soldered to the LED chip 100 on the first positive and negative electrode pads 30; the first trench 40 serves to correct misalignment. Function: The copper substrate 10 is coated with a high-reflectivity layer on its front surface. The high-reflectivity layer covers the non-first positive and negative electrode pads 30 and is encapsulated by a primary optical lens 90. The primary optical lens 90 is fitted and connected to the first trench 40 and the die-bonding region 20 of the copper substrate 10. The back side of the copper substrate 10 is provided with a second positive and negative electrode pad 50. The second positive and negative electrode pad 50 is placed on the back side of the first positive and negative electrode pads 30 for connection to the lower PCB board. The remaining part of the back side of the copper substrate 10, except for the second positive and negative electrode pads 50, is etched with a recessed region 60, and a reinforcing substrate 70 is bonded to the recessed region 60.

[0008] Furthermore, the copper substrate 10, the first positive and negative electrode pads 30, and the first positive and negative electrode pads 30 are integrally formed.

[0009] Furthermore, the width of the first groove 40 is 0.2-0.4 mm and the depth is 0.03-0.07 mm.

[0010] In some embodiments, the reinforcing substrate 70 is made of FR4 material. FR4 reinforcement is applied to the recessed area 60 on the back of the copper sheet to prevent the LED chip 100 from cracking with the copper substrate 10 during subsequent processing.

[0011] Furthermore, the depth of the depression is ≥0.1mm.

[0012] Furthermore, FR4 is bonded to the recessed area 60 of the copper substrate 10 by adhesive.

[0013] In some embodiments, the high-reflectivity layer is a white oil coating. Applying white oil to the copper sheet is a way to replace the previous silver plating process (or BT substrate) for the bracket. The electroplated silver reflective layer accounts for 30% of the cost and is prone to sulfidation and blackening, reducing the reflectivity from 95% to 80%. The white oil coating has high reflectivity and reduces costs.

[0014] In some embodiments, the primary optical lens 90 is integrally packaged with the front surface of the copper substrate 10 through a molding process.

[0015] Furthermore, the die-bonding region 20 has a barb structure, which provides high bonding strength and a more secure fixation.

[0016] Furthermore, a gap 71 is provided between the second positive and negative electrode pads 50 and the reinforcing substrate 70, and the gap 71 is fitted and connected to the primary optical lens 90 for a more secure fixation.

[0017] In some embodiments, the copper substrate 10 is spliced ​​together by connecting strips 80 arranged in parallel around the perimeter to form an array of material plates. Multiple independent packages are formed by cutting the connecting strips 80. Compared with cutting the whole plate, the cutting of the connecting strips 80 has less vibration and is more convenient.

[0018] A method for manufacturing a primary optical LED lamp structure with improved heat dissipation, characterized by comprising the following steps:

[0019] (a) Double-sided etching is performed on the copper substrate 10 to form the first positive and negative electrode pads 30 and the first trench 40 on the front side and the second positive and negative electrode pads 50 and the recessed area 60 on the back side.

[0020] (b) A reinforcing substrate 70 is bonded to the recessed area 60, and a high-reflection layer is coated on the positive surface of the copper substrate 10 to expose the first positive and negative electrode pads 30 and the second positive and negative electrode pads 50.

[0021] (c) The LED chip 100 is fixed in the die bonding area 20 and then fixed by reflow soldering process;

[0022] (d) A primary optical lens 90 is formed in a mold by injection molding process to fit into the first groove 40;

[0023] (e) The copper substrate 10 is cut into an independent package and mounted on the lamp board.

[0024] The process involves first sorting the optical components, then forming them into individual packages. This avoids the inefficiency caused by the large size of the individual optical packages and subsequent sorting.

[0025] Furthermore, the injection molding process described in step (d) uses silicone material.

[0026] Furthermore, in step (e), the LED chip 100 is subjected to spectral and color sorting before slicing.

[0027] Furthermore, the reinforcing substrate 70 is bonded to the copper substrate 10 through a thermosetting process.

[0028] The beneficial effects of this invention: This invention proposes a primary optical LED lamp structure and its manufacturing method for improving heat dissipation, comprising: a copper substrate 10, the front surface of which is provided with a die-bonding region 20 and first positive and negative electrode pads 30. The die-bonding region 20 is a through groove used to fix the LED chip 100 and separate the first positive and negative electrode pads 30 to prevent short circuits. The first positive and negative electrode pads 30 are used to solder the positive and negative electrodes of the LED chip 100. A first trench 40 is etched around the first positive and negative electrode pads 30 on the front surface, which cooperates with the first positive and negative electrode pads 30 so that after the solder paste melts, it can only be soldered to the LED chip 100 on the first positive and negative electrode pads 30. The first trench 40 plays a role in correcting deviation. The front surface of the copper substrate 10 is coated with a high-reflectivity layer, which covers the non-first positive and negative electrode pads 30 and is encapsulated by a primary optical lens 90. The primary optical lens 90 is fitted and connected to the first trench 40 and the die bonding area 20 of the copper substrate 10, so that the primary optical lens 90 wraps the copper substrate 10 and the LED chip 100, which can prevent or reduce the risk of the primary optical lens 90 falling off. The back of the copper substrate 10 is provided with a second positive and negative electrode pad 50, which is placed on the back of the first positive and negative electrode pad 30 for connection to the PCB board below. The heat of the LED chip 100 is directly conducted from the first positive and negative electrode pad 30 to the second positive and negative electrode pad 50 and then directly conducted to the external environment, which is better for heat dissipation. The remaining part of the back of the copper substrate 10, except for the second positive and negative electrode pad 50, is etched with a recessed area 60, and a reinforcing substrate 70 is bonded to the recessed area 60 to prevent the LED chip 100 from cracking with the copper substrate 10 during subsequent processing. Attached Figure Description

[0029] Figure 1 This is a structural diagram of the LED lamp structure of the present invention.

[0030] Figure 2 This is a structural diagram of the copper substrate of the present invention.

[0031] Figure 3 A flowchart illustrating the manufacturing method of the primary optical LED lamp structure for improving heat dissipation according to the present invention.

[0032] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention.

[0033] Explanation of main component symbols

[0034] Copper substrate 10; die bonding area 20; first positive and negative electrode pads 30; first trench 40; second positive and negative electrode pads 50; recessed area 60; reinforcing substrate 70; gap 71; connecting strip 80; primary optical lens 90; LED chip 100. Detailed Implementation

[0035] Example 1:

[0036] like Figure 1-2 As shown, a primary optical LED lamp structure for improved heat dissipation includes: a copper substrate 10, on which a die-bonding region 20 and first positive and negative electrode pads 30 are provided on the front surface. The die-bonding region 20 is a through groove used to fix the LED chip 100 and separate the first positive and negative electrode pads 30. The first positive and negative electrode pads 30 are used to solder the positive and negative electrodes of the LED chip 100. A first trench 40 is etched around the first positive and negative electrode pads 30 on the front surface, which cooperates with the first positive and negative electrode pads 30 so that after the solder paste melts, it can only be soldered to the LED chip 100 on the first positive and negative electrode pads 30. The first trench 40 serves to correct deviations; the width of the first trench 40 is 0.2-0.4 mm and the depth is 0.03-0.07 mm; the positive surface of the copper substrate 10 is coated with a high-reflectivity layer, which is a white oil coating. Applying white oil to the copper sheet replaces the previous silver plating process (or BT substrate) for reflection. Electroplated silver reflective layers account for 30% of the cost and are prone to sulfidation and blackening, reducing reflectivity from 95% to 80%. The white oil coating offers high reflectivity and reduces costs. The high-reflectivity layer covers the non-first positive and negative electrode pads 30 and is encapsulated by a primary optical lens 90. The primary optical lens 90 is integrally packaged with the front surface of the copper substrate 10 through a molding process. The primary optical lens 90 is fitted and connected to the first trench 40 and the die-bonding region 20 of the copper substrate 10. The die-bonding region 20 has a hook structure. A gap 71 is provided between the second positive and negative electrode pads 50 and the reinforcing substrate 70. The gap 71 is fitted and connected to the primary optical lens 90, resulting in high bonding strength and more secure fixation. The back side of the copper substrate 10 has a second positive and negative electrode pad 50, which is placed behind the first positive and negative electrode pads 30 for use in the lower... The PCB board of the part is connected, and the copper substrate 10, the first positive and negative electrode pads 30 are integrally formed. The back of the copper substrate 10, except for the second positive and negative electrode pads 50, has a recessed area 60 etched on the rest. The recessed area is ≥0.1mm. A reinforcing substrate 70 is bonded to the recessed area 60. The reinforcing substrate 70 is made of FR4 material. The FR4 reinforcement is attached to the recessed area 60 on the back of the copper sheet to prevent the LED chip 100 from cracking with the copper substrate 10 during subsequent processing. The FR4 is bonded to the recessed area 60 of the copper substrate 10 with adhesive.

[0037] The copper substrate 10 is spliced ​​together by parallel connecting strips 80 spaced around the perimeter to form an array of material board structures. After the connecting strips 80 are cut, multiple independent packages are formed. Compared with cutting the whole board, the cutting of the connecting strips 80 has less vibration and is more convenient.

[0038] Example 2:

[0039] like Figure 3As shown, a method for manufacturing a primary optical LED lamp structure to improve heat dissipation is characterized by comprising the following steps:

[0040] (a) Double-sided etching is performed on the copper substrate 10 to form the first positive and negative electrode pads 30 and the first trench 40 on the front side and the second positive and negative electrode pads 50 and the recessed area 60 on the back side.

[0041] (b) A reinforcing substrate 70 is bonded to the recessed area 60. The reinforcing substrate 70 is bonded to the copper substrate 10 by a thermosetting process, and a high reflective layer is coated on the positive surface of the copper substrate 10 to expose the first positive and negative electrode pads 30 and the second positive and negative electrode pads 50.

[0042] (c) The LED chip 100 is fixed in the die bonding area 20 and then fixed by reflow soldering process;

[0043] (d) A primary optical lens 90 is formed in a mold by injection molding process to fit into the first groove 40, wherein the injection molding process uses silicone material;

[0044] (e) The copper substrate 10 is cut into an independent package and mounted on the lamp board. Before cutting, the LED chip 100 is sorted by light and color.

[0045] The process involves first sorting the optical components, then forming them into individual packages. This avoids the inefficiency caused by the large size of the individual optical packages and subsequent sorting.

[0046] The beneficial effects of this invention: This invention proposes a primary optical LED lamp structure and its manufacturing method for improving heat dissipation, comprising: a copper substrate 10, the front surface of which is provided with a die-bonding region 20 and first positive and negative electrode pads 30. The die-bonding region 20 is a through groove used to fix the LED chip 100 and separate the first positive and negative electrode pads 30 to prevent short circuits. The first positive and negative electrode pads 30 are used to solder the positive and negative electrodes of the LED chip 100. A first trench 40 is etched around the first positive and negative electrode pads 30 on the front surface, which cooperates with the first positive and negative electrode pads 30 so that after the solder paste melts, it can only be soldered to the LED chip 100 on the first positive and negative electrode pads 30. The first trench 40 plays a role in correcting deviation. The front surface of the copper substrate 10 is coated with a high-reflectivity layer, which covers the non-first positive and negative electrode pads 30 and is encapsulated by a primary optical lens 90. The primary optical lens 90 is fitted and connected to the first trench 40 and the die bonding area 20 of the copper substrate 10, so that the primary optical lens 90 wraps the copper substrate 10 and the LED chip 100, which can prevent or reduce the risk of the primary optical lens 90 falling off. The back of the copper substrate 10 is provided with a second positive and negative electrode pad 50, which is placed on the back of the first positive and negative electrode pad 30 for connection to the PCB board below. The heat of the LED chip 100 is directly conducted from the first positive and negative electrode pad 30 to the second positive and negative electrode pad 50 and then directly conducted to the external environment, which is better for heat dissipation. The remaining part of the back of the copper substrate 10, except for the second positive and negative electrode pad 50, is etched with a recessed area 60, and a reinforcing substrate 70 is bonded to the recessed area 60 to prevent the LED chip 100 from cracking with the copper substrate 10 during subsequent processing.

[0047] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A primary optical LED lamp structure for improving heat dissipation, characterized in that, include: A copper substrate (10) has a die-bonding region (20) and first positive and negative electrode pads (30) on its front surface. The die-bonding region (20) is a through-groove used to fix the LED chip (100) and separate the first positive and negative electrode pads (30). The first positive and negative electrode pads (30) are used to solder the positive and negative electrodes of the LED chip (100). The periphery of the first positive and negative electrode pads (30) on the front surface is etched with first trenches (40) that cooperate with the first positive and negative electrode pads (30). The front surface of the copper substrate (10) is coated with a high-reflectivity layer, which covers the non-first positive and negative electrode pads (30). And it is packaged by a primary optical lens (90), the primary optical lens (90) is fitted and connected to the first trench (40) and the die bonding area (20) of the copper substrate (10), the back of the copper substrate (10) is provided with a second positive and negative electrode pad (50), the second positive and negative electrode pad (50) is placed on the back of the first positive and negative electrode pad (30) for connection of the lower PCB board, and the remaining part of the back of the copper substrate (10) except for the second positive and negative electrode pad (50) is etched with a recessed area (60), and a reinforcing substrate (70) is bonded in the recessed area (60).

2. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The width of the first groove (40) is 0.2-0.4 mm and the depth is 0.03-0.07 mm.

3. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The reinforcing substrate (70) is made of FR4 material. FR4 is applied to the recessed area (60) on the back of the copper sheet. FR4 is bonded to the recessed area (60) of the copper substrate (10) with adhesive.

4. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The high-reflectivity layer is a white oil coating.

5. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The primary optical lens (90) is integrally packaged with the front surface of the copper substrate (10) through a mold forming process.

6. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The solidification region (20) has a barbed structure.

7. The primary optical LED lamp structure for improved heat dissipation as described in claim 1, characterized in that: The copper substrate (10) is spliced ​​together by connecting strips (80) arranged in parallel around the perimeter to form an array of material board structures, and multiple independent packages are formed after the connecting strips (80) are cut.

8. A method for manufacturing a primary optical LED lamp structure with improved heat dissipation, characterized in that, Includes the following steps: (a) The copper substrate (10) is etched on both sides to form the first positive and negative electrode pads (30) and the first trench (40) on the front side and the second positive and negative electrode pads (50) and the recessed area (60) on the back side. (b) A reinforcing substrate (70) is bonded to the recessed area (60), and a high-reflectivity layer is coated on the positive surface of the copper substrate (10) to expose the first positive and negative electrode pads (30) and the second positive and negative electrode pads (50). (c) The LED chip (100) is fixed in the die bonding area (20) and then fixed by reflow soldering. (d) A primary optical lens (90) is formed in the mold by injection molding process to fit into the first groove (40); (e) The copper substrate (10) is cut into an independent package and mounted on the lamp board.

9. The method for manufacturing a primary optical LED lamp structure with improved heat dissipation as described in claim 8, characterized in that: The injection molding process described in step (d) uses silicone material.

10. The method for manufacturing a primary optical LED lamp structure with improved heat dissipation as described in claim 8, characterized in that: In step (e), the LED chip (100) is sorted by light and color before slitting.

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