耳机壳体定位工装及定位方法

By designing a support frame and movable positioning components, the problem of frequent tooling changes during the production of headphone shells was solved, enabling efficient and low-cost assembly of headphone shells and reducing the risk of cosmetic damage.

CN120897159BActive Publication Date: 2026-07-17BOZHON PRECISION IND TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BOZHON PRECISION IND TECH CO LTD
Filing Date
2025-07-31
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Frequent tooling changes during the production of headphone shells result in low production efficiency, high costs, and a high risk of cosmetic damage.

Method used

The device employs a support frame, a first movable positioning component, and a second movable positioning component. By cooperating with the first and second movable positioning components, the head and tail of the earphone shell are clamped, achieving fixation with multiple positions that can be switched, thus reducing the number of tooling components and the number of replacements.

Benefits of technology

It improves assembly efficiency, reduces tooling costs, minimizes the risk of damage to the earphone shell, and enhances assembly convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明涉及耳机组装技术领域，具体公开了一种耳机壳体定位工装及定位方法，该耳机壳体定位工装中，支撑架具有安装通道，安装通道的局部侧壁形成第一固定定位部；第一活动定位组件包括沿第一方向可移动地设于支撑架的第一活动定位件，第一活动定位件具有第一活动定位部，第一活动定位部和第一固定定位部配合以夹持耳机壳体的头部；第二活动定位组件包括第二活动定位件和连接件，连接件设于支撑架，且沿第二方向延伸，第二活动定位件与连接件连接，且能在闭合位置、打开位置、中转位置和避让位置之间运动。上述设置减少工装数量，降低成本、提高组装效率，且降低耳机壳体外观被划伤的风险。
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