一种基于激光增强等离子体的硅基材料高效超光滑表面加工方法
By using laser-enhanced plasma technology, the problems of slow heating rate and unstable temperature in silicon-based material processing have been solved, achieving efficient ultra-smooth surface processing that meets the requirements of nanometer-level precision and atomic-level surface quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies for processing silicon-based materials suffer from problems such as slow heating rates and unstable workpiece temperatures, which limit the accuracy of plasma processing. Furthermore, traditional grinding and polishing processes are unable to meet the requirements for nanometer-level precision and atomic-level surface quality.
By employing laser-enhanced plasma, the density of active plasma particles and the local temperature are increased through simultaneous plasma and laser treatment, thereby achieving highly efficient and ultra-smooth processing of silicon-based material surfaces.
It achieves ultra-smooth processing of silicon-based material surfaces, obtaining sub-nanometer or atomic-level surface roughness and high surface accuracy without damage, avoiding surface defects caused by machining, and is suitable for processing a variety of silicon-based materials.
Smart Images
Figure CN120901497B_ABST