A constant temperature accelerometer and a temperature drift suppression method thereof

Abstract

The application discloses a constant-temperature accelerometer and a temperature drift suppression method thereof, and belongs to the field of accelerometer technology.The constant-temperature accelerometer comprises a quartz vibrating beam accelerometer, a temperature control plate and a heat preservation shell, the heat preservation shell comprises sealed upper and lower chambers, the quartz vibrating beam accelerometer is fixed in the upper chamber, the main plate of the temperature control plate is fixed in the lower chamber, and the quartz vibrating beam accelerometer and the temperature control plate are in communication connection; the temperature control plate is used for detecting the temperature of the quartz vibrating beam accelerometer in real time and controlling the accelerometer to work at a constant temperature.The temperature drift suppression method comprises parameter setting and experimental verification of the constant-temperature accelerometer.The parameters of the constant-temperature accelerometer are determined through simulation modeling, the temperature drift is suppressed, and the zero drift stability of the constant-temperature accelerometer is obviously improved in the constructed dynamic temperature range.

Description

Technical Field

[0001] This invention belongs to the field of inertial sensor temperature control technology, and relates to a constant temperature accelerometer and its temperature drift suppression method. Background Technology

[0002] Quartz resonant beam accelerometers utilize the "acceleration-frequency" modulation principle of quartz resonant beams to directly convert inertial force into a frequency signal. They offer advantages such as high resolution and strong anti-interference capabilities, and are already widely used in smartphones, vehicle-mounted inertial navigation systems, and tactical guidance systems. Their core sensing element is a double-ended fixed quartz resonant beam. The resonant frequency of the beam changes linearly with the axial inertial force, and frequency counting outputs a digital signal proportional to the acceleration. However, the resonant frequency of the quartz resonant beam is temperature-sensitive. The elastic modulus and geometric dimensions of the beam are functions of temperature, and the internal thermal hysteresis of the crystal makes the frequency-temperature curve irreversible, leading to zero-bias drift and limiting its high-precision, wide-temperature-range application. Therefore, necessary measures are required to suppress temperature errors.

[0003] Common methods for suppressing temperature errors mainly include isothermal control and software compensation. Software compensation strategies generally suffer from limitations such as high dependence on precise modeling and temperature measurement accuracy, insufficient adaptability to dynamic temperature changes, and poor long-term stability. Furthermore, current isothermal control technology for accelerometers still faces the following problems: the overall size of the control system is relatively large, and the simulation model of the control system cannot provide effective guidance for parameter tuning of the actual system. Summary of the Invention

[0004] Purpose of the invention: The purpose of this invention is to address the temperature drift problem of quartz vibrating beam accelerometers over a wide temperature range by providing a constant-temperature accelerometer and a method for suppressing temperature drift, thereby effectively improving the zero-bias stability of quartz vibrating beam accelerometers over a wide temperature range.

[0005] Technical solution: The present invention provides a constant temperature accelerometer, comprising: a quartz vibrating beam accelerometer, a temperature control board, and a thermal insulation shell. The thermal insulation shell includes a sealed upper chamber and a lower chamber. The quartz vibrating beam accelerometer is fixed in the upper chamber, and the main board of the temperature control board is fixed in the lower chamber. The quartz vibrating beam accelerometer and the temperature control board are connected in communication. The temperature control board is used to detect the temperature of the quartz vibrating beam accelerometer in real time and control the accelerometer to operate at a constant temperature.

[0006] Optionally, the temperature control board includes a control chip and peripheral circuits. The peripheral circuits include an NTC thermistor bridge, an improved H-bridge drive circuit, an upper heating film, and a lower heating film. The NTC thermistor bridge is used to detect the real-time temperature of the accelerometer and transmit it to the control chip. After processing the real-time temperature, the control chip adjusts the heating power of the upper and lower heating films by driving the improved H-bridge to achieve constant temperature control of the accelerometer.

[0007] Optionally, the improved H-bridge drive circuit removes one upper bridge arm from the traditional H-bridge and connects a second-order low-pass filter composed of L and C in the middle of the two half-bridges for low-ripple unidirectional power control. The improved H-bridge drive circuit is used to drive the upper heating film and the lower heating film.

[0008] Optionally, the peripheral circuit also includes a PI control network. The control chip includes an oscillator, a measurement amplifier, a compensation amplifier, a PWM controller, and a MOSFET driver module. The measurement amplifier is used to amplify the output error voltage of the NTC thermistor bridge. The amplified voltage signal is corrected by the PI controller composed of the compensation amplifier and the PI control network to achieve duty cycle modulation of the output signal of the PWM controller. Finally, the MOSFET driver module directly drives the improved H-bridge. The oscillator is used to provide the base frequency for the PWM controller.

[0009] The method for suppressing temperature drift in a constant-temperature accelerometer according to the present invention includes the following steps:

[0010] A mathematical model is constructed based on the input-output relationship of the temperature control board. The output ΔU of the NTC thermistor bridge is used as the input of the model, and the voltages at both ends of the upper and lower heating films are used as the output of the model.

[0011] Import the mechanical model of the isothermal accelerometer into the simulation software and set the initial parameters and boundary conditions for the simulation.

[0012] Set up M sets of simulation parameters, each set including the installation location of the NTC thermistor, the proportional parameters and integral parameters of the PI controller;

[0013] Under M sets of simulation parameters, M sets of simulation results are obtained. The data types of the simulation results include temperature distribution maps and temperature response curves.

[0014] The temperature distribution map and temperature response curve of the simulation results of Group M are evaluated. The evaluation of the temperature distribution map is based on the temperature range. The smaller the temperature range, the more uniform the temperature distribution is evaluated. The evaluation of the temperature response curve is based on the overshoot and settling time. The smaller the overshoot, the better the stability is evaluated. The smaller the settling time, the faster the response speed is evaluated.

[0015] Based on the evaluation results, a set of optimal simulation parameters is determined, including: determining the installation location of the NTC thermistor, determining a set of optimal PI controller parameters under the simulation environment, and determining N sets of approximate PI controller parameters based on the actual component parameters.

[0016] Experimental verification was conducted based on the determined optimal simulation parameter set, and the final PI controller parameter set was determined by the response observation method to achieve temperature drift suppression of the isothermal accelerometer.

[0017] Furthermore, the mathematical model expression for the temperature control board is:

[0018]

[0019] Among them, V heater K represents the voltage across the upper and lower heating films. p K is the proportional parameter of the PI controller. i These are the integral parameters of the PI controller. It is an integral operator.

[0020] Furthermore, the initial parameters and boundary conditions for the simulation are set as follows:

[0021] Initial parameter settings include: setting the resistance values ​​of the upper and lower heating films to be the same, setting the initial temperature of the simulation environment to room temperature, and setting the material properties of each component to the actual material properties;

[0022] Boundary conditions include heat source boundary conditions and thermal convection boundary conditions. The heat source boundary conditions are set as follows: the upper and lower heating films are set as boundary heat sources with controllable power, and the voltages across the upper and lower heating films are determined by the mathematical model of the temperature control board. The thermal convection boundary conditions need to be set according to the structural types of each surface of the isothermal accelerometer.

[0023] Furthermore, the experimental verification methods include:

[0024] Based on the determined optimal set of simulation parameters, the isothermal accelerometer was assembled.

[0025] For the assembled isothermal accelerometer, the final PI controller parameter set is determined by the response observation method. The specific process is as follows: N temperature response curves are measured under N approximate PI controller parameter sets, and the optimal simulation parameter set under actual test conditions is determined according to the evaluation method.

[0026] To construct a dynamic temperature mode, specifically: set the dynamic temperature range, heating rate, and cooling rate, and maintain the set time at each temperature that is a multiple of 10.

[0027] In the aforementioned dynamic temperature mode, without applying external acceleration, acceleration measurement is performed using a constant-temperature accelerometer with the optimal simulation parameter set.

[0028] The full-temperature zero-bias range and full-temperature zero-bias stability of the acceleration measurement results are calculated to verify the temperature drift suppression effect.

[0029] An electronic device for storing and executing the method includes:

[0030] Memory containing executable program code;

[0031] A processor coupled to the memory;

[0032] The processor calls the executable program code stored in the memory to execute the steps of the temperature drift suppression method.

[0033] A computer-readable storage medium for storing and executing the method, the computer-readable storage medium storing computer instructions, which, when invoked, are used to execute the steps of the temperature drift suppression method.

[0034] Beneficial effects: Compared with the prior art, the significant technical effects of the present invention are: (1) Significantly improve temperature stability: By combining a small-sized constant temperature control device with a precise COMSOL model construction scheme, the frequency drift of the quartz vibrating beam accelerometer in a wide temperature range is effectively suppressed, and the measurement accuracy is greatly improved; (2) Achieve a balance between miniaturization and high precision: By adopting an improved H-bridge temperature control board circuit and a CBY material shell, while ensuring the compactness of the device, excellent temperature control performance is achieved, meeting the needs of high-precision application scenarios; (3) Simplify the development and debugging process: Through a systematic simulation modeling method, clear guidance is provided for the parameter tuning of the actual system, significantly shortening the development cycle and improving the efficiency of engineering implementation. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of a constant temperature accelerometer;

[0036] Figure 2 This is a functional block diagram of the temperature control board circuit;

[0037] Figure 3 This is a schematic diagram of the improved H-bridge drive circuit;

[0038] Figure 4 This is a 3D diagram showing the location where the heating film is pasted.

[0039] Figure 5 This is a flowchart of system parameter tuning and experimental verification;

[0040] Figure 6 It shows the accelerometer output frequency curves before and after heat preservation. Detailed Implementation

[0041] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The following embodiments are for illustrative purposes only and do not constitute a limitation on the scope of protection of the present invention.

[0042] like Figure 1 As shown, the isothermal accelerometer of the present invention includes: a quartz vibrating beam accelerometer (…). Figure 3The accelerometer, temperature control board, and insulation shell are included. The insulation shell includes a sealed upper chamber and a lower chamber. The quartz vibrating beam accelerometer is fixed in the upper chamber, and the main board of the temperature control board is fixed in the lower chamber.

[0043] The insulation shell is made of CBY resin and has an overall size of 54mm×54mm×52mm. A perforated support plate is installed in the upper chamber, and the quartz vibrating beam accelerometer is fixed in the upper chamber through the support plate. The temperature control plate is fixed to the lower chamber of the insulation shell through the boss. The upper chamber and the lower chamber are connected as a whole by a flange.

[0044] The temperature control board can be used to monitor the accelerometer temperature in real time and control the accelerometer to operate at a constant temperature. Its functional block diagram is as follows: Figure 2 As shown. The temperature control board mainly includes the control chip ADN8830 and peripheral circuits. The control chip ADN8830 includes an oscillator, a reference power generator, a measurement amplifier, a compensation amplifier, a PWM controller, and a MOSFET driver module. The peripheral circuits include an NTC thermistor bridge, a PI control network, an improved H-bridge, an upper heating film, and a lower heating film. The core component of the NTC thermistor bridge is the NTC thermistor. The compensation amplifier and the PI control network form a PI controller. The oscillator provides the base frequency for the PWM controller. The reference power generator provides a stable 2.47V voltage to the NTC thermistor bridge and also powers the oscillator. When the circuit is working, the NTC thermistor bridge is used to detect the real-time temperature of the accelerometer. Its temperature measurement delay time is better than 10ms. The output error voltage of the NTC thermistor bridge is amplified by the measurement amplifier, and then corrected by the PI controller composed of the compensation amplifier and the PI control network. This achieves duty cycle modulation of the PWM controller output signal. Finally, the MOSFET driver module directly drives the improved H-bridge to adjust the heating power of the upper and lower heating films, thereby achieving constant temperature control of the accelerometer.

[0045] like Figure 3 As shown, the improved H-bridge driver circuit includes: a P-type MOSFET P1 and two N-type MOSFETs N1 and N2, a capacitor C and an inductor L, where R is the resistance of the upper and lower heating films connected in parallel, PVDD and PGND are the digital power supply and digital ground, respectively, and OUTA and OUTB are the two terminals of the upper and lower heating films connected in parallel. The improved H-bridge driver circuit removes one upper bridge arm from the traditional H-bridge and connects a second-order low-pass filter composed of L and C between the two half-bridges to achieve low-ripple unidirectional power control; the improved H-bridge driver circuit is used to drive R, that is, to drive the upper and lower heating films.

[0046] The peripheral circuit of the control chip ADN8830 has the following main parameters: the β value of the NTC thermistor is 3976K, and the carrier frequency f of the PWM controller is...switch The frequency is 1MHz, the resistance of both the upper and lower heating films is 5Ω, the heating film type is polyimide film, and the cutoff frequency of the second-order low-pass filter is f. c Set to 15.6kHz, satisfying f c In f switch Within the range of 1 / 10 to 1 / 5.

[0047] like Figure 1 and Figure 4 As shown, an upper heating film and a lower heating film are respectively attached to the upper and lower cylindrical surfaces of the accelerometer. An NTC thermistor is installed on the outer surface of the accelerometer. The upper and lower heating films, the NTC thermistor and the temperature control board are electrically connected through copper wires and wiring holes. The connection method between the NTC thermistor and the outer surface of the accelerometer is as follows: the NTC thermistor is attached to the outer surface of the accelerometer using high thermal conductivity double-sided silicone, and then the NTC thermistor is sealed and fixed as a whole using high temperature tape.

[0048] like Figure 5 As shown, a method for suppressing temperature drift in the isothermal accelerometer includes the following steps:

[0049] Isothermal accelerometer parameter tuning:

[0050] S1: Construct a mathematical model of the circuit based on the input-output relationship of the temperature control board, using the output ΔU of the NTC thermistor bridge as the input of the model, and the voltage V across the upper and lower heating films. heater The model output is specifically represented as follows:

[0051]

[0052] Among them, K p K is the proportional parameter of the PI controller. i These are the integral parameters of the PI controller. For integration operators;

[0053] S2: Import into COMSOL simulation software Figure 1 The mechanical model of the isothermal accelerometer is shown, and the initial parameters and boundary conditions for the simulation are set.

[0054] S3: The initial parameter settings described in S2 are as follows: the resistance of both the upper and lower heating films is set to 5Ω, the initial temperature of the simulation environment is set to room temperature (25 degrees Celsius), and the material properties of each component are set to the actual material properties. The boundary conditions described in S2 mainly include: heat source boundary conditions and thermal convection boundary conditions. The heat source boundary conditions are set as follows: the upper and lower heating films are set as power-controllable boundary heat sources, and the voltage across the upper and lower heating films is determined by the mathematical model described in S1. The thermal convection boundary conditions need to be categorized and calculated according to the structural type of each surface of the isothermal accelerometer, and are mainly divided into the following types:

[0055] When external natural convection occurs on a vertical wall:

[0056]

[0057] When external natural convection occurs on the upper side of a horizontal plate:

[0058]

[0059] When external natural convection occurs under the horizontal plate:

[0060]

[0061] Where h is the heat transfer coefficient, μ is the dynamic viscosity, L is the characteristic size of the convection surface, and Ra L Here, C is the Rayleigh number, k is the thermal conductivity, and C is the thermal conductivity. p Here, T represents the heat capacity, and T represents the actual temperature of the isothermal accelerometer. ext The external ambient temperature.

[0062] S4: Set up M sets of simulation parameter groups. Each parameter group consists of the installation location of the thermistor and the proportional parameter K of the PI controller. p Integral parameter K i It consists of three parameters.

[0063] S5: Under the simulation parameters of group M, obtain the simulation results of group M. Set the simulation time to 30 min and the simulation step size to 0.5 s. The data types of the simulation results include temperature distribution diagrams and temperature response curves.

[0064] S6: Evaluate the temperature distribution map and temperature response curve of the simulation results for group M. The evaluation of the temperature distribution map is based on the temperature range ΔT, expressed as:

[0065] ΔT=T max -T min

[0066] Among them, T max and T minThese represent the maximum and minimum temperature values ​​in the temperature distribution map, respectively. A smaller ΔT indicates a more uniform temperature distribution. The evaluation of the temperature response curve is based on the overshoot M. p and adjustment time t s ,in:

[0067] M p =T M -T S

[0068] Among them, T M T represents the maximum temperature in the temperature response curve. S Let t be the steady-state temperature in the temperature response curve. s The temperature value reaches the steady-state value T for the first time. S Time; M p A smaller value indicates better stability. s The smaller the value, the faster the response time.

[0069] S7: Based on the evaluation method described in S6, determine a set of optimal simulation parameters, including: determining the installation location of the NTC thermistor, such as... Figure 1 As shown, a set of optimal PI controller parameters, K, is determined under simulation conditions. p K is 1. i The value is 0.0017; based on the actual parameters of components such as resistors and capacitors, N sets of approximate PI controller parameter groups are determined.

[0070] Experimental verification using a constant-temperature accelerometer:

[0071] S8: Fix the temperature control board, accelerometer, NTC thermistor, upper heating film and lower heating film into the heat preservation shell according to the spatial relationship shown in Figure 1 to realize the assembly of the constant temperature accelerometer.

[0072] S9: For the assembled isothermal accelerometer, the final PI controller parameter set is determined by response observation. Specifically, N temperature response curves are measured under N approximate PI controller parameter sets. Based on the evaluation method described in S6, a set of optimal simulation parameters under actual test conditions is determined, and K is obtained. p K is 1.061. i It is 0.00154.

[0073] S10: Construct a dynamic temperature mode, specifically: set the dynamic temperature within the range of -30℃ to 60℃, with both the heating rate and cooling rate being 5℃ / min, and maintain the temperature for 35 minutes at each multiple of 10. The temperature setting sequence is 30℃ to 60℃ to -30℃ to 30℃.

[0074] S11: Under the dynamic temperature mode described in S10, without applying external acceleration, and under the parameters described in S9, a set of accelerometer output frequency sequences 1 are obtained under bare test conditions, with a sequence size of 46200.

[0075] S12: Under the dynamic temperature mode described in S10, without applying external acceleration, under the assembly conditions described in S8 and the parameters described in S9, obtain a set of accelerometer output frequency sequence 2 with a sequence size of 46200.

[0076] S13: Process frequency sequence 1 and frequency sequence 2 described in S11 and S12, such as... Figure 6 As shown, the curve before heat preservation corresponds to frequency sequence 1, and the curve after heat preservation corresponds to frequency sequence 2. The full-temperature zero-bias range and full-temperature zero-bias stability of the two frequency sequences are calculated. The formula for calculating the full-temperature zero-bias range is as follows:

[0077]

[0078] Where, ΔB max For zero bias range across all temperatures, B max and B min These are the maximum and minimum zero-bias frequencies, respectively. SF is the scale factor of the accelerometer. The formula for calculating full-temperature zero-bias stability is as follows:

[0079]

[0080] Among them, B stability For full-temperature zero-bias stability, f i Here, n represents the zero-bias frequency value at a single sampling point, and n is the amount of data in the frequency sequence. This represents the average value of the zero-bias frequency samples. Based on the calculation results of frequency sequence 1 and frequency sequence 2, the temperature drift suppression method for the isothermal accelerometer described in this invention reduces the full-temperature zero-bias range from 4.745 mg to 0.494 mg and improves the full-temperature zero-bias stability from 1.074 mg to 0.111 mg, representing increases of 89.6% and 89.7% respectively, approaching the same order of magnitude. This demonstrates the significant effectiveness of the proposed isothermal accelerometer temperature drift suppression method. The output frequency curves before (i.e., using a conventional accelerometer) and after (i.e., the isothermal accelerometer described in this invention) are shown in the figure below. Figure 6 As shown.

[0081] In summary, this invention addresses the problem of deteriorated zero-bias stability of quartz beam accelerometers under wide-range dynamic temperature environments. It discloses a isothermal accelerometer composed of a quartz beam accelerometer, a temperature control board, and an insulating shell. It also provides a temperature drift suppression method, including a parameter tuning method based on COMSOL thermal simulation and response observation, and an experimental verification method based on the constructed dynamic temperature model. The parameter tuning method and the experimental verification method are sequential. The parameter tuning method based on COMSOL thermal simulation and response observation includes the following steps: establishing a circuit input / output model of the temperature control board; importing the isothermal accelerometer mechanical model into COMSOL and setting initial parameters and boundary conditions; setting M sets of simulation parameters, performing M simulations, determining one optimal set of simulation parameters, and determining N sets of approximate PI controller parameter sets; assembling the temperature control board, accelerometer, and insulating shell, and determining the final PI controller parameter set through response observation. The experimental verification method based on the constructed dynamic temperature model includes the following steps: constructing a wide-range dynamic temperature model, designing a full-temperature experiment, and conducting data acquisition and effect evaluation. Experimental results show that the disclosed method for suppressing temperature drift in quartz vibrating beam accelerometers effectively suppresses the temperature drift of quartz vibrating beam accelerometers.

Claims

1. A method for suppressing temperature drift in a constant-temperature accelerometer, characterized in that, The isothermal accelerometer includes: a quartz beam accelerometer, a temperature control board, and an insulating shell. The insulating shell includes a sealed upper chamber and a lower chamber. The quartz beam accelerometer is fixed in the upper chamber, and the main board of the temperature control board is fixed in the lower chamber. The quartz beam accelerometer and the temperature control board are connected in communication. The temperature control board is used to detect the temperature of the quartz beam accelerometer in real time and control the accelerometer to operate at a constant temperature. The temperature control board includes a control chip and peripheral circuits. The peripheral circuits include an NTC thermistor bridge, an improved H-bridge drive circuit, an upper heating film, and a lower heating film. The NTC thermistor bridge is used to detect the real-time temperature of the accelerometer and transmit it to the control chip. After processing the real-time temperature, the control chip adjusts the heating power of the upper and lower heating films by driving the improved H-bridge, thereby achieving constant temperature control of the accelerometer. The improved H-bridge drive circuit removes one upper bridge arm from the traditional H-bridge and connects a second-order low-pass filter composed of L and C in the middle of the two half-bridges for low-ripple unidirectional power control. The improved H-bridge drive circuit is used to drive the upper heating film and the lower heating film. The peripheral circuit also includes a PI control network. The control chip includes an oscillator, a measurement amplifier, a compensation amplifier, a PWM controller, and a MOSFET driver module. The measurement amplifier is used to amplify the output error voltage of the NTC thermistor bridge. The amplified voltage signal is corrected by the PI controller composed of the compensation amplifier and the PI control network to achieve duty cycle modulation of the output signal of the PWM controller. Finally, the MOSFET driver module directly drives the improved H-bridge. The oscillator is used to provide the base frequency for the PWM controller. The method includes the following steps: A mathematical model of the temperature control board is constructed based on its input-output relationship. The output ΔU of the NTC thermistor bridge is used as the model input, and the voltages across the upper and lower heating films are used as the model output. The mathematical model expression for the temperature control board is as follows: ； in, The voltage across the upper and lower heating films. The proportional parameter of the PI controller, These are the integral parameters of the PI controller. For integration operators; Import the mechanical model of the isothermal accelerometer into the simulation software, and set the initial parameters and boundary conditions for the simulation; specifically: Initial parameter settings include: setting the resistance values ​​of the upper and lower heating films to be the same, setting the initial temperature of the simulation environment to room temperature, and setting the material properties of each component to the actual material properties; Boundary conditions include heat source boundary conditions and thermal convection boundary conditions. The heat source boundary conditions are set as follows: the upper and lower heating films are set as boundary heat sources with controllable power, and the voltages across the upper and lower heating films are determined by the mathematical model of the temperature control board. The thermal convection boundary conditions need to be set according to the structural type of each surface of the isothermal accelerometer. Set up M sets of simulation parameters, each set including the installation location of the NTC thermistor, the proportional parameters and integral parameters of the PI controller; Under M sets of simulation parameters, M sets of simulation results are obtained. The data types of the simulation results include temperature distribution maps and temperature response curves. The temperature distribution map and temperature response curve of the simulation results of Group M are evaluated. The evaluation of the temperature distribution map is based on the temperature range. The smaller the temperature range, the more uniform the temperature distribution is evaluated. The evaluation of the temperature response curve is based on the overshoot and settling time. The smaller the overshoot, the better the stability is evaluated. The smaller the settling time, the faster the response speed is evaluated. Based on the evaluation results, a set of optimal simulation parameters is determined, including: determining the installation location of the NTC thermistor, determining a set of optimal PI controller parameters under the simulation environment, and determining N sets of approximate PI controller parameters based on the actual component parameters. Experimental verification was conducted based on the determined optimal simulation parameter set, and the final PI controller parameter set was determined using the response observation method to achieve temperature drift suppression of the isothermal accelerometer; the experimental verification methods included: Based on the determined optimal set of simulation parameters, the isothermal accelerometer was assembled. For the assembled isothermal accelerometer, the final PI controller parameter set is determined by the response observation method. The specific process is as follows: N temperature response curves are measured under N approximate PI controller parameter sets, and the optimal simulation parameter set under actual test conditions is determined according to the evaluation method. To construct a dynamic temperature mode, specifically: set the dynamic temperature range, heating rate, and cooling rate, and maintain the set time at each temperature that is a multiple of 10. In the aforementioned dynamic temperature mode, without applying external acceleration, acceleration measurement is performed using a constant-temperature accelerometer with the optimal simulation parameter set. The full-temperature zero-bias range and full-temperature zero-bias stability of the acceleration measurement results are calculated to verify the temperature drift suppression effect.

2. An electronic device, characterized in that, The device includes: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the steps of the temperature drift suppression method according to claim 1.

3. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions, which, when invoked, are used to perform the steps of the temperature drift suppression method according to claim 1.

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