Laser cutting device for wire mesh
Patent Information
- Application Number
- CN202511432558.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2045-10-09
AI Technical Summary
In the existing technology, metal wire mesh has problems such as unstable separation between the cut part and the residue during laser cutting, easy deviation due to static electricity or micro-melting adhesion, easy oxidation and high energy consumption during the cutting process.
It adopts a triangular mesh protruding support platform, a nitrogen protection mechanism and a metal vapor treatment mechanism. It ensures stable separation of the cut parts and scrap materials through electrostatic adsorption and nitrogen protection, prevents oxidation and reduces energy consumption, and uses electrostatic repulsion and a dust pump to treat metal vapor.
It achieves stable separation of the cut metal wire mesh parts and the scrap, avoids electrostatic adhesion and oxidation, reduces energy consumption and improves cutting quality and precision.
Smart Images

Figure CN120901526A_ABST
Abstract
Citation Information
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