Electrically controllable particle adsorbing infrared detector and method of manufacturing the same

Abstract

The application provides an infrared detector capable of electrically controlling adsorption of particles and a manufacturing method thereof. The infrared detector comprises: a substrate, which comprises a functional micro-bridge region and an electric adsorption micro-bridge region located at the periphery of the functional micro-bridge region; a plurality of functional micro-bridges, which are arranged on the substrate and located in the functional micro-bridge region; and a plurality of electric adsorption micro-bridges, which are arranged on the substrate and located in the electric adsorption micro-bridge region, and each electric adsorption micro-bridge comprises an electric adsorption bridge surface, the surface of the electric adsorption bridge surface is provided with a conductive layer, and the conductive layer is electrically connected with a circuit in the substrate, so that the electric adsorption bridge surface can electrically adsorb particles when the electric adsorption micro-bridge is powered. The application can actively intercept particles, inhibit the movement of particles to the functional micro-bridge region, effectively control the particles in the packaging cavity of the infrared detector, avoid the failure of the device due to particle pollution, thereby improving the yield and long-term stability of the device, and solving the industry problem that the micro-bridge structure is failed due to particle contamination or impact.

Description

Technical Field

[0001] This invention relates to the field of micro-opto-electro-mechanical technology, and in particular to an infrared detector capable of electrically controlling the adsorption of particulate matter and its manufacturing method. Background Technology

[0002] In the field of high-reliability packaging for infrared detectors, effectively controlling particulate matter within the packaging cavity remains a core challenge restricting device yield and long-term stability. With advancements in third-generation semiconductor materials and micro / nano fabrication technologies, infrared detectors are evolving towards smaller pixel sizes (e.g., below 12μm × 12μm) and higher integration levels. Consequently, the mechanical strength of the internal microbridge structure decreases, making the impact of packaging particles on the infrared pixel microbridge structure more pronounced. This often leads to large-area dead spots in the array region, resulting in device failure. Relying solely on controlling the cleanliness of the packaging environment cannot completely eliminate the influence of particulate matter.

[0003] Current research confirms that particulate contaminants within the encapsulation cavity primarily originate from solder spatter during reflow (such as alloy particles like SnAgCu and AuSn), debris generated during epoxy resin curing, and intrusion of environmental dust. These particles often possess conductive or dielectric properties (e.g., metals, oxides, or organic matter). Under environmental testing conditions such as vibration, shock, or temperature cycling, the random motion of these particles can lead to two types of damage mechanisms: direct impact damage (kinetic energy exceeding the microbridge structure fracture threshold) and cumulative electrostatic discharge (ESD). Charged particles, in particular, are more easily adsorbed into sensitive areas, forming potential failure points, driven by airflow and electrostatic fields within the cavity.

[0004] How to effectively control particulate matter within the packaging cavity of infrared detectors to prevent device failure due to particulate contamination, thereby improving device yield and long-term stability, is an important problem that urgently needs to be solved. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an infrared detector that can electrically adsorb particulate matter and its manufacturing method, which can effectively control the particulate matter in the packaging cavity of the infrared detector, avoid device failure due to particulate matter contamination, and thus improve device yield and long-term stability.

[0006] To address the aforementioned problems, the present invention provides an infrared detector capable of electrically adsorbing particulate matter, comprising: a substrate including a functional microbridge region and an electroadsorption microbridge region located on the periphery of the functional microbridge region; a plurality of functional microbridges disposed on the substrate and located in the functional microbridge region; and a plurality of electroadsorption microbridges disposed on the substrate and located in the electroadsorption microbridge region, wherein each electroadsorption microbridge includes an electroadsorption bridge surface, the surface of which has a conductive layer, the conductive layer being electrically connected to a circuit within the substrate, such that when the electroadsorption microbridge is energized, the electroadsorption bridge surface can electroadsorb particulate matter.

[0007] In one specific embodiment, the electroadsorption microbridge region includes a positively charged particulate matter adsorption region, a negatively charged particulate matter adsorption region, and a neutral particulate matter adsorption region. The electroadsorption microbridge in the positively charged particulate matter adsorption region is connected to the negative electrode of the power supply and is used to adsorb positively charged particulate matter. The electroadsorption microbridge in the negatively charged particulate matter adsorption region is connected to the positive electrode of the power supply and is used to adsorb negatively charged particulate matter. The electroadsorption microbridge in the neutral particulate matter adsorption region is connected to both the positive and negative electrodes of the power supply and is used to adsorb neutral particulate matter.

[0008] In one specific embodiment, the positively charged particulate matter adsorption region, the negatively charged particulate matter adsorption region, and the neutral particulate matter adsorption region all surround the functional microbridge region.

[0009] In one specific embodiment, the positively charged particulate matter adsorption region, the negatively charged particulate matter adsorption region, and the neutral particulate matter adsorption region are alternately distributed.

[0010] In one specific embodiment, the conductive layer has a plurality of conductive protrusions on its surface, and the conductive layer is electrically connected to the conductive protrusions. When the electroadsorption microbridge is energized, the conductive protrusions can also electroadsorb particulate matter.

[0011] In one specific embodiment, the conductive protrusion surface is a rough surface.

[0012] In one specific embodiment, the electroadsorption microbridge further includes two support pillars for supporting the electroadsorption bridge surface. An electrical connection layer is disposed in the support pillar, and the conductive layer forms a current loop with the circuit in the substrate through the electrical connection layers of the two support pillars.

[0013] In one specific embodiment, the electroadsorption microbridge further includes a bottom support layer, the bottom support layer including a bridge pier connected to the substrate, a cantilever beam suspended above the substrate and connected to the bridge pier, and a bottom bridge surface suspended above the substrate and connected to the cantilever beam. The bottom of the support column is disposed on the bottom bridge surface, the top of the support column is connected to the electroadsorption bridge surface, and the support column is electrically connected to the circuit in the substrate through the bottom bridge surface, the cantilever beam and the bridge pier.

[0014] In one specific embodiment, multiple bottom support layers share the same electro-adsorption bridge surface, and two support columns are disposed on the same bottom bridge surface.

[0015] The present invention also provides a method for manufacturing an infrared detector capable of electrically adsorbing particulate matter, comprising: forming a substrate, the substrate including a functional microbridge region and an electroadsorption microbridge region located on the periphery of the functional microbridge region; forming a plurality of functional microbridges in the functional microbridge region and a plurality of electroadsorption microbridges in the electroadsorption microbridge region, comprising: forming a reflective layer on the surface of the substrate in the functional microbridge region; forming a bottom support layer on the surface of the substrate in the functional microbridge region and the electroadsorption microbridge region, the bottom support layer including bridge piers connected to the substrate and located on the substrate. The structure includes an upper cantilever beam connected to the pier, a bottom bridge surface located above the substrate and connected to the cantilever beam, and a thermally sensitive layer disposed within the bottom bridge surface in the functional microbridge region. In the functional microbridge region and the electroadsorption microbridge region, a top microbridge layer is formed on the bottom support layer. In the electroadsorption microbridge region, the top microbridge layer includes an electroadsorption bridge surface. The surface of the electroadsorption bridge surface has a conductive layer, which is electrically connected to a circuit within the substrate through the bottom support layer, enabling the electroadsorption bridge surface to electroadsorb particulate matter when energized.

[0016] This invention provides an infrared detector capable of electrically adsorbing particulate matter and its manufacturing method. An electro-adsorption microbridge region is set around a functional microbridge region, surrounding the functional microbridge region. Multiple electro-adsorption microbridges are arranged within the electro-adsorption microbridge region. When the electro-adsorption microbridges are energized, the electrostatic force generated by the conductive layer achieves the adsorption of particulate matter, thereby dynamically capturing charged particles and achieving regional isolation. For uncharged particles, the electrostatic field generated by the electro-adsorption microbridges can induce polarization, leading to adsorption and capture. This invention can actively intercept particulate matter, suppress its movement towards the functional microbridge region, effectively control particulate matter within the infrared detector's packaging cavity, and prevent device failure due to particulate matter contamination, thereby improving device yield and long-term stability. It solves the industry problem of microbridge structure failure due to particle contamination or impact. This invention achieves real-time particle capture and path intervention through electrical means, effectively avoiding the negative impact of traditional mechanical limiting schemes on optical performance and thermal management. It provides a novel solution for infrared detector packaging, possessing both feasibility and potential for large-scale application.

[0017] Furthermore, the infrared detector and its manufacturing method for electrically controllable adsorption of particulate matter provided by this invention can also polarize and adsorb particulate matter of different sizes and polarities in the surrounding environment by adjusting the voltage on the electro-adsorption microbridge, thereby further effectively controlling the particulate matter within the infrared detector's encapsulation cavity. Moreover, the infrared detector for electrically controllable adsorption of particulate matter provided by this invention, combined with the detector's intermittent operating mode, can activate the electric field only during vibration and shock triggering or periodic maintenance, resulting in low overall power consumption and compatibility with the device's low-power characteristics. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a top view schematic diagram of a specific embodiment of the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention; Figure 2 This is a cross-sectional schematic diagram of the electroadsorption microbridge in the infrared detector capable of electrically adsorbing particulate matter provided by the present invention; Figure 3 This is a three-dimensional structural diagram of the electroadsorption microbridge in the infrared detector capable of electrically adsorbing particulate matter provided by the present invention; Figure 4 This is a cross-sectional schematic diagram of the functional microbridge in the infrared detector that can electrically control the adsorption of particulate matter provided by the present invention; Figure 5 This is a three-dimensional structural schematic diagram of the functional microbridge in the infrared detector that can electrically control the adsorption of particulate matter provided by the present invention; Figure 6 This is a cross-sectional schematic diagram of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention; Figure 7 This is a three-dimensional structural diagram of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention; Figure 8 This is a partial top view schematic diagram of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention. Figure 9 This is a partial top view schematic diagram of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention. Figure 10 This is a partial top view schematic diagram of another specific embodiment of the infrared detector that can electrically adsorb particulate matter provided by the present invention. Figure 11 This is a schematic diagram of the manufacturing steps of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention; Figures 12-21 This is a process flow diagram of the manufacturing method of the infrared detector that can electrically adsorb particulate matter provided by the present invention. Detailed Implementation

[0020] The following detailed description, in conjunction with the accompanying drawings, illustrates the specific embodiments of the infrared detector capable of electrically controlling the adsorption of particulate matter and its manufacturing method provided by the present invention.

[0021] Figure 1 This is a top view schematic diagram of a specific embodiment of the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention. Figure 2 This is a cross-sectional schematic diagram of the electroadsorption microbridge in the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention. Figure 3 This is a three-dimensional structural diagram of the electroadsorption microbridge in the infrared detector capable of electrically adsorbing particulate matter provided by the present invention. Figure 4 This is a cross-sectional schematic diagram of the functional microbridge in the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention. Figure 5 This is a three-dimensional structural diagram of the functional microbridge in the infrared detector that can electrically control the adsorption of particulate matter provided by the present invention.

[0022] Please see Figures 1-5The infrared detector includes: a substrate 100, including a functional microbridge region 100A and an electroadsorption microbridge region 100B located on the periphery of the functional microbridge region 100A; a plurality of functional microbridges 110 disposed on the substrate 100 and located in the functional microbridge region 100A; and a plurality of electroadsorption microbridges 120 disposed on the substrate 100 and located in the electroadsorption microbridge region 100B. Each electroadsorption microbridge 120 includes an electroadsorption bridge surface 121, the surface of which has a conductive layer 122. The conductive layer 122 is electrically connected to a circuit (not shown in the figures) within the substrate 100, so that when the electroadsorption microbridge 120 is energized, the electroadsorption bridge surface 121 can electroadsorb particulate matter.

[0023] In the infrared detector capable of electrically adsorbing particulate matter provided by this invention, an electro-adsorption microbridge region 100B is arranged around the functional microbridge region 100A, and the electro-adsorption microbridge region 100B surrounds the functional microbridge region 100A. Multiple electro-adsorption microbridges 120 are arranged within the electro-adsorption microbridge region 100B. When the electro-adsorption microbridges 120 are energized, the electrostatic force generated by the conductive layer 122 is used to adsorb particulate matter, thereby dynamically capturing charged particulate matter and achieving regional isolation. For uncharged particulate matter, it can be induced to polarize by the electrostatic field generated by the electro-adsorption microbridges, and then adsorbed and captured. This effectively controls the particulate matter within the infrared detector's encapsulation cavity, thereby improving device yield and long-term stability, and solving the industry problem of microbridge structure failure due to particle contamination or impact.

[0024] The substrate 100 supports the functional microbridge 110 and the electroadsorption microbridge 120, and a circuit is disposed within the substrate 100 to provide power and control signals to the functional microbridge 110 and the electroadsorption microbridge 120. In one specific embodiment, the substrate 100 is a silicon substrate.

[0025] The functional microbridge region 100A is located in the middle of the substrate 100. Within the functional microbridge region 100A, a plurality of functional microbridges 110 are arranged in an array along the X-axis and Y-axis directions. The functional microbridge 110 refers to the microbridge that implements the basic functions of the chip in the infrared detector.

[0026] In one specific implementation, such as Figure 4 and Figure 5 As shown, the functional microbridge 110 includes a bottom support layer 130 and a top microbridge layer 140 disposed on the bottom support layer 130.

[0027] The bottom support layer 130 includes a first pier 150 connected to the substrate 100, a first cantilever beam 151 suspended above the substrate 100 and connected to the first pier 150, and a first bottom bridge surface 152 suspended above the substrate 100 and connected to the first cantilever beam 151. A heat-sensitive layer 153 is disposed within the first bottom bridge surface 152. The first pier 150, the first cantilever beam 151, and the first bottom bridge surface 152 of the bottom support layer 130 are all made of a first dielectric layer 900 (indicated by...). Figure 14 (middle), conductive circuit layer 910 (marked in) Figure 15 (in the middle) and the second dielectric layer 920 (marked in Figure 17 The substrate 100 is composed of a conductive circuit layer 910 and a reflective layer 930 (marked in the middle). At the first pier 150, the conductive circuit layer 910 passes through the first dielectric layer 900 and is electrically connected to the circuit within the substrate 100. At the first bottom bridge surface 152, the thermal layer 153 is disposed in the area of ​​the first dielectric layer 900 not covered by the conductive circuit layer 910, and the edge of the thermal layer 153 is connected to the conductive circuit layer 910. A reflective layer 930 is disposed on the substrate 100 in the area corresponding to the first bottom bridge surface 152. Figure 13 middle).

[0028] The top microbridge layer 140 includes a second pier 160 disposed on the first bottom bridge surface 152, and a top bridge surface 161 connected to the second pier 160 and suspended on the bottom support layer 130. In one specific embodiment, both the second pier 160 and the top bridge surface 161 are made of a third medium layer 940 (marked as...). Figure 18 (middle) and the fourth dielectric layer 950 (marked in Figure 20 It is composed of (Chinese) and (Chinese) compounds.

[0029] The electroadsorption microbridge region 100B is located at the outer edge of the substrate 100 and surrounds the functional microbridge region 100A. In the electroadsorption microbridge region 100B, multiple electroadsorption microbridges 120 are arranged in an array along the X-axis and Y-axis directions. The electroadsorption microbridges 120 refer to microbridges used in infrared detectors for adsorbing particulate matter. The substrate 100 also has multiple pins 102 distributed around the outer periphery of the electroadsorption microbridge region 100B, which are used to achieve electrical connections between the circuitry within the substrate 100 and external devices.

[0030] In one specific implementation, such as Figure 2 and Figure 3 As shown, the electroadsorption microbridge 120 also includes a bottom support layer 130 and a top microbridge layer 140 disposed on the bottom support layer 130.

[0031] The top microbridge layer 140 includes the electroadsorption bridge surface 121, the surface of which has a conductive layer 122. The conductive layer 122 is electrically connected to the circuitry within the substrate 100, so that when the electroadsorption microbridge 120 is energized, the electrostatic force generated by the conductive layer 122 adsorbs particulate matter, thereby dynamically capturing charged particles and achieving regional isolation. For uncharged particles, the electrostatic field generated by the electroadsorption microbridge can induce polarization, leading to adsorption and capture, effectively controlling particulate matter within the infrared detector packaging cavity, thereby improving device yield and long-term stability. Furthermore, the conductive layer 122 can be made of materials with good conductivity, such as titanium, titanium nitride, aluminum, and gold, to enhance its adsorption force, thereby ensuring the adsorption effect on particulate matter and achieving more effective dynamic capture and regional isolation of particulate matter.

[0032] By placing the electro-adsorption bridge surface 121 on the top microbridge layer 140, the area of ​​the conductive layer 122 can be increased to a greater extent, thereby increasing the adsorption area of ​​the electro-adsorption bridge surface 121 for particulate matter, effectively controlling particulate matter in the infrared detector packaging cavity, and thus improving device yield and long-term stability.

[0033] In one specific embodiment, the top microbridge layer 140 further includes two support pillars 123, which support the electroadsorption bridge surface 121. Each support pillar 123 has an electrical connection layer 124, and the conductive layer 122 forms a current loop with the circuitry within the substrate 100 through the electrical connection layers 124 of the two support pillars 123. The electrical connection layer 124 and the conductive layer 122 can be formed in the same step. In some specific embodiments, support pillars 123 of different sizes, heights, and shapes can be selected according to the particle size to effectively adsorb particulate matter.

[0034] In one specific embodiment, the support column 123 is disposed on the bottom support layer 130. The bottom support layer 130 includes a pier connected to the substrate 100, a cantilever beam suspended above the substrate 100 and connected to the pier, and a bottom bridge surface suspended above the substrate 100 and connected to the cantilever beam. The bottom of the support column 123 is disposed on the bottom bridge surface, the top of the support column 123 is connected to the electroadsorption bridge surface 121, and the support column 123 is electrically connected to the circuitry within the substrate 100 through the bottom bridge surface, the cantilever beam, and the pier. Specifically, as... Figure 2 and Figure 3As shown, the bottom support layer 130 includes a third pier 170 connected to the substrate 100, a second cantilever beam 171 suspended above the substrate 100 and connected to the third pier 170, and a second bottom bridge deck 172 suspended above the substrate 100 and connected to the second cantilever beam 171. The third pier 170, the second cantilever beam 171, and the second bottom bridge deck 172 of the bottom support layer 130 are all made of a first dielectric layer 900 (labeled as...). Figure 14 (middle), conductive circuit layer 910 (marked in) Figure 15 (in the middle) and the second dielectric layer 920 (marked in Figure 17 Composed of (in Chinese). At the third bridge pier 170, the conductive circuit layer 910 passes through the first dielectric layer 900 and is electrically connected to the circuit in the substrate 100. The support pillar 123 is disposed on the second bottom bridge surface 172, and the electrical connection layer 124 in the support pillar 123 is electrically connected to the conductive circuit layer 910 in the second bottom bridge surface 172, thereby enabling the conductive layer 122 to be electrically connected to the circuit in the substrate 100 through the support pillar 123 and the bottom support layer 130. In some specific embodiments, the electroadsorption microbridge 120 and the functional microbridge 110 are formed synchronously in the same process, so a reflective layer 930 (marked in Chinese) is disposed on the area of ​​the substrate 100 corresponding to the second bottom bridge surface 172. Figure 13 middle).

[0035] In some specific embodiments, the connection relationship between the electroadsorption microbridge 120 and the positive and negative electrodes of the power supply can be set according to the electrical charge of the particles to be adsorbed, so as to achieve active adsorption of different particles. For example, if it is necessary to actively adsorb positively charged particles, the electroadsorption microbridge 120 can be connected to the negative electrode of the power supply; if it is necessary to actively adsorb negatively charged particles, the electroadsorption microbridge 120 can be connected to the positive electrode of the power supply; if it is necessary to actively adsorb neutral particles, the electroadsorption microbridge 120 can be connected to both the positive and negative electrodes of the power supply to form a non-uniform alternating electric field, which polarizes the uncharged particles, making them charged, and then adsorption is performed.

[0036] Furthermore, in some specific embodiments, in order to achieve adsorption of all particulate matter, the electroadsorption microbridge region 100B can be divided into a positively charged particulate matter adsorption region 200, a negatively charged particulate matter adsorption region 210, and a neutral particulate matter adsorption region 220. The electroadsorption microbridge 120 of the positively charged particulate matter adsorption region 200 is connected to the negative electrode of the power supply and is used to adsorb positively charged particulate matter. The electroadsorption microbridge 120 of the negatively charged particulate matter adsorption region 210 is connected to the positive electrode of the power supply and is used to adsorb negatively charged particulate matter. The electroadsorption microbridge 120 of the neutral particulate matter adsorption region 220 is connected to both the positive and negative electrodes of the power supply and is used to adsorb neutral particulate matter.

[0037] Furthermore, in some specific embodiments, the positively charged particulate matter adsorption region 200, the negatively charged particulate matter adsorption region 210, and the neutral particulate matter adsorption region 220 all surround the functional microbridge region 100A to fully cover the functional microbridge region 100A, which is more conducive to the electro-adsorption of particulate matter. For example, as Figure 1 As shown, the electroadsorption microbridge region 100B is divided into three concentric rings arranged from the outside in, with each ring containing several rows / columns of electroadsorption microbridges 120. The first ring of electroadsorption microbridges 120 is connected to the negative electrode of the power supply and is used to adsorb positively charged particles from the surrounding environment. The second ring of electroadsorption microbridges 120 is connected to the positive electrode of the power supply and is used to adsorb negatively charged particles from the surrounding environment. The third ring of electroadsorption microbridges 120 is connected to both the positive and negative electrodes of the power supply, forming a non-uniform alternating electric field used to polarize and adsorb neutral particles from the surrounding environment. Figure 1 The diagram only schematically shows three concentric circles; in some specific embodiments, there may be more than three concentric circles. The positively charged particulate matter adsorption region 200, the negatively charged particulate matter adsorption region 210, and the neutral particulate matter adsorption region 220 are alternately distributed to achieve active adsorption of different particulate matter and improve the adsorption effect. The positively charged particulate matter adsorption region 200, the negatively charged particulate matter adsorption region 210, and the neutral particulate matter adsorption region 220 can be arranged adjacently according to actual needs, and are not limited to the positively charged particulate matter adsorption region 200 being adjacent to the negatively charged particulate matter adsorption region 210, or the negatively charged particulate matter adsorption region 210 being adjacent to the neutral particulate matter adsorption region 220.

[0038] Furthermore, in some specific embodiments, the voltage applied to the electroadsorption microbridge 120 can be adjusted to change the electroadsorption force, thereby achieving effective adsorption of particles of different sizes.

[0039] This invention also provides another specific embodiment of an infrared detector capable of electrically controlling the adsorption of particulate matter. Figure 6 This is a cross-sectional schematic diagram of another specific embodiment of the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention. Figure 7 This is a three-dimensional structural diagram of another specific embodiment of the infrared detector capable of electrically controlling the adsorption of particulate matter provided by the present invention, as shown below. Figure 6 and Figure 7 As shown, this specific implementation method is similar to... Figures 1-5The difference in the specific embodiment shown is that the conductive layer 122 has multiple conductive protrusions 125 on its surface. The conductive layer 122 is electrically connected to the conductive protrusions 125. When the electroadsorption microbridge 120 is energized, the conductive protrusions 125 can also electroadsorb particulate matter. In this specific embodiment, the conductive protrusions 125 increase the electroadsorption area of ​​the electroadsorption bridge surface 121, and the conductive protrusions 125 can also control the characteristic parameters of the electric field to more effectively adsorb particulate matter, suppress the movement of particulate matter towards the functional microbridge region 100A, and ensure that the functional microbridge 110 is not contaminated by particulate matter.

[0040] In one embodiment, the surface of the conductive protrusion 125 is a rough surface, which includes a high surface roughness or the surface having protrusions, to better adsorb particulate matter. In other embodiments, the surface of the conductive protrusion 125 is a smooth surface to reduce manufacturing difficulty. The size, shape, and arrangement period of the conductive protrusion 125 can be adjusted according to the size of the particulate matter. The conductive protrusion 125 can be a conductive pillar or a conductive cone, and its cross-sectional shape can be a circle, a polygon, etc.

[0041] In some specific embodiments, in the electroadsorption microbridge region 100B, the bottom support layer 130 and the top microbridge layer 140 correspond one-to-one, that is, each electroadsorption microbridge 120 includes a bottom support layer 130 and a top microbridge layer 140.

[0042] In some specific embodiments, in the electroadsorption microbridge region 100B, the relationship between the bottom support layer 130 and the top microbridge layer 140 is many-to-one, that is, each electroadsorption microbridge 120 includes a bottom support layer 130, and multiple bottom support layers 130 share the same top microbridge layer 140. In other words, multiple bottom support layers 130 share the same electroadsorption bridge surface 121, and two support columns 123 are disposed on the same bottom bridge surface. The shape and size of the electroadsorption bridge surface 121 can be adjusted according to the size of the particles. The shape of the electroadsorption bridge surface 121 can be circular, square, cross-shaped, polygonal, eaves-shaped, etc.

[0043] like Figure 8 The diagram shown is a partial top view of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention. In this embodiment, multiple bottom support layers 130 share the same electro-adsorption bridge surface 121, and two support columns 123 are disposed on the same bottom bridge surface. The electro-adsorption bridge surface 121 is circular. Figure 9The diagram shown is a partial top view of another specific embodiment of the infrared detector capable of electrically adsorbing particulate matter provided by the present invention. In this embodiment, multiple bottom support layers 130 share the same electro-adsorption bridge surface 121, and two support columns 123 are disposed on the same bottom bridge surface. The electro-adsorption bridge surface 121 is cross-shaped. Figure 10 As shown, it is a partial top view schematic diagram of another specific embodiment of the infrared detector that can electrically adsorb particulate matter provided by the present invention. In this specific embodiment, multiple bottom support layers 130 share the same electro-adsorption bridge surface 121, and two support columns 123 are disposed on the same bottom bridge surface. The electro-adsorption bridge surface 121 is polygonal.

[0044] The infrared detector provided by the present invention can electrically adsorb particulate matter by setting an electro-adsorption microbridge region 100B around the functional microbridge region 100A. The electrostatic force of the conductive layer 122 is used to achieve the adsorption effect of particulate matter, suppress the movement of particulate matter towards the formal pixel region, realize the dynamic capture and regional isolation of conductive particulate matter, effectively control the particulate matter in the infrared detector packaging cavity, thereby improving the device yield and long-term stability.

[0045] The infrared detector that can electrically adsorb particulate matter provided by this invention combines the detector's intermittent working mode, which activates the electric field only during vibration and shock triggering or periodic maintenance, resulting in low overall power consumption and compatibility with the device's low power consumption characteristics.

[0046] The present invention also provides a method for manufacturing the above-mentioned infrared detector. For example... Figure 11 The diagram shown illustrates the steps of a method for manufacturing an infrared detector capable of electrically adsorbing particulate matter, as provided by the present invention. Figures 12-21 This is a process flow diagram of the manufacturing method of the infrared detector that can electrically adsorb particulate matter provided by the present invention.

[0047] The manufacturing method includes: Please see Figure 11 and Figure 12 In step S100, a substrate 100 is formed, the substrate 100 including a functional microbridge region 100A and an electroadsorption microbridge region 100B located on the periphery of the functional microbridge region 100A. The substrate 100 has a circuit (not shown in the figure), the circuit being a readout circuit.

[0048] Please see Figure 11 Step S110 involves forming multiple functional microbridges in the functional microbridge region and multiple electroadsorption microbridges in the electroadsorption microbridge region. This step further includes the following steps: Please see Figure 11 and Figure 13In step S111, a reflective layer 930 is formed on the surface of the substrate 100 in the functional microbridge region 100A. In some specific embodiments, the reflective layer 930 is also formed in the electroadsorption microbridge region 100B in this step. In this step, a conductive pad 101 is also formed on the surface of the substrate 100, and the conductive pad 101 is electrically connected to the circuitry within the substrate 100.

[0049] Please see Figure 11 In step S112, a bottom support layer is formed on the substrate surface in the functional microbridge region and the electroadsorption microbridge region. The bottom support layer includes a pier connected to the substrate, a cantilever beam located above the substrate and connected to the pier, and a bottom bridge surface located above the substrate and connected to the cantilever beam. A thermal layer is disposed in the bottom bridge surface in the functional microbridge region.

[0050] As an example, the step of forming the bottom support layer on the substrate surface further includes the following steps: Please see Figure 14 A first sacrificial layer 800 is formed in the functional microbridge region 100A and the electroadsorption microbridge region 100B, and the first sacrificial layer 800 is patterned to expose the conductive pad 101 on the substrate 100; a patterned first dielectric layer 900 is formed on the surface of the first sacrificial layer 800, the conductive pad 101 is exposed, and the first dielectric layer 900 has a corresponding pattern in the region where a cantilever beam needs to be formed.

[0051] Please see Figure 15 In the functional microbridge region 100A and the electroadsorption microbridge region 100B, a conductive line layer 910 is formed on the first dielectric layer 900. The conductive line layer 910 covers the first dielectric layer 900 and is connected to the conductive pad 101, and in the bottom bridge surface region, the conductive line layer 910 has a pattern corresponding to the thermal layer.

[0052] Please see Figure 16 A thermistor layer 153 is formed in the functional microbridge region 100A. The thermistor layer 153 is disposed on the surface of the first dielectric layer 900 and its edge is electrically connected to the conductive line layer 910.

[0053] Please see Figure 17 A second dielectric layer 920 is formed in the functional microbridge region 100A and the electroadsorption microbridge region 100B, covering the conductive circuit layer 910, the thermistor layer 153, and the first dielectric layer 900. In the cantilever beam region, the second dielectric layer 920 has a corresponding pattern. In the bottom bridge surface region of the electroadsorption microbridge region 100B, the second dielectric layer 920 has electrical connection holes 921 exposing the conductive circuit layer 910.

[0054] The above steps form the bottom support layer 130.

[0055] Please see Figure 11 In step S113, a top microbridge layer is formed on the bottom support layer in the functional microbridge region and the electroadsorption microbridge region. The top microbridge layer in the electroadsorption microbridge region includes an electroadsorption bridge surface. The surface of the electroadsorption bridge surface has a conductive layer. The conductive layer is electrically connected to the circuit in the substrate through the bottom support layer, so that when the electroadsorption microbridge is energized, the electroadsorption bridge surface can electroadsorb particulate matter.

[0056] As an example, the step of forming the top microbridge layer 140 on the bottom support layer 130 further includes the following steps: Please see Figure 18 A second sacrificial layer 810 is formed on the second dielectric layer 920 and patterned. In the bottom bridge surface region of the electroadsorption microbridge region 100B, the second sacrificial layer 810 forms support holes 811, which expose the electrical connection holes 921. In the bottom bridge surface region of the functional microbridge region 100A, the second sacrificial layer 810 forms pier holes 812, which expose the second dielectric layer 920. A third dielectric layer 940 is formed on the second sacrificial layer 810. In the bottom bridge surface region of the electroadsorption microbridge region 100B, the third dielectric layer 940 does not cover the conductive circuit layer 910.

[0057] Please see Figure 19 In the electroadsorption microbridge region 100B, a conductive layer 122 is formed on the surface of the third dielectric layer 940, wherein the conductive layer 122 located in the support hole 811 region serves as the electrical connection layer 124 of the support pillar 123 of the electroadsorption microbridge 120.

[0058] Please see Figure 20 In the functional microbridge region 100A, a fourth dielectric layer 950 is formed on the third dielectric layer 940.

[0059] Please see Figure 21 The first sacrificial layer 800 and the second sacrificial layer 810 are removed to form the functional microbridge 110 and the electroadsorption microbridge 120.

[0060] Alternatively, in some specific implementations, please refer to Figure 6 and Figure 7 Before removing the first sacrificial layer 800 and the second sacrificial layer 810, the conductive protrusion 125 is formed on the surface of the conductive layer 122 in the electroadsorption microbridge region 100B.

[0061] The present invention provides a method for manufacturing an infrared detector capable of electrically adsorbing particulate matter. In the process of forming the functional microbridges, electro-adsorption microbridges are simultaneously formed. The properties of these microbridges are utilized to achieve particulate matter adsorption, inhibiting the movement of particulate matter towards the actual pixel region. This enables dynamic capture and regional isolation of conductive particulate matter, effectively controlling particulate matter within the infrared detector's encapsulation cavity, thereby improving device yield and long-term stability. Furthermore, in this manufacturing method, the electro-adsorption microbridges and functional microbridges are formed simultaneously. This process flow is compatible with existing processes, facilitating widespread application.

[0062] It should be noted that the terms "comprising" and "having," and their variations, used in this invention document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this invention can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this invention. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0063] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An infrared detector capable of electrically controlling the adsorption of particulate matter, characterized in that, include: The substrate includes a functional microbridge region and an electroadsorption microbridge region located on the periphery of the functional microbridge region; Multiple functional microbridges are disposed on the substrate and located in the functional microbridge region; Multiple electroadsorption microbridges are disposed on the substrate and located in the electroadsorption microbridge region. Each electroadsorption microbridge includes an electroadsorption bridge surface, and the surface of the electroadsorption bridge surface has a conductive layer. The conductive layer is electrically connected to a circuit in the substrate so that when the electroadsorption microbridge is energized, the electroadsorption bridge surface can electroadsorb particulate matter.

2. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 1, characterized in that, The electroadsorption microbridge region includes a positively charged particulate matter adsorption region, a negatively charged particulate matter adsorption region, and a neutral particulate matter adsorption region. The electroadsorption microbridge in the positively charged particulate matter adsorption region is connected to the negative electrode of the power supply and is used to adsorb positively charged particulate matter. The electroadsorption microbridge in the negatively charged particulate matter adsorption region is connected to the positive electrode of the power supply and is used to adsorb negatively charged particulate matter. The electroadsorption microbridge in the neutral particulate matter adsorption region is connected to both the positive and negative electrodes of the power supply and is used to adsorb neutral particulate matter.

3. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 2, characterized in that, The positively charged particulate matter adsorption region, the negatively charged particulate matter adsorption region, and the neutral particulate matter adsorption region all surround the functional microbridge region.

4. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 3, characterized in that, The positively charged particulate matter adsorption region, the negatively charged particulate matter adsorption region, and the neutral particulate matter adsorption region are alternately distributed.

5. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 1, characterized in that, The conductive layer has multiple conductive protrusions on its surface. The conductive layer is electrically connected to the conductive protrusions. When the electroadsorption microbridge is energized, the conductive protrusions can also electroadsorb particulate matter.

6. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 5, characterized in that, The conductive protrusion surface is a rough surface.

7. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 1, characterized in that, The electroadsorption microbridge also includes two support pillars for supporting the electroadsorption bridge surface. An electrical connection layer is disposed inside the support pillar, and the conductive layer forms a current loop with the circuit in the substrate through the electrical connection layers of the two support pillars.

8. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 7, characterized in that, The electroadsorption microbridge further includes a bottom support layer, which includes a bridge pier connected to the substrate, a cantilever beam suspended above the substrate and connected to the bridge pier, and a bottom bridge surface suspended above the substrate and connected to the cantilever beam. The bottom of the support column is disposed on the bottom bridge surface, the top of the support column is connected to the electroadsorption bridge surface, and the support column is electrically connected to the circuit in the substrate through the bottom bridge surface, the cantilever beam, and the bridge pier.

9. The infrared detector capable of electrically controlling the adsorption of particulate matter according to claim 8, characterized in that, Multiple bottom support layers share the same electro-adsorption bridge surface, and two support columns are disposed on the same bottom bridge surface.

10. A method for manufacturing an infrared detector capable of electrically controlling the adsorption of particulate matter, characterized in that, include: A substrate is formed, the substrate including a functional microbridge region and an electroadsorption microbridge region located on the periphery of the functional microbridge region; Multiple functional microbridges are formed in the functional microbridge region, and multiple electroadsorption microbridges are formed in the electroadsorption microbridge region, including: A reflective layer is formed on the substrate surface in the functional microbridge region; In the functional microbridge region and the electroadsorption microbridge region, a bottom support layer is formed on the substrate surface. The bottom support layer includes a bridge pier connected to the substrate, a cantilever beam located above the substrate and connected to the bridge pier, and a bottom bridge surface located above the substrate and connected to the cantilever beam. A thermal layer is disposed in the bottom bridge surface in the functional microbridge region. In the functional microbridge region and the electroadsorption microbridge region, a top microbridge layer is formed on the bottom support layer. In the electroadsorption microbridge region, the top microbridge layer includes an electroadsorption bridge surface. The surface of the electroadsorption bridge surface has a conductive layer. The conductive layer is electrically connected to the circuit in the substrate through the bottom support layer, so that when the electroadsorption microbridge is energized, the electroadsorption bridge surface can electroadsorb particulate matter.

Images