A multi-band adaptive control system for radio frequency front-end modules

Abstract

This application relates to the field of radio frequency (RF) front-end module technology, and in particular to a multi-band adaptive control system for an RF front-end module. The system includes a substrate on which a low-noise amplifier and a power amplifier are integrated; a sensing unit for acquiring real-time operating data of the power amplifier, the real-time operating data including at least temperature data and output power data; an inter-stage matching network connected between the low-noise amplifier and the power amplifier; an output matching network connected to the output terminal of the power amplifier; and a main control unit connected to the sensing unit, the inter-stage matching network, and the output matching network, respectively. The main control unit coordinates the task scheduling and control signal distribution of each unit. This application achieves unified coordination and adjustment of control while reducing the size of the RF front-end module.

Description

Technical Field

[0001] This application relates to the field of radio frequency front-end module technology, and in particular to a multi-band adaptive control system for radio frequency front-end modules. Background Technology

[0002] Currently, with the rapid development of modern wireless communication technologies such as 5G, the radio frequency (RF) front-end system, as a core component of wireless communication equipment, directly determines the communication quality and reliability of the entire system. RF front-end systems typically integrate key components such as power amplifiers (PAs) and low-noise amplifiers (LNAs), which are responsible for transmitting and receiving signal amplification, respectively.

[0003] In traditional RF front-end module design, low-noise amplifiers (LNAs) and power amplifiers are typically separate chips or modules, connected via PCB traces. To achieve interstage matching, external interstage matching networks, such as LC circuits, are often required. Furthermore, the output network of the power amplifier is usually optimized for a single frequency band, making it difficult to dynamically adapt to multi-band requirements. For heat dissipation, a single metal heatsink or conductive thermal silicon is generally used, without actively isolating the thermal coupling between the LNA and power amplifier. Moreover, when the LNA and power amplifier are designed independently, the interstage impedance matching network introduces insertion loss, which degrades the system's noise figure. Additionally, the fixed matching network used in traditional power amplifiers experiences a significant efficiency drop during cross-band switching. Furthermore, the heat generated by the power amplifier at high power output can cause temperature drift in the transistors of adjacent LNAs, further degrading the noise figure. Finally, external heatsinks occupy a large PCB area, hindering miniaturization and thus creating room for improvement. Summary of the Invention

[0004] This application provides a multi-band adaptive control system for radio frequency front-end modules, which can achieve unified coordination and adjustment of control while reducing the size of the radio frequency front-end modules.

[0005] The above-mentioned inventive objective of this application is achieved through the following technical solutions:

[0006] A multi-band adaptive control system for radio frequency front-end modules, comprising:

[0007] A substrate on which a low-noise amplifier and a power amplifier are integrated;

[0008] A sensing unit is used to collect real-time operating data of the power amplifier, wherein the real-time operating data includes at least temperature data and output power data;

[0009] An interstage matching network is connected between the low-noise amplifier and the power amplifier;

[0010] An output matching network is connected to the output terminal of the power amplifier;

[0011] The main control unit is connected to the sensing unit, the inter-level matching network, and the output matching network, respectively. The main control unit is used to coordinate the task scheduling and control signal distribution of each unit.

[0012] By adopting the above technical solution, the low-noise amplifier and power amplifier are integrated on the same substrate, which can significantly reduce the module size and shorten the RF signal transmission path, thereby reducing interstage insertion loss and improving the system noise figure. At the same time, by setting up a sensing unit and a main control unit, a hardware foundation is provided for realizing adaptive control, which can be dynamically adjusted according to actual working conditions, thereby improving the intelligence level and environmental adaptability of the RF front-end system.

[0013] In a preferred embodiment, this application may be further configured such that a MEMS bypass switch is integrated on the substrate, the MEMS bypass switch being connected in parallel with the power amplifier and controlled by the main control unit, for selectively allowing the radio frequency signal to bypass the power amplifier in different operating modes.

[0014] By adopting the above technical solution and adding a MEMS bypass switch, the power amplifier can be completely bypassed in the receiving mode where high power amplification is not required. This can significantly reduce the power consumption of the system in standby or receiving mode, thereby extending the battery life of the mobile terminal and improving the flexibility of the system's operating mode.

[0015] In a preferred embodiment, this application may be further configured such that an isolation wall is provided between the low-noise amplifier and the power amplifier, wherein the surface of the low-noise amplifier is covered with an aerogel thermal insulation layer.

[0016] By adopting the above technical solution, and by setting up a physical isolation wall and covering it with an aerogel thermal insulation layer, the diffusion of a large amount of heat generated during the operation of the power amplifier to the low-noise amplifier area can be effectively blocked from both heat conduction and heat radiation paths. This greatly suppresses the thermal crosstalk effect, thereby ensuring the stability of the low-noise amplifier performance, avoiding the degradation of the noise figure caused by temperature drift, and ensuring the high sensitivity of the receiving link.

[0017] In a preferred embodiment, this application may be further configured such that both the inter-stage matching network and the output matching network comprise an array of adjustable capacitors and adjustable inductors.

[0018] By adopting the above technical solution and using a matching network composed of adjustable capacitors and adjustable inductors, impedance matching can be dynamically adjusted, enabling it to be matched and tuned for different operating frequency bands. This overcomes the defect of traditional fixed matching networks that only have the best performance at a single frequency point, ensuring that the RF front-end module can maintain high efficiency and high linearity throughout the entire operating bandwidth.

[0019] In a preferred embodiment, the present application may be further configured such that the multi-band adaptive control system further includes a microchannel heat dissipation structure disposed on the back side of the substrate region corresponding to the power amplifier.

[0020] By adopting the above technical solution and integrating a microfluidic heat dissipation structure on the back of the power amplifier's heat source area, efficient active heat dissipation can be achieved using fluid, effectively controlling the temperature rise of the power amplifier and ensuring its stable output under high power. Moreover, the structure is compact, which greatly promotes the miniaturization and integration of the entire RF front-end module.

[0021] In a preferred embodiment, this application can be further configured such that: the main control unit is used for,

[0022] Acquire the real-time operating data and current operating frequency band data of the power amplifier, wherein the real-time operating data includes at least the temperature data and the output power data;

[0023] Based on the real-time operating data and the current operating frequency band data, the target control parameters are determined, including the target matching parameters and the target bias voltage;

[0024] The inter-level matching network and the output matching network are adjusted according to the target control parameters.

[0025] By adopting the above technical solution, the main control unit analyzes real-time data and adjusts the inter-stage matching network and the output matching network. This enables real-time response to changes in external operating conditions such as frequency switching and temperature changes, and automatically optimizes the matching network and bias state, thereby always keeping the system at the optimal operating point and improving the overall performance of the system.

[0026] In a preferred embodiment, this application can be further configured such that: determining the target control parameters based on the real-time operating data specifically includes:

[0027] Based on the frequency data in the real-time running data, the target matching parameters of the inter-level matching network and the output matching network are determined using a preset matching parameter fitting function.

[0028] Based on the temperature data, the temperature change rate data is calculated. Based on the temperature data and the temperature change rate data, the predicted temperature drift of the low-noise amplifier is obtained using a preset thermal crosstalk feature lookup table.

[0029] Based on the predicted temperature drift, the target bias voltage of the low-noise amplifier is determined.

[0030] By adopting the above technical solution and utilizing the matching parameter fitting function, the optimal matching parameters at any frequency point can be quickly calculated, achieving efficient broadband matching. Furthermore, by predicting temperature drift based on temperature and temperature change rate and compensating for bias voltage, the impact of thermal crosstalk on the low-noise amplifier can be proactively eliminated. Compared with hysteretic temperature compensation, this predictive compensation mechanism responds more quickly and controls more precisely, thereby further ensuring the ultimate stability of reception performance.

[0031] In a preferred embodiment, the application may be further configured such that the main control unit is also used to determine the current operating mode based on the output power data, and to determine the closing and opening of the MEMS bypass switch based on the type of the current operating mode.

[0032] By adopting the above technical solution and associating the output power with the working mode, the system can autonomously determine when to enter a high-power transmission state and when to switch to a low-power reception state, thereby optimizing the overall energy efficiency management and improving the user experience.

[0033] In a preferred embodiment, this application can be further configured as follows: determining the current operating mode based on the output power data, and determining the closing and opening of the MEMS bypass switch based on the type of the current operating mode, specifically includes:

[0034] When the output power data is lower than the preset low power threshold, the current working mode is determined to be pure LNA receiving mode, and the MEMS bypass switch is controlled to close.

[0035] When the output power data is higher than the low power consumption threshold, the current operating mode is determined to be LNA-PA cascade amplification mode, and the MEMS bypass switch is controlled to open.

[0036] By adopting the above technical solution and using a threshold-based judgment mechanism, the system can minimize mode misjudgment while ensuring normal function switching, thus ensuring the stability of system operation.

[0037] In a preferred embodiment, the present application may be further configured such that the multi-band adaptive control system further includes a cryogenic co-fired ceramic stripline connecting the low-noise amplifier and the power amplifier, and a PIN diode attenuator is integrated on the path of the cryogenic co-fired ceramic stripline for sending a feedback signal to the low-noise amplifier in calibration mode.

[0038] By adopting the above technical solution and integrating a low-temperature co-fired ceramic stripline path with a PIN diode attenuator, it is possible to compensate and correct for problems such as device aging and performance drift after production or during long-term use, thereby improving the module's production yield and long-term reliability, and reducing maintenance costs.

[0039] In summary, this application includes at least one of the following beneficial technical effects:

[0040] 1. By integrating the low-noise amplifier and the power amplifier on the same substrate, the module size can be significantly reduced and the RF signal transmission path can be shortened, thereby reducing interstage insertion loss and improving the system noise figure. At the same time, by setting up a sensing unit and a main control unit, a hardware foundation is provided for adaptive control, which can be dynamically adjusted according to actual working conditions, improving the intelligence level and environmental adaptability of the RF front-end system.

[0041] 2. By analyzing real-time data through the main control unit, the inter-stage matching network and output matching network are adjusted and controlled. This enables real-time response to changes in external operating conditions such as frequency switching and temperature changes, and automatic optimization of the matching network and bias state, thereby always keeping the system at the optimal operating point and improving the overall performance of the system. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the structure of the multi-band adaptive control system for the radio frequency front-end module in the embodiments of this application;

[0043] Figure 2 This is a flowchart illustrating the steps of the multi-band adaptive control system for the radio frequency front-end module in this application embodiment. Detailed Implementation

[0044] The following embodiments will help those skilled in the art to further understand the function of this application, but do not limit this application in any way. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this application. These all fall within the protection scope of this application.

[0045] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0046] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0047] A multi-band adaptive control system for radio frequency front-end modules, comprising:

[0048] A substrate on which a low-noise amplifier and a power amplifier are integrated;

[0049] The sensing unit is used to collect real-time operating data of the power amplifier, which includes at least temperature data and output power data.

[0050] An interstage matching network is used to connect the low-noise amplifier and the power amplifier.

[0051] The output matching network is connected to the output of the power amplifier.

[0052] The main control unit is connected to the sensing unit, the inter-stage matching network, and the output matching network. The main control unit is used to coordinate the task scheduling and control signal distribution of each unit.

[0053] Specifically, the substrate is preferably a semiconductor material with good high-frequency characteristics, such as gallium arsenide (GaAs) or gallium nitride (GaN). Integrating the low-noise amplifier and power amplifier monolithically onto this substrate significantly shortens the physical distance between them, thereby substantially reducing parasitic inductance and capacitance effects introduced during signal transmission due to excessively long traces. The sensing unit can be a temperature sensor integrated near the power amplifier and a power detector acquiring power information via a coupling line. The acquired analog data is converted from analog to digital and then sent to the main control unit. As the control core of the system, the main control unit internally runs a preset control algorithm. Based on the received sensor data and external commands, it generates precise digital or analog control signals, which are then sent to the inter-stage matching network and the output matching network to achieve dynamic, closed-loop control of the entire RF link.

[0054] In some embodiments, a MEMS bypass switch is also integrated on the substrate. The MEMS bypass switch is connected in parallel with the power amplifier and is controlled by the main control unit to selectively allow the radio frequency signal to bypass the power amplifier in different operating modes.

[0055] Specifically, when the system operates in receive mode, the RF signal only needs to be amplified by the low-noise amplifier. At this time, the power amplifier is inactive. To avoid unnecessary insertion loss caused by the signal passing through the inactive power amplifier, the main control unit sends a control signal to close the MEMS bypass switch. The closed MEMS switch forms a low-impedance signal path, guiding the signal from the low-noise amplifier directly to the output matching network or subsequent circuitry, thus ensuring the signal-to-noise ratio of the receive link. Conversely, when the system switches to transmit mode, the main control unit controls the MEMS bypass switch to open, ensuring that the signal must flow through the power amplifier to obtain sufficiently high transmit power.

[0056] In some embodiments, an isolation wall is provided between the low-noise amplifier and the power amplifier, wherein the surface of the low-noise amplifier is covered with an aerogel insulation layer.

[0057] Specifically, the isolation wall can be formed by semiconductor processes such as deep etching or metal filling on the substrate. Its function is to physically block heat from being conducted directly from the power amplifier region to the low-noise amplifier region through the substrate material. The aerogel thermal insulation layer covering the surface of the low-noise amplifier chip, as a nanoporous material with extremely low thermal conductivity, can effectively block the heat generated by the power amplifier from being transferred to the low-noise amplifier through thermal radiation and air convection. This dual thermal insulation design of conductive isolation and radiation / convection isolation suppresses thermal crosstalk to the maximum extent, ensures the stable operating temperature of the low-noise amplifier, and prevents its key performance parameters such as noise figure and gain from deteriorating due to temperature drift.

[0058] In some embodiments, both the inter-stage matching network and the output matching network comprise an array of adjustable capacitors and adjustable inductors.

[0059] Specifically, the adjustable capacitor can be a varactor diode array whose capacitance value is adjusted by changing the DC bias voltage, while the adjustable inductor can be a variable inductor based on MEMS technology or composed of a switched inductor network. The main control unit outputs different DC voltages through a digital-to-analog converter (DAC) based on the current operating frequency and applies them to the control terminals of these adjustable components, thereby precisely changing the capacitance or inductance value of each component. Through the coordinated control of multiple components in the array, the overall impedance characteristics of the matching network can be reconstructed, enabling it to achieve near-ideal 50-ohm impedance matching at different target frequencies, such as switching from 2.4GHz to 5.8GHz, thus ensuring efficient power transmission.

[0060] In some embodiments, the multi-band adaptive control system further includes a microchannel heat dissipation structure disposed on the back side of the substrate region corresponding to the power amplifier.

[0061] Specifically, the microfluidic heat dissipation structure can form a complex microchannel network by etching on the back of the substrate using microfabrication technology and then sealing it. The internal circulating coolant, such as deionized water or a dedicated electronic coolant, can efficiently absorb the large amount of Joule heat generated when the power amplifier is working. The heat is quickly conducted to the coolant through the extremely thin substrate and carried by the flowing liquid to the external heat sink for heat exchange. This active liquid cooling method has a much higher heat exchange efficiency than traditional passive metal heat sinks, which can strictly control the junction temperature of the power amplifier within a safe range, thereby supporting its stable operation at higher output power. At the same time, its compact structure is conducive to the miniaturization of the entire RF front-end module.

[0062] In some embodiments, the main control unit is used for,

[0063] Acquire real-time operating data and current operating frequency band data of the power amplifier. The real-time operating data includes at least temperature data and output power data.

[0064] Based on real-time operating data and current operating frequency band data, the target control parameters are determined. The target control parameters include the target matching parameters and the target bias voltage.

[0065] Based on the target control parameters, regulate the inter-level matching network and the output matching network.

[0066] Specifically, the main control unit periodically reads the latest temperature and power values ​​from the sensing unit and receives current communication frequency band commands from the system baseband or upper-level controller. It then substitutes these real-time changing input data into its internally fixed algorithm model to calculate a set of control parameters that optimize system performance under the current operating conditions. For example, when a change in operating frequency is detected, a new matching network tuning voltage is calculated; when a temperature increase is detected, the bias voltage adjustment amount used to compensate for temperature drift is calculated. These newly calculated target control parameters are then immediately updated to the corresponding execution units, enabling the system to adapt to external changes in real time and automatically.

[0067] In some embodiments, the target control parameters are determined based on real-time operating data, specifically including:

[0068] Based on the frequency data in the real-time operation data, the target matching parameters of the inter-level matching network and the output matching network are determined by using a preset matching parameter fitting function.

[0069] Based on the temperature data, the temperature change rate data is calculated. Based on the temperature data and the temperature change rate data, the predicted temperature drift of the low noise amplifier is obtained using a preset thermal crosstalk feature lookup table.

[0070] The target bias voltage of the low-noise amplifier is determined based on the predicted temperature drift.

[0071] Specifically, the process of determining the target control parameters can be decomposed into two parallel subtasks: one responsible for frequency adaptive matching, and the other for forward-looking thermal management. In the frequency adaptive matching task, the matching parameter fitting function is a mathematical expression or high-dimensional polynomial established during the chip design and verification phase through extensive electromagnetic simulation and network analyzer scanning tests of the circuit. It describes the precise control voltage values ​​required for each adjustable capacitor and adjustable inductor in the inter-stage matching network and the output matching network to achieve optimal parameters such as minimum reflection loss and maximum gain at different operating frequencies. This function is written into the memory of the main control unit. When the main control unit receives new operating frequency band data, such as switching from Band 1 of 4G to the n78 band of 5G, it immediately substitutes the center frequency value into the function for calculation, thereby solving for a complete set of optimal control voltage combinations. These voltages are then applied to each tuning element of the matching network through a digital-to-analog converter to complete rapid frequency reconstruction. Meanwhile, in the thermal management task, the algorithm within the main control unit continuously performs time-series analysis on the received temperature data. By calculating the difference between the current temperature value and the temperature value of the previous sampling period and dividing it by the sampling time interval, real-time temperature change rate data is obtained. This change rate data reflects the intensity and trend of heat generation by the power amplifier. Subsequently, the main control unit uses the current absolute temperature value and this temperature change rate data as two indexes to query the thermal crosstalk feature lookup table stored in non-volatile memory. This table is based on accurate simulation of the chip thermal model or calibration of the actual chip using a thermal imager. It records the temperature changes at different base temperatures and different heating rates. The drift in performance parameters of the low-noise amplifier, such as gain and noise figure, caused by heat crosstalk from the power amplifier to the low-noise amplifier can be predicted by the main control unit through a lookup table. This prediction not only considers the current thermal state but, more importantly, anticipates future thermal trends. Based on this forward-looking predicted temperature drift, the main control unit calculates a compensatory bias voltage adjustment value. For example, if it is predicted that the gain will drop by 0.5dB, the gate bias voltage of the low-noise amplifier will be finely adjusted accordingly to increase the gain by approximately 0.5dB in advance, thereby actively and dynamically offsetting the negative impact of thermal crosstalk and maintaining a high degree of stability in the receiving link performance.

[0072] In some embodiments, the main control unit is further configured to determine the current operating mode based on the output power data, and determine the closing and opening of the MEMS bypass switch based on the type of the current operating mode.

[0073] Specifically, the main control unit determines the current operating mode of the system based on real-time output power data obtained from the sensing unit. For example, when the mobile terminal is in standby or receiving data, the RF front-end does not need to transmit high-power signals, and the detected output power will be very low, so the main control unit will determine that the system is in receive mode. When the user initiates a call or uploads data, the baseband chip drives the RF link to transmit signals, and the output power will rise rapidly. After detecting this change, the main control unit will determine that the system has switched to transmit mode. This automatic mode recognition based on actual power output enables the main control unit to intelligently manage the configuration of the RF link without relying on frequent commands from upper-layer software, thus improving the system's autonomy.

[0074] In some embodiments, the current operating mode is determined based on the output power data, and the closing and opening of the MEMS bypass switch is determined based on the type of the current operating mode, specifically including:

[0075] When the output power data is lower than the preset low power threshold, the current working mode is determined to be pure LNA receiving mode, and the MEMS bypass switch is closed.

[0076] When the output power data is higher than the low power consumption threshold, the current operating mode is determined to be LNA-PA cascade amplification mode, and the MEMS bypass switch is turned off.

[0077] Specifically, the low-power threshold is a pre-calibrated and set power value, such as -10dBm, which serves as a clear boundary distinguishing between receive and transmit states. The comparator within the main control unit continuously compares the real-time acquired output power value with this threshold. When the power value remains below this threshold for an extended period, it indicates that the system is in a pure signal reception or standby state. In this case, a pure LNA receive mode strategy is implemented, i.e., the MEMS switch is closed to bypass the power amplifier, thereby saving power and optimizing the receive link performance. Once the output power value is detected to exceed the threshold, it is immediately determined that the system has entered a transmit state requiring power amplification. In this case, an LNA-PA cascaded amplification mode strategy is implemented, i.e., the MEMS bypass switch is opened, and the power amplifier is connected in series in the signal link to provide the necessary transmit gain.

[0078] In some embodiments, the multi-band adaptive control system further includes a cryogenic co-fired ceramic stripline connecting the low-noise amplifier and the power amplifier, and a PIN diode attenuator is integrated on the path of the cryogenic co-fired ceramic stripline for sending a feedback signal to the low-noise amplifier in calibration mode.

[0079] Specifically, in certain calibration modes, such as during device startup or idle, the main control unit can control the power amplifier to generate a low-power known test signal. This signal travels along the stripline path, undergoes precise attenuation by a PIN diode attenuator controlled by the main control unit, and is then fed back to the input of the low-noise amplifier. The main control unit then compares the actual output of the low-noise amplifier with the theoretically expected output. By analyzing the difference, it can accurately assess whether there are deviations in the current link's gain, linearity, and other performance indicators. If a deviation is detected, the main control unit can automatically adjust its internal control algorithm parameters or bias voltage to compensate for performance drift caused by device aging or environmental changes, thereby achieving online automatic calibration of the system.

[0080] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0081] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A multi-band adaptive control system for radio frequency front-end modules, characterized in that, include: A substrate on which a low-noise amplifier and a power amplifier are integrated; A sensing unit is used to collect real-time operating data of the power amplifier, wherein the real-time operating data includes at least temperature data and output power data; An interstage matching network is connected between the low-noise amplifier and the power amplifier; An output matching network is connected to the output terminal of the power amplifier; The main control unit is connected to the sensing unit, the inter-level matching network and the output matching network respectively. The main control unit is used to coordinate the task scheduling and control signal distribution of each unit. Both the inter-stage matching network and the output matching network include arrays composed of adjustable capacitors and adjustable inductors; The main control unit is used to: acquire the real-time operating data and current operating frequency band data of the power amplifier, wherein the real-time operating data includes at least the temperature data and the output power data; determine target control parameters based on the real-time operating data and the current operating frequency band data, wherein the target control parameters include target matching parameters and target bias voltage; and adjust the interstage matching network and the output matching network based on the target control parameters. The process of determining the target control parameters includes two parallel subtasks: one for frequency adaptive matching and the other for forward-looking thermal management. In the frequency adaptive matching task, based on the frequency data in the real-time operating data, the target matching parameters of the inter-stage matching network and the output matching network are determined using a preset matching parameter fitting function. The matching parameter fitting function is established during the chip design and verification phase through electromagnetic simulation and network analyzer scanning tests on the circuit. The matching parameter fitting function describes the optimal parameters for each adjustable circuit in the inter-stage matching network and the output matching network at different operating frequencies. The precise control voltage value required for the capacitive and adjustable inductor; in the thermal management task, based on the temperature data, the temperature change rate data is calculated, and based on the temperature data and the temperature change rate data, the predicted temperature drift of the low-noise amplifier is obtained using a preset thermal crosstalk feature lookup table; the thermal crosstalk feature lookup table is obtained based on the accurate simulation of the chip thermal model or by calibrating the actual chip using a thermal imager, and records the drift of the performance parameters of the low-noise amplifier caused by heat crosstalk from the power amplifier to the low-noise amplifier under different base temperatures and different heating rates; based on the predicted temperature drift, the target bias voltage of the low-noise amplifier is determined.

2. The multi-band adaptive control system according to claim 1, characterized in that, A MEMS bypass switch is also integrated on the substrate. The MEMS bypass switch is connected in parallel with the power amplifier and is controlled by the main control unit to selectively allow the radio frequency signal to bypass the power amplifier in different operating modes.

3. The multi-band adaptive control system according to claim 1, characterized in that, An isolation wall is provided between the low-noise amplifier and the power amplifier, wherein the surface of the low-noise amplifier is covered with an aerogel heat insulation layer.

4. The multi-band adaptive control system according to claim 1, characterized in that, The multi-band adaptive control system also includes a microchannel heat dissipation structure, which is disposed on the back side of the substrate region corresponding to the power amplifier.

5. The multi-band adaptive control system according to claim 2, characterized in that, The main control unit is also used to determine the current operating mode based on the output power data, and to determine the closing and opening of the MEMS bypass switch based on the type of the current operating mode.

6. The multi-band adaptive control system according to claim 2, characterized in that, The process of determining the current operating mode based on output power data, and determining the closing and opening of the MEMS bypass switch based on the type of the current operating mode, specifically includes: When the output power data is lower than the preset low power threshold, the current working mode is determined to be pure LNA receiving mode, and the MEMS bypass switch is controlled to close. When the output power data is higher than the low power consumption threshold, the current operating mode is determined to be LNA-PA cascade amplification mode, and the MEMS bypass switch is controlled to open.

7. The multi-band adaptive control system according to claim 1, characterized in that, The multi-band adaptive control system also includes a cryogenic co-fired ceramic stripline connecting the low-noise amplifier and the power amplifier. A PIN diode attenuator is also integrated on the path of the cryogenic co-fired ceramic stripline for sending a feedback signal to the low-noise amplifier in calibration mode.

Images