A method for preventing a circuit board from being blocked and a circuit board

Abstract

The application discloses a method for preventing circuit board from being blocked and a circuit board, and relates to the technical field of circuit boards, in particular to a method for preventing circuit board from being blocked and a circuit board. The method comprises the following steps: drawing a solid copper area at the position of a mechanism hole in a circuit board drawing; preparing a semi-finished circuit board according to the circuit board drawing, wherein the position of the mechanism hole on the semi-finished circuit board is provided with a copper layer formed by the solid copper area; and punching the position of the mechanism hole to obtain a finished circuit board. By setting the solid copper area at the position of the mechanism hole when drawing the circuit board drawing, the copper layer can be formed at the position of the mechanism hole when the circuit board is prepared, the support force is provided for the punching process by forming the copper layer, the problem of uneven stress and missing punching hole caused by the lack of support force at the position of the mechanism hole is avoided, and the hole type is complete.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for preventing circuit board via blockage and a circuit board thereof. Background Technology

[0002] In the circuit board manufacturing process, the machining quality of mechanical holes is crucial. However, when machining small-sized mechanical holes, such as 1.0mm round holes and elliptical holes composed of 1.00mm circles, it is very easy to miss punching holes. Furthermore, due to the small hole size, subsequent visual inspection cannot effectively detect these missed holes, ultimately preventing the circuit board from being assembled. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method and a circuit board for preventing circuit board holes from being blocked, so as to avoid the situation of missed punching holes when the circuit board is processed with mechanism holes.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A method for preventing circuit board via clogging includes: Draw solid copper areas at the locations of the mechanism holes in the circuit board drawing; A semi-finished circuit board is prepared according to the circuit board drawing, and the position of the mechanism hole on the semi-finished circuit board has a copper layer formed through the solid copper area; The positions of the mechanism holes are punched to obtain the finished circuit board.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A circuit board is prepared by the above-described method for preventing circuit board holes from becoming clogged.

[0006] The beneficial effects of this invention are as follows: by setting a solid copper area at the location of the mechanism hole when drawing the circuit board drawing, a copper layer can be formed at the location of the mechanism hole during the circuit board manufacturing process. The formation of the copper layer provides support for the punching process, avoiding the problem of incomplete punching due to uneven force caused by lack of support at the mechanism hole location, and making the hole shape complete. Attached Figure Description

[0007] Figure 1 This is a flowchart illustrating the steps of a method for preventing circuit board holes from becoming clogged, as described in an embodiment of the present invention. Figure 2a A schematic diagram of an existing circuit board design; Figure 2b This is a schematic diagram of a circuit board design according to a method for preventing circuit board holes from being blocked, as described in an embodiment of the present invention. Figure 3aA schematic diagram of another existing circuit board design; Figure 3b This is a schematic diagram of another circuit board design for a method of preventing circuit board holes from being blocked, as described in an embodiment of the present invention. Figure 4 This is a schematic diagram of a circuit board after exposure etching, illustrating a method for preventing circuit board via blockage in an embodiment of the present invention. Figure 5 This is a schematic diagram of another circuit board after exposure etching, which is a method for preventing circuit board via blockage in an embodiment of the present invention. Figure 6 This is a schematic diagram of a circuit board after punching, as described in an embodiment of the present invention, for preventing circuit board holes from becoming blocked. Figure 7 This is a schematic diagram of another circuit board after punching, as described in an embodiment of the present invention, for a method to prevent circuit board holes from becoming blocked. Figure 8 This is a schematic diagram of the structure of a circuit board according to an embodiment of the present invention. Detailed Implementation

[0008] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0009] Currently, through-hole punching on circuit boards is typically done using a die through mechanical punching. For example, a mechanical hole is punched out by a 1.0mm punch, and the punched area is a copper-free area. However, the copper-free area usually only contains the substrate layer. For example, in flexible circuit boards, the substrate layer is PI (polyimide), which is typically only 20μm thick. It is not subjected to force during punching, resulting in a lack of support during the punching process. This leads to uneven force distribution, causing the edges to fail to break through and forming unpunched holes.

[0010] In view of the fact that in the processing of small-sized mechanism holes in related technologies, there is a high risk of missed punching. This invention provides a method and a circuit board to prevent circuit board hole blockage. By adding solid copper design at the mechanism hole position, support force is provided for the punching process, avoiding the problem of missed punching caused by uneven force in the mechanism hole area.

[0011] A method for preventing circuit board via clogging includes: Draw solid copper areas at the locations of the mechanism holes in the circuit board drawing; A semi-finished circuit board is prepared according to the circuit board drawing, and the position of the mechanism hole on the semi-finished circuit board has a copper layer formed through the solid copper area; The positions of the mechanism holes are punched to obtain the finished circuit board.

[0012] As can be seen from the above description, the beneficial effects of the present invention are as follows: by setting a solid copper area at the position of the mechanism hole when drawing the circuit board drawing, a copper layer can be formed at the position of the mechanism hole during the preparation of the circuit board. The formation of the copper layer provides support for the punching process, avoiding the problem of missing punching due to uneven force caused by lack of support at the position of the mechanism hole, and making the hole shape complete.

[0013] Furthermore, the solid copper area is located at the center of the mechanism hole; The single-sided distance between the solid copper area and the edge of the mechanism hole is 0.13-0.17 mm.

[0014] As described above, by setting the single-sided distance between the solid copper area and the edge of the mechanism hole to 0.13-0.17mm, not only can it provide support for the punching process, but also by setting the distance, it makes it easier to punch away the copper layer in the solid copper area.

[0015] Further, the process of preparing the semi-finished circuit board according to the circuit board drawing includes: The initial circuit board is obtained by cutting materials according to the circuit board drawing; A photosensitive film is attached to the initial circuit board and exposed and DES processed, while retaining the copper layer in the solid copper area to obtain the semi-finished circuit board.

[0016] As described above, by sequentially applying photosensitive film, exposing, and performing DES processing on the initial circuit board after blanking, a copper layer can be effectively formed in the solid copper area of ​​the circuit board.

[0017] Furthermore, before attaching the photosensitive film to the initial circuit board and performing exposure and DES processing, the process further includes: The initial circuit board was chemically cleaned.

[0018] As described above, chemical cleaning of the initial circuit board can remove impurities from its surface, ensuring the effectiveness of the film application.

[0019] Furthermore, after punching the position of the mechanism hole, the process further includes: The semi-finished circuit board that has been punched is then subjected to copper plating.

[0020] As described above, copper plating on the circuit board improves its conductivity.

[0021] Furthermore, the process before obtaining the finished circuit board also includes: The semi-finished circuit board is surface treated to obtain the finished circuit board.

[0022] As can be seen from the above description, Another embodiment of the present invention provides a circuit board prepared by the above-described method for preventing circuit board holes from becoming clogged.

[0023] As described above, the circuit board prepared by the above method of preventing circuit board hole blockage can form an effective through hole at the position of the mechanism hole, thereby enabling the circuit board to be effectively assembled with electronic components and other structures.

[0024] Furthermore, the circuit board includes a substrate layer, a copper layer, a polymer layer, and a surface layer stacked sequentially.

[0025] As described above, by setting a substrate layer, a copper layer, a polymer layer, and a surface layer, the substrate layer provides support, the copper layer forms the circuit, and the polymer layer connects the copper layer to the surface layer, thereby realizing the function of the circuit board.

[0026] Furthermore, the circuit board includes a copper layer, a polymer layer, and a surface layer that are sequentially stacked on both sides of the substrate layer.

[0027] As can be seen from the above description, by setting a copper layer, a polymer layer and a surface layer on both sides of the substrate layer, a double-layer board is formed.

[0028] Furthermore, the copper layer comprises copper foil or copper foil and immersion copper.

[0029] As described above, by using copper foil or copper foil and immersion copper as the copper layer, the design requirements for the copper layer in different scenarios can be met. For example, copper foil can be used in low-cost scenarios, while immersion copper can be applied to the copper foil in high-conductivity scenarios to improve conductivity.

[0030] The method for preventing circuit board via blockage and the circuit board provided by this invention can be applied to circuit board manufacturing scenarios. The following is a detailed description of the specific embodiments: Example 1 Please refer to Figure 1 A method for preventing circuit board via clogging includes: S1. Draw a solid copper area at the location of the mechanism hole in the circuit board drawing; that is, when creating the circuit board drawing data, adjust the circuit pattern for the location of the mechanism hole and add solid copper design at the location of the mechanism hole; when drawing the solid copper area, the solid copper area can be set at the center of the mechanism hole; the single-sided distance between the solid copper area and the edge of the mechanism hole is 0.13-0.17mm; for example, when the mechanism hole is a circular hole with a diameter of 1.0mm, the diameter of the solid copper area is 0.7mm, that is, there needs to be a 0.15mm space around the solid copper area from the edge of the hole without solid copper, which is a pure PI layer. Please refer to... Figure 2a as well as Figure 3a As shown, the original circuit board drawing had hollowed-out holes with no solid copper area; please refer to... Figure 2b as well as Figure 3b Solid copper areas have been added to the locations of the mechanism holes in the circuit board drawings.

[0031] S2. A semi-finished circuit board is prepared according to the circuit board drawing. The semi-finished circuit board has a copper layer formed through the solid copper area at the location of the mechanism hole. The circuit board manufacturing process mainly includes: pre-process, chemical cleaning, film lamination, exposure, DES (developing, etching, stripping), post-process, and die-cutting. Specifically: The initial circuit board is obtained by cutting according to the circuit board drawing. After the previous process, chemical cleaning is performed to remove impurities on the circuit board surface to ensure the film lamination effect. Then, the film lamination process is carried out to evenly apply the photosensitive film to the circuit board surface. Then, exposure treatment is performed to form specific patterns on the photosensitive film in the solid copper areas and other circuit areas. After exposure, DES treatment is performed to further process the circuit board surface, retaining the copper layer in the solid copper areas, resulting in the semi-finished circuit board. In the subsequent post-processing, the operation is carried out according to the conventional process, with a focus on monitoring the punching process.

[0032] S3. Punch the holes at the mechanism positions to obtain the finished circuit board. During punching, the solid copper at the mechanism hole positions provides support, ensuring uniform force on the punch and successfully punching out complete hole shapes. This results in complete hole shapes, no residual copper, no burrs, and no incomplete punching on the circuit board. After punching, the semi-finished circuit board is subjected to copper plating as required; and surface treatment is performed on the semi-finished circuit board to obtain the finished circuit board; for example, surface treatments such as solder masking and marking can form an insulating layer and mark the positions of components on the circuit board.

[0033] Mass Production and Inspection: Mass production was carried out according to the above method, and a full inspection of the products was performed using a punching fixture after production (for products with completed online circuitry). Results showed no missing punching issues, and product quality was stable. For products before the online circuitry stage, production was carried out according to the updated specifications, and the finished products underwent normal inspection without the need for punching fixtures, thus improving inspection efficiency. Specifically, without design changes, all FQC (Final Quality Control, outgoing inspection) inspections required punching fixtures, averaging 20-30 seconds per set, resulting in 3600 sets inspected per 21 hours per day. After the design change, product quality improved, eliminating the need for punching fixture inspections, effectively saving inspection time and labor costs.

[0034] Example 2 Another embodiment of the present invention provides a circuit board prepared by the method in Embodiment 1. When the circuit board is a single-layer board, the circuit board includes a substrate layer, a copper layer, a polymer layer and a surface layer stacked sequentially.

[0035] When the circuit board is a double-sided board, the circuit board includes a copper layer, a polymer layer, and a surface layer sequentially stacked on both sides of a substrate layer; in an optional embodiment, the copper layer includes copper foil or copper foil and immersion copper. The specific structure of the double-sided flexible copper clad laminate (FCCL) is as follows: Figure 8 As shown. Sections A, B, C, and D are different locations on the same flexible circuit board. Due to different client designs, the copper in some areas was corroded by chemicals or reinforced plates were added, resulting in different total thicknesses at different sections. Therefore, two sets of total thickness data are included.

[0036] In summary, the method and circuit board for preventing circuit board hole blockage provided by the present invention, by setting a solid copper area at the location of the mechanism hole when drawing the circuit board drawing, can form a copper layer at the location of the mechanism hole during the circuit board manufacturing process. The formation of the copper layer provides support for the punching process, avoiding the problem of incomplete punching due to uneven force caused by lack of support at the mechanism hole location, thus ensuring the hole shape is complete; improving product quality, reducing the risk of assembly failure at the customer end, and improving inspection efficiency.

[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for preventing circuit board via blockage, characterized in that, include: Draw solid copper areas at the locations of the mechanism holes in the circuit board drawing; A semi-finished circuit board is prepared according to the circuit board drawing. The semi-finished circuit board has a copper layer formed through the solid copper area at the position of the mechanism hole. The solid copper area is located at the center of the mechanism hole, and the single-sided distance between the solid copper area and the edge of the mechanism hole is 0.13-0.17mm. The positions of the mechanism holes are punched to obtain the finished circuit board.

2. The method for preventing circuit board holes from becoming clogged according to claim 1, characterized in that, The process of preparing a semi-finished circuit board according to the circuit board drawing includes: The initial circuit board is obtained by cutting materials according to the circuit board drawing; A photosensitive film is attached to the initial circuit board and exposed and DES processed, while retaining the copper layer in the solid copper area to obtain the semi-finished circuit board.

3. The method for preventing circuit board holes from becoming clogged according to claim 2, characterized in that, Before attaching the photosensitive film to the initial circuit board and performing exposure and DES processing, the process also includes: The initial circuit board was chemically cleaned.

4. The method for preventing circuit board holes from becoming clogged according to claim 1, characterized in that, The process of punching out the position of the mechanism hole also includes: The semi-finished circuit board that has been punched is then subjected to copper plating.

5. The method for preventing circuit board holes from becoming clogged according to claim 1, characterized in that, The process before obtaining the finished circuit board also includes: The semi-finished circuit board is surface treated to obtain the finished circuit board.

6. A circuit board, characterized in that, It is prepared by any one of the methods for preventing circuit board holes from becoming blocked, as described in any one of claims 1-5.

7. The circuit board according to claim 6, characterized in that, The circuit board includes a substrate layer, a copper layer, a polymer layer, and a surface layer stacked in sequence.

8. The circuit board according to claim 6, characterized in that, The circuit board includes a copper layer, a polymer layer, and a surface layer that are sequentially stacked on both sides of a substrate layer.

9. The circuit board according to claim 7 or 8, characterized in that, The copper layer includes copper foil or copper foil and immersion copper.

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