Novel high-purity spherical high-thermal-conductivity aluminum oxide and preparation method thereof

CN120903535APending Publication Date: 2025-11-07HANGZHOU ZHIHUAJIE TECH
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Patent Information

Application Number
CN202510871264.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-26
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Traditional alumina powder has shortcomings in terms of purity, morphology, thermal conductivity and particle size distribution, making it difficult to meet the application requirements of high-performance electronic devices.

Method used

High-purity spherical high thermal conductivity alumina powder was prepared by optimizing raw material selection, spray granulation process, ball milling, heat treatment and classification process, including surfactant modification, segmented heat treatment and particle size classification.

Benefits of technology

The prepared alumina powder has high purity, regular spherical morphology and excellent thermal conductivity, making it suitable for high-performance electronic packaging and thermal management. It also has good chemical stability and is suitable for high-temperature and humid environments.

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Abstract

The invention relates to the technical field of high-performance aluminum oxide powder, in particular to novel high-purity spherical high-thermal-conductivity aluminum oxide and a preparation method thereof.The preparation method comprises the steps that high-purity aluminum oxide is dispersed in an organic solvent, a surfactant is added, stirring and mixing are conducted, and spray granulation, staged heat treatment, staged treatment and the like are conducted; the prepared alumina powder has high purity (greater than or equal to 99.98%), regular spherical morphology (sphericity degree is greater than or equal to 90%) and excellent heat-conducting property (heat conductivity coefficient is greater than or equal to 25W / m.K), and also has good chemical stability. The performance of the powder is remarkably improved through surfactant modification and segmented heat treatment, the process is simple, large-scale production is easy, and the method can be widely applied to the fields of electronic packaging and heat management.
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