A multi-dimensional positioning device for LED chip based on graphic fitting

Abstract

The application relates to the technical field of automatic mounting, and relates to an LED paster component multi-dimensional positioning device based on pattern fitting, which comprises the following steps: acquiring a light source starting instruction and a camera starting instruction by using a first instruction frame; starting the light source based on the light source starting instruction; irradiating a pre-confirmed LED component by using the started light source to obtain a low-light-noise LED component environment; acquiring a low-light-noise LED component image set based on the camera starting instruction, the camera and the low-light-noise LED component environment; acquiring a cathode position offset error set based on an initial cathode position set of the LED component, a pre-constructed pattern fitting relationship and a pre-set standard cathode position; acquiring a motion adjustment parameter based on the cathode position offset error set; and realizing multi-dimensional positioning of the LED component based on the motion adjustment parameter and a motion controller. The application can improve the precision and efficiency of LED component pasting.

Description

Technical Field

[0001] This invention relates to the field of automated placement technology, and in particular to a multi-dimensional positioning device for LED chip mounters based on graphic fitting. Background Technology

[0002] In the modern electronics manufacturing industry, multi-dimensional component positioning technology for LED chip mounters is crucial. As electronic products become smaller and more high-performance, LED components are becoming smaller and more demanding in terms of precision. High-precision multi-dimensional positioning ensures accurate placement of components during the mounting process, improving production efficiency and product quality.

[0003] Traditional multi-dimensional positioning methods for LED chip mounters primarily rely on conventional vision recognition and mechanical positioning systems. However, traditional vision recognition systems are prone to recognition errors when dealing with complex backgrounds or reflective components, leading to inaccurate positioning. Secondly, mechanical positioning systems experience a gradual decrease in positioning accuracy due to mechanical wear and vibration over long-term use, reducing production efficiency. Therefore, improving the accuracy and efficiency of LED chip mounting has become an urgent problem to be solved. Summary of the Invention

[0004] This invention provides a multi-dimensional positioning device for LED chip mounters based on graphic fitting, the main purpose of which is to improve the accuracy and efficiency of LED chip mounting.

[0005] To achieve the above objectives, the present invention provides a multi-dimensional positioning device for LED chip mounter components based on graphic fitting, comprising:

[0006] Receive LED element multi-dimensional positioning command, and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning command, wherein the multi-dimensional positioning device includes: light source, camera, data processor, motion controller, suction nozzle and four-axis precision platform;

[0007] Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction;

[0008] Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state.

[0009] After confirming that the self-test status is normal, the light source is activated based on the light source activation command, and the pre-confirmed LED element is illuminated by the activated light source to obtain a low light noise LED element environment.

[0010] Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images;

[0011] The initial cathode position set of the LED element is obtained based on the preset standard cathode image of the LED element and the low light noise LED element image set. The cathode position offset error set is obtained based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position.

[0012] Motion adjustment parameters are obtained based on the cathode position offset error set. Multidimensional positioning of LED components is achieved based on the motion adjustment parameters and the motion controller. Precision mounting of LED components is achieved using the motion controller, nozzle, and four-axis precision platform.

[0013] Optionally, obtaining the light source start command and camera start command using the first command frame includes:

[0014] Obtain the first protocol format, which includes multiple fields;

[0015] The first field set is obtained based on the first instruction frame and the first protocol format, wherein the first field set includes: frame header, frame length, frame identity, frame command, frame sequence number, first start address, first start data, second start address, second start data and verification;

[0016] Obtain a set of control parameters, wherein the set of control parameters includes: LED pick and place machine start command address, LED pick and place machine start command data, light source start command address, light source start command data, camera start command address, and camera start command data;

[0017] The light source start command and camera start command are obtained based on the control parameter set and the first field set.

[0018] Optionally, the step of obtaining the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second command frame includes:

[0019] Obtain the second protocol format, which includes multiple fields;

[0020] The second field set is obtained based on the second instruction frame and the second protocol format. The second field set includes: frame header, frame length, frame identity, frame sequence number, frame command, start address, start data, and frame verification.

[0021] The LED chip mounter start command is obtained based on the control parameter set and the second field set.

[0022] The self-test status set is obtained using the LED chip mounter start command and the multi-dimensional positioning device.

[0023] The flag bit is obtained based on the self-test state set, and the flag bit is used as the self-test state.

[0024] Optionally, before illuminating the pre-selected LED element with the activated light source, the process further includes:

[0025] Based on the camera start command, LED components, and camera, a set of original light and noise images is acquired.

[0026] Obtain shadow image set and reflection image set based on the original light noise image set;

[0027] The light source adjustment parameter set of the light source is obtained by using the shadow image set and the reflection image set, wherein the light source adjustment parameter set includes the light source distance value, the light source angle value, the light source height value, the light source brightness value and the light source uniformity;

[0028] The light source is adjusted using a set of light source adjustment parameters.

[0029] Optionally, obtaining the light source adjustment parameter set of the light source using the shadow image set and the reflection image set includes:

[0030] The light source height and angle values ​​are obtained based on the shadow image set and the pre-constructed shadow length detection method.

[0031] The distance value of the light source is obtained based on the shadow image set and the pre-constructed shadow sharpness calculation method;

[0032] Light source brightness values ​​are obtained based on a set of reflective images and a pre-constructed specular region segmentation method.

[0033] Light source uniformity is obtained based on a set of reflective images and a pre-constructed reflection pattern recognition method;

[0034] By summarizing the light source height, light source angle, light source distance, light source brightness, and light source uniformity, a set of light source adjustment parameters is obtained.

[0035] Optionally, obtaining the initial cathode position set of the LED element based on the preset standard cathode image of the LED element and the low-light-noise LED element image set includes:

[0036] Low-light-noise LED element images are extracted sequentially from the low-light-noise LED element image set, and a preprocessed image is obtained based on the extracted low-light-noise LED element images and a pre-constructed image denoising and enhancement method.

[0037] A segmented region image set is obtained based on the preprocessed image, wherein the segmented region image set includes one or more segmented region images;

[0038] Segmented region images are extracted sequentially from the segmented region image set, and the similarity of the comparison images is obtained based on the extracted segmented region images and the standard cathode image of the LED element.

[0039] The similarity scores of the compared images are summarized to obtain a set of similarity scores. The initial cathode position of the LED element is determined based on the set of similarity scores. The initial cathode position of the LED element is the position of the segmented region image corresponding to the largest similarity score in the set of similarity scores within the LED element.

[0040] By summarizing the initial cathode positions of the LED elements, we obtain the initial cathode position set of the LED elements.

[0041] Optionally, the step of obtaining the cathode position offset error set based on the initial cathode position set of the LED element, the pre-constructed graphical fitting formula, and the preset standard cathode position includes:

[0042] The initial cathode positions of the LED elements are sequentially extracted from the initial cathode position set of the LED elements, and the moiré fringe signal is obtained based on the initial cathode position of the LED elements. The moiré fringe signal includes a first sine signal and a second sine signal.

[0043] The acquisition radial length is obtained based on the moiré fringe signal and a pre-constructed waveform generator;

[0044] The standard radial length is obtained based on the standard cathode position;

[0045] The cathode position offset error is obtained based on the acquired radial length, the standard radial length, and the aforementioned graphical fitting formula;

[0046] The cathode position offset errors are summarized to obtain the cathode position offset error set.

[0047] Optionally, the graphical fitting relationship is as follows:

[0048]

[0049] Wherein, Δ(ds) is the cathode position offset error. Let d be the length of the acquisition radial vector. The standard radial length is given.

[0050] Optionally, obtaining motion adjustment parameters based on the cathode position offset error set includes:

[0051] The cathode position offset error is extracted sequentially from the cathode position offset error set. The cathode position offset error vector is obtained based on the cathode position offset error and the pre-constructed array phase correction method. The cathode position offset error vector includes the cathode position distance error and the cathode position angle error.

[0052] The motion adjustment vector is obtained based on the cathode position offset error vector, the preset standard cathode position vector of the LED element, and the pre-constructed calculation formula, wherein the calculation formula is as follows:

[0053]

[0054] Wherein, P(l,θ) is the motion adjustment vector, β(l,θ) is the standard cathode position vector of the LED element, AN is the cathode position offset error vector, l is the cathode position distance error, and θ is the cathode position angle error;

[0055] Summarize the motion adjustment vectors to obtain the motion adjustment vector set;

[0056] One or more partitioned motion control vector sets are identified from the motion control vector set, wherein the motion control vectors in each of the one or more partitioned motion control vector sets are the same;

[0057] Count the number of motion control vectors in each of one or more partitioned motion control vector sets to obtain one or more statistical counts;

[0058] The motion adjustment vector corresponding to the largest statistical quantity among one or more statistical quantities is used as the target adjustment vector. Motion adjustment parameters are extracted from the target adjustment vector, including high-precision adjustment distance value and high-precision adjustment angle value.

[0059] To achieve the above objectives, the present invention also provides a multi-dimensional positioning system for LED chip mounter components based on graphic fitting, comprising:

[0060] The self-test status confirmation module is used to receive LED element multi-dimensional positioning instructions and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning instructions. The multi-dimensional positioning device includes: a light source, a camera, a data processor, a motion controller, a suction nozzle, and a four-axis precision platform.

[0061] Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction;

[0062] Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state.

[0063] The low-noise image acquisition module is used to activate the light source based on the light source activation command after confirming that the self-test status is normal, and to use the activated light source to illuminate the pre-confirmed LED element to obtain a low-light-noise LED element environment.

[0064] Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images;

[0065] The cathode position acquisition module is used to acquire the initial cathode position set of the LED element based on the preset standard cathode image of the LED element and the low light noise LED element image set, and to acquire the cathode position offset error set based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position.

[0066] The motion adjustment control module is used to obtain motion adjustment parameters based on the cathode position offset error set, realize multi-dimensional positioning of LED elements based on motion adjustment parameters and motion controller, and realize precision placement of LED elements using the motion controller, nozzle and four-axis precision platform.

[0067] To address the above problems, the present invention also provides an electronic device, the electronic device comprising:

[0068] A memory for storing at least one instruction; and a processor for executing the instructions stored in the memory to implement the above-described multi-dimensional positioning device for LED chip mounter components based on graphic fitting.

[0069] To address the aforementioned problems, the present invention also provides a computer-readable storage medium storing at least one instruction, which is executed by a processor in an electronic device to implement the aforementioned multi-dimensional positioning device for LED chip mounter components based on graphic fitting.

[0070] To address the problems described in the background art, this invention receives a multi-dimensional positioning command for LED components and identifies a multi-dimensional positioning device based on this command. The multi-dimensional positioning device includes a light source, a camera, a data processor, a motion controller, a nozzle, and a four-axis precision platform. A first command frame is acquired, and light source activation and camera activation commands are obtained using this first command frame. A second command frame is then acquired, and the self-test status of the multi-dimensional positioning device is obtained based on the device and the second command frame. This self-test status can be either normal or abnormal. This invention prevents LED component placement errors caused by performing a self-test on each component of the multi-dimensional positioning device before placement, using a parallel distributed detection method. After confirming a normal self-test status, the light source is activated based on the light source activation command, and the pre-identified LED component is illuminated by the activated light source to obtain a low-light-noise LED component environment. This invention, based on a dynamic light environment optimization method, adjusts the light source to a suitable state in real time, ensuring a low-light-noise environment and effectively improving the light environment adaptability of the multi-dimensional positioning device. Based on the camera startup command and the environment of the low-light-noise LED element, a set of low-light-noise LED element images is acquired. This set includes one or more low-light-noise LED element images. An initial cathode position set for the LED element is obtained based on a preset standard cathode image and the low-light-noise LED element image set. A cathode position offset error set is obtained based on the initial cathode position set, a pre-constructed graphic fitting formula, and the preset standard cathode position. This invention improves the processing efficiency of LED element images by combining a micro-region dynamic segmentation and comparison method with a micro-pixel LED element cathode feature recognition method. Motion adjustment parameters are obtained based on the cathode position offset error set. Multi-dimensional positioning of the LED element is achieved based on the motion adjustment parameters and a motion controller. Precision LED element placement is achieved using the motion controller, nozzle, and four-axis precision platform. This invention improves the accuracy of LED element placement by converting the cathode position offset error into a phase correction vector (including distance / angle error) and by generating a motion adjustment vector and combining it with normal distribution statistics to select the optimal motion adjustment parameters. Therefore, this invention can improve the accuracy and efficiency of LED element placement. Attached Figure Description

[0071] Figure 1 This is a flowchart illustrating a multi-dimensional positioning device for LED chip mounter components based on graphic fitting, according to an embodiment of the present invention.

[0072] Figure 2 A functional block diagram of a multi-dimensional positioning system for LED chip mounter components based on graphic fitting, provided in an embodiment of the present invention;

[0073] Figure 3 This is a schematic diagram of the structure of an electronic device for implementing the multi-dimensional positioning device for LED chip mounter components based on graphic fitting, according to an embodiment of the present invention.

[0074] Figure 4 This is a schematic diagram of the structure of a multi-dimensional positioning device for implementing the multi-dimensional positioning device for LED chip mounter components based on graphic fitting, according to an embodiment of the present invention.

[0075] Explanation of reference numerals in the attached figures:

[0076] 10. Electronic device; 11. Processor; 12. Memory; 13. Bus.

[0077] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0078] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0079] This application provides a multi-dimensional positioning device for LED chip mounter components based on graph fitting. The executing entity of this graph fitting-based multi-dimensional positioning device includes, but is not limited to, at least one of the following electronic devices that can be configured to execute the device provided in this application: a server, a terminal, etc. In other words, the graph fitting-based multi-dimensional positioning device for LED chip mounter components can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0080] Reference Figure 1 The diagram shown is a flowchart illustrating a multi-dimensional positioning device for LED chip mounters based on graphic fitting, according to an embodiment of the present invention. In this embodiment, the multi-dimensional positioning device for LED chip mounters based on graphic fitting includes:

[0081] S1. Receive LED element multi-dimensional positioning command, and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning command, wherein the multi-dimensional positioning device includes: light source, camera, data processor, motion controller, suction nozzle and four-axis precision platform.

[0082] It should be explained that the LED component multi-dimensional positioning command is an instruction issued by personnel who wish to perform multi-dimensional positioning of the LED component. The multi-dimensional positioning device is a highly specialized industrial automation device used to improve the mounting accuracy and efficiency of LED components in surface mount production lines. For details, please refer to... Figure 4 As shown, Figure 4This is a schematic diagram of a multi-dimensional positioning device. The device uses a light source to illuminate LED components, a camera to capture images of the LED components, and a data processor to calculate positional deviations from the processed images to obtain control parameters for a motion controller. The motion controller then coordinates the nozzle and a four-axis precision platform to complete the LED component placement process. The light source is a multi-angle ring light source, which can effectively solve lighting problems such as surface reflection, shadow occlusion, and texture enhancement of LED components by controlling parameters such as brightness and uniformity. Optionally, a FLEX-RA90-W multi-angle ring light source can be used to achieve this process; other models of multi-angle ring light sources can achieve the same effect, which will not be elaborated further. The camera is a high-speed, high-resolution camera capable of capturing high-definition images of LED components in a very short time. Optionally, an XCG-CP510 (IMX530) high-speed, high-resolution camera can be used to achieve this process; other models of high-speed, high-resolution cameras can achieve the same effect, which will not be elaborated further. The data processor achieves multi-dimensional positioning of the LED element by fitting the features of the LED element image to standard features and obtains the adjustment parameters of the motion controller. Optionally, an NVIDIA Jetson AGX Orin data processor can be used to achieve this process; other models of data processors can achieve the same effect, which will not be elaborated further. The motion controller is the core control system of the LED pick-and-place machine, responsible for coordinating the nozzle and the four-axis precision platform to ensure that the LED element is mounted onto the PCB at high speed with micron-level precision. Optionally, a CX2040 motion controller can be used to achieve this process; other models of motion controllers can achieve the same effect, which will not be elaborated further. The nozzle is a precision actuator that contacts the LED element, responsible for vacuum suction, precise positioning, and reliable mounting of the LED element onto the PCB. Optionally, an NZ-1.2F nozzle can be used to achieve this process; other models of nozzles can achieve the same effect, which will not be elaborated further. The four-axis precision platform is the core motion mechanism of the LED chip mounter. It completes the high-speed and high-precision mounting of LED components through the coordinated operation of the X / Y / R / Z axes. Optionally, the HIWIN ATA four-axis precision platform can be used to achieve this process. Other models of four-axis precision platforms can achieve the same effect, which will not be elaborated here.

[0083] S2. Obtain the first instruction frame and use the first instruction frame to obtain the light source start instruction and the camera start instruction.

[0084] It should be understood that the first instruction frame is a standardized data packet that transmits control instructions between the LED pick-and-place machine operator's computer and the LED pick-and-place machine.

[0085] It should be explained that the step of obtaining the light source start command and camera start command using the first command frame includes:

[0086] Obtain the first protocol format, which includes multiple fields;

[0087] The first field set is obtained based on the first instruction frame and the first protocol format, wherein the first field set includes: frame header, frame length, frame identity, frame sequence number, frame command, first start address, first start data, second start address, second start data and verification;

[0088] Obtain a set of control parameters, wherein the set of control parameters includes: LED pick and place machine start command address, LED pick and place machine start command data, light source start command address, light source start command data, camera start command address, and camera start command data;

[0089] The light source start command and camera start command are obtained based on the control parameter set and the first field set.

[0090] It should be explained that the first protocol format defines a standardized structure for data transmission between the LED pick-and-place machine operator's computer and the LED pick-and-place machine. It includes key components such as frame headers, data fields, and checksums, ensuring accurate parsing and real-time response to component control commands in the LED pick-and-place machine. The first protocol format defines the field order as: frame header, frame length, frame identity, frame sequence number, frame command, frame address, frame data, and frame checksum. For example, the frame header field is 0xA0A1_A2A3. The software code determines whether the frame header of the first instruction frame is 0xA0A1_A2A3. If it is, the following extracted fields will be frame length, frame identity, frame sequence number, frame command, frame address, frame data, and frame checksum. The frame checksum is used to determine whether the extracted first set of fields is accurate.

[0091] It should be explained that the control parameter set specifies the addresses and data corresponding to various functions of the LED pick-and-place machine. For example, suppose the control parameter set specifies the camera start command address as 0x4120_8230, the camera start command data as 0x0000_0001, the light source start command address as 0x4120823C, and the light source start command data as 0x0000_0002. When the first start address in the first field set is 0x4120_8230, the first start data is 0x0000_0001, the second start address is 0x4120823C, and the second start data is 0x0000_0002, it indicates that the LED pick-and-place machine has obtained the light source start command and the camera start command, and uses these commands to start the light source and camera.

[0092] S3. Obtain the second instruction frame. Based on the multi-dimensional positioning device and the second instruction frame, obtain the self-test status of the multi-dimensional positioning device, wherein the self-test status is a normal status or an abnormal status.

[0093] It should be understood that the second instruction frame is also a standardized data packet for transmitting control instructions between the LED pick-and-place machine operator's computer and the LED pick-and-place machine. The difference between the second instruction frame and the first instruction frame is that the first instruction frame contains multiple addresses and multiple data, while the second instruction frame contains only one address and one data.

[0094] It should be explained that the step of obtaining the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second command frame includes:

[0095] Obtain the second protocol format, which includes multiple fields;

[0096] The second field set is obtained based on the second instruction frame and the second protocol format. The second field set includes: frame header, frame length, frame identity, frame sequence number, frame command, start address, start data, and frame verification.

[0097] The LED chip mounter start command is obtained based on the control parameter set and the second field set.

[0098] The self-test status set is obtained using the LED chip mounter start command and the multi-dimensional positioning device.

[0099] The flag bit is obtained based on the self-test state set, and the flag bit is used as the self-test state.

[0100] Understandably, the LED pick-and-place machine start command is an instruction that triggers each component in the multi-dimensional positioning device to perform a status self-check. The status self-check process is as follows: The LED pick-and-place machine start command is transmitted to each component in the multi-dimensional positioning device, such as the light source, camera, data processor, and motion controller. After receiving the LED pick-and-place machine start command, each component performs a status self-check and obtains a self-check result. The self-check results of each component are summarized into the flag bit as the self-check status. For example, after receiving the LED pick-and-place machine start command, the light source, camera, data processor, motion controller, and other components begin self-checking. A normal self-check result for each component is represented by 1, and an abnormal self-check result is represented by 0. The self-check results of each component are summarized to obtain a self-check status set. If the self-check status set is {1,1,1,1,1,1}, the output flag bit is 1, indicating that the self-check status is normal. If there is a self-check result of 0 in the self-check status set, such as {1,1,1,0,1,1}, the output flag bit is 0, indicating that the self-check status is abnormal. The self-test status is used to determine whether the multi-dimensional positioning device is ready to perform LED component placement. The method for obtaining the LED placement machine start command is the same as that for obtaining the light source start command and camera start command, and will not be repeated here. This embodiment of the invention uses a parallel distributed detection method to perform status self-tests on each component of the multi-dimensional positioning device before placement, preventing abnormal LED component placement caused by performing placement when the multi-dimensional positioning device is in an abnormal state.

[0101] S4. After confirming that the self-test status is normal, start the light source based on the light source start command, and use the started light source to irradiate the pre-confirmed LED components to obtain a low light noise LED component environment.

[0102] It should be understood that the LED placement machine can only perform LED component placement operations when all components are functioning normally (the multi-dimensional positioning device's self-test status is normal). For example, if the four-axis precision platform malfunctions, the LED component placement operation will fail.

[0103] It should be explained that, before illuminating the pre-confirmed LED element using the activated light source, the process also includes:

[0104] Based on the camera start command, LED components, and camera, a set of original light and noise images is acquired.

[0105] Obtain shadow image set and reflection image set based on the original light noise image set;

[0106] The light source adjustment parameter set of the light source is obtained by using the shadow image set and the reflection image set, wherein the light source adjustment parameter set includes the light source distance value, the light source angle value, the light source height value, the light source brightness value and the light source uniformity;

[0107] The light source is adjusted using a set of light source adjustment parameters.

[0108] It should be understood that when the camera receives the camera start command, it continuously captures multiple images of the LED element within a very short time as a raw light noise image set, wherein the raw light noise image is an image captured by the camera without any processing.

[0109] It should be explained that the shadow image is the dark area in the original light-noise image, and the reflected image is the highlight area in the original light-noise image. The shadow image is obtained by identifying and extracting the dark area from the original noise image, and the reflected image is obtained by identifying and extracting the highlight area from the original noise image. The identification and extraction processes are existing technologies and will not be elaborated here. The light source adjustment parameter set is a set of parameters used to adjust the light source. The purpose of using the light source adjustment parameter set to adjust the light source is to reduce the physical light noise in the environment surrounding the LED element, thereby improving the accuracy of subsequent image-based identification of the LED element's cathode.

[0110] It should be explained that obtaining the light source adjustment parameter set of the light source using the shadow image set and the reflection image set includes:

[0111] The light source height and angle values ​​are obtained based on the shadow image set and the pre-constructed shadow length detection method.

[0112] The distance value of the light source is obtained based on the shadow image set and the pre-constructed shadow sharpness calculation method;

[0113] Light source brightness values ​​are obtained based on a set of reflective images and a pre-constructed specular region segmentation method.

[0114] Light source uniformity is obtained based on a set of reflective images and a pre-constructed reflection pattern recognition method;

[0115] By summarizing the light source height, light source angle, light source distance, light source brightness, and light source uniformity, a set of light source adjustment parameters is obtained.

[0116] It should be understood that the shadow image includes the length and sharpness of the LED element's shadow. Detecting the length and sharpness of the LED element's shadow image and adjusting the height, angle, and distance values ​​of the light source based on these values ​​completes the adjustment of the LED element's shadow. Optionally, edge detection technology can be used as the shadow length detection method, and the modulation transfer function (MTF) method can be used as the shadow sharpness calculation method; these are existing technologies and will not be elaborated upon here. The reflective image includes the highlight area of ​​the LED element and the reflection pattern. Detecting the highlight area and reflection pattern of the LED element's reflective image and adjusting the brightness and uniformity of the light source based on these highlight areas and reflection patterns completes the reflection adjustment of the LED element. Optionally, generative adversarial networks can be used as the highlight area segmentation method, and texture analysis technology can be used as the reflection pattern recognition method; these are existing technologies and will not be elaborated upon here. For example, suppose the relationship between the length of the LED element's shadow and the height and angle of the light source is (length 4: height 10: angle 61), meaning that when the length of the LED element's shadow is detected to be 4, the height of the light source needs to be adjusted to 10 and the angle to 61. Suppose the relationship between the sharpness of the LED element's shadow and the distance to the light source is (sharpness 7: distance 13), meaning that when the sharpness of the LED element's shadow is detected to be 7, the distance to the light source needs to be adjusted to 13. Suppose the relationship between the highlight area of ​​the LED element's reflection and the brightness of the light source is (highlight area 33: brightness 9), meaning that when the highlight area of ​​the LED element's reflection is detected to be 33, the brightness of the light source needs to be adjusted to 9. Suppose the relationship between the reflection mode of the LED element's reflection and the uniformity of the light source is (reflection mode is specular reflection: uniformity 21), meaning that when the reflection mode of the LED element's reflection is detected to be specular reflection, the uniformity of the light source needs to be adjusted to 21. The embodiments of the present invention are based on a dynamic optimization method for the light environment, which adjusts the light source to a suitable state in real time, ensures a low light noise environment, and effectively improves the light environment adaptability of the multi-dimensional positioning device.

[0117] S5. Based on the camera start command, the camera and the low light noise LED element environment, obtain a low light noise LED element image set, wherein the low light noise LED element image set includes one or more low light noise LED element images.

[0118] It should be explained that the low light noise LED element environment refers to the LED element environment under the illumination of the light source after the light source adjustment parameter set has been adjusted. The low light noise LED element image set is obtained by continuously shooting one or more low light noise LED element images in a very short time using a camera that has been started according to the camera start command.

[0119] S6. Obtain the initial cathode position set of LED elements based on the preset standard cathode image of LED elements and the low light noise LED element image set. Obtain the cathode position offset error set based on the initial cathode position set of LED elements, the pre-constructed graphic fitting relationship and the preset standard cathode position.

[0120] It should be explained that obtaining the initial cathode position set of the LED element based on the preset standard cathode image of the LED element and the low light noise LED element image set includes:

[0121] Low-light-noise LED element images are extracted sequentially from the low-light-noise LED element image set, and a preprocessed image is obtained based on the extracted low-light-noise LED element images and a pre-constructed image denoising and enhancement method.

[0122] A segmented region image set is obtained based on the preprocessed image, wherein the segmented region image set includes one or more segmented region images;

[0123] Segmented region images are extracted sequentially from the segmented region image set, and the similarity of the comparison images is obtained based on the extracted segmented region images and the standard cathode image of the LED element.

[0124] The similarity scores of the compared images are summarized to obtain a set of similarity scores. The initial cathode position of the LED element is determined based on the set of similarity scores. The initial cathode position of the LED element is the position of the segmented region image corresponding to the largest similarity score in the set of similarity scores within the LED element.

[0125] By summarizing the initial cathode positions of the LED elements, we obtain the initial cathode position set of the LED elements.

[0126] Understandably, obtaining low-noise LED element images by using adjusted light sources to reduce light noise can improve the accuracy of subsequent image comparison. However, camera sensors typically introduce additional noise into LED element images. Furthermore, the cathode features of LED elements are subtle, possibly only detectable through differences in notches, chamfers, silkscreen markings, or pin lengths. Further noise reduction and enhancement preprocessing of the low-noise LED element images at the software level can not only eliminate the impact of additional noise on the accuracy of subsequent image comparison but also improve the characteristics of the cathode in the LED element image. Optionally, a three-dimensional block matching algorithm can be used as the image noise reduction and enhancement method, which is existing technology and will not be elaborated upon here. Generally, the image size of the cathode location region of an LED element is very small compared to the entire LED element image. Segmenting the LED element image into multiple small region images reduces the data volume of each region image, thus accelerating the efficiency of image comparison and cathode identification. Optionally, an adaptive thresholding algorithm can be used to obtain a set of segmented region images, which is existing technology and will not be elaborated upon here.

[0127] It should be understood that only a very small number of the segmented region images are similar to the preset LED standard cathode image. All segmented region images are compared with the LED element standard cathode image, and the position of the segmented region image with the highest similarity within the LED element is used as the initial cathode position of the LED element. Optionally, a color histogram feature matching method can be used to obtain the similarity of the compared images; this is existing technology and will not be elaborated upon here. To ensure that the cathode part of the LED element is not segmented into multiple segmented region images due to segmentation boundaries, thereby improving the accuracy of the comparison, a certain degree of overlap is ensured between each segmented region image when dividing the images. For example, the size of each segmented region image can be 32×32 pixels, and the overlap can be set to 16 pixels, resulting in a 16-pixel overlap between each segmented region image. Optionally, an extended boundary method can be used to achieve overlapping division of the preprocessed image; this is existing technology and will not be elaborated upon here. If the position of the segmented region with the highest image similarity in the LED element is represented as p(2.3168, 3.9485), then p(2.3168, 3.9485) is taken as the initial cathode position of the LED element.

[0128] It should be explained that the process of obtaining the cathode position offset error set based on the initial cathode position set of the LED element, the pre-constructed graphical fitting formula, and the preset standard cathode position includes:

[0129] The initial cathode positions of the LED elements are sequentially extracted from the initial cathode position set of the LED elements, and the moiré fringe signal is obtained based on the initial cathode position of the LED elements. The moiré fringe signal includes a first sine signal and a second sine signal.

[0130] The acquisition radial length is obtained based on the moiré fringe signal and a pre-constructed waveform generator;

[0131] The standard radial length is obtained based on the standard cathode position;

[0132] The cathode position offset error is obtained based on the acquired radial length, the standard radial length, and the aforementioned graphical fitting formula;

[0133] The cathode position offset errors are summarized to obtain the cathode position offset error set.

[0134] It should be understood that an ideal moiré fringe signal is two orthogonal sinusoidal signals. However, due to various factors, there may be problems such as unequal amplitude and DC level shift in the signal, which can cause deviation in orthogonality and form errors. Using the initial cathode position of the LED element as a parameter of the moiré fringe signal, a first sine signal and a second sine signal are obtained. When there is a deviation between the initial cathode position and the standard cathode position of the LED element, the orthogonality of the first and second sine signals deviates. The waveform generator is used to plot the Lissajous figures of the first and second sine signals. The process of obtaining the Lissajous figure using the waveform generator is prior art and will not be elaborated here. It is known that the characteristic index of the Lissajous figure is the radial length, which is used as the acquisition radial length. For example, assuming the first sine signal is represented as the length of a rectangle and the second sine signal as the width of a rectangle, a rectangular figure can be drawn based on the length and width. The diagonal length of the rectangle can be used as a characteristic index. Therefore, the acquisition radial length can be obtained from the first and second sine signals. Similarly, the method for obtaining the standard radial length is the same as the method for obtaining the acquisition radial length, and will not be elaborated here.

[0135] Furthermore, the graphical fitting relationship is as follows:

[0136]

[0137] Wherein, Δ(ds) is the cathode position offset error. Let d be the length of the acquisition radial vector. The standard radial length is given.

[0138] It should be understood that the cathode position offset error is used to measure the degree of offset of the initial cathode position of the LED element relative to the standard cathode position of the LED element. This embodiment of the invention improves the processing efficiency of LED element images by combining a micro-region dynamic segmentation and comparison method with a micro-pixel LED element cathode feature recognition method.

[0139] S7. Obtain motion adjustment parameters based on cathode position offset error set, realize multi-dimensional positioning of LED element based on motion adjustment parameters and motion controller, and realize precision placement of LED element using motion controller, nozzle and four-axis precision platform.

[0140] It should be explained that the acquisition of motion adjustment parameters based on the cathode position offset error set includes:

[0141] The cathode position offset error is extracted sequentially from the cathode position offset error set. The cathode position offset error vector is obtained based on the cathode position offset error and the pre-constructed array phase correction method. The cathode position offset error vector includes the cathode position distance error and the cathode position angle error.

[0142] The motion adjustment vector is obtained based on the cathode position offset error vector, the preset standard cathode position vector of the LED element, and the pre-constructed calculation formula, wherein the calculation formula is as follows:

[0143]

[0144] Where P(l,θ) is the motion adjustment vector, β(l,θ) is the standard cathode position vector of the LED element, and A N Let l be the cathode position offset error vector, l be the cathode position distance error, and θ be the cathode position angle error;

[0145] Summarize the motion adjustment vectors to obtain the motion adjustment vector set;

[0146] One or more partitioned motion control vector sets are identified from the motion control vector set, wherein the motion control vectors in each of the one or more partitioned motion control vector sets are the same;

[0147] Count the number of motion control vectors in each of one or more partitioned motion control vector sets to obtain one or more statistical counts;

[0148] The motion adjustment vector corresponding to the largest statistical quantity among one or more statistical quantities is used as the target adjustment vector. Motion adjustment parameters are extracted from the target adjustment vector, including high-precision adjustment distance value and high-precision adjustment angle value.

[0149] It should be understood that the array phase correction method is a method for obtaining the estimated position vector of the LED element cathode by detecting and correcting the phase deviation of the initial cathode position set of the LED element. The process of obtaining the estimated position vector of the LED element cathode using the array phase correction method is as follows: multiple reference points are selected around the initial cathode position to form an array; the phase of these reference points is measured using phase measurement technology; the deviation between the phase of each reference point and the phase of a preset standard cathode pattern position is calculated; this deviation reflects the difference between the standard cathode position and the initial cathode position; the phase deviation of each reference point is converted into a phase deviation vector; and a weighted average is calculated based on the magnitude and direction of the phase deviation vector to obtain the estimated cathode position vector. Optionally, the phase measurement technology includes, but is not limited to, phase interferometers and phase shift methods. Based on the angle of the estimated position vector of the LED element cathode and the cathode position offset error, the cathode position offset error vector is obtained. For example, suppose that the position deviation of each LED element in the initial cathode position set of the LED element is detected and corrected, and the estimated position vector of the LED element cathode is finally obtained as a(33.58, 62.86), where a(33.58, 62.86) means that the distance corresponding to the estimated position vector a of the LED element cathode is 33.58mm, the angle is 62.86°, and the cathode position offset error is 2.54mm. Then the cathode position offset error vector is Δ(2.54, 62.86).

[0150] It is understood that the preset standard cathode position vector of the LED element is the precise position vector where the LED element needs to be mounted, and the motion adjustment vector is the correction vector that the motion controller needs to adjust. Identical motion adjustment vectors are aggregated from the motion adjustment vector set, and their quantities are counted to obtain one or more motion adjustment vectors. A normal distribution curve can be constructed based on the number of one or more motion adjustment vectors. Motion adjustment parameters are extracted from the motion adjustment vector corresponding to the vertex position of the normal distribution curve. For example, the motion adjustment vector set includes 3 a, 5 b, 11 c, 4 d, and 2 e, where a, b, c, d, and e are different motion adjustment vectors. c has the most occurrences and is the motion adjustment vector corresponding to the vertex of the normal distribution curve; therefore, motion adjustment parameters are extracted from c. This embodiment of the invention improves the accuracy of LED element mounting by converting the cathode position offset error into a phase correction vector (including distance / angle error), generating motion adjustment vectors, and combining them with normal distribution statistics to select the optimal motion adjustment parameters.

[0151] To address the problems described in the background art, this invention receives a multi-dimensional positioning command for LED components and identifies a multi-dimensional positioning device based on this command. The multi-dimensional positioning device includes a light source, a camera, a data processor, a motion controller, a nozzle, and a four-axis precision platform. A first command frame is acquired, and light source activation and camera activation commands are obtained using this first command frame. A second command frame is then acquired, and the self-test status of the multi-dimensional positioning device is obtained based on the device and the second command frame. This self-test status can be either normal or abnormal. This invention prevents LED component placement errors caused by performing a self-test on each component of the multi-dimensional positioning device before placement, using a parallel distributed detection method. After confirming a normal self-test status, the light source is activated based on the light source activation command, and the pre-identified LED component is illuminated by the activated light source to obtain a low-light-noise LED component environment. This invention, based on a dynamic light environment optimization method, adjusts the light source to a suitable state in real time, ensuring a low-light-noise environment and effectively improving the light environment adaptability of the multi-dimensional positioning device. Based on the camera startup command and the environment of the low-light-noise LED element, a set of low-light-noise LED element images is acquired. This set includes one or more low-light-noise LED element images. An initial cathode position set for the LED element is obtained based on a preset standard cathode image and the low-light-noise LED element image set. A cathode position offset error set is obtained based on the initial cathode position set, a pre-constructed graphic fitting formula, and the preset standard cathode position. This invention improves the processing efficiency of LED element images by combining a micro-region dynamic segmentation and comparison method with a micro-pixel LED element cathode feature recognition method. Motion adjustment parameters are obtained based on the cathode position offset error set. Multi-dimensional positioning of the LED element is achieved based on the motion adjustment parameters and a motion controller. Precision LED element placement is achieved using the motion controller, nozzle, and four-axis precision platform. This invention improves the accuracy of LED element placement by converting the cathode position offset error into a phase correction vector (including distance / angle error) and by generating a motion adjustment vector and combining it with normal distribution statistics to select the optimal motion adjustment parameters. Therefore, this invention can improve the accuracy and efficiency of LED element placement.

[0152] like Figure 2 The diagram shown is a functional block diagram of a multi-dimensional positioning system for LED chip mounter components based on graphic fitting, provided in an embodiment of the present invention.

[0153] The LED chip mounter component multi-dimensional positioning system 100 based on image fitting described in this invention can be installed in an electronic device. Depending on the functions implemented, the LED chip mounter component multi-dimensional positioning system 100 may include a self-test status confirmation module 101, a low-noise image acquisition module 102, a cathode position acquisition module 103, and a motion adjustment control module 104. The module described in this invention can also be called a unit, referring to a series of computer program segments that can be executed by the processor of an electronic device and can perform a fixed function, stored in the memory of the electronic device.

[0154] The self-test status confirmation module 101 is used to receive LED element multi-dimensional positioning instructions and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning instructions. The multi-dimensional positioning device includes: a light source, a camera, a data processor, a motion controller, a suction nozzle, and a four-axis precision platform.

[0155] Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction;

[0156] Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state.

[0157] The low-noise image acquisition module 102 is used to activate the light source based on the light source activation command after confirming that the self-test status is normal, and use the activated light source to illuminate the pre-confirmed LED element to obtain a low-light-noise LED element environment.

[0158] Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images;

[0159] The cathode position acquisition module 103 is used to acquire an initial cathode position set of LED elements based on a preset standard cathode image of LED elements and the low light noise LED element image set, and to acquire a cathode position offset error set based on the initial cathode position set of LED elements, a pre-constructed graphic fitting formula and a preset standard cathode position.

[0160] The motion adjustment control module 104 is used to obtain motion adjustment parameters based on the cathode position offset error set, realize multi-dimensional positioning of LED elements based on motion adjustment parameters and motion controller, and realize precision mounting of LED elements using the motion controller, nozzle and four-axis precision platform.

[0161] In detail, the modules in the LED chip mounter component multi-dimensional positioning system 100 based on graphic fitting described in this embodiment of the invention employ the same methods as described above during use. Figure 1 The same technical means are used in the LED chip mounting machine component multi-dimensional positioning device based on graphic fitting described in the article, and can produce the same technical effect, so it will not be repeated here.

[0162] like Figure 3 The diagram shown is a structural schematic of an electronic device for implementing a multi-dimensional positioning device for LED chip mounter components based on graphic fitting, according to an embodiment of the present invention.

[0163] The electronic device 1 may include a processor 10, a memory 11 and a bus 12, and may also include a computer program stored in the memory 11 and executable on the processor 10, such as a program for a multi-dimensional positioning device for LED chip mounter components based on graphic fitting.

[0164] The memory 11 includes at least one type of readable storage medium, such as flash memory, portable hard drive, multimedia card, card-type memory (e.g., SD or DX memory), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the electronic device 1, such as the portable hard drive of the electronic device 1. In other embodiments, the memory 11 can be an external storage device of the electronic device 1, such as a plug-in portable hard drive, smart media card (SMC), secure digital card (SD), flash card, etc., equipped on the electronic device 1. Furthermore, the memory 11 includes both internal storage units and external storage devices of the electronic device 1. The memory 11 can be used not only to store application software and various types of data installed on the electronic device 1, such as the code of a multi-dimensional positioning device program for LED chip mounter components based on graphic fitting, but also to temporarily store data that has been output or will be output.

[0165] In some embodiments, the processor 10 may be composed of integrated circuits, such as a single packaged integrated circuit or multiple integrated circuits with the same or different functions, including combinations of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The processor 10 is the control unit of the electronic device, connecting various components of the entire electronic device through various interfaces and lines. It executes programs or modules stored in the memory 11 (e.g., a multi-dimensional positioning device program for LED chip mounters based on graphic fitting) and calls data stored in the memory 11 to perform various functions of the electronic device 1 and process data.

[0166] The bus 12 can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus 12 can be divided into an address bus, a data bus, a control bus, etc. The bus 12 is configured to realize the connection and communication between the memory 11 and at least one processor 10, etc.

[0167] Figure 3 Only electronic devices with components are shown; it will be understood by those skilled in the art that... Figure 3 The structure shown does not constitute a limitation on the electronic device 1, and may include fewer or more components than shown, or combine certain components, or have different component arrangements.

[0168] For example, although not shown, the electronic device 1 may also include a power supply (such as a battery) to power various components. Preferably, the power supply can be logically connected to the at least one processor 10 through a power management system, thereby enabling functions such as charging management, discharging management, and power consumption management through the power management system. The power supply may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The electronic device 1 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0169] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a Wi-Fi interface, a Bluetooth interface, etc.), which is typically used to establish communication connections between the electronic device 1 and other electronic devices.

[0170] Optionally, the electronic device 1 may further include a user interface, which may be a display, an input unit (such as a keyboard), or a standard wired or wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, or an OLED (Organic Light-Emitting Diode) touchscreen. The display may also be appropriately referred to as a screen or display unit, used to display information processed in the electronic device 1 and to display a visual user interface.

[0171] The program for the LED chip mounter component multi-dimensional positioning device based on graphic fitting, stored in the memory 11 of the electronic device 1, is a combination of multiple instructions. When run in the processor 10, it can achieve the following:

[0172] Receive LED element multi-dimensional positioning command, and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning command, wherein the multi-dimensional positioning device includes: light source, camera, data processor, motion controller, suction nozzle and four-axis precision platform;

[0173] Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction;

[0174] Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state.

[0175] After confirming that the self-test status is normal, the light source is activated based on the light source activation command, and the pre-confirmed LED element is illuminated by the activated light source to obtain a low light noise LED element environment.

[0176] Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images;

[0177] The initial cathode position set of the LED element is obtained based on the preset standard cathode image of the LED element and the low light noise LED element image set. The cathode position offset error set is obtained based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position.

[0178] Motion adjustment parameters are obtained based on the cathode position offset error set. Multidimensional positioning of LED components is achieved based on the motion adjustment parameters and the motion controller. Precision mounting of LED components is achieved using the motion controller, nozzle, and four-axis precision platform.

[0179] Specifically, the specific implementation apparatus of the processor 10 for the above instructions can be referred to Figures 1 to 3 The descriptions of the relevant steps in the corresponding embodiments are not repeated here.

[0180] Furthermore, if the modules / units integrated in the electronic device 1 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium may include: any entity or system capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0181] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor of an electronic device, can perform the following:

[0182] Receive LED element multi-dimensional positioning command, and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning command, wherein the multi-dimensional positioning device includes: light source, camera, data processor, motion controller, suction nozzle and four-axis precision platform;

[0183] Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction;

[0184] Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state.

[0185] After confirming that the self-test status is normal, the light source is activated based on the light source activation command, and the pre-confirmed LED element is illuminated by the activated light source to obtain a low light noise LED element environment.

[0186] Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images;

[0187] The initial cathode position set of the LED element is obtained based on the preset standard cathode image of the LED element and the low light noise LED element image set. The cathode position offset error set is obtained based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position.

[0188] Motion adjustment parameters are obtained based on the cathode position offset error set. Multidimensional positioning of LED components is achieved based on the motion adjustment parameters and the motion controller. Precision mounting of LED components is achieved using the motion controller, nozzle, and four-axis precision platform.

[0189] In the embodiments provided by this invention, it should be understood that the disclosed devices, systems, and apparatuses can be implemented in other ways. For example, the system embodiments described above are merely illustrative, and actual implementations may have other classification methods.

[0190] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0191] Furthermore, the functional modules in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0192] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0193] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A multi-dimensional positioning device for LED chip mounter components based on graphic fitting, characterized in that, The device includes: Receive LED element multi-dimensional positioning command, and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning command, wherein the multi-dimensional positioning device includes: light source, camera, data processor, motion controller, suction nozzle and four-axis precision platform; Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction; Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state. After confirming that the self-test status is normal, the light source is activated based on the light source activation command, and the pre-confirmed LED element is illuminated by the activated light source to obtain a low light noise LED element environment. Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images; The initial cathode position set of the LED element is obtained based on the preset standard cathode image of the LED element and the low light noise LED element image set. The cathode position offset error set is obtained based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position. Motion adjustment parameters are obtained based on the cathode position offset error set. Multidimensional positioning of LED components is achieved based on the motion adjustment parameters and the motion controller. Precision mounting of LED components is achieved using the motion controller, nozzle, and four-axis precision platform.

2. The multi-dimensional positioning device for LED chip mounter components based on graphic fitting as described in claim 1, characterized in that, The step of obtaining the light source start command and camera start command using the first command frame includes: Obtain the first protocol format, which includes multiple fields; The first field set is obtained based on the first instruction frame and the first protocol format, wherein the first field set includes: frame header, frame length, frame identity, frame command, frame sequence number, first start address, first start data, second start address, second start data and verification; Obtain a set of control parameters, wherein the set of control parameters includes: LED pick and place machine start command address, LED pick and place machine start command data, light source start command address, light source start command data, camera start command address, and camera start command data; The light source start command and camera start command are obtained based on the control parameter set and the first field set.

3. The multi-dimensional positioning device for LED chip mounter components based on graphic fitting as described in claim 2, characterized in that, The process of obtaining the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second command frame includes: Obtain the second protocol format, which includes multiple fields; The second field set is obtained based on the second instruction frame and the second protocol format. The second field set includes: frame header, frame length, frame identity, frame sequence number, frame command, start address, start data, and frame verification. The LED chip mounter start command is obtained based on the control parameter set and the second field set. The self-test status set is obtained using the LED chip mounter start command and the multi-dimensional positioning device. The flag bit is obtained based on the self-test state set, and the flag bit is used as the self-test state.

4. The multi-dimensional positioning device for LED chip mounter components based on graphic fitting as described in claim 3, characterized in that, Before illuminating the pre-confirmed LED element using the activated light source, the process further includes: Based on the camera start command, LED components, and camera, a set of original light and noise images is acquired. Obtain shadow image set and reflection image set based on the original light noise image set; The light source adjustment parameter set of the light source is obtained by using the shadow image set and the reflection image set, wherein the light source adjustment parameter set includes the light source distance value, the light source angle value, the light source height value, the light source brightness value and the light source uniformity; The light source is adjusted using a set of light source adjustment parameters.

5. The multi-dimensional positioning device for LED chip mounter components based on graphic fitting as described in claim 4, characterized in that, The step of obtaining the light source adjustment parameter set of the light source using the shadow image set and the reflection image set includes: The light source height and angle values ​​are obtained based on the shadow image set and the pre-constructed shadow length detection method. The distance value of the light source is obtained based on the shadow image set and the pre-constructed shadow sharpness calculation method; Light source brightness values ​​are obtained based on a set of reflective images and a pre-constructed specular region segmentation method. Light source uniformity is obtained based on a set of reflective images and a pre-constructed reflection pattern recognition method; By summarizing the light source height, light source angle, light source distance, light source brightness, and light source uniformity, a set of light source adjustment parameters is obtained.

6. The multi-dimensional positioning device for LED chip mounter components based on graphic fitting as described in claim 5, characterized in that, The process of obtaining the initial cathode position set of LED elements based on the preset standard cathode image of LED elements and the low-light-noise LED element image set includes: Low-light-noise LED element images are extracted sequentially from the low-light-noise LED element image set, and a preprocessed image is obtained based on the extracted low-light-noise LED element images and a pre-constructed image denoising and enhancement method. A segmented region image set is obtained based on the preprocessed image, wherein the segmented region image set includes one or more segmented region images; Segmented region images are extracted sequentially from the segmented region image set, and the similarity of the comparison images is obtained based on the extracted segmented region images and the standard cathode image of the LED element. The similarity scores of the compared images are summarized to obtain a set of similarity scores. The initial cathode position of the LED element is determined based on the set of similarity scores. The initial cathode position of the LED element is the position of the segmented region image corresponding to the largest similarity score in the set of similarity scores within the LED element. By summarizing the initial cathode positions of the LED elements, we obtain the initial cathode position set of the LED elements.

7. The LED chip mounter component multi-dimensional positioning device based on graphic fitting as described in claim 6, characterized in that, The method for obtaining the cathode position offset error set based on the initial cathode position set of LED elements, the pre-constructed graphical fitting formula, and the preset standard cathode position includes: The initial cathode positions of the LED elements are sequentially extracted from the initial cathode position set of the LED elements, and the moiré fringe signal is obtained based on the initial cathode position of the LED elements. The moiré fringe signal includes a first sine signal and a second sine signal. The acquisition radial length is obtained based on the moiré fringe signal and a pre-constructed waveform generator; The standard radial length is obtained based on the standard cathode position; The cathode position offset error is obtained based on the acquired radial length, the standard radial length, and the aforementioned graphical fitting formula; The cathode position offset errors are summarized to obtain the cathode position offset error set.

8. The LED chip mounter component multi-dimensional positioning device based on graphic fitting as described in claim 7, characterized in that, The graphical fitting formula is as follows: Wherein, Δ(ds) is the cathode position offset error. The acquisition radial length is... The standard radial length is given.

9. The LED chip mounter component multi-dimensional positioning device based on graphic fitting as described in claim 8, characterized in that, The process of obtaining motion adjustment parameters based on the cathode position offset error set includes: The cathode position offset error is extracted sequentially from the cathode position offset error set. The cathode position offset error vector is obtained based on the cathode position offset error and the pre-constructed array phase correction method. The cathode position offset error vector includes the cathode position distance error and the cathode position angle error. The motion adjustment vector is obtained based on the cathode position offset error vector, the preset standard cathode position vector of the LED element, and the pre-constructed calculation formula, wherein the calculation formula is as follows: Where P(l,θ) is the motion adjustment vector, β(l,θ) is the standard cathode position vector of the LED element, and A N Let l be the cathode position offset error vector, l be the cathode position distance error, and θ be the cathode position angle error; Summarize the motion adjustment vectors to obtain the motion adjustment vector set; One or more partitioned motion control vector sets are identified from the motion control vector set, wherein the motion control vectors in each of the one or more partitioned motion control vector sets are the same; Count the number of motion control vectors in each of one or more partitioned motion control vector sets to obtain one or more statistical counts; The motion adjustment vector corresponding to the largest statistical quantity among one or more statistical quantities is used as the target adjustment vector. Motion adjustment parameters are extracted from the target adjustment vector, including high-precision adjustment distance value and high-precision adjustment angle value.

10. A multi-dimensional positioning system for LED chip mounter components based on graphic fitting, characterized in that, The system includes: The self-test status confirmation module is used to receive LED element multi-dimensional positioning instructions and confirm the multi-dimensional positioning device based on the LED element multi-dimensional positioning instructions. The multi-dimensional positioning device includes: a light source, a camera, a data processor, a motion controller, a suction nozzle, and a four-axis precision platform. Obtain the first instruction frame, and use the first instruction frame to obtain the light source start instruction and the camera start instruction; Obtain the second instruction frame, and obtain the self-test status of the multi-dimensional positioning device based on the multi-dimensional positioning device and the second instruction frame, wherein the self-test status is a normal state or an abnormal state. The low-noise image acquisition module is used to activate the light source based on the light source activation command after confirming that the self-test status is normal, and to use the activated light source to illuminate the pre-confirmed LED element to obtain a low-light-noise LED element environment. Based on the camera startup command and the camera and low-light-noise LED element environment, a low-light-noise LED element image set is obtained, wherein the low-light-noise LED element image set includes one or more low-light-noise LED element images; The cathode position acquisition module is used to acquire the initial cathode position set of the LED element based on the preset standard cathode image of the LED element and the low light noise LED element image set, and to acquire the cathode position offset error set based on the initial cathode position set of the LED element, the pre-constructed graphic fitting relationship and the preset standard cathode position. The motion adjustment control module is used to obtain motion adjustment parameters based on the cathode position offset error set, realize multi-dimensional positioning of LED elements based on motion adjustment parameters and motion controller, and realize precision placement of LED elements using the motion controller, nozzle and four-axis precision platform.

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