A flattening device for a circuit board production

Abstract

The application relates to the field of integrated circuit manufacturing, in particular to a flattening device for circuit board production, which comprises a supporting seat, the top of the supporting seat is fixedly connected with a driving mechanism, the bottom of the driving mechanism is fixedly connected with a fixing mechanism, the bottom of the fixing mechanism is fixedly connected with a plurality of flattening mechanisms on the periphery, the supporting seat is fixedly connected with a containing mechanism corresponding to the flattening mechanisms, and circuit boards are placed in the containing mechanism. In the process of using the device, a plurality of flattening wheels rotate in a ring shape around the edges of the circuit boards to flatten the edges, and the middle part of the circuit board is limited by the pressing disc, so that the edges of the circuit board can be effectively flattened. The driving mechanism can drive the fixing mechanism to ascend and rotate, the containing mechanism can contain and limit the circuit board, and the circuit board is prevented from deviating when being flattened by the flattening mechanism.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing, and in particular to a flattening device for circuit board production. Background Technology

[0002] The flattening device used in PCB manufacturing is an important component of the PCB production line. A common flattening device mainly consists of a feeding mechanism, a film application mechanism, a film attaching mechanism, a leveling mechanism, and a film removal mechanism. The specific process of using the flattening device for PCB processing is as follows: The PCB to be processed is placed on the feeding mechanism, and release film and other necessary processing materials are prepared; the film application mechanism covers the surface of the PCB with release film, preparing for subsequent film attaching and flattening operations; the film attaching mechanism tightly adheres the PCB and release film, ensuring the release film is firmly attached to the PCB surface; the leveling mechanism flattens the solder resist layer on the PCB by applying appropriate pressure and temperature to achieve a smooth solder resist layer; after the flattening operation is completed, the film removal mechanism peels the release film off the PCB surface, exposing the smooth solder resist layer.

[0003] When the edges of a circuit board have many grooves, notches, or other complex structures, the material in these edge areas will shrink or expand at different rates than the internal areas when subjected to external forces or heat, resulting in the edges lifting up. Existing leveling devices generally flatten the entire circuit board, which is less effective when dealing with circuit boards where only the edges are lifted up. Therefore, we designed a flattening device for circuit board production. Summary of the Invention

[0004] In view of the problem that the above-mentioned or existing technologies have poor flattening effect when dealing with circuit boards with only edge warping, the present invention is proposed.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a flattening device for circuit board production, comprising a support base, a driving mechanism fixedly connected to the top of the support base, a fixing mechanism fixedly connected to the bottom of the driving mechanism, a plurality of flattening mechanisms fixedly connected to the bottom periphery of the fixing mechanism, a holding mechanism fixedly connected to the support base corresponding to the flattening mechanism, and a circuit board placed inside the holding mechanism; the flattening mechanism includes a positioning cover fixedly connected to the bottom of the fixing mechanism, a docking frame fixedly connected to the bottom of the positioning cover, a bracket slidably connected to the bottom of the docking frame, a flattening wheel fixedly connected to the bottom of the bracket, the bottom of the bracket and the docking frame connected by an elastic band, a cross frame provided between the top of the bracket and the docking frame, airbags provided at both ends of the cross frame, and the bracket slidably connected to the positioning cover.

[0006] As a preferred embodiment of the flattening device for circuit board production of the present invention, the number of positioning covers is multiple, and the multiple positioning covers are distributed in a circular array at the bottom edge of the fixing mechanism. The cross-section of the positioning cover is rectangular, and the opening of the positioning cover is vertically downward. The flattening wheel is made of rubber and is located inside the holding mechanism. The cross-section of the docking frame is rectangular.

[0007] As a preferred embodiment of the flattening device for circuit board production of the present invention, the airbag is made of rubber, the top of the bracket is provided with a blind groove corresponding to the cross bracket, the elastic band is located at the center of the bottom of the inner wall of the docking frame, and the elastic band is woven from elastic fibers.

[0008] As a preferred embodiment of the flattening device for circuit board production of the present invention, the cross frame includes an inner frame, an outer frame is rotatably connected to the middle of the inner frame via a shaft, an outer plate is fixedly connected to the ends of both the inner frame and the outer frame, and the outer plates at both ends of the inner frame and the outer frame are fixedly connected to an airbag.

[0009] In a preferred embodiment of the flattening device for circuit board production of the present invention, the inner frame and the outer frame are both made of metal, the inner frame is fixedly connected to the shaft, and the shaft is rotatably connected to the outer frame.

[0010] As a preferred embodiment of the flattening device for circuit board production of the present invention, the driving mechanism includes a driving motor and an electric telescopic rod fixed to the top of the support base. The driving end of the driving motor passes through the top of the support base and is fixedly connected to the driving rod. A sliding sleeve is sleeved on the bottom of the driving rod. A lifting plate is rotatably connected to the outside of the sliding sleeve. The top of the lifting plate is fixedly connected to the driving end of the electric telescopic rod.

[0011] In a preferred embodiment of the flattening device for circuit board production of the present invention, the drive rod has a rectangular cross-section, the inner wall of the sliding sleeve is adapted to the outer wall of the drive rod, and the bottom of the sliding sleeve is fixedly connected to the fixing mechanism.

[0012] As a preferred embodiment of the flattening device for circuit board production of the present invention, the fixing mechanism includes a base frame fixedly connected to the bottom of the sliding sleeve, a mounting frame fixedly connected to the bottom of the base frame, a positioning cover fixedly connected to the bottom of the mounting frame, a positioning box fixedly connected to the middle of the mounting frame, a movable plate slidably connected inside the positioning box, a vertical rod and a spring fixedly connected to the bottom of the movable plate, the bottom of the vertical rod passing through the positioning box and rotatably connected to a pressure plate, and the bottom of the spring fixedly connected to the bottom wall of the positioning box.

[0013] As a preferred embodiment of the flattening device for circuit board production of the present invention, wherein: there is a gap between the movable plate and the positioning box, the pressure plate is located at the center of the holding mechanism, the pressure plate is made of iron, and a rubber layer is provided at the bottom of the pressure plate.

[0014] As a preferred embodiment of the flattening device for circuit board production of the present invention, the holding mechanism includes a bottom cover fixedly connected to a support base, a ring fixedly connected to the top of the bottom cover, a placement groove opened on the top of the bottom cover, the circuit board located inside the placement groove, a bottom groove and a through hole opened at the bottom of the placement groove, a lifting plate attached to the bottom groove, a cylinder fixedly connected to the bottom of the lifting plate, an anti-detachment ring fixedly connected to the bottom of the cylinder through the through hole, the lifting plate being made of magnet, and a protective pad fixedly connected to its upper surface.

[0015] The beneficial effects of the flattening device for circuit board production of the present invention are as follows: During use, multiple flattening rollers rotate in a ring around the edge of the circuit board to flatten it. In conjunction with the pressure plate to limit the center of the circuit board, the device can effectively flatten the edge of the circuit board. The drive mechanism can drive the fixing mechanism to lift and rotate. The holding mechanism can accommodate the circuit board and limit its movement, preventing the circuit board from shifting when the flattening mechanism flattens it. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a flattening device used in circuit board production.

[0018] Figure 2 This is a schematic diagram of the fixing mechanism of a flattening device used in circuit board production.

[0019] Figure 3 This is a schematic diagram of the holding mechanism of a flattening device used in circuit board production.

[0020] Figure 4 An exploded schematic diagram of the holding mechanism of a flattening device used in circuit board production.

[0021] Figure 5 This is a cross-sectional view of the holding mechanism of a flattening device used in circuit board production.

[0022] Figure 6 This is a cross-sectional view of the fixing mechanism of a flattening device used in circuit board production.

[0023] Figure 7 This is a cross-sectional view of the flattening mechanism of a flattening device used in circuit board production.

[0024] Figure 8 This is a schematic diagram of a cross rack for a flattening device used in circuit board production.

[0025] In the diagram: 1. Support base; 2. Drive mechanism; 21. Drive motor; 22. Electric telescopic rod; 23. Drive rod; 24. Sliding sleeve; 25. Lifting plate; 3. Fixing mechanism; 31. Base frame; 32. Mounting frame; 33. Positioning box; 34. Movable plate; 35. Vertical rod; 36. Spring; 37. Pressure plate; 4. Flattening mechanism; 41. Positioning cover; 42. Docking frame; 43. Bracket; 44. Flattening wheel; 45. Elastic band; 46. Cross frame; 47. Airbag; 461. Inner frame; 462. Shaft; 463. Outer frame; 464. Outer plate; 5. Container mechanism; 51. Bottom cover; 52. Ring; 53. Placement slot; 54. Bottom slot; 55. Through hole; 56. Lifting piece; 57. Cylinder; 58. Anti-detachment ring; 6. Circuit board. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Example 1, referring to Figures 1 to 8 This is the first embodiment of the present invention. This embodiment provides a flattening device for circuit board production, which can achieve the flattening effect of circuit board 6. It includes a support base 1, a driving mechanism 2 fixedly connected to the top of the support base 1, a fixing mechanism 3 fixedly connected to the bottom of the driving mechanism 2, a plurality of flattening mechanisms 4 fixedly connected to the bottom periphery of the fixing mechanism 3, and a holding mechanism 5 fixedly connected to the support base 1 corresponding to the flattening mechanism 4. The circuit board 6 is placed inside the holding mechanism 5 and the circuit board 6 is located between the holding mechanism 5 and the flattening mechanism 4.

[0028] Among them, the support base 1 is made of metal. The support base 1 can limit the holding mechanism 5 and fix the driving mechanism 2. The driving mechanism 2 can drive the fixing mechanism 3 to lift and rotate, so as to flatten the circuit board 6. The flattening mechanism 4 supports the circuit board 6. The holding mechanism 5 can accommodate the circuit board 6 and prevent the circuit board 6 from shifting when the flattening mechanism 4 flattens the circuit board 6.

[0029] The flattening mechanism 4 includes a positioning cover 41 fixedly connected to the bottom of the fixing mechanism 3. A docking frame 42 is fixedly connected to the bottom of the positioning cover 41. A bracket 43 is slidably connected to the bottom of the docking frame 42. A flattening wheel 44 is fixedly connected to the bottom of the bracket 43. The bottom of the bracket 43 and the docking frame 42 are connected by an elastic band 45. A cross frame 46 is provided between the top of the bracket 43 and the docking frame 42. Airbags 47 are provided at both ends of the cross frame 46. The bracket 43 is slidably connected to the positioning cover 41. There are two airbags 47, which are located on both sides of the cross frame 46.

[0030] Furthermore, the positioning cover 41 is made of metal. During the movement of the positioning cover 41, it can drive the docking frame 42 to move. The bracket 43 and the docking frame 42 slide up and down. During use, when the docking frame 42 encounters resistance during its descent, it can move towards the inside of the positioning cover 41. The bracket 43 is made of metal. The setting of the bracket 43 can effectively limit the flattening wheel 44, so that the flattening wheel 44 can be effectively limited by the positioning cover 41 during the movement, making the flattening wheel 44 more stable when working, and preventing it from moving laterally and damaging the circuit board 6. When the positioning cover 41 moves towards the flattening wheel 44, the cross frame 46 will simultaneously squeeze the two airbags 47.

[0031] There are multiple positioning covers 41, which are arranged in a ring array at the bottom edge of the fixing mechanism 3. The cross-section of the positioning cover 41 is rectangular, and the opening of the positioning cover 41 is vertically downward. The flattening wheel 44 is made of rubber and is located inside the holding mechanism 5. The cross-section of the docking frame 42 is rectangular. The airbag 47 is made of rubber. The top of the bracket 43 is provided with a blind groove corresponding to the cross frame 46. The elastic band 45 is located at the center of the bottom of the inner wall of the docking frame 42 and is made of elastic fiber.

[0032] like Figure 8 As shown, the cross frame 46 includes an inner frame 461. An outer frame 463 is rotatably connected to the middle of the inner frame 461 via a shaft 462. An outer plate 464 is fixedly connected to the ends of both the inner frame 461 and the outer frame 463. The outer plates 464 at both ends of the inner frame 461 and the outer frame 463 are fixedly connected to the airbag 47. Both the inner frame 461 and the outer frame 463 are made of metal. The inner frame 461 is fixedly connected to the shaft 462, and the shaft 462 is rotatably connected to the outer frame 463.

[0033] Specifically, both the inner frame 461 and the outer frame 463 are made of metal. Two airbags 47 are located on both sides of the inner frame 461 and the outer frame 463. The outer plate 464 is bonded to the airbags 47 with glue. The inner frame 461 and the outer frame 463 are arranged so that the two airbags 47 can be squeezed simultaneously when the positioning cover 41 moves towards the flattening wheel 44. While flattening the circuit board 6, the flattening wheel 44 is prevented from excessively squeezing the circuit board 6, so that the device can flatten the workpiece more stably.

[0034] In summary, the support base 1 can limit the holding mechanism 5 and fix the drive mechanism 2. The drive mechanism 2 can drive the fixing mechanism 3 to lift and rotate, which facilitates the flattening of the circuit board 6. The holding mechanism 5 can accommodate the circuit board 6 and limit its movement, preventing the circuit board 6 from shifting when the flattening mechanism 4 flattens it.

[0035] Example 2, refer to Figures 1 to 7 This is the second embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a driving device for a flattening device used in circuit board production, solving the driving problem of the flattening mechanism 4. It includes a driving mechanism 2 and a fixing mechanism 3. The driving mechanism 2 includes a driving motor 21 and an electric telescopic rod 22 fixed to the top of the support base 1. Both the driving motor 21 and the electric telescopic rod 22 are electrically connected to an external power source. The electric telescopic rod 22 can effectively drive the fixing mechanism 3 to move vertically and can also drive the fixing mechanism 3 to rotate. The driving end of the driving motor 21 passes through the top of the support base 1 and is fixedly connected to a driving mechanism. The moving rod 23 has a sliding sleeve 24 sleeved at its bottom. A lifting plate 25 is rotatably connected to the outside of the sliding sleeve 24. The top of the lifting plate 25 is fixedly connected to the driving end of the electric telescopic rod 22. The setting of the driving rod 23 can drive the sliding sleeve 24 to rotate. The cooperation between the sliding sleeve 24 and the driving rod 23 can adapt to the rotation of the drive motor 21 without affecting the operation of the electric telescopic rod 22. The lifting plate 25 is made of metal. The setting of the lifting plate 25 can transmit the driving force of the driving end of the electric telescopic rod 22 to the fixed mechanism 3. At the same time, the lifting plate 25 is rotatably connected to the sliding sleeve 24. The rotation of the sliding sleeve 24 is not affected when the lifting plate 25 rises and falls.

[0036] The cross-section of the drive rod 23 is rectangular. The inner wall of the sliding sleeve 24 is adapted to the outer wall of the drive rod 23. The bottom of the sliding sleeve 24 is fixedly connected to the fixing mechanism 3. There is a gap between the sliding sleeve 24 and the drive rod 23. This gap prevents the inner wall of the sliding sleeve 24 and the drive rod 23 from being affected by the seal and thus avoids affecting their mutual movement.

[0037] The fixing mechanism 3 includes a base frame 31 fixedly connected to the bottom of the sliding sleeve 24. A mounting frame 32 is fixedly connected to the bottom of the base frame 31. The bottom of the mounting frame 32 is fixedly connected to the positioning cover 41. A positioning round box 33 is fixedly connected to the middle of the mounting frame 32. A movable plate 34 is slidably connected inside the positioning round box 33. A vertical rod 35 and a spring 36 are fixedly connected to the bottom of the movable plate 34. The bottom of the vertical rod 35 passes through the positioning round box 33 and is rotatably connected to a pressure plate 37. The bottom of the spring 36 is fixedly connected to the bottom wall of the positioning round box 33. There is a gap between the movable plate 34 and the positioning round box 33. The pressure plate 37 is located at the center of the holding mechanism 5. The pressure plate 37 is made of iron. A rubber layer is provided at the bottom of the pressure plate 37. The rubber layer can effectively prevent damage to the circuit board 6 during the flattening process.

[0038] The base frame 31 is conical, and the conical structure formed by the base frame 31 and the mounting frame 32 can better protect the bottom structure of the base frame 31 when it is accidentally touched by external moving robotic arms or feeding equipment during operation. The positioning box 33 has a circular cross-section, and its setting can effectively limit the movable plate 34 inside. The circular movable plate 34 can move vertically inside the positioning box 33. The vertical rod 35 has a circular cross-section and is slidably connected to the positioning box 33. When the vertical rod 35 is limited by the positioning box 33, the movable plate 34 is simultaneously limited by the inner wall of the positioning box 33. The simultaneous limitation of both can better limit the pressure plate 37 at the bottom of the vertical rod 35. Since the pressure plate 37 directly contacts the circuit board 6, the claw-shaped pressure plate 37 can better press the middle of the circuit board 6, so that the middle of the circuit board 6 can be prevented from bulging when the edges are squeezed.

[0039] When the electric telescopic rod 22 descends, it drives the base frame 31 to descend. After the base frame 31 descends, it drives the mounting frame 32 to descend. During the descent of the mounting frame 32, it drives the positioning box 33 to descend. The descent of the positioning box 33 drives the movable plate 34, the vertical rod 35 and the pressure plate 37 to descend. At the same time, the mounting frame 32 drives the positioning cover 41 and the docking frame 42 to descend. When the docking frame 42 descends, it drives the elastic band 45 and the flattening wheel 44 to descend. When the flattening wheel 44 contacts the base cover 51, the electric telescopic rod 22 continues to descend. During the descent of the electric telescopic rod 22, since the flattening wheel 44 has already contacted the base cover 51, the base plate continues to descend. The descent of the base plate drives the positioning box 33 to descend, and the movable plate 34 is in a relatively stationary state. The corresponding spring 36 is stretched and accumulates elastic potential energy.

[0040] The rest of the structure is the same as in Example 1.

[0041] In summary, the circuit board 6 will be subjected to external forces and generate stress during the flattening process. Rotating and flattening at multiple points along the edge can disperse the stress and prevent the stress from being excessively concentrated in a certain location. If the stress is concentrated in a point or a small area, it may cause defects such as cracks, delamination or damage to components on the circuit board 6 at that location.

[0042] Example 3, referring to Figures 1 to 8This is the third embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a support component for a flattening device for circuit board production, which solves the problem of limiting the position of the circuit board 6. It includes a holding mechanism 5, which includes a bottom cover 51 fixedly connected to the support base 1. A ring 52 is fixedly connected to the top of the bottom cover 51. A placement groove 53 is opened on the top of the bottom cover 51. The circuit board 6 is located inside the placement groove 53. A bottom groove 54 and a through hole 55 are opened at the bottom of the placement groove 53. A lifting piece 56 is attached to the bottom groove 54. A cylinder 57 is fixedly connected to the bottom of the lifting piece 56. The bottom of the cylinder 57 passes through the through hole 55 and is fixedly connected to an anti-detachment ring 58. The lifting piece 56 is made of magnet and a protective pad is fixedly connected to its upper surface.

[0043] Furthermore, the bottom cover 51 has an "n" shaped cross-section and is made of metal. During the extrusion process of the circuit board 6, the bottom cover 51 supports the bottom of the circuit board 6. When the flattening roller 44 extrudes the circuit board 6, the bottom cover 51 provides support to its bottom. The ring 52 effectively protects the edge of the flattening roller 44, preventing external impurities from entering the flattening working area through the top edge of the bottom cover 51 during operation. The placement groove 53 effectively limits the movement of the circuit board 6, preventing it from being moved. If a misalignment occurs during the flattening process, the bottom groove 54 can effectively limit the lifting piece 56. The lifting piece 56 is magnetically connected to the pressure plate 37. When the pressure plate 37 descends, the lifting piece 56 retracts into the bottom groove 54, which will not affect the flattening of the circuit board 6. When the flattening process is finished, the pressure plate 37 is raised, and the pressure plate 37 drives the lifting piece 56 to rise. When the lifting piece 56 rises, it can effectively lift the circuit board 6, preventing the circuit board 6 from being overly attached to the placement groove 53 after the flattening process, which would affect the removal of the circuit board 6.

[0044] The rest of the structure is the same as in Example 2.

[0045] When using;

[0046] First, place the circuit board 6 into the placement slot 53, start the electric telescopic rod 22. The electric telescopic rod 22 descends, causing the base frame 31 to descend. After the base frame 31 descends, it causes the mounting frame 32 to descend. During the descent of the mounting frame 32, it causes the positioning box 33 to descend. The descent of the positioning box 33 causes the movable plate 34, the vertical rod 35 and the pressure plate 37 to descend. At the same time, the mounting frame 32 causes the positioning cover 41 and the docking frame 42 to descend. When the docking frame 42 descends, it causes the elastic band 45 and the flattening wheel 44 to descend. When the flattening wheel 44 contacts the base cover 51, the electric telescopic rod 22 continues to descend.

[0047] During the descent of the electric telescopic rod 22, the flattening wheel 44 has already contacted the base cover 51, causing the base plate to continue descending. The descent of the base plate drives the positioning box 33 to descend, and the movable plate 34 is in a relatively stationary state. The corresponding spring 36 is stretched and accumulates elastic potential energy. Simultaneously, the positioning cover 41 descends, causing the docking frame 42 to squeeze the airbag 47 and stretch the elastic band 45. The elastic band 45, the two airbags 47, and the spring 36 are all in a state of accumulating elastic potential energy. The potential energy of the three forces simultaneously drives the flattening wheel 44 towards the circuit board 6, so that the circuit board 6 is always squeezed by the flattening wheel 44. This allows the device to effectively flatten the circuit board 6 during operation. Furthermore, the elastic potential energy of the three forces prevents damage to the circuit board 6 due to excessive squeezing.

[0048] When the drive motor 21 is working, the drive motor 21 drives the drive rod 23 to rotate, and the drive rod 23 drives the sliding sleeve 24, the base frame 31, and the mounting bracket 32 ​​to rotate. Since the vertical rod 35 and the pressure plate 37 are in a rotating connection, it does not affect the operation of the pressure plate 37. The rotation of the mounting bracket 32 ​​drives the mounting cover, the docking frame 42, and the bracket 43 to rotate, thereby driving the pressure plate to perform a ring-shaped flattening operation on the circuit board 6. After the flattening operation is completed, the electric telescopic rod 22 is raised, and the fixing mechanism 3 is raised. During the lifting process of the pressure plate 37, the pressure plate 37 drives the lifting plate 56 to rise. When the lifting plate 56 rises, it can effectively lift the circuit board 6, avoiding the circuit board 6 from being affected by excessive contact with the placement groove 53 after the flattening operation.

[0049] In summary, when flattening the circuit board 6, multi-point rotational flattening along the edge of the circuit board 6 can make the pressure more evenly distributed on the surface of the circuit board 6. If only a single position is flattened, it may cause excessive local stress on the circuit board 6, while other areas are not stressed enough, resulting in local flatness but overall unevenness. Multi-point rotational flattening can ensure that the circuit board 6 receives a certain degree of flattening effect in all directions, making the circuit board 6 flatter overall. The support base 1 can limit the holding mechanism 5 and fix the drive mechanism 2. The drive mechanism 2 can drive the fixing mechanism 3 to lift and rotate, which facilitates the flattening of the circuit board 6. The holding mechanism 5 can accommodate the circuit board 6 and limit it, preventing the circuit board 6 from shifting when the flattening mechanism 4 flattens the circuit board 6.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A flattening device for circuit board production, comprising a support base (1), characterized in that: The support base (1) is fixedly connected to the top of the drive mechanism (2), the drive mechanism (2) is fixedly connected to the bottom of the fixed mechanism (2) and a plurality of flattening mechanisms (4) are fixedly connected to the bottom periphery of the fixed mechanism (3). The support base (1) is fixedly connected to the flattening mechanism (4) and a holding mechanism (5) is fixedly connected to it. A circuit board (6) is placed inside the holding mechanism (5). The flattening mechanism (4) includes a positioning cover (41) fixedly connected to the bottom of the fixing mechanism (3). A docking frame (42) is fixedly connected to the bottom of the positioning cover (41). A bracket (43) is slidably connected to the bottom of the docking frame (42). A flattening wheel (44) is fixedly connected to the bottom of the bracket (43). The bottom of the bracket (43) is connected to the docking frame (42) by an elastic band (45). A cross frame (46) is provided between the top of the bracket (43) and the docking frame (42). Airbags (47) are provided at both ends of the cross frame (46). The bracket (43) is slidably connected to the positioning cover (41). The fixing mechanism (3) includes a base frame (31) fixedly connected to the bottom of the sliding sleeve (24), a mounting frame (32) fixedly connected to the bottom of the base frame (31), the bottom of the mounting frame (32) fixedly connected to the positioning cover (41), a positioning round box (33) fixedly connected to the middle of the mounting frame (32), a movable plate (34) slidably connected inside the positioning round box (33), a vertical rod (35) and a spring (36) fixedly connected to the bottom of the movable plate (34), the bottom of the vertical rod (35) passes through the positioning round box (33) and is rotatably connected to a pressure plate (37), and the bottom of the spring (36) is fixedly connected to the inner bottom wall of the positioning round box (33). The holding mechanism (5) includes a bottom cover (51) fixedly connected to the support base (1), a ring (52) fixedly connected to the top of the bottom cover (51), a placement groove (53) opened on the top of the bottom cover (51), the circuit board (6) is located inside the placement groove (53), a bottom groove (54) and a through hole (55) are opened at the bottom of the placement groove (53), a lifting piece (56) is attached to the bottom groove (54), a cylinder (57) is fixedly connected to the bottom of the lifting piece (56), and an anti-detachment ring (58) is fixedly connected to the bottom of the cylinder (57) through the through hole (55); The lifting plate (56) and the pressure plate (37) are magnetically attached.

2. The flattening device for circuit board production as described in claim 1, characterized in that: The number of positioning covers (41) is multiple, and the multiple positioning covers (41) are arranged in a ring array at the bottom edge of the fixing mechanism (3). The cross-section of the positioning cover (41) is rectangular, and the opening of the positioning cover (41) is vertically downward. The flattening wheel (44) is made of rubber and is located inside the holding mechanism (5). The cross-section of the docking frame (42) is rectangular.

3. The flattening device for circuit board production as described in claim 1, characterized in that: The airbag (47) is made of rubber. The top of the bracket (43) is provided with a blind groove corresponding to the cross frame (46). The elastic band (45) is located at the center of the bottom of the inner wall of the docking frame (42), and the elastic band (45) is woven from elastic fibers.

4. The flattening device for circuit board production as described in claim 1, characterized in that: The cross frame (46) includes an inner frame (461), and an outer frame (463) is rotatably connected to the middle of the inner frame (461) via a shaft (462). Both ends of the inner frame (461) and the outer frame (463) are fixedly connected to an outer plate (464). Both ends of the outer plates (464) of the inner frame (461) and the outer frame (463) are fixedly connected to an airbag (47).

5. The flattening device for circuit board production as described in claim 4, characterized in that: Both the inner frame (461) and the outer frame (463) are made of metal. The inner frame (461) is fixedly connected to the shaft (462), and the shaft (462) is rotatably connected to the outer frame (463).

6. The flattening device for circuit board production as described in claim 4, characterized in that: The drive mechanism (2) includes a drive motor (21) and an electric telescopic rod (22) fixed on the top of the support base (1). The drive end of the drive motor (21) passes through the top of the support base (1) and is fixedly connected to a drive rod (23). A sliding sleeve (24) is sleeved on the bottom of the drive rod (23). A lifting plate (25) is rotatably connected to the outside of the sliding sleeve (24). The top of the lifting plate (25) is fixedly connected to the drive end of the electric telescopic rod (22).

7. The flattening device for circuit board production as described in claim 6, characterized in that: The cross-section of the drive rod (23) is rectangular, the inner wall of the sliding sleeve (24) is adapted to the outer wall of the drive rod (23), and the bottom of the sliding sleeve (24) is fixedly connected to the fixing mechanism (3).

8. The flattening device for circuit board production as described in claim 1, characterized in that: There is a gap between the movable plate (34) and the positioning round box (33). The pressure plate (37) is located at the center of the holding mechanism (5). The pressure plate (37) is made of iron and has a rubber layer at the bottom.

9. The flattening device for circuit board production as described in claim 1, characterized in that: The lifting plate (56) is made of magnet and has a protective pad fixedly connected to its upper surface.

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