Temperature-controlled fluid distribution assembly, process chamber, and semiconductor processing apparatus

Abstract

The application discloses a temperature-controlled fluid distribution assembly, a process chamber and a semiconductor process equipment, and relates to the semiconductor field. The temperature-controlled fluid distribution assembly is used in a process chamber, and is provided with an air inlet, a first air outlet, a flow channel and an air outlet. The air inlet and the air outlet are respectively arranged at one end of the temperature-controlled fluid distribution assembly, and the first air outlet is arranged at the other end of the temperature-controlled fluid distribution assembly, used for providing temperature-controlled fluid to the process chamber. In the flow direction of the temperature-controlled fluid, the first air outlet is located between the air inlet and the air outlet. The flow channel extends along the circumference of the temperature-controlled fluid distribution assembly, and the air inlet, the air outlet and the first air outlet are respectively communicated with the flow channel. The application can at least solve the problem of uneven temperature of a ceramic cylinder.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductors, specifically relating to a temperature-controlled fluid distribution component, a process chamber, and semiconductor process equipment. Background Technology

[0002] Temperature is a crucial factor in the etching process, significantly impacting the uniformity of the etching rate. Therefore, improving temperature uniformity during etching is essential. Stereo plasma sources can generate higher plasma densities, leading to faster etching rates. Furthermore, related process kits allow for better control of plasma and process gas distribution, thereby adjusting the uniformity and morphology of wafer etching.

[0003] Some ICP etching equipment in related technologies uses a hot air structure to control the temperature of the ceramic cylinder. The hot air structure introduces hot air into the air duct around the outer periphery of the ceramic cylinder through the air outlet to heat the ceramic cylinder. However, when the hot air flows in the air duct, the hot air flow rate is larger near the air duct inlet, resulting in a higher temperature of the ceramic cylinder near the air duct inlet and a lower temperature near the air duct outlet. This leads to uneven temperature distribution in the ceramic cylinder, affecting the process. Summary of the Invention

[0004] The purpose of this application is to provide a temperature-controlled fluid distribution component, a process chamber, and a semiconductor process equipment, which can at least solve problems such as uneven temperature in ceramic cylinders.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides a temperature-controlled fluid distribution assembly for a process chamber, the temperature-controlled fluid distribution assembly having an air inlet, a first vent, a flow channel and an air outlet; The air inlet and the air outlet are respectively located at one end of the temperature-controlled fluid distribution assembly, and the first vent is located at the other end of the temperature-controlled fluid distribution assembly for providing temperature-controlled fluid to the process chamber. Along the flow direction of the temperature-controlled fluid, the first vent is located between the air inlet and the air outlet. The flow channel extends circumferentially along the temperature-controlled fluid distribution assembly, and the air inlet, air outlet, and first vent are respectively connected to the flow channel.

[0006] This application embodiment also provides a process chamber, including: a temperature control body and a mounting plate, wherein the mounting plate is disposed on the temperature control body and is used to support the above-mentioned temperature control fluid distribution component; The temperature control unit is equipped with a third flow channel; The mounting plate is provided with a first vent and a second vent. The first vent is configured to be opposite to the first vent of the temperature-controlled fluid distribution component and to connect the first vent and the third flow channel. The second vent is configured to be opposite to the air outlet of the temperature-controlled fluid distribution component and to connect the air outlet and the third flow channel.

[0007] This application also provides a semiconductor process apparatus, including the above-mentioned temperature-controlled fluid distribution component, process chamber, and temperature control module; The temperature control module is located on the temperature control fluid distribution assembly and is used to deliver temperature control fluid to the temperature control fluid distribution assembly and to deliver the temperature control fluid to the third flow channel of the temperature control body in the process chamber through the temperature control fluid distribution assembly.

[0008] In this embodiment, a temperature-controlled fluid (such as hot or cold air) can be introduced into the flow channel through the air inlet, allowing it to diffuse and fill the space within the channel. The fluid can then be transported to the process chamber via the first vent, enabling it to flow more evenly into all areas of the process chamber. This increases the contact area between the fluid and the various areas within the process chamber, improving temperature uniformity. Compared to related technologies that use a hot air structure to introduce hot air through an outlet into the air duct around the ceramic cylinder, this embodiment also improves the temperature difference between the fluid near the inlet and outlet, effectively enhancing temperature uniformity and ensuring the normal operation of the semiconductor process. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the semiconductor process equipment disclosed in this application without the temperature control module; Figure 3 This is a first structural schematic diagram of the air intake component disclosed in an embodiment of this application; Figure 4 This is a schematic diagram of the second structure of the air intake component disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the mounting plate disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the air intake plate disclosed in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the air outlet component disclosed in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of the air outlet plate disclosed in the embodiments of this application; Figure 9 This is a partial schematic diagram of the first or second arc surface disclosed in the embodiments of this application; Figure 10 This is a first schematic diagram of one of the process chambers disclosed in the embodiments of this application; Figure 11 This is a second schematic diagram of one of the process chambers disclosed in the embodiments of this application; Figure 12 This is a first schematic diagram of another form of process chamber disclosed in the embodiments of this application; Figure 13 This is a second schematic diagram of another form of process chamber disclosed in the embodiments of this application; Figure 14 This is a schematic diagram of the simulation results disclosed in the embodiments of this application; Figure 15 This is a schematic diagram of the temperature control system disclosed in the embodiments of this application.

[0010] Explanation of reference numerals in the attached figures: 01-Temperature-controlled fluid distribution assembly; 11-Casing; 111-Intake component; 1111-Intake port; 1112-First opening; 1113-First curved surface; 112 - Air outlet; 1121 - Air outlet; 1122 - Second opening; 1123 - Second arc surface; 12-hole plate; 121-Inlet plate; 121a-Ventilator assembly; 1211-First vent; 122 - Vent plate; 1221 - Second vent; M - Flow channel; M1 - First flow channel; M2 - Second flow channel; 02-Temperature control unit; 021-Medium cylinder; 022-Mounting plate; 0221-First vent; 0222-Second vent; 023-Medium window; M3-Third flow channel; 03-Temperature control module. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0014] The relevant technology uses a hot air structure to control the temperature of the ceramic cylinder. Specifically, the hot air module can be equipped with an air inlet and an air outlet. Heated or cooling air can enter the ceramic cylinder through the air inlet, flow through the air duct of the ceramic cylinder, and then flow out through the air outlet to achieve temperature control of the ceramic cylinder. However, this temperature control method results in the temperature of the ceramic cylinder being higher near the air inlet and lower near the air outlet, leading to a large temperature difference between the air inlet and the air outlet. Furthermore, after air is supplied through the air inlet, most of the air flows directly out of the air outlet, resulting in insufficient heat exchange with the ceramic cylinder.

[0015] To address the issue of uneven temperature distribution at the inlet and outlet of ceramic cylinders in related technologies, this application discloses a temperature-controlled fluid distribution component 01, applied to a process chamber, for temperature control within the process chamber. (Reference) Figures 1 to 15 The disclosed temperature control fluid distribution assembly 01 is provided with an air inlet 1111, a first vent 1211, a flow channel M and an air outlet 1121.

[0016] The air inlet 1111 is used to receive temperature-controlled fluid, such as hot air or cold air; the flow channel M is used to transport the temperature-controlled fluid; in some embodiments, there can be multiple first air vents 1211, which are used to uniformly distribute the temperature-controlled fluid to improve the uniformity of the temperature-controlled fluid transport; the air outlet 1121 is used to discharge the temperature-controlled fluid.

[0017] The air inlet 1111 and the air outlet 1121 are respectively located at one end of the temperature control fluid distribution assembly 01, and the first vent 1211 is located at the other end of the temperature control fluid distribution assembly 01 for supplying temperature control fluid to the process chamber. Along the flow direction of the temperature control fluid, the first vent 1211 is located between the air inlet 1111 and the air outlet 1121.

[0018] Optionally, the temperature-controlled fluid distribution component 01 can be an annular structure. Of course, it can also be other shapes adapted to the process chamber, which are not specifically limited here. When the temperature-controlled fluid distribution component 01 is an annular structure, the air inlet 1111 and the air outlet 1121 can be respectively opened on the side wall of one end of the temperature-controlled fluid distribution component 01 along its own axis, and the first vent 1211 can be opened at the other end of the temperature-controlled fluid distribution component 01 along its own axis.

[0019] The flow channel M extends circumferentially along the temperature control fluid distribution component 01, and the air inlet 1111, air outlet 1121 and first vent 1211 are respectively connected to the flow channel M. In this way, the temperature control fluid can flow between the air inlet 1111, air outlet 1121 and first vent 1211 and the flow channel M respectively, so as to achieve the temperature control effect of the process chamber.

[0020] Specifically, the temperature-controlled fluid can flow into the flow channel M through the air inlet 1111 and diffuse in the flow channel M. After diffusion, the temperature-controlled fluid is evenly transported to the outer wall of the process chamber through the first air vent 1211 to facilitate temperature control of the outer wall of the process chamber. After the temperature-controlled fluid is transported to the outer wall of the process chamber, it will exchange heat with the outer wall of the process chamber. After heat exchange, the temperature-controlled fluid flows back from the temperature-controlled chamber to the flow channel M and is finally discharged through the air outlet 1121.

[0021] In this embodiment, a temperature-controlled fluid (e.g., hot or cold air) can be introduced into the flow channel M through the air inlet 1111, allowing the fluid to diffuse and fill the space within the channel M. The fluid in the flow channel M can then be transported to the outer wall of the process chamber via the first vent 1211, enabling it to flow more evenly into the outer wall and increasing the contact area between the fluid and the chamber, thus improving the temperature uniformity. Compared to related technologies that use a hot air structure to introduce hot air through an outlet into the air duct around the ceramic cylinder, this embodiment improves the temperature difference between the temperature-controlled fluid near the air inlet 1111 and near the outlet 1121, effectively enhancing temperature uniformity and ensuring the normal operation of the semiconductor process.

[0022] refer to Figure 1 and Figure 2 In some embodiments, the flow channel M may include a first flow channel M1 and a second flow channel M2, which are arranged circumferentially along the temperature-controlled fluid distribution assembly 01 and are respectively used to communicate with the process chamber, so that the first flow channel M1 and the second flow channel M2 can respectively transport temperature-controlled fluid between the process chamber.

[0023] The air inlet 1111 and the first vent 1211 can be connected to the first flow channel M1 respectively, so that the temperature control fluid can flow into the first flow channel M1 through the air inlet 1111 and flow out from the first vent 1211 and be transported to the outer wall of the process chamber for heat exchange.

[0024] The outlet 1121 is connected to the second flow channel M2, so that the temperature-controlled fluid after heat exchange flows back from the process chamber to the second flow channel M2 and is finally discharged through the outlet 1121.

[0025] It should be noted that the first flow channel M1 and the second flow channel M2 are separated from each other to prevent a portion of the temperature-controlled fluid in the first flow channel M1 from being discharged directly from the second flow channel M2 and the outlet 1121 without flowing into the process chamber.

[0026] In some embodiments, the temperature-controlled fluid distribution assembly 01 may further be provided with a second vent 1221, which is connected to one end of the second flow channel M2 away from the vent 1121, so that the second vent 1221 can be locally corresponding to the process chamber to receive the temperature-controlled fluid that has undergone heat exchange from the process chamber. In some embodiments, there may be multiple second vents 1221, which are used to uniformly distribute the temperature-controlled fluid.

[0027] Optionally, the second vent 1221 can be opened at the other end of the temperature control fluid distribution assembly 01 along its own axis, that is, it can be located at the same end as the first vent 1211, so that when the temperature control fluid distribution assembly 01 is installed in the process chamber, the first vent 1211 and the second vent 1221 can be connected to the process chamber respectively, thereby realizing the transmission of temperature control fluid.

[0028] refer to Figure 2 In some embodiments, the temperature-controlled fluid distribution assembly 01 may include a housing 11 and an orifice plate 12. The air inlet 1111 and the air outlet 1121 may be respectively provided at one end of the housing 11, and the other end of the housing 11 is provided with an opening. The orifice plate 12 is provided at the opening and forms a flow channel M with the housing 11. The first vent 1211 is provided on the orifice plate 12.

[0029] It should be noted that the other end of the casing 11 can be through-hole to form an opening, while other areas can be closed to serve as the inner wall of the flow channel M. The perforated plate 12 is provided at the opening, so that the surface of the perforated plate 12 can also serve as the inner wall of the flow channel M.

[0030] Optionally, the cover 11 can be a long strip-shaped shell, such as a rectangular shell or a long arc-shaped shell; correspondingly, the shape of the perforated plate 12 is adapted to the shape of the cover 11. Of course, other shapes are also possible, which are not specifically limited here.

[0031] In some more specific embodiments, the air inlet 1111 and the air outlet 1121 can be opened on the side wall of one end of the cover 11 and are distributed circumferentially along the temperature control fluid distribution component 01, so that the position of the temperature control fluid entering the process chamber and the position of the temperature control fluid exiting the process chamber are spaced apart, thereby increasing the contact area between the temperature control fluid and the process chamber and improving the heat exchange effect.

[0032] In some embodiments, the cover 11 and the perforated plate 12 can be integrally formed to ensure the sealing of the flow channel M; in other embodiments, the perforated plate 12 can be fixedly connected to the opening of the cover 11, such as by welding, bonding, riveting, screwing, etc., to ensure the reliability and stability of the connection between the perforated plate 12 and the cover 11, and of course, to ensure the sealing of the flow channel M.

[0033] In some embodiments, the temperature-controlled fluid distribution assembly 01 may include at least two housings 11 and at least two perforated plates 12. The at least two housings 11 are arranged end-to-end along the circumference of the temperature-controlled fluid distribution assembly 01, and the at least two perforated plates 12 are located at the openings of the respective housings 11. Based on this arrangement, the at least two housings 11 can form an annular structure to accommodate the shape of the process chamber. Furthermore, the at least two perforated plates 12 located at the openings of the at least two housings 11 can form an annular flow channel M, allowing the temperature-controlled fluid entering the flow channel M to flow annularly along the temperature-controlled fluid distribution assembly 01. This improves the efficiency of the temperature-controlled fluid entering the process chamber and increases the contact area between the temperature-controlled fluid and the process chamber, thereby improving the heat exchange efficiency between the temperature-controlled fluid and the process chamber.

[0034] It should be noted that at least two housings 11 and at least two orifice plates 12 can form at least two flow channels M to deliver temperature-controlled fluid to the process chamber through the at least two flow channels M respectively.

[0035] Furthermore, in two adjacent housings 11, the air inlet 1111 of one is used to communicate with the air outlet 1121 of the other through the flow channel M and the process chamber. Specifically, when the temperature-controlled fluid distribution assembly 01 is installed in the process chamber, the air inlet 1111 of one of the two adjacent housings 11 can sequentially pass through the first flow channel M1, the first vent 1211, the process chamber, and the second flow channel M2, and finally be discharged through the air outlet 1121.

[0036] From the perspective of ease of processing and disassembly, in the embodiments of this application, the cover 11 may include an air inlet 111 and an air outlet 112, the perforated plate 12 may include an air inlet perforated plate 121 and an air outlet perforated plate 122, and the opening may include a first opening 1112 and a second opening 1122.

[0037] The air intake component 111 may have an air inlet 1111 and a first opening 1112. The air inlet plate 121 may be disposed at the first opening 1112 and form a first flow channel M1 with the air intake component 111. Based on this, the temperature control fluid can flow into the first flow channel M1 through the air inlet 1111 of the air intake component 111, and the temperature control fluid can be evenly delivered to the process chamber through the first vent 1211 of the air inlet plate 121.

[0038] Optionally, the air inlet 111 may be provided with an arc-shaped groove extending along the temperature control fluid distribution assembly 01. The arc-shaped groove can guide the temperature control fluid and extend the flow area of ​​the temperature control fluid so as to achieve a uniform flow of the temperature control fluid before it enters the process chamber.

[0039] In addition, the air outlet 112 may be provided with an air outlet 1121 and a second opening 1122, and the air outlet plate 122 is provided at the second opening 1122, forming a second flow channel M2 with the air outlet 112. Based on this, the temperature-controlled fluid after heat exchange in the process chamber can flow into the second flow channel M2 through the second flow equalization plate, and finally be discharged through the air outlet 1121.

[0040] To further improve the uniform flow effect, the air inlet plate 121 can be provided with multiple air vent groups 121a, such as Figure 6 As shown, each vent group 121a may include multiple first vents 1211. Based on this, the multiple vent groups 121a can divert the temperature-controlled fluid in the first flow channel M1, allowing the temperature-controlled fluid to flow into the process chamber through the multiple vent groups 121a respectively, thus achieving a uniform flow of the temperature-controlled fluid. Furthermore, it can realize multi-port input of temperature-controlled fluid, which helps to reduce temperature differences at different locations in the process chamber, thereby improving temperature uniformity. At the same time, the multiple first vents 1211 in each vent group 121a can further uniformize the flow of the temperature-controlled fluid.

[0041] Optionally, the first flow channel M1 can extend circumferentially along the temperature control fluid distribution component 01. For example, the first flow channel M1 can be an arc-shaped flow channel. In this case, multiple vent groups 121a can be distributed circumferentially, such as uniformly or non-uniformly, so as to transport the temperature control fluid to different areas along the circumferential direction in the process chamber through multiple vent groups 121a, thereby increasing the heat exchange efficiency between the temperature control fluid and the process chamber.

[0042] In addition, the multiple first vents 1211 in each vent group 121a can be arranged evenly or unevenly, depending on actual needs.

[0043] like Figure 8As shown, the vent plate 122 is provided with multiple second vents 1221, and the multiple second vents 1221 can also form a vent group 121a, so that the temperature-controlled fluid in the process chamber after heat exchange can enter the second flow channel M2 through the uniform flow effect of the multiple second vents 1221, thereby increasing the flow area of ​​the temperature-controlled fluid flowing into the second flow channel M2 and improving the conveying efficiency.

[0044] It should be noted that the distribution of vent groups 121a and the first vents 1211 within each vent group 121a will affect the flow rate of the temperature-controlled fluid entering the process chamber. Therefore, the number of first vents 1211 in vent groups 121a at different locations needs to be considered to ensure that the flow rate of the temperature-controlled fluid entering each vent group 121a is the same. Similarly, the distribution of the second vents 1221 will also affect the flow rate of the temperature-controlled fluid. Therefore, by combining simulation and actual testing, the optimal distribution of the first vents 1211 and the second vents 1221 can be determined by changing these distributions while keeping the overall structure unchanged.

[0045] like Figure 14 As shown in the simulation, the streamlines represent the flow path of the temperature-controlled fluid. The density of the streamlines reflects the area traversed by most of the temperature-controlled fluid. The streamline diagram shows that the temperature-controlled fluid is distributed in most of the area within the third flow channel M3 of the process chamber. The uniformity of the temperature-controlled fluid distribution within the third flow channel M3 directly affects the heat exchange efficiency between the process chamber and the temperature-controlled fluid, thus affecting the temperature distribution uniformity within the process chamber.

[0046] In the temperature distribution of the simulation results, color represents temperature. The temperature differences within the process chambers can be visually observed from the color differences; smaller color differences indicate smaller temperature differences. Figure 14 It can be seen that when multiple vent groups 121a are used to input the temperature-controlled fluid, the temperature-controlled fluid distribution component 01 uniformly distributes the temperature-controlled fluid entering the process chamber, resulting in a more uniform temperature distribution and improved temperature difference between the inlet and outlet.

[0047] In addition, the air inlet plate 121 also serves to shield against radio frequency (RF) radiation, preventing the RF radiation generated by the coils inside the process chamber from affecting the external environment. From an RF shielding perspective, to further improve the RF shielding effect, the aperture of the first vent 1211 can not exceed 4mm, such as 4mm, 3.5mm, 3mm, 2.5mm, etc. Of course, other sizes are also possible, and no specific limitation is made here. It should be noted that simulation methods can be used to simulate the impact of the aperture of the first vent 1211 on the RF shielding effect. Of course, the aperture of the second vent 1221 of the exhaust plate 122 can also not exceed 4mm to improve the RF shielding effect.

[0048] Considering that the first flow channel M1 can extend circumferentially along the temperature-controlled fluid distribution component 01, correspondingly, the first opening 1112 can also extend circumferentially along the temperature-controlled fluid distribution component 01 to facilitate the installation of an air inlet plate 121 extending circumferentially along the temperature-controlled fluid distribution component 01. This allows for the increase of the uniform flow area and the improvement of the uniform flow effect through multiple air vent groups 121a distributed circumferentially on the air inlet plate 121. For example, the first opening 1112 can be an arc-shaped opening to facilitate the installation of an arc-shaped air inlet plate 121 at this location.

[0049] The air inlet 1111 can be positioned opposite to a local area of ​​the first opening 1112. The cross-sectional area of ​​the air inlet 1111 is larger than the cross-sectional area of ​​the local area of ​​the first opening 1112, and the air inlet 1111 and the local area of ​​the first opening 1112 are connected by a first arc surface 1113. Based on this arrangement, on the one hand, the first flow channel M1 can be made smoother between the air inlet 1111 and the first opening 1112, reducing the flow resistance of the temperature-controlled fluid in the first flow channel M1 and making the flow of the temperature-controlled fluid smoother. On the other hand, it can also make the air inlet component 111 smoother, which helps to alleviate the stress concentration problem.

[0050] Optionally, the air inlet 1111 is located at one end of the first opening 1112 along the circumferential direction, and the cross-sectional area of ​​the air inlet 1111 is larger than the cross-sectional area of ​​the area opposite the first opening 1112 and the air inlet 1111. For example, the air inlet 1111 can be a circular opening, and the first opening 1112 can be an elongated opening, such as an arc-shaped opening.

[0051] For example, the air inlet 1111 can be a circular opening, and the first opening 1112 and the first air hole 0221 of the mounting plate 022 can be fan-shaped openings. The smooth transition between the circular opening and the fan-shaped opening can be achieved through the first arc surface 1113 to reduce flow resistance.

[0052] Similarly, the air outlet 1121 and the second opening 1122 are arranged opposite to each other. The cross-sectional area of ​​the air outlet 1121 is larger than that of the second opening 1122, and the air outlet 1121 and the second opening 1122 can be connected by a second arc surface 1123. Based on this arrangement, on the one hand, the second flow channel M2 can be made smoother between the air outlet 1121 and the second opening 1122, reducing the flow resistance of the temperature-controlled fluid in the second flow channel M2 and making the flow of the temperature-controlled fluid smoother. On the other hand, it can also make the air outlet 112 smoother, which helps to alleviate the stress concentration problem.

[0053] For example, the air outlet 1121 can be a circular opening, and the second opening 1122 can be an oblong opening.

[0054] In some embodiments, the sum of the cross-sectional areas of the first vents 1211 of the plurality of vent groups 121a may be less than or equal to the cross-sectional area of ​​the inlet 1111. Based on this, uniform diffusion of the temperature-controlled fluid can be ensured without reducing the input area. This application also discloses a process chamber, which includes a temperature control body 02 and a mounting plate 022. The mounting plate 022 is disposed on the temperature control body 02 and is used to support the aforementioned temperature control fluid distribution assembly 01. (See reference...) Figure 5 , Figure 10 and Figure 11 The temperature control body 02 may be provided with a third flow channel M3. The mounting plate 022 is provided with a first vent 0221 and a second vent 0222. The first vent 0221 is arranged opposite to the first vent 1211 of the temperature control fluid distribution component 01 and connects the first vent 1211 and the third flow channel M3. The second vent 0222 is arranged opposite to the air outlet 1121 of the temperature control fluid distribution component 01 and connects the air outlet 1121 and the third flow channel M3.

[0055] Optionally, screws can be used to fix the air inlet 111 and air inlet plate 121, as well as the air outlet 112 and air outlet plate 122 of the temperature control fluid distribution assembly 01 to the mounting plate 022 to ensure the installation stability of the temperature control fluid distribution assembly 01.

[0056] Based on the above configuration, the temperature control fluid can be input into the first vent 0221 through the temperature control fluid distribution component 01 via the first vent 1211, and then into the third flow channel M3 through the first vent 0221, so that the temperature control fluid can flow in the third flow channel M3 and exchange heat with the temperature control body 02; after heat exchange, the temperature control fluid flows into the second vent 0222 through the third flow channel M3, and then into the air outlet 1121 through the second vent 0222, and finally discharged through the air outlet 1121.

[0057] Optionally, the second vent 0222 can be directly connected to the second vent 1221, and the second vent 1221 is connected to the outlet 1121 through the second flow channel M2.

[0058] Optionally, the mounting plate 022 may be provided with a plurality of first air holes 0221 distributed circumferentially along the medium cylinder 021; the plurality of first air holes 0221 may be evenly or non-uniformly arranged circumferentially, depending on the actual needs.

[0059] Considering that the sizes of the first vent 0221 and the second vent 0222 each have a certain impact on the strength of the mounting plate 022, and that when the third flow channel M3 is in a ring structure, in order to increase the input area and reduce the impact of the vents on the strength of the mounting plate 022, both the first vent 0221 and the second vent 0222 can be fan-shaped holes, such as... Figure 5 As shown.

[0060] In addition, the center of the multiple first air holes 0221 and the center of the second air holes 0222 can be located on the center line of the medium cylinder 021. In this way, the cross-sectional areas of the multiple first air holes 0221 and the second air holes 0222 can be the same, ensuring the uniformity of the temperature-controlled fluid flow rate.

[0061] Furthermore, considering the issue of alleviating stress concentration, the edges of the walls of the first vent 0221 and the second vent 0222 can be designed as rounded corners.

[0062] In some embodiments, the opening form and position of the air inlet plate 121 and the air outlet plate 122 can correspond to the opening form and position on the mounting plate 022. For example, the air inlet group 121a of the air inlet plate 121 can be rectangular; the plurality of second air inlets 1221 of the air outlet plate 122 can also be rectangularly distributed.

[0063] In some embodiments, the mounting plate 022 facing the temperature-controlled fluid distribution assembly 01 may be provided with a plurality of mounting grooves extending circumferentially along the temperature-controlled fluid distribution assembly 01, and the ends of the plurality of temperature-controlled fluid distribution assemblies 01 having the first vent 1211 are respectively embedded in the corresponding mounting grooves. Optionally, the perforated plate 12 may be embedded in the mounting groove, and the cover 11 may be fixed at the mounting plate 022 and correspondingly disposed with the mounting groove.

[0064] The bottom of each mounting slot may be provided with multiple first air holes 0221 and second air holes 0222. The multiple first air holes 0221 and second air holes 0222 are arranged circumferentially along the temperature control fluid distribution component 01 and are respectively arranged opposite to and connected to the first air vent 1211 and the second air vent 1221 of the temperature control fluid distribution component 01, so as to connect the temperature control fluid distribution component 01 with the third flow channel M3 of the temperature control body 02 through the multiple first air holes 0221 and second air holes 0222.

[0065] In addition, in two adjacent mounting slots, the first air hole 0221 of the former is set to correspond with the second air hole 0222 of the latter, so that it can be adapted to the air inlet 1111 and air outlet 1121 of the temperature control fluid distribution assembly 01. refer to Figure 10 and Figure 11 In some embodiments, the temperature control body 02 can be a medium cylinder 021, which has a cylinder wall and a third flow channel M3 extending circumferentially within the cylinder wall; the mounting plate 022 is disposed on the medium cylinder 021, and the first air hole 0221 and the second air hole 0222 are respectively connected to the third flow channel M3.

[0066] Based on the above configuration, when the temperature-controlled fluid distribution component 01 is installed on the medium cylinder 021, the mounting plate 022 can support the temperature-controlled fluid distribution component 01 to ensure its stability. Furthermore, the mounting plate 022 can seal the opening of the medium cylinder 021. At the same time, the first vent 1211 and the third flow channel M3 are connected through the first vent 0221, and the second vent 1221 and the third flow channel M3 are connected through the second vent 0222 to prevent the mounting plate 022 from blocking the connection between the temperature-controlled fluid distribution component 01 and the medium cylinder 021.

[0067] For example, the dielectric cylinder 021 may include a ceramic cylinder and a coil shielding cylinder, with the ceramic cylinder disposed inside the coil shielding cylinder and spaced apart to form a third flow channel M3.

[0068] refer to Figure 12 and Figure 13 In some embodiments, the temperature control body 02 may also be a medium window 023, which may have a third flow channel M3 inside, and the surface of the medium window 023 is provided with an inlet and an outlet respectively connected to the third flow channel M3; the mounting plate 022 is provided on the surface of the medium window 023, and the first air hole 0221 is connected to the inlet and the second air hole 0222 is connected to the outlet.

[0069] Based on the above configuration, when the temperature-controlled fluid distribution assembly 01 is installed on the medium window 023, the mounting plate 022 can support the temperature-controlled fluid distribution assembly 01 to ensure its stability. Furthermore, the first vent 0221 connects to the first vent 1211 and the inlet, and the second vent 0222 connects to the outlet 1121 and the outlet. The inlet and outlet are respectively connected to the third flow channel M3, effectively preventing the mounting plate 022 from obstructing the connection between the temperature-controlled fluid distribution assembly 01 and the medium window 023. Distributing the temperature-controlled fluid through the temperature-controlled fluid distribution assembly 01 allows for uniform flow before heat exchange with the medium window 023, reducing the temperature difference at the inlet and outlet positions of the medium window 023 and improving the temperature uniformity of the medium window 023.

[0070] It should be noted that the temperature control body 02 in this embodiment is not limited to the three-dimensional medium cylinder 021, but can also be the planar medium window 023.

[0071] This application also discloses a semiconductor process apparatus, which includes the aforementioned temperature-controlled fluid distribution assembly 01 and the aforementioned process chamber, as well as a temperature control module 03. The temperature control module 03 is disposed on the temperature-controlled fluid distribution assembly 01 and is used to supply temperature-controlled fluid to the temperature-controlled fluid distribution assembly 01, and to transport the temperature-controlled fluid to the third flow channel M3 of the temperature-controlled body 02 in the process chamber via the temperature-controlled fluid distribution assembly 01.

[0072] Based on the above settings, temperature control fluid can be generated by temperature control module 03. The temperature control fluid enters the flow channel M of temperature control fluid distribution component 01 through air inlet 1111, and is transported to the third flow channel M3 of temperature control body 02 in process chamber through first air vent 1211. The temperature control fluid exchanges heat with medium cylinder 021 in the third flow channel M3. After heat exchange, the temperature control fluid flows back to flow channel M through the third flow channel M3, and is finally discharged through air outlet 1121. At this time, the temperature control fluid completes a cycle, thereby realizing the temperature regulation and control of temperature control body 02.

[0073] For example, the temperature control module 03 may include a heating wire, an air inlet flange, an air amplifier, and other structures. The heating wire is used to heat the cold air, and the air amplifier utilizes the principles of fluid mechanics to achieve a large flow rate of gas within the air duct when compressed air is introduced. It should be noted that the specific structure and working principle of the temperature control module 03 can also be found in related technologies.

[0074] In some embodiments, the semiconductor process equipment may further include a controller, which includes a memory and a processor. The memory stores a computer program that, when executed by the processor, implements the following temperature control method: Detect the temperature of a local area of ​​the temperature control unit 02; When the detected temperature is higher than the preset temperature value, a low-temperature fluid is introduced into the third flow channel M3 of the temperature control body 02 through the temperature control module 03 via the temperature control fluid distribution component 01; wherein, the low-temperature fluid can be cold air; Alternatively, if the detected temperature is lower than the preset temperature value, a high-temperature fluid can be introduced into the third flow channel M3 of the temperature control body 02 through the temperature control module 03 via the temperature control fluid distribution component 01. The high-temperature fluid can be hot air.

[0075] Based on the above method, the temperature of the temperature control body 02 can be adjusted and controlled to ensure that the temperature of the temperature control body 02 meets the process requirements.

[0076] Taking dielectric cylinder 021 as an example, the temperature of dielectric cylinder 021 needs to ensure dynamic balance between cooling and heating. During the process, the heat source of dielectric cylinder 021 can include two parts: radio frequency heating power and heating wire heating power. The cooling source includes air cooling power when the relay is off. Controlling the on and off time of the relay can control the mutual adjustment between the heating system and the cooling system to maintain a relatively stable temperature of dielectric cylinder 021.

[0077] Alternatively, an infrared temperature sensor can be used to measure the temperature of the medium cylinder 021. When the feedback temperature (i.e., the detected temperature) is lower than the preset temperature value, the relay is activated, and the resistance wire heats up; when the feedback detected temperature is higher than the preset temperature value, the relay is deactivated, and cold air is introduced to achieve cooling, thereby achieving dynamic balance. When using the temperature control method described in this embodiment, dual over-temperature protection is also employed. When the CDA flow rate is less than 40 L / min, the heating power supply to the machine is disconnected via the relay; when the heating wire temperature exceeds 200°C, the normally closed contact of the temperature limiter opens, disconnecting the heating power supply to the machine. Its temperature control principle is as follows: Figure 15 As shown.

[0078] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A temperature-controlled fluid distribution assembly for a process chamber, characterized in that, The temperature-controlled fluid distribution assembly (01) is provided with an air inlet (1111), a first air vent (1211), a flow channel (M) and an air outlet (1121). The air inlet (1111) and the air outlet (1121) are respectively located at one end of the temperature-controlled fluid distribution assembly (01), and the first vent (1211) is located at the other end of the temperature-controlled fluid distribution assembly (01) for providing temperature-controlled fluid to the process chamber. Along the flow direction of the temperature-controlled fluid, the first vent (1211) is located between the air inlet (1111) and the air outlet (1121). The flow channel (M) extends circumferentially along the temperature-controlled fluid distribution assembly (01), and the air inlet (1111), air outlet (1121) and the first vent (1211) are respectively connected to the flow channel (M).

2. The temperature-controlled fluid distribution assembly according to claim 1, characterized in that, The flow channel (M) includes a first flow channel (M1) and a second flow channel (M2). The first flow channel (M1) and the second flow channel (M2) are arranged circumferentially along the temperature control fluid distribution assembly (01) and are respectively used to communicate with the process chamber. The air inlet (1111) and the first vent (1211) are respectively connected to the first flow channel (M1); The air outlet (1121) is connected to the second flow channel (M2).

3. The temperature-controlled fluid distribution assembly according to claim 2, characterized in that, The temperature-controlled fluid distribution assembly (01) is further provided with a second vent (1221), which is connected to the end of the second flow channel (M2) away from the air outlet (1121).

4. The temperature-controlled fluid distribution assembly according to claim 2 or 3, characterized in that, The temperature-controlled fluid distribution assembly (01) includes a housing (11) and an orifice plate (12). The air inlet (1111) and the air outlet (1121) are respectively located at one end of the cover (11), and the other end of the cover (11) is provided with an opening. The perforated plate (12) is located at the opening and forms the flow channel (M) with the cover (11). The first vent (1211) is located on the orifice plate (12).

5. The temperature-controlled fluid distribution assembly according to claim 4, characterized in that, The temperature-controlled fluid distribution assembly (01) includes at least two of the housings (11) and at least two of the orifice plates (12). At least two of the housings (11) are arranged end to end along the circumference of the temperature control fluid distribution assembly (01), and in two adjacent housings (11), the air inlet (1111) of one is used to communicate with the air outlet (1121) of the other through the flow channel (M) and the process chamber. At least two of the perforated plates (12) are provided at the openings of the corresponding housings (11).

6. The temperature-controlled fluid distribution assembly according to claim 4, characterized in that, The cover (11) includes an air inlet (111) and an air outlet (112), the perforated plate (12) includes an air inlet perforated plate (121) and an air outlet perforated plate (122), and the opening includes a first opening (1112) and a second opening (1122). The air intake component (111) has the air inlet (1111) and the first opening (1112), and the air inlet plate (121) is located at the first opening (1112) and forms the first flow channel (M1) with the air intake component (111). The air outlet (112) is provided with the air outlet (1121) and the second opening (1122), and the air outlet plate (122) is provided at the second opening (1122) and forms the second flow channel (M2) with the air outlet (112). The air inlet plate (121) is provided with a plurality of air vent groups (121a), each of the air vent groups (121a) includes a plurality of first air vents (1211), and the air outlet plate (122) is provided with a plurality of second air vents (1221).

7. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The first opening (1112) extends circumferentially along the temperature-controlled fluid distribution assembly (01), and the air inlet (1111) is disposed opposite to a local area of ​​the first opening (1112). The cross-sectional area of ​​the air inlet (1111) is larger than the cross-sectional area of ​​the local area of ​​the first opening (1112), and the air inlet (1111) and the local area of ​​the first opening (1112) are connected by a first arc surface (1113).

8. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The air outlet (1121) is positioned opposite to the second opening (1122); The cross-sectional area of ​​the air outlet (1121) is larger than that of the second opening (1122), and the air outlet (1121) and the second opening (1122) are connected by a second arc surface (1123).

9. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The sum of the cross-sectional areas of the first vents (1211) of the plurality of vent groups (121a) is less than or equal to the cross-sectional area of ​​the inlet (1111).

10. A process chamber, characterized in that, include: Temperature control body (02) and mounting plate (022), wherein the mounting plate (022) is disposed on the temperature control body (02) and is used to carry the temperature control fluid distribution assembly (01) according to any one of claims 1 to 9; The temperature control body (02) is provided with a third flow channel (M3); The mounting plate (022) is provided with a first vent (0221) and a second vent (0222). The first vent (0221) is arranged opposite to the first vent (1211) of the temperature control fluid distribution assembly (01) and connects the first vent (1211) and the third flow channel (M3). The second vent (0222) is arranged opposite to the air outlet (1121) of the temperature control fluid distribution assembly (01) and connects the air outlet (1121) and the third flow channel (M3).

11. The process chamber according to claim 10, characterized in that, The mounting plate (022) facing the temperature control fluid distribution assembly (01) has a plurality of mounting grooves extending circumferentially along the temperature control fluid distribution assembly (01), and the ends of the plurality of temperature control fluid distribution assemblies (01) having the first vent (1211) are respectively embedded in the corresponding mounting grooves. Each of the mounting slots has a plurality of first air holes (0221) and second air holes (0222) at the bottom of the slot, and the plurality of first air holes (0221) and second air holes (0222) are arranged along the circumferential direction; In two adjacent mounting slots, the first air hole (0221) of the former is correspondingly provided with the second air hole (0222) of the latter.

12. The process chamber according to claim 10, characterized in that, The temperature control body (02) is a medium cylinder (021), the medium cylinder (021) has a cylinder wall, and the cylinder wall is provided with the third flow channel (M3) extending circumferentially along the medium cylinder (021). The mounting plate (022) is disposed on the medium cylinder (021), and the first air hole (0221) and the second air hole (0222) are respectively connected to the third flow channel (M3).

13. The process chamber according to claim 10, characterized in that, The temperature control body (02) is a medium window (023), the medium window (023) is provided with the third flow channel (M3), and the surface of the medium window (023) is provided with an inlet and an outlet respectively connected to the third flow channel (M3); The mounting plate (022) is disposed on the surface of the medium window (023), and the first air hole (0221) is connected to the inlet, and the second air hole (0222) is connected to the outlet.

14. A semiconductor process apparatus, comprising a temperature-controlled fluid distribution assembly (01) as described in any one of claims 1 to 9, a process chamber as described in any one of claims 10 to 13, and a temperature control module (03). The temperature control module (03) is located on the temperature control fluid distribution assembly (01) and is used to deliver temperature control fluid to the temperature control fluid distribution assembly (01) and deliver the temperature control fluid to the third flow channel (M3) of the temperature control body (02) in the process chamber through the temperature control fluid distribution assembly (01).

15. The semiconductor process equipment according to claim 14, characterized in that, It also includes a controller, which comprises a memory and a processor. The memory stores a computer program that, when executed by the processor, implements the following temperature control method: Detect the temperature of a local area of ​​the temperature control body (02); When the detected temperature is higher than the preset temperature value, cold air is introduced into the third flow channel (M3) of the temperature control body (02) through the temperature control module (03) via the temperature control fluid distribution component (01); Alternatively, if the detected temperature is lower than the preset temperature value, hot air is introduced into the third flow channel (M3) of the temperature control body (02) through the temperature control module (03) via the temperature control fluid distribution component (01).

Images