Manifold microchannel heat sink and liquid-cooled phase change heat dissipation system

Abstract

This application provides a manifold-type microchannel heat sink device and a liquid-cooled phase change heat dissipation system, relating to the field of heat sink technology. It addresses the problems of poor gas-liquid separation and ineffective bubble removal in related technologies during liquid-cooled phase change heat dissipation of microchannel heat sinks. The manifold-type microchannel heat sink device includes a microchannel module and a manifold module. The microchannel module includes multiple interconnected and alternately arranged rectangular and parallelogram-shaped microchannel regions. The manifold module is stacked on top of the microchannel module and includes alternately arranged inlet and outlet channels. A partition is provided between adjacent inlet and outlet channels. The partition is located directly above the parallelogram-shaped microchannel region, and both the inlet and outlet channels are located directly above the rectangular microchannel region. One sidewall of the outlet channel has a stepped step, the height of which gradually decreases along the fluid flow direction to gradually expand the outlet channel.

Description

Technical Field

[0001] This application relates to the field of heat sink technology, and in particular to a manifold microchannel heat sink device and a liquid-cooled phase change heat dissipation system. Background Technology

[0002] Microchannel heat sinks are key components in liquid-cooled phase change heat dissipation systems. They have densely packed micron-sized channels, where fluid is forced to convect and carry away heat, thus achieving ultra-high performance heat dissipation.

[0003] The microchannel heat sink in related technologies has the following problems: the fluid distribution within the microchannel heat sink is uneven, with localized flow deviation and localized drying, resulting in low heat transfer performance and poor flow stability; secondly, bubbles generated by fluid phase change are prone to stagnation within the microchannel, forming air resistance and affecting flow continuity, which is more pronounced under high heat flux density conditions; in addition, the outlet of the microchannel heat sink adopts a simple linear expansion structure, which makes it difficult to simultaneously meet the requirements of stable exhaust and low pressure drop in two-phase flow, resulting in poor gas-liquid separation and high flow resistance. Summary of the Invention

[0004] In view of the above problems, this application provides a manifold microchannel heat sink device and a liquid-cooled phase change heat dissipation system to solve the problems of poor gas-liquid separation effect and ineffective bubble discharge of microchannel heat sinks in liquid-cooled phase change heat dissipation in related technologies.

[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0006] This application provides a manifold-type microchannel heat sink device, comprising: a microchannel module, the microchannel module including a substrate and a plurality of ribs arranged in an array on the substrate to form a plurality of interconnected rectangular microchannel regions and parallelogram microchannel regions on the substrate, wherein the rectangular microchannel regions and the parallelogram microchannel regions are alternately spaced along a first horizontal direction; and a manifold module, the manifold module being stacked on top of the microchannel module in a vertical direction, the manifold module including liquid inlet channels alternately spaced along the first horizontal direction. The liquid outlet channel and the liquid inlet channel are connected by a partition between adjacent liquid outlet channels. The partition is positioned directly above the parallelogram-shaped microchannel region along the vertical direction. Both the liquid inlet channel and the liquid outlet channel are positioned directly above the rectangular microchannel region and are connected to the rectangular microchannel region. One sidewall of the liquid outlet channel has a stepped platform, the height of which gradually decreases along the vertical direction of fluid flow, so that the liquid outlet channel gradually expands along the fluid flow direction.

[0007] In one embodiment of this application, the plurality of ribs includes a plurality of parallel first ribs and a plurality of second ribs, the plurality of first ribs and the plurality of second ribs being spaced apart along a second horizontal direction, and the plurality of first ribs and the plurality of second ribs being alternately spaced apart along a first horizontal direction; the first ribs have opposing first and second wall surfaces along the first horizontal direction, and the second ribs have opposing third and fourth wall surfaces along the first horizontal direction, the first wall surface and the third wall surface being rectangular surfaces, the first wall surface and the third wall surface being opposite each other along the first horizontal direction to form the rectangular microchannel region; the second wall surface and the fourth wall surface being inclined surfaces to the rectangular surfaces, the second wall surface and the fourth wall surface being opposite each other along the first horizontal direction to form the parallelogram microchannel region; wherein, the first horizontal direction and the second horizontal direction are perpendicular.

[0008] In one embodiment of this application, the angle between the inclined surface and the rectangular surface is 30°-70°; and / or, along the vertical direction, the depth of the rectangular microchannel region and the parallelogram microchannel region is 70%-90% of the height of the partition; and / or, along the vertical direction, the depth of the rectangular microchannel region and the parallelogram microchannel region is 500μm-1000μm; and / or, along the second horizontal direction, the width of the rectangular microchannel region and the parallelogram microchannel region is 500μm-1000μm.

[0009] In one embodiment of this application, the projection of the rectangular microchannel region in the vertical direction is a rectangle with an aspect ratio greater than 1.5, the length of the rectangle extends along the second horizontal direction, and the width of the rectangle extends along the first horizontal direction; the width of the rectangle is 1.2 to 1.5 times the width of the projection of the parallelogram microchannel region in the vertical direction.

[0010] In one embodiment of this application, along the vertical direction, the height of the lowest point of the stepped step is 40%-60% of the height of the partition; and / or, the height of the stepped step is 3000μm-5500μm; and / or, the gradually widening angle of the liquid outlet channel along the flow direction of the fluid is 5°-15°.

[0011] In one embodiment of this application, the manifold module includes an inlet and an outlet. The inlet is connected to the inlet channel via an inlet groove, and the outlet is connected to the outlet channel via an outlet groove. Both the inlet groove and the outlet groove are trapezoidal grooves. In the direction in which fluid flows into the manifold module from the inlet, the opening of the inlet groove gradually decreases; in the direction in which fluid flows out of the manifold module from the outlet, the opening of the outlet groove gradually increases.

[0012] In one embodiment of this application, the manifold-type microchannel heat sink device further includes: a cover plate; the cover plate is stacked on top of the manifold module along the vertical direction, and the cover plate is sealed to the manifold module.

[0013] In one embodiment of this application, the cover plate is made of copper, aluminum, silicon, ceramic, polycarbonate, quartz glass, or heat-resistant resin; and / or, the thickness of the cover plate is 2000μm-5000μm; and / or, the light transmittance of the cover plate is greater than or equal to 90%.

[0014] In one embodiment of this application, the edge of the stepped step is a rounded transition edge.

[0015] This application embodiment also provides a liquid-cooled phase change heat dissipation system, which includes multiple manifold microchannel heat sinks described above, and the multiple manifold microchannel heat sinks are arranged in an array and interconnected.

[0016] The manifold-type microchannel heat sink device provided in this application has the following technical effects:

[0017] By setting multiple rectangular microchannel regions below the flow channel of the manifold module, the uniformity of liquid distribution in the microchannels can be improved and the inlet pressure drop can be reduced. At the same time, multiple parallelogram microchannel regions are also set below the baffle of the manifold module. When the fluid flows from the rectangular microchannel region to the parallelogram microchannel region, it can guide the bubbles to escape laterally, effectively promoting the lateral flow of fluid between microchannels and the timely discharge of bubbles. This avoids the accumulation and retention of bubbles below the baffle, significantly improving the problems of bubble retention and local drying in the microchannels, improving the exhaust efficiency and flow stability of the two-phase flow, and thus improving the heat exchange efficiency.

[0018] The stepped expansion of the liquid outlet channel is achieved through a single-stage step, and the liquid outlet channel has two planes with different heights. The single-stage stepped expansion allows the gas-liquid fluid to obtain sufficient diffusion space in the outlet area, effectively reducing the pressure drop and flow resistance of the gas-liquid mixture at the outlet, improving flow stability, and ensuring the reliable operation of the manifold microchannel heat sink device.

[0019] Furthermore, the multiple manifold microchannel heat sink devices provided in this application embodiment can be arranged in an array and interconnected. They can form an array-type heat sink heat dissipation system by modular splicing of multiple units. Through the design of multi-module superposition and multi-flow path series and parallel connection, the heat dissipation capacity can be flexibly expanded to meet the heat dissipation requirements of electronic devices with different power densities. It is suitable for the thermal management needs of servers, data centers, high heat flux density equipment, etc. Attached Figure Description

[0020] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the structure of the manifold microchannel heat sink device provided in the embodiments of this application. Figure 1 ;

[0022] Figure 2 A top view of the microchannel module of the manifold microchannel heat sink device provided in the embodiments of this application;

[0023] Figure 3 for Figure 2 Enlarged view of section A;

[0024] Figure 4 A top view of the manifold module of the manifold microchannel heat sink device provided in the embodiments of this application;

[0025] Figure 5 A schematic diagram of a single-stage stepped structure of the liquid outlet channel provided in an embodiment of this application;

[0026] Figure 6 A schematic diagram of the structure of the manifold microchannel heat sink device provided in the embodiments of this application. Figure 2 .

[0027] Figure label:

[0028] 100-Microchannel Module;

[0029] 101 - Substrate; 102 - Rectangular microchannel region; 103 - Parallelogram microchannel region;

[0030] 1011 - First rib; 1012 - Second rib;

[0031] 200-Manifold Module;

[0032] 201-Liquid inlet; 202-Liquid outlet; 203-Liquid inlet channel; 204-Liquid outlet channel; 205-Baffle; 206-Liquid inlet tank; 207-Liquid outlet tank;

[0033] 2041 - Stepped steps;

[0034] 300 - Cover plate. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] refer to Figure 1 The manifold microchannel heat sink device provided in this application includes a microchannel module 100 and a manifold module 200 stacked sequentially from bottom to top along the vertical direction (z-axis shown in the figure).

[0037] The microchannel module 100 includes a substrate 101, on which a recess is formed, and multiple ribs arranged in an array are disposed in the recess to form multiple interconnected microchannels in the recess.

[0038] The manifold module 200 is stacked vertically on the base 101. The manifold module 200 includes an inlet channel 203 and an outlet channel 204. The inlet channel 203 and the outlet channel 204 have opposing top and bottom walls in the vertical direction. The bottom wall has an opening, and the top wall can be closed to form a closed channel. The side wall of the manifold module 200 is also provided with an inlet port 201 and an outlet port 202. The inlet port 201 is connected to the inlet channel 203, and the outlet port 202 is connected to the outlet channel 204.

[0039] Fluid flows into the inlet channel 203 from the inlet port 201 and into the microchannel in the pit through the opening on the bottom wall of the inlet channel 203. After the microchannel is filled with fluid and heat exchange is completed, the fluid overflows from the top of the microchannel into the outlet channel 204 and flows out from the outlet port 202.

[0040] The manifold module 200 can be sealed to the substrate 101 by lamination bonding, mechanical connection, or welding to ensure closed-loop fluid circulation. Simultaneously, the substrate 101 can be processed by chemical etching to form multiple ribs arranged in an array within the recesses.

[0041] refer to Figure 2 and Figure 3 Multiple interconnected microchannels have different shapes, so that the pit has multiple rectangular microchannel regions 102 and multiple parallelogram microchannel regions 103, and the multiple rectangular microchannel regions 102 and multiple parallelogram microchannel regions 103 are arranged alternately along the first horizontal direction (x-axis shown in the figure).

[0042] Continue to refer to Figure 1The inlet channel 203 and the outlet channel 204 are also arranged alternately along the first horizontal direction (x-axis shown in the figure). A partition 205 is provided between adjacent inlet channels 203 and outlet channels 204. The partition 205 is used to block the inlet channel 203 and the outlet channel 204.

[0043] Along the vertical direction (z-axis shown in the figure), each partition 205 is positioned directly above a corresponding parallelogram microchannel region 103, and each liquid inlet channel 203 and liquid outlet channel 204 is positioned directly above a corresponding rectangular microchannel region 102, and the liquid inlet channel 203 and liquid outlet channel 204 are also connected to the rectangular microchannel region 102.

[0044] In other words, the fluid flows into the inlet channel 203 from the inlet port 201, and then flows into the rectangular microchannel region 102 in the pit through the opening on the bottom wall of the inlet channel 203. It then flows from the rectangular microchannel region 102 to the parallelogram microchannel region 103. After the pit is filled with fluid and heat exchange is completed, the fluid overflows from the rectangular microchannel region 102 into the outlet channel 204 and flows out from the outlet port 202.

[0045] The rectangular microchannel region 102 is located below the liquid inlet channel 203 and the liquid outlet channel 204, which can improve the uniformity of liquid distribution in the microchannel and reduce the inlet pressure drop.

[0046] The fluid is a gas-liquid mixture. The buoyancy of the bubbles in the liquid is always vertically upward (opposite to the direction of gravity). The fluid flows from the rectangular microchannel region 102 to the parallelogram microchannel region 103, which means that the fluid flows from the mainstream horizontal channel through the inclined channel. The wall of the inclined channel forms an angle with the mainstream horizontal direction, so that the buoyancy of the bubbles is tilted upward. The bubbles are pushed to the side of the channel, causing the bubbles to break away from the mainstream. The bubbles eventually reach the top of the channel and escape along the inclined direction.

[0047] Therefore, the manifold microchannel heat sink device provided in this application guides the lateral escape of bubbles by setting multiple rectangular microchannel regions 102 and multiple parallelogram microchannel regions 103, effectively promoting the lateral flow of fluid between microchannels and the timely discharge of bubbles, avoiding the accumulation and retention of bubbles below the baffle 205, significantly improving the problems of bubble retention and local drying in microchannels, improving the exhaust efficiency and flow stability of two-phase flow, and thus improving heat exchange efficiency.

[0048] refer to Figure 4 and Figure 5 One sidewall of the liquid outlet channel 204 has a stepped step 2041. In the vertical direction (z-axis shown in the figure), the height of the stepped step 2041 is along the direction of fluid flow. Figure 4The direction shown (from left to right) gradually decreases so that the outlet channel 204 gradually expands linearly along the flow direction of the fluid, and the cross-sectional area of ​​the outlet channel 204 gradually increases.

[0049] In other words, the stepped expansion of the liquid outlet channel 204 is achieved through a single-stage step, and the liquid outlet channel 204 has two planes with different heights. The single-stage stepped expansion allows the gas-liquid fluid to obtain sufficient diffusion space in the outlet area, effectively reducing the pressure drop and flow resistance of the gas-liquid mixture at the outlet, improving flow stability, and ensuring that the manifold microchannel heat sink device can operate reliably.

[0050] refer to Figure 2 and Figure 3 In this embodiment of the application, the plurality of ribs include a plurality of first ribs 1011 and a plurality of second ribs 1012 that are parallel to each other.

[0051] Multiple first ribs 1011 are arranged at intervals along the second horizontal direction (y-axis shown in the figure), and multiple second ribs 1012 are also arranged at intervals along the second horizontal direction (y-axis shown in the figure); and multiple first ribs 1011 and multiple second ribs 1012 are arranged alternately at intervals along the first horizontal direction (x-axis shown in the figure), thereby forming multiple ribs arranged in an array within the recess.

[0052] Along the first horizontal direction (x-axis shown in the figure), the first rib 1011 has a first wall and a second wall opposite each other, and the second rib 1012 has a third wall and a fourth wall opposite each other. The first wall and the third wall are both rectangular surfaces, and the second wall and the fourth wall are both inclined surfaces that are inclined to the rectangular surfaces.

[0053] Along the first horizontal direction (x-axis shown in the figure), the first wall and the third wall face each other to form a rectangular microchannel region 102; the second wall and the fourth wall face each other along the first horizontal direction to form a parallelogram microchannel region 103.

[0054] By setting rectangular and inclined surfaces on a single rib, it is possible to achieve an alternating arrangement of multiple rectangular microchannel regions 102 and multiple parallelogram microchannel regions 103. This simplifies the fabrication process of the manifold-type microchannel heat sink device provided in this embodiment.

[0055] Each rib is equipped with a reinforcing rib.

[0056] In this embodiment, the angle between the inclined plane and the rectangular plane can be 30°-70°, 30°-60° or 50°-70°, which promotes the rapid detachment of bubbles and prevents bubble accumulation; in the vertical direction (z-axis shown in the figure), the depth of the rectangular microchannel region 102 and the parallelogram microchannel region 103 is 70%-90% of the height of the partition 205, which promotes the lateral discharge of bubbles.

[0057] In this embodiment, the depth of the rectangular microchannel region 102 and the parallelogram microchannel region 103 can be 500μm-1000μm; along the first horizontal direction (x-axis shown in the figure), the width of the rectangular microchannel region 102 and the parallelogram microchannel region 103 is 500μm-1000μm.

[0058] In this embodiment, the projection of the rectangular microchannel region 102 in the vertical direction (z-axis shown in the figure) is a rectangle. The length of the rectangle extends along the second horizontal direction (y-axis shown in the figure), and the width of the rectangle extends along the first horizontal direction (x-axis shown in the figure). The aspect ratio of the rectangle is greater than 1.5. The width of the rectangle is 1.2 to 1.5 times the width of the projection of the parallelogram microchannel region 103 in the vertical direction (z-axis shown in the figure). This reduces the pressure drop difference between the rectangular microchannel region 102 and the parallelogram microchannel region 103, ensuring lateral replenishment of liquid and pressure balance.

[0059] The width and depth dimensions of the optimized rectangular microchannel region 102 and parallelogram microchannel region 103 can balance flow pressure loss and heat exchange effect.

[0060] In this embodiment, the edge of the stepped step 2041 is a rounded transition edge, which can reduce local eddies and separation in fluid flow and improve flow stability.

[0061] In this embodiment of the application, along the vertical direction (z-axis shown in the figure), the height of the lowest point of the stepped step 2041 is 40%-60% of the height of the partition 205. Preferably, the height of the lowest point of the stepped step 2041 can be 50% of the height of the partition 205, which can effectively reduce the pressure drop and flow disturbance of the gas-liquid mixture at the outlet.

[0062] Among them, the height of the stepped steps 2041 is 3000μm-5500μm.

[0063] refer to Figure 5 In this embodiment of the application, the liquid outlet channel 204 has a gradually widening angle of 5°-15° along the flow direction of the fluid, which is used to optimize the separation flow path of the gas and liquid phases and enhance the exhaust capacity.

[0064] refer to Figure 4 In this embodiment of the application, the liquid inlet 201 is connected to the liquid inlet channel 203 through the liquid inlet tank 206, and the liquid outlet 202 is connected to the liquid outlet channel 204 through the liquid outlet tank 207.

[0065] Both the inlet tank 206 and the outlet tank 207 are trapezoidal tanks. In the direction in which the fluid flows from the inlet port 201 into the manifold module 200, the opening of the inlet tank 206 gradually decreases; in the direction in which the fluid flows from the outlet port 202 out of the manifold module 200, the opening of the outlet tank 207 gradually increases.

[0066] The depth of the inlet tank 206 and the outlet tank 207 is the same as the height of the partition 205 to ensure the entry and exit of fluid.

[0067] refer to Figure 6 In this embodiment of the application, the manifold microchannel heat sink device further includes: a cover plate 300.

[0068] The cover plate 300 is stacked on top of the manifold module 200 along the vertical direction (z-axis shown in the figure), and the cover plate 300 is sealed to the manifold module 200.

[0069] At this time, the top and bottom walls of the inlet channel 203 and the outlet channel 204 of the manifold module 200 have openings, and the cover plate 300 is used to seal the top walls of the inlet channel 203 and the outlet channel 204 to form a closed channel.

[0070] The cover plate 300 is sealed to the manifold module 200 by mechanical connection or welding to ensure closed circulation of fluid.

[0071] The microchannel module 100, manifold module 200 and cover plate 300 can be made of the same metal material. The microchannel module 100 can also be made of copper, aluminum, silicon or ceramic material, with high thermal conductivity metal to ensure thermal performance.

[0072] The cover plate 300 can also be made of copper, aluminum, silicon, ceramic, polycarbonate, quartz glass or heat-resistant resin.

[0073] The thickness of the cover plate 300 can be 2000μm-5000μm.

[0074] The cover plate 300 is made of polycarbonate, quartz glass or heat-resistant resin. In this case, the cover plate 300 has a certain light transmittance, which is greater than or equal to 90%, and is used for visual monitoring or experimental observation.

[0075] The manifold microchannel heat sink device provided in this application will be further described below through specific embodiments:

[0076] refer to Figure 1 and Figure 6 The manifold microchannel heat sink device is mainly composed of a microchannel module 100, a manifold module 200 and a cover plate 300. The components are precisely assembled to form a complete cooling device.

[0077] The cover plate 300 is made of 5mm thick tempered glass, which has good light transmittance and mechanical strength, making it easy to observe the internal flow.

[0078] The manifold module 200 is made of oxygen-free copper or aluminum. The total height of the manifold module 200 is designed to be 11mm, and the flow channel size accuracy is ensured through precision machining.

[0079] The microchannel module 100 is also made of oxygen-free copper or aluminum. The microchannel module 100 has two specially designed connecting areas: a rectangular microchannel area 102 and a parallelogram microchannel area 103. The rectangular microchannel area 102 is located directly below the flow channel of the manifold module 200 and has a width of 1-1.5 mm. The parallelogram microchannel area 103 is arranged directly below the partition 205 of the manifold module 200 and adopts a 55° inclined parallelogram design. This heterogeneous structure can guide bubbles to detach in a specific direction and avoid them from accumulating in the partition 205 area.

[0080] The liquid outlet channel 204 of the manifold module 200 adopts a single-stage stepped gradually expanding design. The height of the stepped steps 2041 is 3-5.5mm. This single-stage stepped structure can control the overall pressure drop while ensuring the gas-liquid separation effect.

[0081] In terms of manufacturing process, this embodiment uses vacuum diffusion welding technology to connect the microchannel module 100, manifold module 200, and cover plate 300. The temperature is controlled at 900℃, the holding time is 200 minutes, and the vacuum degree is maintained at 5×10-3P. a Next, ensure welding quality.

[0082] For the visible cover plate 300, fluororubber sealing rings are selected for sealing. The sealing surface is precision machined, and the surface roughness is controlled within Ra1.6μm to ensure no leakage during long-term use.

[0083] Meanwhile, positioning pins are used to guide the assembly of each component to ensure precise alignment of the interlayer flow channels and control the assembly tolerance within ±0.05mm.

[0084] The working process of this manifold-type microchannel heat sink device is as follows: Coolant first enters through inlet 201 and is evenly distributed to each microchannel through rectangular microchannel region 102. When flowing through parallelogram-shaped microchannel region 103, the inclined wall structure generates directional secondary flow, causing bubbles to detach along a specific path. In outlet channel 204, the sudden expansion cross-section formed by the single-stage stepped expansion design creates a local low-pressure zone, accelerating bubble rise. At the same time, the horizontal expansion design smoothly reduces the flow velocity, promoting gas-liquid separation. Finally, the coolant is discharged from outlet 202, completing the entire cooling cycle.

[0085] Performance tests show that this manifold microchannel heat sink exhibits excellent heat dissipation performance under standard operating conditions, with a thermal resistance as low as 0.025℃·cm. 2 / W, effectively controlling chip temperature rise; at a flow rate of 3L / min, the system pressure drop is less than 30kPa, demonstrating good energy efficiency; the critical heat flux density exceeds 100W / cm³. 2 This meets the heat dissipation requirements of high-power devices.

[0086] In practical applications, this embodiment is specifically optimized for the heat dissipation requirements of 3300V / 2000A IGBT modules and high-power chips. Under steady-state operating conditions, the chip junction temperature can be controlled below 105℃ (ambient temperature 40℃), and the coolant temperature rise does not exceed 10℃. In transient condition tests, the system exhibits excellent dynamic response characteristics, capable of withstanding a short-term overload of 150% of the rated current (lasting 10 seconds), with a temperature fluctuation of less than 2℃. These performance indicators are superior to traditional heat dissipation solutions, fully demonstrating the technical advantages of this invention.

[0087] To ensure long-term reliable operation, this embodiment establishes a comprehensive maintenance plan. It is recommended to perform system cleaning every 2000 hours to remove any potential deposits. The visible cover seal should be replaced every two years to prevent aging and failure. A pressure test should be performed annually to verify the system's sealing performance. These maintenance measures effectively extend the equipment's lifespan and ensure long-term stable heat dissipation performance.

[0088] In the specific implementation process, the following key points need to be noted:

[0089] First, dimensional tolerances must be strictly controlled during microchannel fabrication, especially the tilt angle of the oblique connecting region must be within the range of 55±1°.

[0090] Secondly, the temperature profile must be precisely controlled during the vacuum brazing process to avoid welding defects.

[0091] Finally, special attention must be paid to cleaning the sealing surfaces during system assembly to ensure a good seal. These details are key factors in guaranteeing product performance.

[0092] Actual test data shows that, under the same operating conditions, the heat exchange efficiency of the present invention is more than 30% higher than that of the traditional solution, and the pressure drop is reduced by more than 25%. These performance improvements are of great significance for the heat dissipation of high-power electronic devices.

[0093] The implementation effect of this embodiment has passed multiple verification tests, including 500 hours of continuous operation, 200 thermal cycle tests, and vibration and shock tests. The results all demonstrate that the system performance is stable and reliable. These test data provide ample technical support for the engineering application of the product. Furthermore, the manufacturing process adopted in this solution is mature and reliable, fully suitable for mass production, and has excellent industrialization prospects.

[0094] It should be noted that although this embodiment uses IGBT modules and high-power chip heat dissipation as typical applications, the technical solution of the present invention is also applicable to the heat dissipation needs of other high-power electronic devices, such as power MOSFETs, CPUs, GPUs, etc.

[0095] This application also provides a liquid-cooled phase change heat dissipation system, which includes multiple manifold microchannel heat sinks as described above. The multiple manifold microchannel heat sinks are arranged in an array and interconnected. That is, the multiple manifold microchannel heat sinks are assembled into an array-type heat sink heat dissipation system through multi-unit modular splicing. Through multi-module superposition and multi-flow path series and parallel design, the heat dissipation capacity can be flexibly expanded to meet the heat dissipation requirements of electronic devices with different power densities. It is suitable for the thermal management requirements of servers, data centers, high heat flux density equipment, etc.

[0096] Among them, multiple manifold microchannel heat sink devices are connected in parallel, in series, or in series-parallel connection.

[0097] This liquid cooling system is suitable for server chips, power semiconductors, communication modules and high-performance electronic devices, and is especially suitable for cooling conditions based on fluid boiling.

[0098] In summary, this application provides a manifold microchannel heat sink device and a liquid-cooled phase change heat dissipation system. The manifold microchannel heat sink device includes a microchannel module 100 and a manifold module 200 stacked sequentially from bottom to top along the vertical direction (z-axis shown in the figure). The microchannel module 100 includes a substrate 101 and multiple ribs arranged in an array on the substrate 101 to form multiple interconnected rectangular microchannel regions 102 and parallelogram microchannel regions 103. The multiple rectangular microchannel regions 102 and multiple parallelogram microchannel regions 103 are arranged alternately along a first horizontal direction (x-axis shown in the figure). The manifold module 200 includes multiple ribs arranged along the first horizontal direction (x-axis shown in the figure). The inlet channels 203 and outlet channels 204 are arranged alternately, with baffles 205 between adjacent inlet channels 203 and outlet channels 204. Along the vertical direction (z-axis shown in the figure), each baffle 205 is positioned directly above a corresponding parallelogram-shaped microchannel region 103. Each inlet channel 203 and outlet channel 204 is positioned directly above a corresponding rectangular microchannel region 102, and the inlet channels 203 and outlet channels 204 are also connected to the rectangular microchannel region 102. One sidewall of the outlet channel 204 has a stepped step 2041. In the vertical direction (z-axis shown in the figure), the height of the stepped step 2041 is along the fluid flow direction. Figure 4 The direction shown (from left to right) gradually decreases so that the outlet flow channel 204 gradually expands linearly along the flow direction of the fluid.

[0099] By setting multiple rectangular microchannel regions 102 below the flow channel of the manifold module 200, the uniformity of liquid distribution in the microchannels can be improved and the inlet pressure drop can be reduced. At the same time, multiple parallelogram microchannel regions 103 are also set below the baffle 205 of the manifold module 200. When the fluid flows from the rectangular microchannel region 102 to the parallelogram microchannel region 103, it can guide the bubbles to escape laterally, effectively promoting the lateral flow of fluid between the microchannels and the timely discharge of bubbles, avoiding the accumulation and retention of bubbles below the baffle 205, significantly improving the problems of bubble retention and local drying in the microchannels, improving the exhaust efficiency and flow stability of the two-phase flow, thereby improving the heat exchange efficiency.

[0100] Furthermore, the stepped expansion of the liquid outlet channel 204 is achieved through a single-stage step, and the liquid outlet channel 204 has two planes with different heights; the single-stage stepped expansion allows the gas-liquid fluid to obtain sufficient diffusion space in the outlet area, effectively reducing the pressure drop and flow resistance of the gas-liquid mixture at the outlet, improving flow stability, and ensuring that the manifold microchannel heat sink device can operate reliably.

[0101] The various embodiments or embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0102] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0103] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0104] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0105] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A manifold-type microchannel heat sink device, characterized in that, include: A microchannel module, comprising a substrate and a plurality of ribs arranged in an array on the substrate to form a plurality of interconnected rectangular microchannel regions and parallelogram microchannel regions on the substrate, wherein the rectangular microchannel regions and the parallelogram microchannel regions are arranged alternately at intervals along a first horizontal direction. A manifold module is stacked vertically on top of the microchannel module. The manifold module includes inlet channels and outlet channels arranged alternately along a first horizontal direction, and a partition is provided between adjacent inlet channels and outlet channels. Along the vertical direction, the partition is positioned directly above the parallelogram-shaped microchannel region, and both the inlet channel and the outlet channel are positioned directly above the rectangular microchannel region, and both the inlet channel and the outlet channel are connected to the rectangular microchannel region. One of the sidewalls of the liquid outlet channel has a stepped step, the height of which gradually decreases along the vertical direction in the direction of fluid flow, so that the liquid outlet channel gradually expands along the direction of fluid flow. The plurality of ribs includes a plurality of first ribs and a plurality of second ribs that are parallel to each other. The plurality of first ribs and the plurality of second ribs are arranged at intervals along a second horizontal direction, and the plurality of first ribs and the plurality of second ribs are arranged alternately at intervals along a first horizontal direction. The first rib has a first wall and a second wall facing each other along the first horizontal direction, and the second rib has a third wall and a fourth wall facing each other along the first horizontal direction. The first wall and the third wall are both rectangular surfaces. The first wall and the third wall are facing each other along the first horizontal direction to form the rectangular microchannel region. Both the second wall and the fourth wall are inclined surfaces that are tilted to the rectangular surface. The second wall and the fourth wall are opposite each other along the first horizontal direction to form the parallelogram microchannel region. Wherein, the first horizontal direction and the second horizontal direction are perpendicular.

2. The manifold-type microchannel heat sink device according to claim 1, characterized in that, The angle between the inclined plane and the rectangular plane is 30°-70°; and / or, Along the vertical direction, the depths of both the rectangular microchannel region and the parallelogram microchannel region are 70%-90% of the height of the partition; or, along the vertical direction, the depths of both the rectangular microchannel region and the parallelogram microchannel region are 500μm-1000μm; and / or, Along the second horizontal direction, the width of the rectangular microchannel region and the parallelogram microchannel region is 500μm-1000μm.

3. The manifold-type microchannel heat sink device according to claim 1, characterized in that, The projection of the rectangular microchannel region in the vertical direction is a rectangle with an aspect ratio greater than 1.

5. The length of the rectangle extends along the second horizontal direction, and the width of the rectangle extends along the first horizontal direction. The width of the rectangle is 1.2 to 1.5 times the width of the projection of the parallelogram microchannel region in the vertical direction.

4. The manifold-type microchannel heat sink device according to claim 1, characterized in that, Along the vertical direction, the height of the lowest point of the stepped step is 40%-60% of the height of the partition; and / or, The height of the stepped steps is 3000μm-5500μm; and / or, The gradually widening angle of the outlet channel along the fluid flow direction is 5°-15°.

5. The manifold-type microchannel heat sink device according to claim 1, characterized in that, The manifold module includes an inlet and an outlet. The inlet is connected to the inlet channel via an inlet groove, and the outlet is connected to the outlet channel via an outlet groove. Both the inlet tank and the outlet tank are trapezoidal tanks; The opening of the inlet groove gradually decreases in the direction in which the fluid flows from the inlet into the manifold module; The opening of the outlet gradually increases in the direction in which the fluid flows out of the manifold module from the outlet.

6. The manifold-type microchannel heat sink device according to claim 1, characterized in that, The manifold-type microchannel heat sink device also includes: a cover plate; The cover plate is stacked on top of the manifold module along the vertical direction, and the cover plate is sealed to the manifold module.

7. The manifold-type microchannel heat sink device according to claim 6, characterized in that, The cover plate is made of copper, aluminum, silicon, ceramic, polycarbonate, quartz glass, or heat-resistant resin; and / or, The thickness of the cover plate is 2000μm-5000μm; and / or, The light transmittance of the cover plate is greater than or equal to 90%.

8. The manifold-type microchannel heat sink device according to claim 1, characterized in that, The edges of the stepped steps are rounded transition edges.

9. A liquid-cooled phase change heat dissipation system, characterized in that, It includes multiple manifold microchannel heat sink devices as described in any one of claims 1-8, wherein multiple manifold microchannel heat sink devices are arranged in an array and interconnected.

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