A control method and system of a high-voltage amplification power supply

Abstract

The application relates to a control method and system of a high-voltage amplification power supply, and relates to the field of electronic technology, which comprises the following steps: 100, collecting an interface image of the high-voltage amplification power supply; 101, judging whether preset deposition features exist in the interface from the interface image; 102, identifying a deposition area from the interface image when the preset deposition features exist in the interface; 103, determining a number of hits in response to the deposition area; 104, controlling preset hitting devices to release preset hitting balls according to the number of hits, and identifying a deposition thickness from the interface image; 105, determining a hitting wind speed according to the deposition thickness; and 106, controlling preset kinetic energy devices to blow wind into the interface according to the hitting wind speed so that the preset hitting balls hit the deposits at high speed in the interface. The application has the effects of improving the safety of the high-voltage amplification power supply and reducing the situation of poor interface contact.

Description

Technical Field

[0001] This invention relates to the field of electronic technology, and in particular to a control method and system for a high-voltage amplification power supply. Background Technology

[0002] A high-voltage amplifier power supply is a power supply device that can amplify a low-voltage input signal and output a high-voltage signal.

[0003] In existing technologies, operational amplifiers are generally used to construct differential amplifier circuits to amplify low-voltage signals, and capacitors and other components are used to construct filter circuits to reduce voltage signal fluctuations, thereby converting low-voltage signals into stable high-voltage signals. High-voltage power supplies are generally equipped with interfaces for high-voltage signal output, and external devices are connected to the high-voltage signals by inserting corresponding connectors into the interfaces.

[0004] Dust tends to accumulate at the interface of high-voltage amplifier power supplies. When connectors of other devices are inserted into the interface, the connectors may squeeze the dust to the bottom of the interface, causing the dust to accumulate at the bottom of the interface and resulting in poor contact. Summary of the Invention

[0005] To improve the safety of high-voltage amplifier power supplies and reduce the occurrence of poor interface contact, this invention provides a control method and system for high-voltage amplifier power supplies.

[0006] In a first aspect, the present invention provides a control method for a high-voltage amplification power supply, employing the following technical solution:

[0007] A control method for a high-voltage amplifier power supply includes:

[0008] Step 100: Acquire the interface image of the high-voltage amplifier power supply;

[0009] Step 101: Determine whether a preset deposition feature exists in the interface from the interface image;

[0010] Step 102: When a preset deposition feature exists in the interface, the deposition area is identified from the interface image;

[0011] Step 103: Determine the number of blows in response to the deposition area;

[0012] Step 104: Control the preset striking device to release the preset striking ball according to the number of strikes, and identify the deposition thickness from the interface image;

[0013] Step 105: Determine the impact wind speed based on the deposition thickness;

[0014] Step 106: Control the preset kinetic energy device to blow air into the interface according to the said striking wind speed so that the preset striking ball strikes the deposit at high speed in the interface.

[0015] By adopting the above technical solution, visual technology is used to detect the dust accumulation at the bottom of the interface. When dust accumulation is present, a striking ball is placed into the interface, and the ball is driven by wind to collide inside the interface to break up the accumulated dust, thereby reducing the possibility of poor interface contact and improving the safety of the high-voltage amplification power supply.

[0016] Optional, also includes:

[0017] Step 107: When a preset deposition feature exists in the interface, the deposition volume is determined by combining the impact area and the impact thickness;

[0018] Step 108: Determine the impact kinetic energy based on the number of impacts and the impact wind speed;

[0019] Step 109: Calculate the impact time based on the deposition volume and impact kinetic energy;

[0020] Step 110: After the impact time, control the preset kinetic energy device to stop blowing, and determine the cleaning wind speed in response to the deposition volume;

[0021] Step 111: Control the preset kinetic energy device to blow air into the interface at the cleaning wind speed to blow the debris out of the interface.

[0022] By adopting the above technical solution, after the deposited dust is crushed by hitting the ball, an appropriate wind force is selected according to the volume of the dust deposit, so as to blow the crushed deposited debris away from the bottom of the interface, thereby reducing the possibility of poor interface contact and improving the safety of the high voltage amplification power supply.

[0023] Optional, also includes:

[0024] Step 112: When a preset deposition feature exists in the interface, the placement direction of the high-voltage amplification power supply is collected;

[0025] Step 113: When the placement direction exceeds the preset retention range, determine the adsorption magnetic force in response to the placement direction;

[0026] Step 114: Control the preset adsorption device to adsorb the preset hitting ball according to the adsorption magnetic force, and control the preset hitting device to release the preset hitting ball according to the number of hits.

[0027] Step 115: Determine the airflow direction based on the placement orientation;

[0028] Step 116: In response to the blowing direction, retrieve the blowing number;

[0029] Step 117: Control the preset kinetic energy device to blow air into the interface at the impact wind speed according to the blower number.

[0030] By adopting the above technical solution, when the high-voltage amplification power supply is facing the ground, the striking ball is prone to rolling out of the interface. At this time, an electromagnet set at the bottom of the interface is used to attract the striking ball, thereby reducing the situation where the striking ball detaches from the interface.

[0031] Optionally, it also includes a method for recovering the hitting ball, the method comprising:

[0032] Step 200: After the impact time, identify the deposition location from the interface image;

[0033] Step 201: Determine the main deposition points based on the deposition location, deposition area, and deposition thickness;

[0034] Step 202: Determine the cleaning wind direction and outlet number based on the main sedimentation points;

[0035] Step 203: Open the preset air outlet according to the air outlet number, and query the cleaning number in response to the cleaning air direction;

[0036] Step 204: Control the preset kinetic energy device to blow air into the interface at the cleaning speed according to the cleaning number, and determine the cleaning time according to the deposition volume;

[0037] Step 205: After the cleaning time, close the preset air outlet according to the air outlet number.

[0038] By adopting the above technical solution, dust is easily deposited unevenly at the bottom of the interface. The distribution of deposited debris can be predicted based on the distribution of the deposited dust, and the deposited debris can be concentrated in one place by wind power, which makes it easier to blow the crushed deposited debris away from the bottom of the interface by wind power.

[0039] Optionally, the ball recovery method further includes:

[0040] Step 206: Update the interface image after the said impact time;

[0041] Step 207: Identify the stopping position of the ball from the interface image;

[0042] Step 208: Generate a recovery trip in response to the stated dwell position;

[0043] Step 209: Control the preset adsorption device to adsorb the preset hitting ball according to the recovery stroke.

[0044] By adopting the above technical solution, after the deposited dust is crushed by hitting the ball, the distribution of the hitting ball at the bottom of the interface is identified by visual technology, thereby planning the route for recycling the hitting ball, and driving the hitting ball to move by an electromagnet, thereby improving the convenience of using the hitting ball.

[0045] Optionally, the ball recovery method further includes:

[0046] Step 210: When the placement direction is inconsistent with the preset flat angle, determine the rolling position of the hitting ball in response to the placement direction;

[0047] Step 211: Update the main deposition point according to the rolling position, and determine the rolling area in combination with the placement direction and the number of blows;

[0048] Step 212: Determine a retrieval route in response to the rolling area, and determine the retrieval magnetic force based on the placement direction;

[0049] Step 213: Update the recycling journey by combining the recycling route and the recycling magnetism.

[0050] By adopting the above technical solution, when the high-voltage amplification power supply is tilted, the hitting balls are easily caused to roll and gather to one side of the bottom of the interface. The gathering of the hitting balls can be predicted based on the tilt of the high-voltage amplification power supply, thereby planning the route for the recovery of the hitting balls, reducing the computational load of the vision technology and improving the ease of use of the hitting balls.

[0051] Optionally, the ball recovery method further includes:

[0052] Step 214: When the placement direction is inconsistent with the preset flat angle, determine the reverse coefficient in response to the placement direction;

[0053] Step 215: Calculate the product of the reverse coefficient and the cleaning time, and define it as the correction time;

[0054] Step 216: After the correction time, close the preset air outlet according to the air outlet number, and determine the blocking angle in response to the placement direction;

[0055] Step 217: Select a corrected wind speed based on the aforementioned shielding angle and deposition volume;

[0056] Step 218: Control the preset kinetic energy device to blow air into the interface according to the corrected wind speed to blow the debris out of the interface.

[0057] By adopting the above technical solution, when the high voltage amplifier power supply is tilted, the debris is easily affected by the tilted side of the interface when it is blown out of the bottom of the interface. According to the tilt of the high voltage amplifier power supply, a suitable wind speed is selected to gather the debris to the side that is hitting the ball, and a suitable wind force is selected to blow the debris out of the interface, thereby improving the convenience of using the high voltage amplifier power supply.

[0058] Optionally, a heat dissipation method may also be included, the heat dissipation method comprising:

[0059] Step 300: Collect the interface temperature at various points within the interface;

[0060] Step 301: Generate a temperature distribution in response to the interface temperature;

[0061] Step 302: Determine the temperature concentration point based on the temperature distribution;

[0062] Step 303: Read the high temperature based on the temperature concentration point;

[0063] Step 304: Select the heat dissipation fan speed in response to the high temperature, and match the heat dissipation number in response to the temperature concentration point;

[0064] Step 305: Control the preset kinetic energy device to blow air at the temperature concentration point at the heat dissipation wind speed according to the heat dissipation number.

[0065] By adopting the above technical solution, when the high-voltage amplification power supply outputs a high-voltage electrical signal, the interface is prone to heat generation. The temperature value of each point at the interface is detected in real time, thereby calculating the temperature distribution inside the interface. When the temperature value is high, the heat dissipation speed of the interface is accelerated by wind power, reducing the possibility of interface burnout.

[0066] Optionally, the heat dissipation method further includes:

[0067] Step 306: Read the highest temperature based on the temperature distribution;

[0068] Step 307: Select the amount of heat dissipation based on the highest temperature;

[0069] Step 308: Control the preset striking device to release the preset striking ball according to the heat dissipation quantity, and plan the heat dissipation route based on the temperature concentration point;

[0070] Step 309: Determine the heat dissipation direction by combining the heat dissipation route and heat dissipation number;

[0071] Step 310: Control the preset kinetic energy device to turn in the direction of heat dissipation according to the heat dissipation number, and determine the start-up sequence according to the heat dissipation route, heat dissipation wind speed and heat dissipation number;

[0072] Step 311: Activate the preset kinetic energy devices in sequence according to the activation sequence and the heat dissipation number to blow air at the heat dissipation wind speed.

[0073] By adopting the above technical solution, when the temperature at the interface is too high, the heat of the interface is absorbed by hitting the ball, and the wind power is used to create a path for the hitting ball to move at the bottom of the interface, thereby improving the heat dissipation efficiency of the interface and reducing the possibility of interface burnout.

[0074] Secondly, this application provides a control system for a high-voltage amplification power supply, which adopts the following technical solution:

[0075] A control system for a high-voltage amplification power supply includes:

[0076] The acquisition module is used to acquire interface images, placement orientation, and interface temperature;

[0077] A memory for storing the program of any of the above-mentioned high-voltage amplification power supply control methods;

[0078] The processor is the unit of memory that allows programs to be loaded and executed by the processor.

[0079] By adopting the above technical solution, visual technology is used to detect the dust accumulation at the bottom of the interface. When dust accumulation is present, a striking ball is placed into the interface, and the ball is driven by wind to collide inside the interface to break up the accumulated dust, thereby reducing the possibility of poor interface contact and improving the safety of the high-voltage amplification power supply.

[0080] In summary, this application includes at least one of the following beneficial technical effects:

[0081] 1. Visual technology is used to detect the accumulation of dust at the bottom of the interface. When dust accumulation is present, a striking ball is placed into the interface. The ball is driven by wind to collide inside the interface to break up the accumulated dust, thereby reducing the possibility of poor interface contact and improving the safety of the high-voltage amplification power supply.

[0082] 2. Dust tends to accumulate unevenly at the bottom of the interface. The distribution of accumulated dust can be used to predict the distribution of accumulated debris, and wind can be used to concentrate the accumulated debris in one place, making it easier to blow the crushed debris away from the bottom of the interface later.

[0083] 3. When the high-voltage amplifier outputs a high-voltage signal, the interface is prone to overheating. The temperature value of each point at the interface is detected in real time to calculate the temperature distribution inside the interface. When the temperature value is high, the heat dissipation speed of the interface is accelerated by airflow to reduce the possibility of interface burnout. Attached Figure Description

[0084] Figure 1 This is a flowchart of a control method for a high-voltage amplifier power supply;

[0085] Figure 2 This is a flowchart of the ball recovery method;

[0086] Figure 3 This is a flowchart of the heat dissipation method. Detailed Implementation

[0087] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0088] Reference Figure 1 A control method for a high-voltage amplification power supply, comprising:

[0089] Step 100: Acquire the interface image of the high-voltage amplifier power supply.

[0090] Interface image refers to the bottom image of the output interface of the high-voltage amplifier power supply. The interface image can be captured by a camera fixed at the interface. The method of capturing the interface image is selected by the staff according to the actual situation, and will not be described in detail here.

[0091] Step 101: Determine whether there are preset deposition features in the interface from the interface image.

[0092] Deposition features refer to dust deposits at the bottom of the interface. The composition of dust accumulated by high-voltage amplification power supplies used in different environments varies. Deposition features are selected by the staff based on the actual situation. Image recognition technology can be used to determine whether there are deposition features in the interface image. The method for judging deposition features is common knowledge in the field and will not be elaborated here.

[0093] Step 102: When a preset deposition feature exists in the interface, the deposition area is identified from the interface image.

[0094] The presence of deposition features in the interface indicates that the dust accumulation at the bottom of the interface is relatively serious. The deposition area is the total area of ​​dust accumulation. The deposition area can be identified by image recognition technology. The method for identifying the deposition area is common knowledge to those in the field and will not be elaborated here.

[0095] Step 103: Determine the number of blows in response to the deposition area.

[0096] A striking ball is a small metal ball used to break up accumulated dust for easy cleaning. A striking device is a device used to hold the striking ball. The striking device has an outlet for the striking ball to enter the bottom of the interface and a push rod to drive the striking ball into the bottom of the interface. The striking device also has an inlet for retrieving the striking ball. Both the outlet and the inlet are equipped with motor-driven valves to control the entry of the striking ball. The striking ball and the striking device are selected by the staff according to the actual situation, and will not be described in detail here.

[0097] The number of hits refers to the number of balls needed to clean up the deposited dust. The larger the deposited area, the greater the number of hits required. The number of hits corresponding to the deposited area can be found in the quantity relationship table, which is a data table that records different deposited areas and their corresponding number of hits.

[0098] Step 104: Control the preset hitting device to release the preset number of hitting balls according to the number of hits, and identify the deposition thickness from the interface image.

[0099] Deposition thickness refers to the maximum thickness of dust deposited at the bottom of the interface. Image recognition technology can be used to identify the deposition thickness at various points at the bottom of the interface based on color differences, and then the maximum value can be selected as the deposition thickness. The method for identifying deposition thickness is common knowledge in the field and will not be elaborated here.

[0100] Step 105: Determine the impact wind speed based on the deposition thickness.

[0101] The kinetic energy device is a device used to blow air to drive the ball to move at the bottom of the interface. Multiple kinetic energy devices are evenly arranged on the circumferential side of the interface, and each kinetic energy device can adjust the direction of the airflow independently. The kinetic energy device is selected by the staff according to the actual situation, which will not be elaborated here.

[0102] The impact wind speed refers to the minimum wind speed required for the kinetic energy device to drive the impact ball to move at high speed at the bottom of the interface to break up the deposited dust. The greater the deposit thickness, the greater the impact wind speed is required. The impact wind speed corresponding to the deposit thickness can be found in the wind speed relationship table, which is a data table that records different deposit thicknesses and their corresponding impact wind speeds.

[0103] Step 106: Control the preset kinetic energy device to blow air into the interface according to the said striking wind speed so that the preset striking ball strikes the deposit at high speed in the interface.

[0104] Visual technology is used to detect the amount of dust deposited at the bottom of the interface. When dust is present, a striking ball is placed into the interface, and wind force drives the ball to collide inside the interface to break up the deposited dust, thereby reducing the possibility of poor interface contact and improving the safety of the high-voltage amplification power supply.

[0105] A control method for a high-voltage amplification power supply further includes:

[0106] Step 107: When a preset deposition feature exists in the interface, the deposition volume is determined by combining the impact area and the impact thickness.

[0107] Deposition volume refers to the total volume of dust deposited at the bottom of the interface. It is generally calculated by taking the product of the impact area and the impact thickness. The method for calculating the deposition volume is selected by the staff based on the actual situation and will not be elaborated here.

[0108] Step 108: Determine the impact kinetic energy by combining the number of impacts and the impact wind speed.

[0109] The impact kinetic energy refers to the kinetic energy of the ball when it moves at the bottom of the interface. It can be determined by first looking up the ball's speed in the kinetic velocity relationship table based on the impact wind speed, and then combining it with the formula [impact kinetic energy = 0.5 * (number of hits * impact mass) * movement speed^2]. The kinetic velocity relationship table is a data table that records different impact wind speeds and their corresponding movement speeds. The impact mass refers to the mass of a single ball. The impact mass can be preset by the staff. The calculation method of impact kinetic energy is common knowledge in the field and will not be elaborated here.

[0110] Step 109: Calculate the impact time based on the deposition volume and impact kinetic energy.

[0111] The hitting time refers to the time required for the ball to completely break up the dust deposit. The smaller the deposit volume and the greater the kinetic energy of the impact, the less time is required. The method for calculating the hitting time is selected by the staff according to the actual situation, and will not be elaborated here.

[0112] Step 110: After the impact time, control the preset kinetic energy device to stop blowing air, and determine the cleaning wind speed in response to the deposition volume.

[0113] Cleaning air velocity refers to the air velocity required to blow the deposited dust debris out of the interface after it is broken up by the kinetic energy device. The larger the deposit volume, the greater the cleaning air velocity required. The cleaning air velocity corresponding to the deposit volume can be found in the cleaning relationship table, which is a data table that records different deposit volumes and their corresponding cleaning air velocities.

[0114] Step 111: Control the preset kinetic energy device to blow air into the interface at the cleaning wind speed to blow the debris out of the interface.

[0115] After the deposited dust is broken up by hitting the ball, an appropriate wind force is selected according to the volume of the dust deposit to blow the broken deposited debris away from the bottom of the interface, thereby reducing the possibility of poor interface contact and improving the safety of the high voltage amplification power supply.

[0116] Specifically, when the kinetic energy device blows the ball to break up the deposited dust, the kinetic energy device automatically turns to the same angle so that the airflow blows in the circumferential direction, thereby forming a vortex at the bottom of the interface, reducing the attenuation of the ball's kinetic energy caused by the airflow blowing against it. After the hitting time, the kinetic energy device automatically turns to the same angle so that the airflow blows towards the bottom of the interface, thereby causing the airflow blown by the kinetic energy device to surge upward after hitting the bottom, forming an upward airflow, which in turn carries away the deposited debris at the bottom.

[0117] A control method for a high-voltage amplification power supply further includes:

[0118] Step 112: When a preset deposition feature exists in the interface, the placement direction of the high-voltage amplification power supply is collected.

[0119] The placement direction refers to the orientation angle of the high-voltage amplification power supply. The method for obtaining the placement direction is selected by the staff according to the actual situation, and will not be elaborated here.

[0120] Step 113: When the placement direction exceeds the preset retention range, determine the adsorption magnetic force in response to the placement direction.

[0121] The retention area refers to the range of placement directions within which the ball will not roll out of the bottom of the interface after being struck. The retention area is selected by the staff based on the actual situation and will not be elaborated here. The adsorption device is an electromagnet device used to attract the ball to the bottom of the interface. The adsorption device is controlled by multiple electromagnet units, and the position and magnitude of the magnetic force generated by the adsorption device can be controlled by controlling the input current. The adsorption device is selected by the staff based on the actual situation and will not be elaborated here.

[0122] If the placement direction exceeds the retention range, the ball is more likely to roll out of the bottom of the interface. The magnetic force of adsorption refers to the magnitude of the magnetic force required for the adsorption device to adsorb and fix the ball, that is, the magnitude of the component of the ball's weight in the direction away from the bottom plane of the interface. The calculation method of the magnetic force of adsorption is common knowledge to those in the field and will not be elaborated here.

[0123] Step 114: Control the preset adsorption device to adsorb the preset hitting ball according to the adsorption magnetic force, and control the preset hitting device to release the preset hitting ball according to the number of hits.

[0124] The adsorption device generates a uniform magnetic force on the bottom plane of the interface to reduce the chance of the ball detaching from the bottom of the interface when it is hit. When the adsorption magnetic force is lower than the preset safety magnetic force, the safety magnetic force is used as the adsorption magnetic force. The safety magnetic force is the magnetic force used to reduce the chance of the ball detaching from the bottom of the interface when the bottom plane of the interface is close to 90 degrees relative to the horizontal plane. The safety magnetic force is preset by the staff and will not be described in detail here.

[0125] Step 115: Determine the air blowing direction based on the placement direction.

[0126] The blowing direction refers to the angle at which the kinetic energy device blows air. Generally, the blowing angle is 90 degrees to the bottom plane and between 0 and 180 degrees. The method for determining the blowing angle is common knowledge to those in the field and will not be elaborated here.

[0127] Step 116: Query the air blowing number in response to the air blowing direction.

[0128] The blower number is a number used to distinguish the kinetic energy device. Each kinetic energy device corresponds one-to-one with the blower number. First, find the air initiation point on the side of the interface located in the opposite direction of the air initiation direction according to the air initiation direction. Then, look up the blower number closest to the air initiation point from the position relationship table. The position relationship table is a data table that records different blower numbers and their installation positions.

[0129] Step 117: Control the preset kinetic energy device to blow air into the interface at the impact wind speed according to the blower number.

[0130] When the high-voltage amplification power supply is facing the ground, the striking ball is prone to rolling out of the interface. In this case, an electromagnet located at the bottom of the interface is used to attract the striking ball, thereby reducing the chance of the striking ball detaching from the interface.

[0131] Reference Figure 2 Methods for recovering the ball after hitting it include:

[0132] Step 200: After the impact time, identify the deposition location from the interface image.

[0133] The deposition location refers to the point where dust is deposited. The deposition location can be determined by image recognition technology. The method for identifying the deposition location is common knowledge to those in the field and will not be elaborated here.

[0134] Step 201: Determine the main deposition points by combining the deposition location, deposition area and deposition thickness.

[0135] The primary deposition point refers to the location where dust is concentrated. The average thickness within a certain range around each location can be calculated, and the location with the largest average thickness can be selected as the primary deposition point. The calculation method for the primary deposition point is common knowledge to those in the field and will not be elaborated here.

[0136] Step 202: Determine the cleaning wind direction and outlet number based on the main sedimentation points.

[0137] The cleaning wind direction refers to the direction that blows sedimentary debris from other locations toward the main sedimentary point. The location on the side of the interface closest to the main sedimentary point can be taken as the accumulation point, and the location on the side of the interface furthest from the accumulation point can be taken as the driving point. The direction from the driving point to the accumulation point is the cleaning wind direction.

[0138] An air outlet refers to a through hole on a high-voltage amplification power supply used to ventilate the interface to the outside. Air outlets are evenly distributed on the side of the interface, and each air outlet is equipped with a solenoid valve to control the opening and closing of the air outlet. The air outlet number is used to distinguish the air outlets. The air outlet number corresponding to the air outlet closest to the gathering point can be found from the air outlet relationship table. The air outlet relationship table is a data table that records different air outlet numbers and their corresponding air outlet locations.

[0139] Step 203: Open the preset air outlet according to the air outlet number, and query the cleaning number in response to the cleaning air direction.

[0140] The cleaning number refers to the number of the kinetic energy device that blows sediment debris from other locations to the main sedimentation point. The cleaning number can be found in the location relationship table and is the blowing number corresponding to the installation position closest to the driving point.

[0141] Step 204: Control the preset kinetic energy device to blow air into the interface at the cleaning speed according to the cleaning number, and determine the cleaning time according to the deposition volume.

[0142] Cleaning time refers to the minimum time required for the accumulation of sedimentary debris. When the vent is opened, the airflow blown out by the kinetic energy device flows to the outside through the vent. At this time, no eddies will appear in the interface. The sedimentary debris will accumulate near the vent with the airflow. The larger the sediment volume, the longer the cleaning time required for the accumulation of sedimentary debris. The cleaning time corresponding to the sediment volume can be found from the aggregation relationship table. The aggregation relationship table is a data table that records different sediment volumes and their corresponding cleaning times.

[0143] Step 205: After the cleaning time, close the preset air outlet according to the air outlet number.

[0144] Dust tends to accumulate unevenly at the bottom of the interface. The distribution of deposited debris can be predicted based on the distribution of the dust, and the debris can be concentrated in one place by wind power, making it easier to blow the crushed debris away from the bottom of the interface by wind power.

[0145] Methods for recovering the hit ball also include:

[0146] Step 206: Update the interface image after the said impact time.

[0147] After the impact time, the accumulated dust has been broken up by the impact ball. At this point, the kinetic energy device stops blowing air, the impact ball stops moving and is evenly distributed at the bottom of the interface.

[0148] Step 207: Identify the stopping position of the ball from the interface image.

[0149] The stopping position refers to the position of each ball at the bottom of the interface. The stopping position can be identified by image recognition technology. The method for identifying the stopping position is common knowledge to those in the field and will not be elaborated here.

[0150] Step 208: Generate a recovery trip in response to the stated dwell position.

[0151] The recovery stroke refers to the route taken by the adsorption device to move the ball from its resting position to the ball inlet, i.e., the timing of the positions where the adsorption device generates magnetic force. The method for generating the recovery stroke is common knowledge to those skilled in the art and will not be elaborated here.

[0152] Step 209: Control the preset adsorption device to adsorb the preset hitting ball according to the recovery stroke.

[0153] After the deposited dust is broken up by hitting the ball, the distribution of the hitting ball at the bottom of the interface is identified using visual technology. This allows for the planning of a route to retrieve the hitting ball, and an electromagnet is used to drive the ball to move, thereby improving the ease of use of the hitting ball.

[0154] Methods for recovering the hit ball also include:

[0155] Step 210: When the placement direction is inconsistent with the preset flat angle, determine the rolling position of the hitting ball in response to the placement direction.

[0156] The horizontal angle refers to the placement direction when the bottom plane of the interface is horizontal. The horizontal angle can be preset by the staff. If the placement direction is inconsistent with the horizontal angle, it means that the bottom plane of the interface is not horizontal, that is, the bottom of the interface is inclined. In this case, when hitting the ball, it is easy for it to roll to the lowest point on the inclined plane. The rolling position is the lowest point of the bottom plane of the interface in the current placement direction. The method for determining the rolling position is common knowledge in the field and will not be elaborated here.

[0157] Step 211: Update the main deposition point according to the rolling position, and determine the rolling area in combination with the placement direction and the number of blows.

[0158] Since the hitting ball is prone to rolling to the rolling position, the deposited debris needs to be blown away from the hitting ball to separate the deposited debris from the hitting ball. That is, the point on the side of the interface that is furthest from the rolling position is taken as the main deposition point.

[0159] The rolling area refers to the range of the hitting ball distribution at the rolling position. When the hitting ball rolls to the rolling position, it tends to be arranged in a pyramid shape on the bottom plane of the interface. The closer the bottom plane of the interface is to 90 degrees, the more hitting balls are arranged on the bottom plane of the interface. The bottom number corresponding to the placement direction can be found from the arrangement table. Then, the shape obtained by arranging the hitting balls in the placement direction in a pyramid shape with the bottom number of the hitting balls is the rolling area. The arrangement table is a data table that records different placement directions and their corresponding bottom numbers.

[0160] Step 212: Determine the retrieval route in response to the rolling area and determine the retrieval magnetic force based on the placement direction.

[0161] The recovery path is the route that drives the ball in the rolling area to enter the ball inlet in sequence. The recovery magnetism is the magnetism required to attract the ball. The methods for determining the recovery path and the recovery magnetism are the same as those in steps 208 and 113 above, and will not be repeated here.

[0162] Step 213: Update the recycling journey by combining the recycling route and the recycling magnetism.

[0163] When the high-voltage amplification power supply is tilted, the hitting balls tend to roll and gather to one side of the bottom of the interface. The gathering of the hitting balls can be predicted based on the tilt of the high-voltage amplification power supply, thereby planning the route for the recovery of the hitting balls, reducing the computational load of the vision technology and improving the ease of use of the hitting balls.

[0164] Methods for recovering the hit ball also include:

[0165] Step 214: When the placement direction is inconsistent with the preset flat angle, determine the reverse coefficient in response to the placement direction.

[0166] The reverse coefficient is a numerical value used to show the ease with which sedimentary debris is driven to move to the main sedimentation point. The closer the bottom plane of the interface is to 90 degrees, the larger the reverse coefficient is. Generally, the sine value of the angle of the bottom plane of the interface plus one is used as the reverse coefficient. The reverse coefficient corresponding to the placement direction can be found from the reverse relationship table. The reverse relationship table is a data table that records different placement directions and their corresponding reverse coefficients.

[0167] Step 215: Calculate the product of the reverse coefficient and the cleaning time, and define it as the correction time.

[0168] Correction time refers to the cleaning time adjusted according to the inverse coefficient, which is the time required to depolymerize the deposited debris according to the tilt of the high-voltage amplification power supply, thereby reducing the situation where the debris is not completely aggregated.

[0169] Step 216: After the correction time, close the preset air outlet according to the air outlet number, and determine the blocking angle in response to the placement direction.

[0170] The occlusion angle refers to the angle value of the interface side closest to the aggregation point. The method for determining the occlusion angle is common knowledge to those in the field and will not be elaborated here.

[0171] Step 217: Select the corrected wind speed based on the shading angle and deposition volume.

[0172] Corrected wind speed refers to the wind speed at which deposited debris is blown out by the kinetic energy device under the obstruction of the interface side. When the high-voltage power supply is tilted, the interface side is tilted accordingly, resulting in an acute angle between the interface side and the horizontal plane. This causes the interface side to obstruct the deposited debris from leaving the interface. The closer the obstruction angle is to the horizontal and the larger the deposit volume, the greater the required corrected wind speed. The method for determining the corrected wind speed is the same as the steps mentioned above, and will not be repeated here.

[0173] Step 218: Control the preset kinetic energy device to blow air into the interface according to the corrected wind speed to blow the debris out of the interface.

[0174] When the high-voltage amplifier power supply is tilted, the debris is easily affected by the tilted side of the interface when it is blown out of the bottom of the interface. According to the tilt of the high-voltage amplifier power supply, select an appropriate wind speed to gather the debris to the side that is hitting the ball, and select an appropriate wind force to blow the debris out of the interface, thereby improving the convenience of using the high-voltage amplifier power supply.

[0175] Reference Figure 3 Heat dissipation methods include:

[0176] Step 300: Collect the interface temperature at various points within the interface.

[0177] Interface temperature refers to the temperature value at various points within the interface. The interface temperature can be collected by temperature sensors, which are evenly distributed on the side of the interface. The method for collecting the interface temperature is selected by the staff according to the actual situation, and will not be elaborated here.

[0178] Step 301: Generate a temperature distribution in response to the interface temperature.

[0179] Temperature distribution refers to the spatial distribution of temperature within the interface. The methods for determining temperature distribution are common knowledge to those skilled in the art and will not be elaborated here.

[0180] Step 302: Determine the temperature concentration point based on the temperature distribution.

[0181] The temperature concentration point is the location where the temperature reaches its peak. The method for identifying the temperature concentration point is common knowledge to those in the field and will not be elaborated here.

[0182] Step 303: Read the high temperature based on the temperature concentration point.

[0183] High temperature is the temperature value of the temperature concentration point. The method for determining high temperature is common knowledge among those in the field and will not be elaborated here.

[0184] Step 304: Select the heat dissipation fan speed in response to the high temperature, and match the heat dissipation number in response to the temperature concentration point.

[0185] Cooling air velocity refers to the air velocity required to accelerate the heat dissipation of concentrated temperature points through kinetic energy devices. The higher the temperature, the greater the cooling air velocity required. The cooling air velocity corresponding to a high temperature can be found in the cooling relationship table, which is a data table that records different high temperatures and their corresponding cooling air velocities.

[0186] The heat dissipation number refers to the air blowing number of the kinetic energy device closest to the temperature concentration point. The method for determining the heat dissipation number is the same as step 116 above. After the heat dissipation number corresponds one-to-one with the temperature concentration point, the orientation of the kinetic energy device is adjusted according to the spatial relationship between the kinetic energy device and the temperature concentration point so that the kinetic energy device is aligned with the temperature concentration point. In addition, when the temperature is too high, the air outlet can be opened to speed up the airflow.

[0187] When different temperature concentration points correspond to the same heat dissipation number, the distance between the different temperature concentration points and the kinetic energy device with the heat dissipation number is calculated respectively. The kinetic energy device with the heat dissipation number is controlled to align with the selected temperature concentration point with a larger distance. The kinetic energy device that is closest to another temperature concentration point (excluding the heat dissipation number) is controlled to align with another temperature concentration point. This reduces the situation where the distance between the kinetic energy device and the temperature concentration point is too far, which leads to the attenuation of wind speed and thus reduces the heat dissipation effect of the airflow.

[0188] Step 305: Control the preset kinetic energy device to blow air at the temperature concentration point at the heat dissipation wind speed according to the heat dissipation number.

[0189] When the high-voltage amplifier power supply outputs a high-voltage electrical signal, the interface is prone to heat generation. The temperature value of each point at the interface is detected in real time to calculate the temperature distribution inside the interface. When the temperature value is high, the heat dissipation speed of the interface is accelerated by airflow to reduce the possibility of interface burnout.

[0190] Heat dissipation methods also include:

[0191] Step 306: Read the highest temperature based on the temperature distribution.

[0192] The highest temperature is the highest value of temperature on the temperature distribution. The method for determining the highest temperature is common knowledge among those in the field and will not be elaborated here.

[0193] Step 307: Select the amount of heat dissipation based on the highest temperature.

[0194] The amount of heat dissipation refers to the amount of heat absorbed by hitting the ball. The higher the maximum temperature, the greater the amount of heat dissipation required. The amount of heat dissipation corresponding to the maximum temperature can be found in the heat absorption relationship table, which is a data table that records different maximum temperatures and their corresponding amounts of heat dissipation.

[0195] Step 308: Control the preset striking device to release the preset striking ball according to the heat dissipation quantity, and plan the heat dissipation route based on the temperature concentration point.

[0196] The heat dissipation path is the route the ball takes through the points of concentrated temperature after being struck. The method for determining the heat dissipation path is common knowledge to those in the field and will not be elaborated here.

[0197] Step 309: Determine the heat dissipation direction by combining the heat dissipation route and heat dissipation number.

[0198] The heat dissipation direction refers to the angle of airflow required for the kinetic energy device of the heat dissipation number to drive the hitting ball to move along the heat dissipation path. The direction from the current temperature concentration point to the next temperature concentration point can be found from the heat dissipation path as the heat dissipation direction. The method for determining the heat dissipation direction is common knowledge to those in the field and will not be elaborated here.

[0199] Step 310: Control the preset kinetic energy device to turn in the direction of heat dissipation according to the heat dissipation number, and determine the start-up sequence according to the heat dissipation route, heat dissipation wind speed and heat dissipation number.

[0200] The startup sequence is the sequence of opening and closing of the airflow required for the kinetic energy device with the heat dissipation number to drive the hitting ball along the heat dissipation path. The heat dissipation movement speed corresponding to the heat dissipation wind speed can be found in the dynamic speed relationship table. Then, the heat dissipation distance from the current temperature concentration point to the next temperature concentration point can be found in the heat dissipation path. The quotient of the heat dissipation movement speed and the heat dissipation distance is used as the startup duration of the kinetic energy device corresponding to the heat dissipation number. All startup durations are arranged in the order of the heat dissipation path to form the startup sequence. The method for determining the startup sequence is common knowledge to those skilled in the art and will not be elaborated here.

[0201] Step 311: Activate the preset kinetic energy devices in sequence according to the activation sequence and the heat dissipation number to blow air at the heat dissipation wind speed.

[0202] When the interface temperature is too high, the heat is absorbed by hitting the ball, and the ball is guided by wind to move along the bottom of the interface, which improves the heat dissipation efficiency and reduces the possibility of the interface burning out.

[0203] Based on the same inventive concept, embodiments of the present invention provide a control system for a high-voltage amplification power supply, comprising:

[0204] The acquisition module is used to acquire interface images, placement orientation, and interface temperature.

[0205] The memory is used to store the program for the control method of any of the above-mentioned high-voltage amplification power supplies.

[0206] The processor is the unit of memory that allows programs to be loaded and executed by the processor.

[0207] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0208] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A method for cleaning the interface of a high-voltage amplification power supply, characterized in that, include: Step 100: Acquire the interface image of the high-voltage amplifier power supply; Step 101: Determine whether a preset deposition feature exists in the interface from the interface image; Step 102: When a preset deposition feature exists in the interface, the deposition area is identified from the interface image; Step 103: Determine the number of blows in response to the deposition area; Step 104: Control the preset striking device to release the preset striking ball according to the number of strikes, and identify the deposition thickness from the interface image; Step 105: Determine the impact wind speed based on the deposition thickness; Step 106: Control the preset kinetic energy device to blow air into the interface according to the said striking wind speed so that the preset striking ball strikes the deposit at high speed in the interface.

2. The interface cleaning method for a high-voltage amplification power supply according to claim 1, characterized in that, Also includes: Step 107: When a preset deposition feature exists in the interface, the deposition volume is determined by combining the impact area and the impact thickness; Step 108: Determine the impact kinetic energy based on the number of impacts and the impact wind speed; Step 109: Calculate the impact time based on the deposition volume and impact kinetic energy; Step 110: After the impact time, control the preset kinetic energy device to stop blowing, and determine the cleaning wind speed in response to the deposition volume; Step 111: Control the preset kinetic energy device to blow air into the interface at the cleaning wind speed to blow the debris out of the interface.

3. The interface cleaning method for a high-voltage amplification power supply according to claim 2, characterized in that, Also includes: Step 112: When a preset deposition feature exists in the interface, the placement direction of the high-voltage amplification power supply is collected; Step 113: When the placement direction exceeds the preset retention range, determine the adsorption magnetic force in response to the placement direction; Step 114: Control the preset adsorption device to adsorb the preset hitting ball according to the adsorption magnetic force, and control the preset hitting device to release the preset hitting ball according to the number of hits. Step 115: Determine the airflow direction based on the placement orientation; Step 116: In response to the blowing direction, retrieve the blowing number; Step 117: Control the preset kinetic energy device to blow air into the interface at the impact wind speed according to the blower number.

4. The interface cleaning method for a high-voltage amplification power supply according to claim 3, characterized in that, It also includes a method for recovering the hitting ball, the method comprising: Step 200: After the impact time, identify the deposition location from the interface image; Step 201: Determine the main deposition points based on the deposition location, deposition area, and deposition thickness; Step 202: Determine the cleaning wind direction and outlet number based on the main sedimentation points; Step 203: Open the preset air outlet according to the air outlet number, and query the cleaning number in response to the cleaning air direction; Step 204: Control the preset kinetic energy device to blow air into the interface at the cleaning speed according to the cleaning number, and determine the cleaning time according to the deposition volume; Step 205: After the cleaning time, close the preset air outlet according to the air outlet number.

5. The interface cleaning method for a high-voltage amplification power supply according to claim 4, characterized in that, The method for recovering the struck ball also includes: Step 206: Update the interface image after the said impact time; Step 207: Identify the stopping position of the ball from the interface image; Step 208: Generate a recovery trip in response to the stated dwell position; Step 209: Control the preset adsorption device to adsorb the preset hitting ball according to the recovery stroke.

6. The interface cleaning method for a high-voltage amplification power supply according to claim 5, characterized in that, The method for recovering the struck ball also includes: Step 210: When the placement direction is inconsistent with the preset flat angle, determine the rolling position of the hitting ball in response to the placement direction; Step 211: Update the main deposition point according to the rolling position, and determine the rolling area in combination with the placement direction and the number of blows; Step 212: Determine a retrieval route in response to the rolling area, and determine the retrieval magnetic force based on the placement direction; Step 213: Update the recycling journey by combining the recycling route and the recycling magnetism.

7. The interface cleaning method for a high-voltage amplification power supply according to claim 6, characterized in that, The method for recovering the struck ball also includes: Step 214: When the placement direction is inconsistent with the preset flat angle, determine the reverse coefficient in response to the placement direction; Step 215: Calculate the product of the reverse coefficient and the cleaning time, and define it as the correction time; Step 216: After the correction time, close the preset air outlet according to the air outlet number, and determine the blocking angle in response to the placement direction; Step 217: Select a corrected wind speed based on the aforementioned shielding angle and deposition volume; Step 218: Control the preset kinetic energy device to blow air into the interface according to the corrected wind speed to blow the debris out of the interface.

8. The interface cleaning method for a high-voltage amplification power supply according to claim 1, characterized in that, It also includes a heat dissipation method, which includes: Step 300: Collect the interface temperature at various points within the interface; Step 301: Generate a temperature distribution in response to the interface temperature; Step 302: Determine the temperature concentration point based on the temperature distribution; Step 303: Read the high temperature based on the temperature concentration point; Step 304: Select the heat dissipation fan speed in response to the high temperature, and match the heat dissipation number in response to the temperature concentration point; Step 305: Control the preset kinetic energy device to blow air at the temperature concentration point at the heat dissipation wind speed according to the heat dissipation number.

9. The interface cleaning method for a high-voltage amplification power supply according to claim 8, characterized in that, The heat dissipation method further includes: Step 306: Read the highest temperature based on the temperature distribution; Step 307: Select the amount of heat dissipation based on the highest temperature; Step 308: Control the preset striking device to release the preset striking ball according to the heat dissipation quantity, and plan the heat dissipation route based on the temperature concentration point; Step 309: Determine the heat dissipation direction by combining the heat dissipation route and heat dissipation number; Step 310: Control the preset kinetic energy device to turn in the direction of heat dissipation according to the heat dissipation number, and determine the start-up sequence according to the heat dissipation route, heat dissipation wind speed and heat dissipation number; Step 311: Activate the preset kinetic energy devices in sequence according to the activation sequence and the heat dissipation number to blow air at the heat dissipation wind speed.

10. An interface control system for a high-voltage amplification power supply, characterized in that, include: The acquisition module is used to acquire interface images, placement orientation, and interface temperature; A memory for storing a program for cleaning the interface of a high-voltage amplification power supply as described in any one of claims 1 to 9; The processor is the unit of memory that allows programs to be loaded and executed by the processor.

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