Phase change liquid cooling system and electronic device

Abstract

The embodiment of the application provides a phase change liquid cooling system and electronic equipment, and relates to the technical field of liquid cooling. The system comprises a liquid storage tank, a working medium pump, a radiator, a gas-liquid separator, a first valve, a compressor and a first condenser. The phase change cooling liquid is stored in the liquid storage tank. The first liquid outlet of the liquid storage tank is connected with the inlet of the working medium pump. The outlet of the working medium pump is connected with the inlet of the radiator. The outlet of the radiator is connected with the inlet of the gas-liquid separator. The second gas outlet of the gas-liquid separator is connected with the inlet of the first condenser. The first valve is arranged in the passage between the second gas outlet of the gas-liquid separator and the inlet of the first condenser. The first gas outlet of the liquid storage tank is connected with the inlet of the compressor, and the outlet of the compressor is connected with the inlet of the first condenser. When the temperature of the chip is lower than the first preset temperature, the compressor is in the closed state. When the temperature of the chip is not lower than the first preset temperature, the compressor is in the open state. The scheme provided by the embodiment of the application can switch the heat dissipation efficiency according to the running condition of the chip.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a phase change liquid cooling system and electronic equipment. Background Technology

[0002] As the power consumption of electronic device chips increases, the heat dissipation requirements also rise. Insufficient heat dissipation can lead to overheating of the chip, affecting its normal operation. Traditional pump-driven phase change liquid cooling systems use phase change coolants for heat dissipation. These coolants have low boiling points and absorb heat to vaporize when passing near the heat sink, thus cooling the chip. However, the heat dissipation efficiency of these systems is fixed and cannot be adjusted to suit different chip operating conditions. Summary of the Invention

[0003] The purpose of this application is to provide a phase-change liquid cooling system and electronic device, thereby switching the heat dissipation efficiency according to the chip's operating conditions. The specific technical solution is as follows:

[0004] In a first aspect, embodiments of this application provide a phase change liquid cooling system, which includes a liquid storage tank, a working fluid pump, a radiator, a gas-liquid separator, a first valve, a compressor, and a first condenser;

[0005] The storage tank contains phase change coolant, and the first outlet of the storage tank is connected to the inlet of the working fluid pump.

[0006] The outlet of the working fluid pump is connected to the inlet of the heat sink; the heat sink is in contact with the chip;

[0007] The outlet of the radiator is connected to the inlet of the gas-liquid separator; the second liquid outlet of the gas-liquid separator is connected to the first inlet of the liquid storage tank; and the passage between the second gas outlet of the gas-liquid separator and the inlet of the first condenser includes a first valve.

[0008] The first outlet of the liquid storage tank is connected to the inlet of the compressor, and the outlet of the compressor is connected to the inlet of the first condenser.

[0009] The outlet of the first condenser is connected to the second inlet of the liquid storage tank;

[0010] When the temperature of the chip is lower than the first preset temperature, the compressor is turned off and the first valve is turned on.

[0011] When the temperature of the chip is not lower than the first preset temperature, the compressor is turned on and the first valve is turned off.

[0012] In one embodiment of this application, the phase change liquid cooling system further includes: a second condenser;

[0013] The outlet of the radiator is connected to the inlet of the second condenser;

[0014] The outlet of the second condenser is connected to the inlet of the gas-liquid separator;

[0015] When the temperature of the chip is lower than the first preset temperature, the liquid in the gas-liquid separator flows out from the second liquid outlet, and the gas in the gas-liquid separator flows out from the second gas outlet.

[0016] When the temperature of the chip is not lower than the second preset temperature, both the gas and liquid in the gas-liquid separator flow out from the second liquid outlet.

[0017] In one embodiment of this application, the phase change liquid cooling system further includes a second valve;

[0018] The second valve is located between the second liquid outlet of the gas-liquid separator and the first inlet of the storage tank;

[0019] When the temperature of the chip is lower than the first preset temperature, the second valve is closed.

[0020] When the temperature of the chip is not lower than the first preset temperature, the second valve is in the open state.

[0021] In one embodiment of this application, the phase change liquid cooling system further includes a third valve and a heater capable of heating the liquid storage tank;

[0022] The passage between the second outlet of the gas-liquid separator and the inlet of the first condenser includes a first valve and a third valve, and the passage between the outlet of the compressor and the inlet of the first condenser includes the third valve;

[0023] When the temperature of the phase change coolant in the storage tank is lower than the second preset temperature, the heater is turned on and the third valve is turned off until the temperature of the phase change coolant reaches the third preset temperature, which is higher than the second preset temperature but lower than the boiling point of the phase change coolant.

[0024] In one embodiment of this application, when the liquid temperature in the storage tank is lower than a second preset temperature, the compressor is turned on and the first valve is turned on.

[0025] In one embodiment of this application, the phase change liquid cooling system further includes: a second condenser, a fourth valve, and a fifth valve;

[0026] The fourth valve is located between the outlet of the radiator and the inlet of the second condenser;

[0027] The fifth valve is located between the outlet of the radiator and the inlet of the gas-liquid separator;

[0028] The outlet of the second condenser is connected to the inlet of the gas-liquid separator;

[0029] When the temperature of the chip is lower than the first preset temperature, the fifth valve is closed and the fourth valve is open. The liquid in the gas-liquid separator flows out from the second liquid outlet and the gas in the gas-liquid separator flows out from the second gas outlet.

[0030] When the temperature of the chip is not lower than the second preset temperature, the fifth valve is in the closed state and the fourth valve is in the open state, and both the gas and liquid in the gas-liquid separator flow out from the second liquid outlet.

[0031] When the liquid temperature in the storage tank is lower than the second preset temperature, the fourth valve is closed and the fifth valve is open.

[0032] In one embodiment of this application, the phase change liquid cooling system further includes a second valve;

[0033] The second valve is located between the second liquid outlet of the gas-liquid separator and the first inlet of the storage tank;

[0034] When the temperature of the chip is lower than the first preset temperature, the second valve is closed.

[0035] When the temperature of the chip is not lower than the first preset temperature or the temperature of the liquid in the storage tank is lower than the second preset temperature, the second valve is in the open state.

[0036] In one embodiment of this application, the heater is installed inside the liquid storage tank or on the outer wall of the liquid storage tank.

[0037] In one embodiment of this application, the first vent of the liquid storage tank is located at the top of the liquid storage tank.

[0038] In one embodiment of this application, the phase change liquid cooling system further includes a fan for dissipating heat from the first condenser.

[0039] Secondly, embodiments of this application provide an electronic device, including a phase change liquid cooling system and a chip, wherein the phase change liquid cooling system is any of the phase change liquid cooling systems described in the first aspect, and the heat sink in the phase change liquid cooling system is in contact with the chip.

[0040] Beneficial effects of the embodiments in this application:

[0041] The phase change liquid cooling system provided in this application embodiment involves a phase change coolant in a storage tank flowing into a working fluid pump through a first outlet. Under the action of the working fluid pump, the coolant flows into the inlet of a heat sink. The heat sink absorbs heat generated by the chip upon contact, and the vaporized gas flows out from the heat sink outlet and into a gas-liquid separator. When the chip temperature is below a first preset temperature, enhanced heat dissipation is not required, so the compressor is in a closed state, and the first valve is in an open state. Gas in the gas-liquid separator can flow out from the second outlet, enter the first condenser through the open first valve, condense into phase change coolant, and flow back to the storage tank through the outlet of the first condenser and the second inlet of the storage tank, completing the cycle. When the chip temperature is not lower than the first preset temperature, enhanced heat dissipation is required, so the compressor is in a closed state, and the first valve is closed. Therefore, gas flowing out from the second outlet of the gas-liquid separator is blocked, and the gas can only flow into the storage tank through the second outlet of the gas-liquid separator and the first inlet of the storage tank, and then into the compressor through the first outlet of the storage tank. The compressor increases the temperature of the gas, raising the temperature of the gas entering the first condenser. Since the purpose of the first condenser is to transfer heat to the external environment, the greater the temperature difference between the gas and the outside environment, the faster the heat conduction and the better the heat dissipation effect. Therefore, increasing the gas temperature by the compressor can improve the heat dissipation efficiency. Thus, when the chip temperature is not lower than the first preset temperature, the compressor, being in the on state, can achieve a stronger heat dissipation effect. It is evident that the phase change liquid cooling system in this embodiment can provide different levels of heat dissipation depending on the chip's operating conditions, enabling the phase change liquid cooling system to have both high-intensity heat dissipation and normal heat dissipation states. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0043] Figure 1 This is a schematic diagram of the structure of the first phase change liquid cooling system provided in the embodiments of this application;

[0044] Figure 2 This is a schematic diagram of the structure of a second phase change liquid cooling system provided in an embodiment of this application;

[0045] Figure 3 This is a schematic diagram of the structure of the third phase change liquid cooling system provided in the embodiments of this application;

[0046] Figure 4 This is a schematic diagram of the structure of the fourth phase change liquid cooling system provided in the embodiments of this application;

[0047] Figure 5 This is a schematic diagram of the structure of the fifth phase change liquid cooling system provided in the embodiments of this application;

[0048] Figure 6 This is a schematic diagram of the sixth phase change liquid cooling system provided in the embodiments of this application;

[0049] Figure 7 This is a schematic diagram of the structure of the seventh phase change liquid cooling system provided in the embodiments of this application;

[0050] Figure 8 This is a schematic diagram of the structure of the eighth phase change liquid cooling system provided in the embodiments of this application. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0052] In order to switch the heat dissipation efficiency according to the chip's operating conditions, this application provides a phase change liquid cooling system and electronic device.

[0053] See Figure 1 This is a schematic diagram of the structure of the first phase change liquid cooling system provided in the embodiment of this application. The phase change liquid cooling system includes a liquid storage tank 101, a working fluid pump 102, a radiator 103, a gas-liquid separator 104, a first valve 105, a compressor 106, and a first condenser 107.

[0054] The aforementioned storage tank 101 stores phase change coolant. The first outlet 1011 of the aforementioned storage tank 101 is connected to the inlet 1021 of the aforementioned working fluid pump.

[0055] The first outlet 1011 mentioned above is the outlet for the phase change coolant on the storage tank 101. The phase change coolant can be water, ethylene glycol aqueous solution, propylene glycol aqueous solution, etc.

[0056] The outlet 1022 of the working fluid pump 102 is connected to the inlet 1031 of the heat sink 103; the heat sink 103 is in contact with the chip.

[0057] The working fluid pump 102 provides kinetic energy to the phase change coolant, enabling it to flow within the phase change coolant cooling system. The heat sink 103 can be a cold plate or an evaporator. The cold plate has internal flow channels through which the phase change coolant flows to absorb heat, thereby cooling the chip in contact with the cold plate. The evaporator can be a tube-plate evaporator or a finned tube evaporator, etc. The phase change coolant in the evaporator vaporizes and absorbs heat, lowering the evaporator surface temperature, which in turn absorbs heat from the chip, thus cooling the chip.

[0058] The outlet 1032 of the radiator 103 is connected to the inlet 1041 of the gas-liquid separator 104; the second liquid outlet 1042 of the gas-liquid separator 104 is connected to the first inlet 1012 of the liquid storage tank 101; the passage between the second gas outlet 1043 of the gas-liquid separator 104 and the inlet 1071 of the first condenser 107 includes a first valve 105. The second liquid outlet 1042 is used to discharge liquid, and the second gas outlet 1043 is used to discharge gas.

[0059] The second gas outlet 1043 is used to discharge the gas in the gas-liquid separator 104. The second liquid outlet 1042 can discharge gas alone, liquid alone, or both gas and liquid depending on the contents of the gas-liquid separator 104. Specific differences can be found in the following description, which will not be detailed here.

[0060] Since the density of gas is lower than that of liquid, after the gas and liquid separate, the gas will be distributed in the upper part of the gas-liquid separator 104. Therefore, the second gas outlet 1043, which is only used for gas outflow, can be configured at the top of the gas-liquid separator 104 to prevent liquid from also flowing out from the second gas outlet 1043. The second liquid outlet 1042 can flow out liquid. In order to ensure that the liquid flows out as completely as possible, the second liquid outlet 1042 can be close to the bottom of the gas-liquid separator 104. However, the specific location of the second gas outlet 1043 is not limited in this embodiment.

[0061] The aforementioned gas-liquid separator 104 can be a gravity settling gas-liquid separator, a baffle-type gas-liquid separator, a centrifugal force gas-liquid separator, a wire mesh gas-liquid separator, etc. A gravity settling gas-liquid separator utilizes the downward velocity of liquid under gravity to separate it from gas. A baffle-type gas-liquid separator is equipped with baffles. When the gas-liquid mixture passes through the baffles, the gas is deflected, while the liquid, due to inertia, adheres to the baffles and collects at the bottom of the separator under gravity, while the gas is distributed in the upper part, thus achieving gas-liquid separation. A centrifugal force gas-liquid separator utilizes the difference in density between gas and liquid. When they mix and flow, the centrifugal force on the liquid is greater than that on the gas, causing the liquid to tend to separate centrifugally. The liquid adheres to the wall of the gas-liquid separator and collects at the bottom under gravity, while the gas is distributed in the upper part, thus achieving gas-liquid separation.

[0062] The first outlet 1013 of the liquid storage tank 101 is connected to the inlet 1061 of the compressor 106, and the outlet 1062 of the compressor 106 is connected to the inlet 1071 of the first condenser 107.

[0063] In one embodiment, the outlet 1062 of the compressor 106 and the inlet 1071 of the first condenser 107 are respectively connected to two ports of the first three-way connector, and the second outlet 1043 of the gas-liquid separator 104 is connected to the third port of the first three-way connector via the first valve 105.

[0064] In another embodiment, the first vent 1013 of the liquid storage tank 101 is located at the top of the liquid storage tank 101. Since the liquid in the liquid storage tank 101 is deposited at the bottom of the liquid storage tank 101 due to gravity, placing the first vent 1013 at the top of the liquid storage tank 101 can minimize the risk of the compressor 106 drawing liquid from the bottom of the liquid storage tank 101 during operation.

[0065] The outlet 1072 of the first condenser 107 is connected to the second inlet 1014 of the liquid storage tank 101.

[0066] The first condenser 107 is used to condense the gas flowing through it, thereby liquefying the gas into a phase change coolant and releasing heat.

[0067] In one embodiment of this application, the phase change liquid cooling system may further include a fan, which is located within a preset range near the first condenser 107 to conduct heat from the first condenser 107 to the external environment, thereby dissipating heat from the gas in the first condenser 107.

[0068] In another embodiment of this application, heat dissipation fins may be attached to the surface of the first condenser 107, or a liquid cooling plate may be connected to the first condenser 107, so that the heat of the first condenser 107 can be transferred to the external environment by means of heat dissipation fins or liquid cooling plate.

[0069] When the temperature of the chip is lower than the first preset temperature, the compressor 106 is turned off and the first valve 105 is turned on.

[0070] When the temperature of the chip is not lower than the first preset temperature, the compressor 106 is turned on and the first valve 105 is turned off.

[0071] In one embodiment of this application, a Baseboard Management Controller (BMC) can be configured to monitor the chip temperature, and the BMC sends the detected chip temperature to the Rack Management Controller (RMC) in the server. Each RMC can connect to multiple BMCs, and different BMCs are used to detect the chip temperature within different nodes. When the chip temperature is lower than a first preset temperature, the RMC can control the compressor 106 in the phase change liquid cooling system that dissipates heat from the chip to shut down, and control the first valve 105 to open. When the chip temperature is not lower than the first preset temperature, the RMC can control the compressor 106 in the phase change liquid cooling system that dissipates heat from the chip to turn on, and control the first valve 105 to close.

[0072] Depend on Figure 1 As can be seen, when the compressor 106 is in the off state and the first valve 105 is in the open state, the phase change coolant flows out of the storage tank 101 and passes through the working fluid pump 102 to the radiator 103. In the radiator 103, it absorbs the heat of the chip and vaporizes into gas. The generated gas reaches the gas-liquid separator 104. Since the first valve 105 is in the open state, the gas flows out from the second outlet 1043, passes through the first valve 105, and reaches the first condenser 107, where it is liquefied again into phase change coolant. After that, it flows back to the storage tank 101 to complete the cycle.

[0073] With compressor 106 in the on state and first valve 105 in the off state, phase change coolant flows out of storage tank 101 and passes through working fluid pump 102 to radiator 103. In radiator 103, it absorbs heat from the chip and vaporizes into gas. The generated gas reaches gas-liquid separator 104. Since first valve 105 is in the off state, the gas can only flow into storage tank 101 through second outlet 1042 of gas-liquid separator 104 and first inlet 1012 of storage tank 101. Then it flows out through first outlet 1013 of storage tank 101 and enters compressor 106. Compressor 106 is in the on state and can heat the gas. The heated gas enters first condenser 107, re-liquefies into phase change coolant, and then flows back to storage tank 101 to complete the cycle.

[0074] As can be seen, when the chip temperature is below the first preset temperature, the gas is directly condensed by the first condenser 107. When the chip temperature is not lower than the first preset temperature, the gas is heated by the compressor 106 before being condensed by the first condenser 107. Since gas heat dissipation relies on the temperature difference between the gas and the external environment, the greater the temperature difference, the faster the heat dissipation. Therefore, in this application, heating the gas by the compressor 106 can increase the temperature difference between the gas and the external environment, thereby improving heat dissipation efficiency. This results in a stronger heat dissipation effect when the chip temperature is not lower than the first preset temperature.

[0075] As can be seen from the above, in the phase change liquid cooling system, the phase change coolant in the storage tank flows into the working fluid pump through the first outlet. Under the action of the working fluid pump, it flows into the inlet of the heat sink. After the heat sink absorbs the heat generated by the chip, the vaporized gas flows out from the outlet of the heat sink and enters the gas-liquid separator. When the chip temperature is lower than the first preset temperature, there is no need to enhance heat dissipation, so the compressor is in the off state and the first valve is in the open state. The gas in the gas-liquid separator can flow out from the second outlet and enter the first condenser through the open first valve. The condensate in the first condenser is liquefied into phase change coolant and flows back to the storage tank through the outlet of the first condenser and the second inlet of the storage tank, completing the cycle. When the chip temperature is not lower than the first preset temperature, there is a need to enhance heat dissipation, so the compressor is in the on state and the first valve is in the closed state. Therefore, the gas in the gas-liquid separator is blocked after flowing out from the second outlet. The gas can only flow into the storage tank through the second outlet of the gas-liquid separator and the first inlet of the storage tank, and then into the compressor through the first outlet of the storage tank. The compressor increases the temperature of the gas, raising the temperature of the gas entering the first condenser. Since the purpose of the first condenser is to transfer heat to the external environment, the greater the temperature difference between the gas and the outside environment, the faster the heat conduction and the better the heat dissipation effect. Therefore, increasing the gas temperature by the compressor can improve the heat dissipation efficiency. Thus, when the chip temperature is not lower than the first preset temperature, the compressor, being in the on state, can achieve a stronger heat dissipation effect. It is evident that the phase change liquid cooling system in this embodiment can provide different levels of heat dissipation depending on the chip's operating conditions, enabling the phase change liquid cooling system to have both high-intensity heat dissipation and normal heat dissipation states.

[0076] See Figure 2 This is a schematic diagram of the structure of the second phase change liquid cooling system provided in the embodiments of this application, which is consistent with the aforementioned Figure 1 Compared to the embodiment shown, the phase change liquid cooling system described above further includes a second condenser 108.

[0077] The outlet 1032 of the radiator 103 is connected to the inlet 1081 of the second condenser 108.

[0078] The outlet 1082 of the second condenser 108 is connected to the inlet 1041 of the gas-liquid separator 104.

[0079] Alternatively, a fan can be positioned within a preset range near the second condenser 108 to conduct heat from the second condenser 108 to the external environment, thereby dissipating heat from the gas in the second condenser 108.

[0080] In another embodiment of this application, heat dissipation fins may be attached to the surface of the second condenser 108, or a liquid cooling plate may be connected to the second condenser 108, so that the heat of the second condenser 108 can be transferred to the external environment by means of heat dissipation fins or liquid cooling plate.

[0081] Since the outlet of radiator 103 is connected to the inlet 1081 of the second condenser 108, the phase change coolant that vaporizes into gas in radiator 103 will first pass through the second condenser 108 and undergo a round of liquefaction in the second condenser 108. The liquid flowing out of the outlet 1082 of the second condenser 108 may be entirely liquid or a gas-liquid mixture.

[0082] If the outflow is liquid, the liquid flows into the gas-liquid separator 104 and then flows out entirely from the second liquid outlet 1042.

[0083] If the outflow is a gas-liquid mixture, then the following two situations exist:

[0084] When the temperature of the chip is lower than the first preset temperature, the liquid in the gas-liquid separator 104 flows out from the second liquid outlet 1042, and the gas in the gas-liquid separator 104 flows out from the second gas outlet 1043.

[0085] Since the temperature of the chip is lower than the first preset temperature, the first valve 105 is in the open state, so the gas in the gas-liquid separator 104 can flow out from the second gas outlet 1043.

[0086] When the temperature of the chip is not lower than the second preset temperature, both the gas and liquid in the gas-liquid separator 104 flow out from the second liquid outlet 1042.

[0087] Since the chip temperature is below the first preset temperature, the first valve 105 is closed, so the gas in the gas-liquid separator 104 can only flow out from the second outlet 1042 along with the liquid. Because the gas and liquid have different densities, they can separate in the storage tank 101. Therefore, the gas in the storage tank 101 will still flow out from the first outlet 1013 and enter the compressor 106.

[0088] As can be seen from the above, the phase change liquid cooling system in this embodiment also includes a second condenser. The gas vaporized in the radiator undergoes condensation once in the second condenser before flowing into the gas-liquid separator. That is, there are two condensers with heat dissipation functions in this application, and the combined effect of the two condensers can achieve higher heat dissipation efficiency.

[0089] See Figure 3 This is a schematic diagram of the structure of the third phase change liquid cooling system provided in the embodiments of this application, which is consistent with the aforementioned Figure 1Compared to the embodiment shown, the phase change liquid cooling system described above also includes a second valve 109.

[0090] The second valve 109 is located between the second outlet 1042 of the gas-liquid separator 104 and the first inlet 1012 of the storage tank 101.

[0091] When the temperature of the chip is lower than the first preset temperature, the second valve 109 is closed.

[0092] When the temperature of the chip is not lower than the first preset temperature, the second valve 109 is in the open state.

[0093] In this embodiment, there is no second condenser 108, so theoretically, all gas flowing into the gas-liquid separator 104 should be gas. When the chip temperature is lower than the first preset temperature, the second valve 109 is closed and the first valve 105 is open, so the gas in the gas-liquid separator 104 flows out from the first valve 105 and enters the first condenser 107. When the chip temperature is not lower than the first preset temperature, the second valve 109 is open and the first valve 105 is closed, so the gas in the gas-liquid separator 104 enters the liquid storage tank 101, and then enters the compressor 106 from the first gas outlet 1013.

[0094] As can be seen from the above, the embodiments of this application only include one condenser, and heat dissipation of the chip can be achieved through one condenser. The phase change liquid cooling system has a relatively simple structure and can reduce the cost of chip heat dissipation.

[0095] See Figure 4 This is a schematic diagram of the structure of the fourth phase change liquid cooling system provided in the embodiments of this application, which is consistent with the aforementioned Figure 1 Compared to the embodiment shown, the phase change liquid cooling system described above also includes a third valve 110 and a heater 111 capable of heating the liquid storage tank.

[0096] The passage between the second outlet 1043 of the gas-liquid separator 104 and the inlet 1071 of the first condenser 107 includes a first valve 105 and a third valve 110, and the passage between the outlet 1062 of the compressor 106 and the inlet 1071 of the first condenser 107 includes the third valve 110.

[0097] In one embodiment, the outlet 1062 of the compressor 106 is connected to one port of the first three-way connector, the second outlet 1043 of the gas-liquid separator 104 is connected to the second port of the first three-way connector via the first valve 105, and the third port of the first three-way connector is connected to the inlet 1071 of the first condenser 107 via the third valve 110.

[0098] When the temperature of the phase change coolant in the storage tank 101 is lower than the second preset temperature, the heater 111 is turned on and the third valve 110 is turned off until the temperature of the phase change coolant reaches the third preset temperature, which is higher than the second preset temperature but lower than the boiling point of the phase change coolant.

[0099] The heater 111 is installed inside the liquid storage tank 101 or on the outer wall of the liquid storage tank 101. Figure 4 In the embodiment shown, the heater 111 is installed inside the liquid storage tank 101.

[0100] In this phase change liquid cooling system, the substances flow in the following sequence: liquid storage tank 101 - working fluid pump 102 - radiator 103 - gas-liquid separator 104 - liquid storage tank 101.

[0101] The aforementioned third valve 110 is in the closed state, so that the substance flowing in the phase change liquid cooling system will not enter the first condenser 107 to dissipate heat, and thus will not affect the heating effect of the heater.

[0102] In one embodiment of this application, the BMC can be configured to monitor the temperature of the phase change coolant in the storage tank 101 and send the temperature of the phase change coolant to the RMC. When the temperature of the phase change coolant is lower than a second preset temperature, the RMC controls the heater to turn on for heating. After the phase change coolant is heated to a third preset temperature, the RMC controls the heater to turn off to stop heating. The aforementioned third preset temperature can be a temperature obtained through testing. When the phase change coolant reaches the third preset temperature, it can boil within a preset time when passing through the radiator 103.

[0103] As can be seen from the above, in this embodiment, when the temperature of the phase change coolant in the storage tank 101 is too low, the phase change coolant is heated to reach a third preset temperature. This makes it easier for the phase change coolant to reach its boiling point when passing through the heat sink, thus making it easier to boil in the heat sink. Since liquids absorb the most heat when boiling and vaporizing, this embodiment makes it easier for the phase change coolant to boil in the heat sink, thereby enabling it to absorb the heat generated by the chip more efficiently. This allows the phase change liquid cooling system to have a heating state in addition to high-intensity heat dissipation and normal heat dissipation states.

[0104] In one embodiment of this application, when the liquid temperature in the storage tank 101 is lower than the second preset temperature, the compressor 106 is turned on and the first valve 105 is turned on.

[0105] When the compressor 106 is turned on, it draws gas from the storage tank 101 through the first outlet 1013 and heats the gas. Since the third valve 110 is closed and the first valve 105 is open, the heated gas flows out from the outlet 1062 of the compressor 106, passes through the first valve 105 and enters the gas-liquid separator 104, and enters the storage tank 101 from the second outlet 1042 of the gas-liquid separator 104, thereby heating the phase change coolant in the storage tank 101 and thus increasing the heating rate of the phase change coolant.

[0106] See Figure 5 This is a structural schematic diagram of the fifth phase change liquid cooling system provided in the embodiments of this application, which is consistent with the aforementioned Figure 4 Compared to the embodiment shown, the phase change liquid cooling system further includes: a second condenser 108, a fourth valve 112, and a fifth valve 113.

[0107] The fourth valve 112 is located between the outlet 1032 of the radiator 103 and the inlet 1081 of the second condenser 108.

[0108] The fifth valve 113 is located between the outlet 1032 of the radiator 103 and the inlet 1041 of the gas-liquid separator 104.

[0109] The outlet 1082 of the second condenser 108 is connected to the inlet 1041 of the gas-liquid separator 104.

[0110] Specifically, the outlet 1032 of the radiator 103 is connected to one port of the second three-way connector. The second port of the second three-way connector is connected to the inlet 1081 of the second condenser 108 via the fourth valve 112. The third port of the second three-way connector is connected to one port of the third three-way connector via the fifth valve 113. The second port of the third three-way connector is connected to the outlet 1082 of the second condenser 108, and the third port of the third three-way connector is connected to the inlet 1041 of the aforementioned gas-liquid separator 104.

[0111] When the temperature of the chip is lower than the first preset temperature, the fifth valve 113 is closed and the fourth valve 112 is open. The liquid in the gas-liquid separator 104 flows out from the second liquid outlet 1042 and the gas in the gas-liquid separator 104 flows out from the second gas outlet 1043.

[0112] When the temperature of the chip is not lower than the second preset temperature, the fifth valve 113 is closed and the fourth valve 112 is open, and the gas and liquid in the gas-liquid separator 104 both flow out from the second liquid outlet 1042.

[0113] With the fourth valve 112 in the open position and the fifth valve 113 in the closed position, the gas flowing out of the radiator 103 is condensed and dissipated by the second condenser 108. For details of the heat dissipation process, please refer to the preceding text. Figure 2 The embodiments shown will not be described in detail here.

[0114] When the liquid temperature in the aforementioned storage tank 101 is lower than the second preset temperature, the aforementioned fourth valve 112 is placed in the closed state, and the aforementioned fifth valve 113 is placed in the open state.

[0115] When the liquid temperature in the storage tank 101 is lower than the second preset temperature, it enters the heating state. In order to prevent the substance from dissipating heat through the second condenser 108, the fourth valve 112 is closed and the fifth valve 113 is open, so that the substance flows directly into the gas-liquid separator 104 after exiting the outlet 1032 of the radiator 103.

[0116] As can be seen from the above, the phase change liquid cooling system in this embodiment not only has two condensers to improve the efficiency of chip heat dissipation, but also a heater to heat the phase change coolant, and can ensure that the heating efficiency of the two condensers will not be affected by heat dissipation during the heating of the phase change coolant.

[0117] It should be noted that the first valve 105, the second valve 109, the third valve 110, the fourth valve 112, and the fifth valve 113 in the embodiments of this application can all be any one of a solenoid valve, an expansion valve, a gate valve, a ball valve, and a check valve.

[0118] See Figure 6 This is a schematic diagram of the sixth phase change liquid cooling system provided in the embodiments of this application. Figure 5 Based on the embodiments shown, Figure 6 The diagram shows a fan 114 that is paired with the first condenser 107 and the second condenser 108, as well as a first three-way connector 115, a second three-way connector 116, and a third three-way connector 117. The connection relationships of the first three-way connector 115, the second three-way connector 116, and the third three-way connector 117 can be found in the description above.

[0119] See Figure 7 This is a structural schematic diagram of the seventh phase change liquid cooling system provided in the embodiments of this application. Figure 4 Based on the embodiment shown, the phase change liquid cooling system also includes a second valve 109.

[0120] The second valve 109 is located between the second outlet 1042 of the gas-liquid separator 104 and the first inlet 1012 of the storage tank 101.

[0121] When the temperature of the chip is lower than the first preset temperature, the second valve 109 is closed.

[0122] When the temperature of the chip is not lower than the first preset temperature or the temperature of the liquid in the storage tank is lower than the second preset temperature, the second valve 109 is in the open state.

[0123] The settings when the temperature of the chip is lower than the first preset temperature, and the settings when the temperature of the chip is not lower than the first preset temperature, are the same as described above. Figure 3 The embodiments shown are the same and will not be described again here.

[0124] When the liquid temperature in the aforementioned storage tank is lower than the second preset temperature, the phase change coolant needs to be heated. At this time, the second valve 109 is in the open state and the first valve 105 is in the closed state, so that the substances in the phase change liquid cooling system flow in the order of storage tank 101-working fluid pump 102-radiator 103-gas-liquid separator 104-storage tank 101, thereby realizing the heating cycle of the phase change coolant.

[0125] As can be seen from the above, the phase change liquid cooling system in this embodiment of the application only contains a condenser and a heater, which can realize three states: normal heat dissipation state, high-intensity heat dissipation state, and heating state. The structure of the phase change liquid cooling system is relatively simple, which can reduce the cost of chip heat dissipation.

[0126] See Figure 8 This is a schematic diagram of the eighth phase change liquid cooling system provided in the embodiments of this application. Figure 7 Based on the embodiments shown, Figure 8 The image shows a fan 114 that accompanies the first condenser 107, and a first three-way connector 115. The connection relationship of the first three-way connector 115 can be found in the description above.

[0127] This application also provides an electronic device, including a phase change liquid cooling system and a chip, wherein the phase change liquid cooling system is any of the aforementioned phase change liquid cooling systems, and the heat sink in the phase change liquid cooling system is in contact with the chip.

[0128] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0129] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the electronic device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0130] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A phase change liquid cooling system, characterized in that, The phase change liquid cooling system includes a liquid storage tank, a working fluid pump, a radiator, a gas-liquid separator, a first valve, a compressor, and a first condenser; The storage tank contains phase change coolant, and the first outlet of the storage tank is connected to the inlet of the working fluid pump. The outlet of the working fluid pump is connected to the inlet of the heat sink; the heat sink is in contact with the chip; The outlet of the radiator is connected to the inlet of the gas-liquid separator; the second liquid outlet of the gas-liquid separator is connected to the first inlet of the liquid storage tank; and the passage between the second gas outlet of the gas-liquid separator and the inlet of the first condenser includes a first valve. The first outlet of the liquid storage tank is connected to the inlet of the compressor, and the outlet of the compressor is connected to the inlet of the first condenser. The outlet of the first condenser is connected to the second inlet of the liquid storage tank; When the temperature of the chip is lower than the first preset temperature, the compressor is turned off and the first valve is turned on. When the temperature of the chip is not lower than the first preset temperature, the compressor is turned on and the first valve is turned off.

2. The phase change liquid cooling system according to claim 1, characterized in that, The phase change liquid cooling system further includes: a second condenser; The outlet of the radiator is connected to the inlet of the second condenser; The outlet of the second condenser is connected to the inlet of the gas-liquid separator; When the temperature of the chip is lower than the first preset temperature, the liquid in the gas-liquid separator flows out from the second liquid outlet, and the gas in the gas-liquid separator flows out from the second gas outlet. When the temperature of the chip is not lower than the first preset temperature, both the gas and liquid in the gas-liquid separator flow out from the second liquid outlet.

3. The phase change liquid cooling system according to claim 1, characterized in that, The phase change liquid cooling system also includes a second valve; The second valve is located between the second liquid outlet of the gas-liquid separator and the first inlet of the storage tank; When the temperature of the chip is lower than the first preset temperature, the second valve is closed. When the temperature of the chip is not lower than the first preset temperature, the second valve is in the open state.

4. The phase change liquid cooling system according to claim 1, characterized in that, The phase change liquid cooling system also includes a third valve and a heater capable of heating the liquid storage tank; The passage between the second outlet of the gas-liquid separator and the inlet of the first condenser includes a first valve and a third valve, and the passage between the outlet of the compressor and the inlet of the first condenser includes the third valve; When the temperature of the phase change coolant in the storage tank is lower than the second preset temperature, the heater is turned on and the third valve is turned off until the temperature of the phase change coolant reaches the third preset temperature, which is higher than the second preset temperature but lower than the boiling point of the phase change coolant.

5. The phase change liquid cooling system according to claim 4, characterized in that, When the liquid temperature in the storage tank is lower than the second preset temperature, the compressor is turned on and the first valve is turned on.

6. The phase change liquid cooling system according to claim 4, characterized in that, The phase change liquid cooling system also includes: a second condenser, a fourth valve, and a fifth valve; The fourth valve is located between the outlet of the radiator and the inlet of the second condenser; The fifth valve is located between the outlet of the radiator and the inlet of the gas-liquid separator; The outlet of the second condenser is connected to the inlet of the gas-liquid separator; When the temperature of the chip is lower than the first preset temperature, the fifth valve is closed and the fourth valve is open. The liquid in the gas-liquid separator flows out from the second liquid outlet and the gas in the gas-liquid separator flows out from the second gas outlet. When the temperature of the chip is not lower than the first preset temperature, the fifth valve is in the closed state and the fourth valve is in the open state, and both the gas and liquid in the gas-liquid separator flow out from the second liquid outlet. When the liquid temperature in the storage tank is lower than the second preset temperature, the fourth valve is closed and the fifth valve is open.

7. The phase change liquid cooling system according to claim 4, characterized in that, The phase change liquid cooling system also includes a second valve; The second valve is located between the second liquid outlet of the gas-liquid separator and the first inlet of the storage tank; When the temperature of the chip is lower than the first preset temperature, the second valve is closed. When the temperature of the chip is not lower than the first preset temperature or the temperature of the liquid in the storage tank is lower than the second preset temperature, the second valve is in the open state.

8. The phase change liquid cooling system according to claim 4, characterized in that, The heater is installed inside the liquid storage tank or on the outer wall of the liquid storage tank.

9. The phase change liquid cooling system according to any one of claims 1-8, characterized in that, The first vent of the liquid storage tank is located at the top of the liquid storage tank.

10. The phase change liquid cooling system according to any one of claims 1-8, characterized in that, The phase change liquid cooling system also includes a fan for dissipating heat from the first condenser.

11. An electronic device, characterized in that, The device includes a phase change liquid cooling system and a chip, wherein the phase change liquid cooling system is any one of the phase change liquid cooling systems described in claims 1-10, and the heat sink in the phase change liquid cooling system is in contact with the chip.

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