High-strength high-conductivity low-beryllium copper alloy

Abstract

This invention relates to the field of beryllium copper alloy technology, specifically disclosing a high-strength, high-conductivity, low-beryllium copper alloy. The preparation process of this low-beryllium copper alloy includes the following steps: by mass percentage, the beryllium content is 0.2%-0.6%, the nickel content is 1.4%-2.5%, the cobalt content is less than or equal to 0.3%, the iron content is less than or equal to 0.3%, the silver content is 0.005%-0.01%, and the remainder is copper; copper is added to a crucible and melted, then nickel, cobalt, and iron are added and stirred until the added metals are completely dissolved in the melt, then the beryllium copper master alloy is added, and after the melt is homogenized, casting begins to obtain an ingot. The ingot is then subjected to furnace homogenization treatment, and then extrusion forging is performed to obtain a billet; heating and holding are performed; after holding, aging heat treatment is performed to obtain the beryllium copper alloy, which solves the bottleneck problem of "difficulty in balancing strength and conductivity" in traditional low-beryllium copper alloys, and combines high strength, excellent plasticity, and high conductivity.

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