一种晶体材料的加工方法及加工而成的晶体
By generating a modified layer on the surface of a crystalline material with a boiling point lower than the melting point of the substrate and removing it through heat treatment, combined with laser heating, the problems of low processing efficiency and damage in existing crystalline materials have been solved. This has enabled high-precision, damage-free ultra-smooth surface processing, expanding its application in high-end fields.
CN120905785BActive Publication Date: 2026-07-17NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing crystal material processing technologies are inefficient and introduce subsurface damage, making it difficult to achieve high-precision, damage-free, and ultra-smooth surface processing.
Method used
A modified layer with a boiling point lower than the melting point of the substrate is generated on the surface of the crystalline material by modification treatment. The modified layer is then removed by heat treatment and combined with laser heating and other methods to achieve non-destructive ultra-smooth surface processing.
Benefits of technology
A non-damaging, ultra-smooth crystalline material surface was obtained, with surface roughness reaching the sub-nanometer or atomic level, expanding its application in high-end fields.
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Figure CN120905785B_ABST
Abstract
本发明属于晶体材料超精密加工领域，涉及等离子改性技术及高温加工技术，尤其是一种等离子体辅助挥发的晶体超光滑表面加工方法及加工而成的晶体。本发明公开了一种晶体材料的加工方法，所述的加工方法包括改性处理、加热处理；其中通过改性处理在晶体材料表面生成改性层，晶体材料的熔点为T1，改性层的沸点为T2；所述的加热处理的加热温度为T，所述T2＜T＜T1。本发明还公开了具有无损伤超光滑表面的被加工晶体材料。本发明通过改性处理在晶体材料表面获得沸点低于基底熔点的改性层，通过加热处理将晶体表面提升至介于改性层沸点和基底熔点之间，实现改性层的有效挥发去除，进而获得超光滑基底表面。
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