Wafer polishing cleaning apparatus and cleaning method thereof

Abstract

This invention discloses a wafer grinding and cleaning equipment and method. The wafer grinding and cleaning equipment includes at least two loading modules; a transfer module is configured at the front end of the loading module; cleaning modules are configured on both sides of the transfer module; a front-end robot is configured between the loading module, transfer module, and cleaning module; a through robot is configured at the front end of the transfer module and the cleaning module; a grinding device is configured at the front end of the through robot, and the grinding device has multiple loading and unloading ports; the through robot is used to transfer wafers between the loading and unloading ports and the transfer module, and between the loading and unloading ports and the cleaning module. This invention integrates the loading and unloading positions at the loading module, reducing the number of robots and loading ports, and also reducing the overhead crane's running route and loading / unloading points, thus lowering costs, reducing equipment footprint, improving production efficiency, and effectively enhancing competitiveness.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer grinding and cleaning equipment and its cleaning method. Background Technology

[0002] Wafer grinding is a key process in semiconductor manufacturing. It is mainly used to control the thickness and flatten the surface of silicon wafers (or other semiconductor material wafers) to meet the precision requirements of subsequent processes such as photolithography and thin film deposition.

[0003] Existing grinding and cleaning equipment such as Figure 1 As shown, the working process is as follows: First, the front-end process places the wafer cassette at the loading port 1a for loading. Then, the upstream equipment 2a cleans the wafer in the wafer cassette at the loading port 1a. After cleaning, the unloading robot 3a places the wafer in the transfer cavity 4a. Then, the first robot 5a removes the wafer from the transfer cavity and places it in the cleaning unit 6a for surface cleaning. Next, the second robot 7a places the wafer in the wafer cassette at the unloading port 8a for unloading, thus completing the entire process of wafer grinding and cleaning.

[0004] However, after a long period of operation, the following problems were found with this processing method: First, the upstream equipment needs to be independently configured with loading port 1a and unloading robot 3a, resulting in a large equipment footprint and high cost; second, the equipment also has an additional transfer cavity 4a, which not only takes up space but also increases the complexity of the equipment; in addition, the loading and unloading positions are scattered, resulting in excessively long overhead crane paths on the customer's production site, which leads to low efficiency and directly affects the wafer production efficiency and cost. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art by providing a wafer grinding and cleaning equipment and its cleaning method, which has high wafer production efficiency and low cost.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a wafer grinding and cleaning device, comprising:

[0007] At least two loading modules are used to dock with the front-end process or the processed wafer cassette;

[0008] A transfer module is configured at the front end of the loading module;

[0009] A cleaning module is configured on both sides of the transfer module;

[0010] A front-end robotic arm is configured between the loading module, the transfer module, and the cleaning module to transfer wafers between the loading module and the transfer module, and between the loading module and the cleaning module.

[0011] A through-type robotic arm is configured at the front end of the transfer module and the cleaning module;

[0012] A grinding device is configured at the front end of the through-feed robot, the grinding device having multiple loading and unloading ports; wherein, the through-feed robot is used to transfer wafers between the loading and unloading ports and the transfer module, and between the loading and unloading ports and the cleaning module.

[0013] Preferably, the cleaning module includes a scrubbing chamber and a process chamber; the scrubbing chamber and the process chamber are connected by a transfer robot.

[0014] Preferably, the number of loading and unloading ports is six.

[0015] A cleaning method for a wafer grinding and cleaning equipment includes the following steps:

[0016] S1. The loading module receives the wafer cassette containing the wafer from the front-end process.

[0017] S2. The front-end robotic arm delivers a wafer from the wafer box located at the loading module to the transfer module.

[0018] S3. The transfer module moves a wafer laterally to the gripping position of the through robot arm.

[0019] S4. After the through robot grabs a wafer from the transfer module, it sends it to any loading or unloading port in the grinding equipment.

[0020] S5. The grinding equipment picks up a wafer located at the loading / unloading port and grinds the wafer. After grinding, the wafer is ready at the loading / unloading port.

[0021] S6. The through-line robot grabs a wafer that is waiting at the loading and unloading port and sends it to the idle cleaning module.

[0022] S7. The front-end robotic arm takes out a cleaned wafer from the cleaning module and sends it to a wafer box with an empty slot in any loading module. When any wafer box is full, the back-end station takes the wafer box away.

[0023] Preferably, in step S5, the grinding robot arm built into the grinding equipment picks up a wafer and sends it to the grinding equipment for wafer cleaning. Then, the grinding robot arm sends the ground wafer to any loading or unloading port.

[0024] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0025] The wafer grinding and cleaning equipment of the present invention integrates the loading and unloading positions in the loading module, reducing the need for independent robotic arms and loading positions in the grinding equipment, reducing the overhead crane's running route and loading / unloading points, lowering costs, reducing the number of robotic arms, reducing the overall length of the equipment, reducing the equipment's footprint, and improving competitiveness.

[0026] Secondly, the loading modules are centrally located, which allows for the use of two full and two empty boxes at the loading module, enabling double inflow and double outflow. Furthermore, when the incoming material has a high cleanliness level, it can also achieve the cycle of three full and one empty boxes, resulting in high cleaning efficiency. Attached Figure Description

[0027] The technical solution of the present invention will be further described below with reference to the accompanying drawings:

[0028] Figure 1 This is a schematic diagram of the structure of a grinding and cleaning equipment in the prior art;

[0029] Figure 2 This is a schematic diagram of the structure of a wafer grinding and cleaning device according to one embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of a wafer grinding and cleaning device with a feeding path in one embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of a wafer grinding and cleaning device with a feeding path in one embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of a wafer grinding and washing device with dual-input and dual-output wafer paths in one embodiment of the present invention.

[0033] The components are as follows: 1. Loading module; 2. Transfer module; 3. Cleaning module; 4. Front-end robot; 5. Straight-through robot; 6. Grinding equipment; 7. Loading / unloading port; 1a. Loading port; 2a. Upstream equipment; 3a. Unloading robot; 4a. Transfer chamber; 5a. First robot; 6a. Cleaning unit; 7a. Second robot; 8a. Unloading port; 30. Brushing chamber; 31. Process chamber; 32. Transfer robot. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0035] This invention provides a wafer grinding and cleaning equipment and a cleaning method thereof, in order to solve the problem that the existing wafer grinding and cleaning methods are inefficient and costly due to unreasonable equipment layout and processes.

[0036] For ease of understanding, the specific processes in the embodiments of this application are described below. Please refer to [link / reference]. Figure 2 An embodiment of this application discloses a wafer grinding and cleaning apparatus, comprising a loading module 1, a transfer module 2, a cleaning module 3, a front-end robotic arm 4, a through robotic arm 5, and a grinding device 6. The four loading modules 1 are arranged in parallel sequence, and each loading module 1 is used to dock with a wafer cassette after front-end processing or processing. The transfer module 2 is disposed at the front end of the loading module 2. The cleaning module 3 is disposed on both sides of the transfer module 2. The front-end robotic arm 4 is disposed between the loading module 1, the transfer module 2, and the cleaning module 6. Between blocks 3, wafers are transferred between the loading module 1 and the transfer module 2, and between the loading module 1 and the cleaning module 3; the through-feed robot 5 is configured at the front end of the transfer module 2 and the cleaning module 3; the grinding device 6 is configured on one side of the through-feed robot 5, and the grinding device 6 has multiple loading and unloading ports 7; wherein, the through-feed robot 5 is used to transfer wafers between the loading and unloading ports 7 and the transfer module 2, and between the loading and unloading ports 7 and the cleaning module 3.

[0037] Furthermore, the cleaning module 3 includes a brushing chamber 30 and a process chamber 31; the brushing chamber and the process chamber are connected by a transfer robot 32. The brushing chamber 30 mainly removes particulate contaminants and grinding residues from the wafer surface through physical contact brushing (such as rotating brush head). The process chamber 31 removes molecular-level contaminants (such as organic residues, metal ions, oxide layers, etc.) or performs surface modification through chemical or physical methods.

[0038] Furthermore, preferably, the number of loading / unloading ports 7 is six, and the number of loading modules 1 is four. The number of both can be adjusted and set according to actual needs. The loading / unloading ports 7 are used to meet the needs of different numbers of wafers, while the loading modules 1 are used to meet the needs of different numbers of wafer cassettes. Secondly, the loading / unloading ports 7 can be set at any position, as long as the through robot 5 can place the wafers at the loading / unloading ports 7.

[0039] The wafer grinding and cleaning equipment of the present invention integrates the loading and unloading positions in the loading module 1, reducing the need for separate robotic arms and loading positions in the grinding equipment 6, reducing the overhead crane's operating route, lowering costs, reducing the number of robotic arms, reducing the overall length of the equipment, and reducing the equipment's floor space.

[0040] This invention also discloses a cleaning method for a wafer grinding and cleaning equipment, comprising the following steps:

[0041] S1. The four loading modules 1 receive the wafer boxes to be processed from the front-end process and are in standby mode.

[0042] S2. The front-end robotic arm 4 moves vertically to transfer a wafer from the wafer box of any loading module 1 to the transfer module 2. In this embodiment, the transfer module 2 mainly plays the role of lateral transfer of wafers.

[0043] S3, Transfer module 2 delivers a wafer to the gripping position of the through robot 5.

[0044] S4. Since the through robot 5 can also move vertically, after the through robot 5 picks up a wafer from the transfer module, it is sent to any loading or unloading port 7 in the grinding equipment 6.

[0045] S5. The grinding equipment picks up a wafer located at the loading / unloading port and cleans it. After cleaning, the wafer is ready at the loading / unloading port 7.

[0046] The above steps S1-S5 complete the loading process of transporting the wafer from the loading module 1 to the grinding equipment 6. Then, the grinding equipment 6 performs grinding operations on the wafer located at the loading / unloading port 7. The operation route diagram is as follows: Figure 3 As shown by the arrow in the image. Of course, this is only a single-thread wafer operation method; dual-thread wafer operation is also possible.

[0047] S5, the through robot 5 picks up a wafer waiting in the loading / unloading port 7 and sends it to the idle cleaning module 3;

[0048] S6, Cleaning module 3 performs surface cleaning on a wafer;

[0049] S7. The front-end robotic arm 4 takes out a wafer processed by the cleaning module 3 and sends it to a wafer box with an empty space in any loading module. When any wafer box is full, the back-end station takes the entire wafer box away. In this embodiment, a wafer box is considered full when it carries 25 wafers.

[0050] The above steps S5-S7 complete the wafer grinding, cleaning, and unloading process, and its operation route is as follows: Figure 4 As shown by the arrow in the image.

[0051] In this method, loading module 1 serves as both the starting and ending point of the cleaning process. Both wafer loading and unloading occur at loading module 1. Since wafer transportation requires overhead crane operation, this reduces the number of overhead crane loading and unloading points, shortens the overhead crane travel route at the customer's site, and saves costs.

[0052] At the same time, it reduces the cost of grinding equipment by eliminating the need for a separate robotic arm to handle the loading of the material box.

[0053] See Figure 5 The following is an example, where port1-port4 represent four loading modules 1, and port5-port8 represent four loading / unloading ports. In this example, a dual-input, dual-output wafer configuration is used, and the cleaning process includes the following steps:

[0054] S1, port2 and port3 receive wafer cassettes containing wafers from the front-end process.

[0055] S2 and the front-end robotic arm 4 sequentially deliver the wafers located at port2 and port3 to the transfer module 2;

[0056] S3. The transfer module sequentially moves the wafers at port2 and port3 to the gripping position of the through robot 5.

[0057] S4. The through-pass robot grabs the wafers at port2 and port3 from the transfer module in sequence and sends them to port7 and port8 in the grinding equipment respectively.

[0058] S5. The grinding equipment picks up the wafers located at port 7 and port 8 and cleans them. After the cleaning is completed, the two wafers are placed at port 5 and port 6 respectively for standby.

[0059] S6. The through-pass robot 5 picks up the wafers waiting at port 5 and port 6 respectively and sends them to the two cleaning modules 3 for cleaning.

[0060] S7. The front-end robotic arm takes out the cleaned wafers from the cleaning module and sends them to the empty wafer cassettes at ports 1 and 4. When any wafer cassette is full, the full wafer cassette can be taken away by the subsequent workstation.

[0061] Of course, in addition to the above-mentioned dual-in, dual-out wafer loading method, if the incoming material cleanliness is high, it is also possible to achieve a cycle of three loading modules being full and one loading module being idle, thereby improving production efficiency.

[0062] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A cleaning method for a wafer grinding and cleaning equipment, characterized in that, The wafer grinding and cleaning equipment includes: At least two loading modules are used to dock with the front-end process or the processed wafer cassette; A transfer module is configured at the front end of the loading module; A cleaning module is configured on both sides of the transfer module; A front-end robotic arm is configured between the loading module, the transfer module, and the cleaning module to transfer wafers between the loading module and the transfer module, and between the loading module and the cleaning module. A through-type robotic arm is configured at the front end of the transfer module and the cleaning module; A grinding device is configured at the front end of the through-feed robotic arm, and the grinding device has multiple loading and unloading ports; wherein, the through-feed robotic arm is used to transfer wafers between the loading and unloading ports and the transfer module, and between the loading and unloading ports and the cleaning module; the cleaning module includes a brushing chamber and a process chamber; the brushing chamber and the process chamber are connected by a transfer robotic arm; the number of loading and unloading ports is six; The cleaning method includes the following steps: S1. The loading module receives the wafer cassette containing the wafer from the front-end process. S2. The front-end robotic arm delivers a wafer from the wafer box located at the loading module to the transfer module. S3. The transfer module moves a wafer laterally to the gripping position of the through robot arm. S4. After the through robot grabs a wafer from the transfer module, it sends it to any loading or unloading port in the grinding equipment. S5. The grinding equipment picks up a wafer located at the loading / unloading port and grinds the wafer. After grinding, the wafer is ready at the loading / unloading port. S6. The through-line robot grabs a wafer that is waiting at the loading and unloading port and sends it to the idle cleaning module. S7. The front-end robotic arm takes out a cleaned wafer from the cleaning module and sends it to a wafer box with an empty slot in any loading module. When any wafer box is full, the back-end station takes the wafer box away.

2. The wafer cleaning method of claim 1, wherein: In step S5, the grinding robot arm built into the grinding equipment picks up a wafer and sends it to the grinding equipment for cleaning. Then, the grinding robot arm sends the ground wafer to any loading or unloading port.

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