Mold insert for injection molding system, carrier substrate for such mold insert, injection molding system having such mold insert, and method for injection molding

Abstract

The invention relates to a mold insert (50) for an injection molding system (18) for producing microstructures and / or nanostructures on molded parts, the mold insert (50) having a surface profile (9) in the injection molding system in the mounted state, which surface profile faces a cavity (20) of the injection molding system in the mounted state, the invention relates to a mould insert (1) comprising:-a structural element (7) having a surface profile (7) in order to form microstructures and / or nanostructures on a moulded part during an injection moulding process; and-a carrier substrate (3) to which the structural element (7) is attached directly or indirectly, the carrier substrate (3) and preferably the structural element (7) being designed such that the mould insert (50) is at least locally deformable, in particular locally elastically deformable, in the mounted state.

Description

Technical Field

[0001] The present invention relates to a mold insert for an injection molding system for manufacturing microstructures and / or nanostructures at a molded part, particularly for molded parts used in the semiconductor industry, a carrier substrate, an injection molding system having such a mold insert, and a method for injection molding. Background Art

[0002] In the semiconductor industry, it is known that imprint lithography is used to form structures in the micrometer or nanometer range. In recent years, this technology has become increasingly important, especially in photolithography. The advantages of imprint lithography include the elimination of the need to manufacture expensive masks and freedom from diffraction limits. Although the so-called master mold must be produced expensively and laboriously in imprint lithography, this master mold is not directly used as a working mold. More precisely, a soft mold, particularly polymer-based, is replicated from the master mold, and this soft mold is then used as the working mold. If the soft mold wears out, a new soft mold can be replicated from the master mold.

[0003] The flexible mold is preferably used in an imprinting apparatus. In the imprinting apparatus, the flexible mold is fixed to a mold holder, particularly by means of a backplane. The substrate is fixed to the substrate holder and coated with imprint material. The mold holder and the substrate holder can move relative to each other. If the mold is smaller than the substrate, the negative shape of the mold structure can be imprinted onto the substrate multiple times in a step-and-repeat process. If the size of the mold is approximately equal to or equal to the size of the substrate, the imprint material on the substrate is imprinted in a single imprinting step.

[0004] This embossing equipment offers high precision and reproducibility of the embossed structures. However, the throughput of this technology is low. Injection molding equipment has been known in industry for decades for manufacturing components using injection molding processes. Initially considered only for manufacturing large, rough components, this technology has also been used to manufacture components with smaller structural dimensions. Examples worth mentioning are the injection molding of CDs and DVDs. This equipment is known by the name "embossing device." While embossing devices can provide high throughput, it has been proven that manufacturing structures in the nanoscale is extremely difficult, especially while maintaining or increasing throughput. Special equipment and, in particular, methodological steps are required to precisely control not only the injection molding process but also the demolding of the resulting molded parts. Especially for demolding hardened embossed materials with nanoscale structures, special equipment and methodological steps are needed. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide an apparatus and method by means of which injection molding and demolding of molded parts or injection-molded articles can be performed with high throughput and as few failures as possible, especially when it comes to molded parts with microstructures or nanostructures imprinted on their outer side.

[0006] The present invention achieves the objective by means of the mold insert according to claim 1, the carrier substrate according to claim 11, the injection molding system according to claim 12, and the method according to claim 13.

[0007] According to a first aspect, a mold insert for an injection molding system is provided, the mold insert being used to manufacture microstructures and / or nanostructures at a molded part, wherein the mold insert, in an installed state, has a surface contoured portion in the injection molding system, the surface contoured portion facing a cavity of the injection molding system, the mold insert comprising:

[0008] - A structural element having a surface contouring portion to form microstructures and / or nanostructures at the molded part during injection molding; and

[0009] - A carrier substrate, on which structural elements are directly or indirectly attached.

[0010] The carrier substrate and preferably the structural elements are designed such that the mold insert is at least partially deformable, especially locally elastically deformable, in the installed state.

[0011] In contrast to existing technologies, the present invention proposes a deformable mold insert comprising a carrier substrate and structural elements. Advantageously, through targeted selection of the materials and / or sizing of the carrier substrate and, preferably, the structural elements, the mold insert can be deformed at least locally and / or globally. For example, during demolding, more than 50%, preferably more than 70%, and particularly preferably more than 80% of the volume of the mold insert is deformed, especially elastically. It has been shown that, precisely in the case of a mold insert designed to form microstructures and / or nanostructures, the corresponding deformation is advantageous during the demolding process of the molded part, as it simplifies demolding. This allows for faster and more advantageous demolding of the resulting molded part without concern for damage or even destruction of the microstructures and / or nanostructures of the manufactured molded part.

[0012] Another advantage is its excellent replication accuracy. Replication accuracy is understood as the smallest structural size that can be manufactured without failure upon demolding. The replication accuracy is less than 1000 nm, preferably less than 500 nm, more preferably less than 100 nm, and most preferably less than 10 nm.

[0013] Another advantage lies in the feasibility of manufacturing structures with high aspect ratios. Aspect ratio is understood as the ratio between the height of a structure and its lateral dimension, such as its width. Aspect ratios that can be produced are better than 1:1, preferably better than 5:1, more preferably better than 10:1, and most preferably better than 20:1.

[0014] The molded parts produced by the described method and the described equipment preferably comprise one of the following materials:

[0015] PMMA

[0016] - COC

[0017] - COP

[0018] - PS

[0019] - PET

[0020] - Polyimide

[0021] Based on experience, the material is particularly well-suited for manufacturing molded parts.

[0022] Here, the structural element is designed such that, during the operation of the injection molding system, i.e., during the injection process, it is introduced into the injection material within the cavity, causing structuring on the outer side of the molded part to be formed. This structuring is microstructuring and / or nanostructuring. Microstructuring and / or nanostructuring should be particularly understood as structuring where the distance between two contour objects can be less than 50 µm, preferably less than 10 µm, more preferably less than 1 µm, most preferably less than 100 nm, and most preferably less than 10 nm.

[0023] In particular, mold inserts should be understood as plug-ins that are inserted as replaceable components into the injection molding system so as to achieve structuring, especially surface structuring, at the molded part to be formed when a viscous liquid is injected into the cavity of the injection molding system during operation to harden the viscous liquid in the cavity.

[0024] In particular, the surface contouring portion formed by contour objects on the outside of the molded part should be understood as a surface contouring portion that can be reproducibly implemented in multiple injection molding processes, and in the surface contouring portion, the spacing between two contour objects, for example, two contour objects in the form of convexities, with correspondingly small dimensions, can be reproducibly manufactured.

[0025] The structural element preferably includes at least one impression carrier and an impression. The impression carrier can be any type of substrate on which the impression can be manufactured and transported. The impression preferably has a desired surface contouring portion for the outer side of the impression molded part.

[0026] In one embodiment, the mold carrier is a wafer, particularly a silicon wafer. However, a glass wafer is also conceivable. Glass wafers are particularly suitable when the mold imprint material, i.e., the imprint material from which the mold is formed, must be cured by means of visible or UV light through the mold carrier. In this case, the proximity of the electromagnetic radiation that performs the curing action can also be achieved through the mold carrier. This is particularly advantageous when the mold of the replicating mold of the imprinting equipment is opaque, translucent, or transparent to the wavelength mentioned above.

[0027] In another embodiment, the impression carrier is a thin film. The thin film is preferably stretched onto a frame. In semiconductor technology, such a thin film and frame are used to transport a substrate. Instead of a transport substrate, an impression is formed on the corresponding thin film.

[0028] Imprint carriers are typically made of metal, glass, polymer, or ceramic. If necessary, an adhesion promoter can be used between the imprint carrier and the impression to improve adhesion of the impression to the carrier.

[0029] In particular, it is proposed that the structural elements, especially the molds, include hard molds or soft molds. It is particularly conceivable that the structural elements, especially the molds for the structural elements, are formed using a master sample, for example, made of metal, which is manufactured by means of an imprinting method. Therefore, it is possible to provide structural elements that can realize surface contouring portions in the micrometer or nanometer range within the molded part.

[0030] The mold of the structural element is preferably connected to the aforementioned mold carrier, and particularly manufactured directly on the mold carrier. The mold is preferably a flexible mold, meaning it is preferably produced by an impression material. The impression material is preferably a polymer.

[0031] It is also conceivable that the impression mold can be a rigid impression mold. In this case, an impression mold without an impression mold carrier can be used. However, it is also conceivable that the impression mold is fixed to an impression mold carrier. This is necessary when only the impression mold carrier, and not the impression mold itself, is compatible with the mold insert described later. The impression mold carrier thus also performs the function of an adapter. Manufacturing the impression mold as a rigid impression mold is more laborious and costly than replicating a soft impression mold from a master impression mold.

[0032] The carrier substrate preferably determines the mechanical properties of the mold insert and is preferably assembled from a single component, a single layer, or multiple components or multiple layers. If the carrier substrate is a composition of multiple layers, each endowed with different physical properties to combine multiple different properties within the carrier substrate, then the carrier substrate is also called a hybrid carrier substrate. A mold insert having a hybrid carrier substrate is thus preferably a hybrid mold insert. Here, the different layers are preferably made of different materials.

[0033] Specifically, it is proposed that the molded part is a component in optics, microfluidics, or electronics, particularly semiconductor technology. For example, the molded part can be an optical device or a device in biology and microfluidics. The optical device can be a lens, especially a Fresnel lens. Diffraction or refraction gratings or optical elements for holography are also conceivable. The fabrication of photonic crystals is also conceivable. Another possibility is to fabricate a complete microfluidic system with chambers, especially reaction chambers, channels, etc.

[0034] Bending moment is a measure of the resistance a beam exhibits to internal stresses when subjected to load. A larger bending moment requires a larger external force acting on the beam to produce the corresponding bending. Bending moment can be calculated directly from the cross-sectional profile. As is known to those skilled in the art, for a rectangle with width B and height H, the bending moment is calculated as follows when the beam bends about an axis parallel to B:

[0035]

[0036] The bending moment should be minimized to allow for the simplest possible bending of the mold insert for demolding. Exemplary calculations are performed in the table below and presented in tabular form. The molded part is to be embossed in the form of a substrate with a dimension of 200 mm. Therefore, the mold insert is also estimated as a group of square components with a length of 200 mm and a width of 200 mm. The length is not included in the bending moment calculation. The width is fixed at 200 mm. The height varies with the parameter set to calculate the corresponding bending moment.

[0037]

[0038] Specifically, it is proposed that the mold insert has a bending moment resistance of less than 100,000 mm³, preferably less than 80,000 mm³, preferably less than 40,000 mm³, preferably less than 1,000 mm³, and preferably less than 100 mm³. Similar considerations apply to mold inserts with different widths and / or heights.

[0039] In particular, the bending moment is set such that, for example, a maximum local stroke movement of up to 1 mm, preferably up to 1 cm, more preferably up to 2 cm, and most preferably up to 3 cm can be achieved, for example, during demolding. Stroke movement should be understood in particular as movement in the direction perpendicular to the main extension plane, relating to the position or orientation of the mold insert in its undeformed state.

[0040] Furthermore, it is specifically proposed that the structural element is directly attached to the carrier substrate, thereby directly abutting against the carrier substrate. The carrier substrate is characterized in that it can be inserted into a corresponding holding or receiving device in the injection molding system, and particularly can be fixed in the injection molding system. Correspondingly, the carrier substrate is sized and, for example, has at least one contact area that allows the mold insert to be secured in the corresponding holding device in the injection molding system. For example, the contact area does not contain the structural element. For example, the carrier substrate has an extension surface in a plane extending parallel to the main extension plane that is larger than the extension surface of the structural element.

[0041] The structural element, and in particular the mold of the structural element, is joined to the injection material during the injection molding process, thereby imprinting itself onto the molded part to be formed.

[0042] Specifically, it is proposed that the mold insert has at least one heating element. Thus, it is advantageously possible, particularly as needed, to influence the injection material in the cavity through corresponding heat transfer, for example, during the molding process or injection process of the molded part and / or during demolding.

[0043] In particular, the heating element is a micro-heating element. The maximum size of the micro-heating element is less than 1 cm, preferably less than 5 mm, more preferably less than 1 mm, most preferably less than 0.1 mm, and most preferably less than 0.01 mm. As the size of the micro-heating element becomes smaller, the achievable local temperature resolution is improved.

[0044] It is conceivable that one or more heating elements are designed such that they can act locally, i.e., spatially confined, on the injection-molded material at specific locations. In particular, the heating element is a micro-heating element, for example, in the form of a micro-heating wire, which extends in a meandering manner and / or has arc-shaped and / or circular cutouts. Heating elements, especially micro-heating elements, can take on any shape. For example, spiral, meandering, circular, rectangular, or honeycomb-shaped micro-heating devices are conceivable.

[0045] In particular, it is proposed that at least one or more heating elements are configured to achieve a spatially anisotropic or non-uniform heat distribution. This allows for targeted, localized application of heat to the injection-molded material, and specifically targeting particular areas of the molded or already molded part for heat transfer. It is particularly conceivable that each heating element can be individually controlled to induce different heating periods and / or different heat inputs, for example, for different areas within the molded part.

[0046] Ideally, each micro-heating element or heating element can be heated individually. In the described embodiment, non-uniform and / or anisotropic heating profiles can be achieved simply by correspondingly manipulating or adjusting the heating elements.

[0047] It is also conceivable that multiple micro-heating elements can be grouped and heated together. The micro-heating elements can be grouped to more effectively heat specific spatial regions, especially areas where the density of the mold structure increases. In this sense, heating tailored to the mold can be achieved not only through manipulation but also through the structure or grouping of the heating elements. A disadvantage here is that a new heating substrate must be manufactured for each mold with different surface contours. Therefore, it is advantageous to achieve non-uniform and / or anisotropic heating by correspondingly manipulating the heating elements.

[0048] By selectively specifying a high density of micro-heating elements in regions with high mold structure density, sufficient temperature can be ensured to guarantee adequate viscosity of the injection material for complete filling of the mold structure. Furthermore, the feasibility of individually manipulating the micro-heating elements ensures rapid temperature regulation based on minimal hot material. It is no longer necessary to heat the entire mold to the temperature required for optimal filling of the high-density mold structure. In particular, the micro-heating elements assist the flow of injection material into the microstructured or nanostructured sections. Temperature regulation of the entire injection molding tool is no longer required; it is performed directly at the mold. This also reduces the necessary demolding temperature. Another advantage is better controllable heat transfer from the micro-heating elements to the mold and then to the injection molding material. Furthermore, the number of design criteria used to generate the mold is reduced. In the prior art, it is common to include additional mold structures that serve no purpose other than assisting in demolding. With improved temperature regulation, at least these design criteria can be reduced.

[0049] Alternatively, the heating element can be constructed over an entire surface to apply heat to the injection-molded material as uniformly as possible. The micro-heating element can be fabricated, for example, by deposition on a heating substrate. For instance, it is conceivable to deposit metal, particularly aluminum or copper, on the heating substrate, where the metal is subsequently structured using a coating process, etching process, and photolithography. In another embodiment, the heater is generated directly in the heating substrate by doping. The surface of the heating substrate is correspondingly masked before doping. The surface of the heating substrate with the micro-heater is called the active heating substrate surface. The surface opposite the active heating substrate surface is called the passive heating substrate surface.

[0050] The heating substrate has at least one, preferably more than ten, more preferably more than 50, most preferably more than 100, or even more than 500 micro-heating elements on its active heating substrate surface. The micro-heating elements preferably generate heat in a resistive manner.

[0051] In particular, at least one heating element is integrated into the carrier substrate or attached to the outside of the carrier substrate, especially to the outside facing the structural element. This allows, advantageously, the heating effect on the injection-molded material to be influenced by the position of the integrated heating element, depending on the molded part to be formed.

[0052] In particular, it is proposed that the carrier substrate be constructed in multiple layers. For this purpose, the carrier substrate may have, for example, a first layer and a second layer. Advantageously, it is possible to incorporate different physical properties, particularly the mechanical properties of the carrier substrate and thus the molded part, into the carrier substrate, for example, in terms of bending moment resistance and / or thermal conductivity. Therefore, the first and second layers are preferably different in material and / or size. In the simplest case, the mold insert is a single mold substrate, the purpose of which is to accommodate a subsequent soft mold or a soft mold together with its mold carrier (backplane).

[0053] Furthermore, it is preferably proposed that the structural element is made of a first material and the carrier substrate is made of a second material, wherein the first material and the second material are different. Particularly preferably, it is proposed that the structural element is made of a material whose coefficient of thermal expansion is similar to that of the injection-molded material of the molded part to be manufactured. This has proven particularly advantageous during the demolding process.

[0054] Another aspect of the invention is a carrier substrate for a molded part according to the invention. All the characteristics described for the molded part can be similarly applied to the carrier substrate, and vice versa.

[0055] Another aspect of the invention is an injection molding system having a cavity, the injection molding system comprising: a deformation element for deforming an inserted mold insert, particularly a mold insert according to the invention; and / or a mechanism for influencing the amount of incoming injection material, particularly in a conveying section directly downstream of the cavity's inlet opening. Here, the injection material can preferably be set temporally and / or spatially by means of the influencing mechanism. For example, in this manner, a time-varying cross-sectional profile for the incoming injection material can be set. The conveying section is preferably a gating device. All the advantages and characteristics disclosed in conjunction with the mold insert are similarly applicable to the injection molding system, and vice versa.

[0056] It has been demonstrated that deformation, particularly elastic deformation, of the mold insert can be achieved by means of a corresponding deformation element preferably acting on the mold insert according to the invention, which simplifies demolding of the molded part after the molding injection process or the injection process is completed. This has been particularly advantageous when it involves structured parts only a few micrometers or nanometers in size.

[0057] Specifically, the deformable element is a displaceable pin, which preferably passes through a corresponding opening or recess in the retaining element and can contact the mold insert, particularly the carrier substrate, on the side of the mold insert opposite to the structural element. Thus, the pin can press against the mold insert and deform it, particularly in a domed shape. However, the deformable element can also be based on a pressure principle, where the side opposite the structural element is in contact with a fluid, which is pressure-loaded to induce the desired deformation.

[0058] In particular, the injection molding system includes a retaining device for the mold insert. The retaining device for the mold insert preferably includes a retaining device base, in which an inlet or opening is preferably provided, through which a deformable element can act on the mold insert. The mold insert is preferably supported in a flexible manner. The mold insert is secured peripherally, for example by means of fixing devices and fixing elements.

[0059] In an improved embodiment, multiple deformable elements may also be used, which are spatially distributed and allow for targeted, localized demolding.

[0060] A mechanism for influencing the amount of injection molding material is also proposed, particularly in the conveying section directly downstream of the cavity inlet opening. It has been demonstrated that the injection molding process can be influenced by the corresponding mechanism for affecting the amount of injection molding material. In particular, by being located directly upstream of the cavity, i.e., downstream, it is feasible to achieve individualized flow rate regulation within the cavity. This is especially feasible because flow rate regulation occurs directly at the cavity. For example, if a corresponding sensor in the cavity can identify certain favorable and / or less favorable flow effects, the corresponding adjustment of the inflowing material can be made via a corresponding regulating loop. Therefore, intervention in the injection molding process can be made directly before unusable molded parts are produced.

[0061] A gating distributor is a component or assembly of components designed to guide injection material through its injection material inlet into the injection space, preferably between mold inserts. The gating distributor, for example, has at least one sliding element that can change the cross-section of the injection material inlet. It is conceivable to use multiple sliding elements to locally differentiate the cross-section of the injection material inlet. This allows for targeted control of the injection material dosage.

[0062] Another aspect of the invention is a method for injection molding using an injection molding system according to the invention, wherein, in order to demold the molded part, the mold insert is deformed and / or the amount of injection material flowing in is affected. All the advantages and characteristics described for the injection molding system can be similarly transferred to the method for injection molding, and vice versa.

[0063] Specifically, it is proposed that during demolding of the molded part, in the first step, the outer region of the mold insert separates from the molded part, and in the second step, the inner region of the mold insert separates from the molded part. Here, the second step is performed temporally after the first step. In particular, the separation is carried out gradually, i.e., discontinuously. It has been proven that by using the corresponding demolding strategy, the scrap of damaged molded parts can be reduced.

[0064] Specifically, it is proposed that the cross-section of the conveying section changes during the inflow of the injection molding material. For example, the hose can be modified in terms of its opening cross-section by corresponding clips, sliders, and / or pins to change the flow rate of the injection molding material spatially and / or temporally. Here, the hose can be flexible and its cross-section can be changed by external force, or by components that can be placed inside the hose or pipe to achieve different cross-sections or cross-sectional profiles. It is also conceivable that the conveying line constitutes a distributor. The corresponding increase or change in the cross-section in the conveying section can then be preferably used to achieve spatial changes as the injection molding material flows in. It is also conceivable that the conveying section is designed as a distributor for the injection molding material, which guides the injection molding material into different cavities. Attached Figure Description

[0065] Other advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the accompanying drawings. The drawings show:

[0066] Figure 1 A carrier substrate for a mold insert according to a first exemplary embodiment of the present invention is shown.

[0067] Figure 2a A carrier substrate for a mold insert according to a second exemplary embodiment of the present invention is shown.

[0068] Figure 2b A carrier substrate for a mold insert according to a third exemplary embodiment of the present invention is shown.

[0069] Figure 3a A carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention is shown.

[0070] Figure 3b A carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention is shown.

[0071] Figure 3c A mold insert according to a first exemplary embodiment of the present invention is shown.

[0072] Figure 4aA retaining device with a mold insert according to a first exemplary embodiment is shown in a first operating state.

[0073] Figure 4b A retaining device with a mold insert according to a first exemplary embodiment is shown in a second operating state.

[0074] Figure 5 A top view of a mold insert according to a second exemplary embodiment of the present invention is shown.

[0075] Figure 6a A side view of an injection molding system according to a first exemplary embodiment of the present invention is shown in a first position.

[0076] Figure 6b A side view of an injection molding system according to a first exemplary embodiment of the present invention in a second position is shown.

[0077] Figure 7a A front view of an injection molding system with a first gate distributor according to a first exemplary embodiment of the present invention is shown, and

[0078] Figure 7b A front view of an injection molding system with a second gate distributor according to a second exemplary embodiment of the present invention is shown.

[0079] In the accompanying drawings, the same components or components with the same function are indicated by the same reference numerals. Detailed Implementation

[0080] The following figures illustrate injection molding system 18 in different embodiments for the purposes of this invention (see Figure 18). Figure 6a and Figure 6b This injection molding system 18 is configured to manufacture molded parts from injection material by means that the injection material enters into the corresponding molded cavity 20 of the injection molding system 18 and solidifies. Here, the injection material is introduced into the cavity 20 via a conveying section, which... Figure 7a and Figure 7b The invention is illustrated in detail with reference to exemplary embodiments. In particular, the invention relates to a preferably replaceable mold insert 50 for such an injection molding system 18, wherein the mold insert 50 is configured in… Figure 3c As exemplarily illustrated, the mold insert 50, in addition to the carrier substrate 3, also includes a structural element 8, wherein the carrier substrate is... Figures 1 to 3bDifferent exemplary embodiments are shown in the figure. The structural element 8 faces the cavity 20 of the injection system 18 in the installed state of the mold insert 50. The structural element 8, and especially the impression 7 of the structural element, pre-defines the outer contour of the molded part produced by injection molding through its surface contouring portion 9. The mold insert 50 can preferably be installed in a corresponding holding device 12, such as in… Figure 4a and Figure 4b As shown in the diagram. The retaining device 12 is preferably also a component of the injection molding system 18.

[0081] Figure 1 A schematic, non-proportional side view of a microheating substrate 1 is shown, the microheating substrate including a microheating base 2 having a microheating surface 2o, on which at least one microheating element 11 (not shown) is disposed. This microheating substrate 1 may be a carrier substrate 3 for a mold insert 50 or a portion thereof according to an exemplary embodiment of the present invention.

[0082] Figure 2a A schematic, non-scale side view of a first embodiment of a carrier substrate 3 for a mold insert 50 is shown, wherein the carrier substrate 3 includes a single first layer 4. The carrier substrate 3 is used to either directly fix the structure or the mold layer 7, or to fix the mold carrier 6 on which the mold 7 is manufactured and placed.

[0083] Figure 2b A schematic, non-proportional side view of another embodiment of the carrier substrate 3 is shown, which includes a second layer 4' in addition to the first layer 4. The second layer 4' can perform any physical task. It is conceivable that it is made of a material having specific thermal conductivity and / or specific heat capacity and / or specific mechanical stiffness tensor, etc. For overview purposes, other figures with other layers are omitted. However, the number of layers is not limited to two. Here, each layer can perform a very specific physical task or be used for a specific purpose. The carrier substrate 3 is used either to directly fix the impression 7 or to fix the impression carrier 6 on which the impression 7 is manufactured and placed. Figure 2a and Figure 2b The first layer 4 and the second layer 4' of the variant embodiment of the carrier substrate 3 are specifically used to preset the mechanical properties of the carrier substrate 3, such as thermal conductivity and / or bending moment resistance, thereby determining the mechanical properties of the mold insert 50. Here, the first layer 4 and the second layer 4' can influence the mechanical properties of the carrier substrate 3, for example, through the selection of their materials and the selected thickness. Layers 4 and 4' can be bending-resistant substrates or thin films. By using metal thin films or polymer thin films, for example, thermal conductivity can be set very simply and optimally.

[0084] Figure 3a The diagram shows a schematic, non-proportional side view of a first embodiment of a carrier substrate 3, which, in addition to a first layer 4 for pre-setting the mechanical properties of the carrier substrate 3, also includes a microheating substrate 1. Here, the microheating substrate 1 and the first layer 4 are sandwiched together, wherein... Figure 3a In a modified implementation, the micro-heating surface 2o is disposed between the micro-heating substrate 2 and the first layer 4. The embodiment is characterized in that the active micro-heating surface 2o is directly connected to the layer that determines the mechanical fraction of the carrier substrate 3. Thus, the heat source of each micro-heating element is located within the carrier substrate 3. Optimal thermal uniformity is achieved through this structure.

[0085] Figure 3b The diagram shows a schematic, non-scale side view of a second embodiment of the carrier substrate 3, which includes a first layer 4 and a microheating substrate 1. The second embodiment is characterized in that a passive microheating surface 2o is directly connected to the first layer 4, such that the active microheating surface 2o points outwards. This allows the thermal properties of the microheating substrate 2 to be utilized.

[0086] exist Figure 3a and Figure 3b The hybrid characteristics of the two embodiments are that the micro-heating element (not shown) of the micro-heating substrate 1 is both open-loop and closed-loop controllable, while the physical properties of the mold insert substrate 1 of the mechanical mold insert 50 are immutable.

[0087] Instead of the first layer 4, other layers can be used to determine the mechanical properties of the carrier substrate 3. It is conceivable that the first layer 4, for example as a micro-heating substrate, is variable in its properties, while the second layer 4' is immutable in its properties.

[0088] Figure 3cA hybrid carrier substrate 3 is shown, on which a structural element 8 is fixed. The structural element 8 includes an impression carrier 6 (back-plane) and an impression 7 manufactured on the impression carrier. The impression carrier 6 is thus fixed by the hybrid carrier substrate 5. It is thus possible for the impression 7 to be manufactured independently of the hybrid carrier substrate 5 on the impression carrier 6, so that the impression can be transported by means of the impression carrier 6. The impression 7 is typically manufactured in an embossing apparatus. The impression or impression layer 7 is in particular a soft impression, which is replicated from a master impression in the embossing apparatus. The master impression of the embossing apparatus is preferably a metal impression. In the combination of the carrier substrate 3 and the structural element 8, a mold insert 50 is provided, particularly in the form of a hybrid mold insert. The hybrid mold insert 50 now comprises three parts: a micro-heating substrate 1 responsible for heat loading, a collection of all used first and / or second layers that allow for the setting of physical properties, and an impression layer 7 responsible for forming the molded part during injection molding. Thus, the hybrid characteristics extend the aspects of molding.

[0089] Figure 4a A mixing mold insert 50 is shown in a holding device 12. The holding device 12 has a fixing device 13 by means of which the mixing mold insert 50' is secured peripherally. Advantageously, the fixing device 13 itself is releasable and replaceable. The fixing device 13 is secured to the holding device base 15, for example, by a fixing element 14. The holding device base 15 has an inlet 16 or opening or recess through which a deformable element 17 can reach the underside of the mixing mold insert 5''. The mixing mold insert 50 can be bent by the deformable element 17. The deformable element 17 is preferably a pin. It is also conceivable that the deformable element 17 is a fluid outlet opening through which fluid, preferably gas, can be forced onto the back side of the mixing mold insert 50. The resulting overpressure then causes the mixing mold insert 50 to bulge. It is also conceivable that magnetic and / or electrical, especially electrostatic, devices can cause the mixing mold insert 50 to bulge. Therefore, the deformable element 17 should be considered as generally as possible.

[0090] Figure 4b The deformation state of the hybrid mold insert 50 via the deformation element 10 is shown. The deformed auxiliary molded part shown is necessary to be demolded from the mold 7 after injection molding.

[0091] Figure 5A top view of the mold surface of the mold 7 is shown, which has multiple surface contoured portions 9. For overview purposes, the surface contoured portions 9 are presented in a very simple manner. It can be seen that the surface contoured portions 9 are neither uniformly distributed on the mold surface nor uniform in density. This view is chosen to illustrate the most abstract and general case possible. The density and distribution of the surface contoured portions 9 can naturally be uniform. Four different micro-heating elements 11, particularly in the form of micro-heating wires, are shown in four different regions Z1-Z4. The micro-heating elements in regions Z1 and Z3 are located directly below the corresponding surface contoured portions 9. The micro-heating elements can be shaped differently and / or have different line densities and / or line thicknesses depending on the density of the surface contoured portions 9. Region Z2 is a local area below the free surface. Region Z4 is a global area encompassing the entire mold or the entire mold layer 7. However, due to the shaping of the micro-heating elements 11, not the entire surface of the mold or mold surface 7 is heated, but only the outer edges of the mold or mold surface are heated. Similarly, any other region can be created.

[0092] Figure 6a A schematic side view of the complete injection molding system 18 is shown, which in a first position includes at least two retaining devices 12 and a delivery section, particularly in the form of a gate distributor 19. Preferably, at least one of the retaining devices 12 has a deformable element 17 to more effectively eject the resulting injection-molded product after molding. The two retaining devices 12, together with an inserted mold insert 50, form a boundary for a cavity, the so-called injection space 20, which is filled with injection material during injection molding. The gate distributor 19 is located on the upper side of the injection molding system 18 and is responsible for delivering the injection material. The gate distributor 19 has at least one sliding element 21 on at least one side, preferably on both sides, which can change the cross-section of the injection material inlet 22 guided into the injection space 20 in an open-loop and / or closed-loop controlled manner. In the first position, at least one sliding element 21 is fully retracted, such that the cross-section of the injection material inlet 22 is maximized.

[0093] Figure 6b A schematic side view of the complete injection molding system 18 is shown, which, in a second position, includes at least two holding devices 12 and a gate distributor 19. In the second position, at least one sliding element 21 moves, causing the cross-section of the injection material inlet 22 to decrease. By selectively positioning at least one sliding element 21, open-loop control and / or closed-loop control of the injection material flow rate through the injection material inlet 22 is possible.

[0094] Figure 7aA schematic front view of the back side of the holding device 12 of the injection molding system 18 is shown, the injection molding system having a first feasible gate distributor 19. The inlet 16 and the back side of the bending or deforming element 17 are visible. Furthermore, the shape of the gate distributor 19 is visible. This gate distributor 19 is referred to as an arc-shaped gate distributor. A single, rectangular sliding element 21 is visible, which extends almost across the entire width of the gate distributor 19, thereby allowing continuous variation of the cross-section of the injection material inlet 22 across the entire width.

[0095] Figure 7b A schematic front view of the back side of the holding device 12 of the injection molding system 18 is shown, the injection molding system having a second feasible gate distributor 19'. The inlet 16 and the back side of the bending element 17 are visible. In this embodiment, the gate distributor 19' has a plurality of sliding elements 21 that can be individually inserted into the injection material inlet 22, thereby allowing for localized control of the injection material flow rate.

[0096] An improved version of the gate distributors 19 and 19', which are not shown in the first two figures, includes sliding elements 21 with different cross-sections, in a grid form, or in a grid form with different cross-sections.

[0097] List of reference numerals

[0098] 1 Micro-heated substrate

[0099] 2 Micro-heating substrate

[0100] 2o micro-heating surface

[0101] 3. Support substrate

[0102] 4 First layer

[0103] 4' Second layer

[0104] 6 Imprint Carrier

[0105] 7 impressions

[0106] 8 structural components

[0107] 9 Surface contouring section

[0108] 11 micro heating elements

[0109] 12 Holding Equipment

[0110] 13 Fixing devices

[0111] 14 Fixing Components

[0112] 15. Maintain equipment base

[0113] 16 entrances

[0114] 17 Deformable Elements

[0115] 18 Injection Molding System

[0116] 19, 19' gate distributor

[0117] 20 injection molding space

[0118] 21 Sliding element

[0119] 22 Injection Material Inlet Section

[0120] 50 mold inserts

Claims

1. A mold insert (50) for an injection molding system (18), the mold insert being used to fabricate microstructures and / or nanostructures at a molded part, wherein the mold insert (50) has a surface contouring portion (9) in the injection molding system in an installed state, the surface contouring portion facing a cavity (20) of the injection molding system in the installed state, the mold insert comprising: - A structural element (7) having the surface contouring portion (7) to form the microstructure and / or nanostructure at the molded part during injection molding, and - A carrier substrate (3), wherein the structural element (7) is directly or indirectly attached to the carrier substrate. The carrier substrate (3) and preferably the structural element (7) are designed such that the mold insert (50) is at least partially deformable, especially partially elastically deformable, in the installed state.

2. The mold insert (50) according to claim 1, wherein the mold insert (50) has a bending moment of less than 100,000 mm³, preferably less than 80,000 mm³, preferably less than 40,000 mm³, preferably less than 1,000 mm³, and preferably less than 100 mm³.

3. The mold insert (50) according to any one of the preceding claims, wherein the mold insert (50) has at least one heating element (11).

4. The mold insert (50) according to claim 3, wherein the at least one heating element (11) or the plurality of heating elements (11) are configured to enable spatially anisotropic and / or non-uniform heating distribution.

5. The mold insert (50) according to any one of the preceding claims, wherein the at least one heating element (11) is integrated into the carrier substrate (3) or formed on the outside of the carrier substrate (3).

6. The mold insert (50) according to any one of the preceding claims, wherein the structural element (50) comprises an impression (7) and an impression carrier (6).

7. The mold insert (50) according to any one of the preceding claims, wherein the structural element (7) comprises a hard mold or a soft mold.

8. The mold insert (50) according to claim 5 or 6, wherein the impression carrier (6) is transparent or translucent.

9. The mold insert (50) according to any one of the preceding claims, wherein the carrier substrate (3) comprises at least one first layer (4) and a second layer (4').

10. The mold insert (50) according to any one of the preceding claims, wherein the structural element (7) is made of a first material and the carrier substrate (3) is made of a second material, wherein the first material is different from the second material.

11. A carrier substrate (3) for a mold insert (50) according to any one of the preceding claims.

12. An injection molding system (18) having a cavity (20), the injection molding system comprising: - A deformation element (17) for deforming the inserted mold insert (50), especially the mold insert (50) according to any one of claims 1 to 10, and / or - A mechanism for influencing the amount of injection molding material flowing in, particularly in the conveying section directly downstream of the inlet opening of the cavity, preferably in the gate distributor (19, 19').

13. A method for injection molding using the injection molding system (18) according to claim 12, wherein, in order to demold the injection molded part, the mold insert (50) is deformed and / or affects the amount of the injection material flowing in.

14. The method according to claim 13, wherein during demolding, the molded part is separated from the outer region of the mold insert (50) in a first step and from the inner region of the mold insert (50) in a second step.

15. The method according to any one of claims 13 or 14, wherein the cross-section of the conveying section changes during the inflow of the injection molding material.

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