Semiconductor chip processing fixture
By combining the design of the rotating cylinder and the fixed frame with the dynamic clamping mechanism of the tilting clamp, the problems of low efficiency and excessive manual intervention in existing fixtures for double-sided operation are solved, achieving stable chip fixation and efficient processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU MACROCORE SEMICON CO LTD
- Filing Date
- 2025-10-10
- Publication Date
- 2026-06-12
AI Technical Summary
Existing semiconductor chip fixing fixtures suffer from low efficiency in double-sided operations, quality and cycle time losses due to repeated clamping, excessive manual intervention required for the separation of clamping/movement/positioning actions, and insufficient size adaptability and repeatability accuracy, making it difficult to achieve continuous and efficient operations.
The design employs a combination of a rotating cylinder and a fixed frame to enable 360° rotation of the chip. Combined with a dynamic clamping mechanism using an inclined clamping plate and a movable bar, the clamping and movement are synchronized through the cooperation of the guide components and guide bars.
It improves the efficiency of double-sided operation, ensures processing accuracy and quality, reduces manual intervention, enhances overall production efficiency and processing accuracy, and adapts to the stable fixing of different chip sizes.
Smart Images
Figure CN120914159B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and more specifically, to a semiconductor chip processing fixture. Background Technology
[0002] Semiconductor chip fixtures are key tooling for front-end / back-end processes and functional testing. They are responsible for maintaining the reference and ensuring the stability of the chip during handling, positioning, clamping, and processing operations (such as soldering, dispensing, and probe testing). Their general goal is to provide reliable and repeatable clamping and alignment capabilities while minimizing stress and contamination risks.
[0003] In existing production lines, the basic workflow of common fixtures is as follows: first, the chip is placed on the fixture support platform, and then clamped by a clamping component. To accommodate chips of different sizes, the clamping component is usually adjustable. Although this type of solution can achieve basic fixation, its structure and process characteristics also bring a series of limitations.
[0004] First, support platforms are mostly fixed structures. Once the chip is clamped, testing / soldering can only be performed on the front side. When the process requires inspection or processing on the back side as well, it often requires multiple back-and-forth movements of unclamping, flipping, and reclamping, resulting in fragmented cycle times, lengthy processes, and the risk of pick-and-place deviations and surface damage with each repeated clamping, leading to low overall efficiency. The aforementioned problem of "only front-side operation and double-sided operation requiring two separate processes" is typical in traditional fixtures.
[0005] Secondly, fixing and disassembly rely on manual operation. Clamping / unclamping actions and platform movement are often decoupled, requiring additional manual assistance and confirmation when switching workstations. The process is cumbersome and highly dependent on the operator's experience, which is not conducive to achieving continuous, rhythmic, efficient operation and consistent control.
[0006] Furthermore, with the diversification of chip size, thickness, and packaging, if the clamping interface is only constrained in the planar direction, or if the clamping force is uneven and repeated positioning is difficult to stabilize, micro-displacement is likely to occur during handling / processing, affecting test accuracy and soldering quality. At the same time, the lack of a fast and predictable stroke and mechanical compensation mechanism when the fixture switches between different sizes will further amplify the above-mentioned instability.
[0007] In summary, the main pain points of existing semiconductor chip fixtures are: ① low efficiency in double-sided operations, with repeated clamping leading to quality and cycle time losses; ② separation of clamping / movement / positioning actions, requiring significant manual intervention and making it difficult to establish a stable continuous process; ③ insufficient dimensional adaptability and repeatability accuracy, and difficulty in balancing clamping stability and surface protection. The industry urgently needs a fixture solution with higher synergy in clamping, alignment, movement, and adaptability to improve double-sided operation capabilities and overall production line cycle time consistency while ensuring chip surface safety and positioning stability. Summary of the Invention
[0008] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.
[0009] Therefore, the purpose of this invention is to provide a semiconductor chip processing fixture, including a base, a mounting bracket disposed on the base, and a clamping mechanism located on the mounting bracket.
[0010] The clamping mechanism includes a fixed frame, on which a first transverse support plate and a second transverse support plate are respectively provided on both sides of the horizontal direction. The first transverse support plate is fixed to the fixed frame by a metal part. On both sides of the vertical direction of the fixed frame, a vertical support plate is provided. A first fixing strip is provided on the surface of the first transverse support plate, and a first clamping plate is provided on the surface of the first fixing strip. A second fixing strip is provided on the surface of both the second transverse support plate and the vertical support plate, and a second clamping plate is provided on the surface of the second fixing strip.
[0011] Rotating cylinders are provided through both sides of the fixed frame. One end of each rotating cylinder passes through the fixed frame and is movably connected to the bearing of the fixed frame. The two rotating cylinders are respectively provided with a first movable column for driving the second transverse pallet to move horizontally and a second movable column for driving the longitudinal pallet to move horizontally.
[0012] The first and second movable columns are each provided with a guide component at one end, and the base is provided with a first guide bar and a second guide bar that cooperate with the guide component.
[0013] As a preferred technical solution:
[0014] As described above, in a semiconductor chip processing fixture, the surfaces of the first fixing strip and the second fixing strip are flush, the first clamping plate and the second clamping plate are both inclined, and there are acute angles between the first fixing strip and the first clamping plate and between the second fixing strip and the second clamping plate.
[0015] Through the above technical solution, the first fixing strip and the second fixing strip can be enclosed to form a rectangular frame bracket. This shape design ensures that the bottom of the chip is not obstructed after the chip is placed. After the robot arm places the chip on the bracket, the chip can be placed stably, which is beneficial to the subsequent clamping effect.
[0016] As described above, a semiconductor chip processing fixture has a movable strip on the surface of the first fixing strip. One side of the movable strip is connected to the bottom side of the first clamping plate via a first spring. The surface of the first fixing strip has multiple sliding grooves, and the bottom surface of the movable strip is integrally formed with a T-shaped slider that matches the sliding grooves.
[0017] With the above technical solution, the movable strip is perpendicular to the first fixed strip and the movable strip is located below the first clamping plate. In this way, when the chip is placed on the first fixed strip and the second fixed strip, it will not touch the movable strip, ensuring that the chip is placed stably.
[0018] As described above, in a semiconductor chip processing fixture, a set of guide rods are welded and fixed to the side wall of the second transverse support plate, and the side wall of the second transverse support plate is welded and fixed to the first movable column. One end of the guide rod passes through the fixed frame, and a second spring is sleeved on the guide rod. Both ends of the second spring are welded and fixed to the fixed frame and the side wall of the second transverse support plate.
[0019] Through the above technical solution, the second transverse support plate can be fixed to the fixed frame by the guide rod, so that the second fixing strip and the second clamping plate on it can be kept horizontal.
[0020] As described above, in a semiconductor chip processing fixture, a protrusion extends vertically downward from the bottom surface of the longitudinal support plate. A lead screw threadedly passes through the protrusion and is connected to it. A set of guide posts slidably connected to the protrusion also passes through the protrusion. One end of the lead screw passes through the fixing frame and is connected to the fixing frame bearing. One end of the guide post passes through the fixing frame and is welded to the fixing frame.
[0021] Through the above technical solution, the protrusion can be fixed to the fixed frame by a set of guide posts, so that the longitudinal support plate can also be kept fixed by the protrusion, thereby ensuring that the second fixing strip and the second clamping plate on it remain horizontal.
[0022] As described above, in a semiconductor chip processing fixture, gears are fixed to both lead screws with pins, the threads of the two lead screws are in opposite directions, a connecting plate is welded to one end of the second movable column, and racks that mesh with the gears are welded to both sides of the connecting plate.
[0023] Through the above technical solution, the thread direction design of the two lead screws allows the protrusions on the two lead screws to move towards each other or away from each other when the two lead screws rotate synchronously, thereby achieving longitudinal clamping of the chip.
[0024] As described above, in a semiconductor chip processing fixture, one end of the rack is inserted into a fixed cylinder, which is hollow and has an open side. A third spring is provided inside the fixed cylinder, one end of the fixed cylinder is welded and fixed to the inner wall of the fixed frame, and both ends of the third spring are welded and fixed to the inner wall of the fixed cylinder and the end face of the rack.
[0025] Through the above technical solution, the fixed cylinder is used to support one end of the rack, preventing the rack from tilting due to its excessive length, and ensuring that the rack can always mesh with the gear during horizontal movement, which is a reasonable structure.
[0026] As described above, in a semiconductor chip processing fixture, the guide component includes a cylindrical connecting post, one end of which has a notch, and a roller is axially connected to the notch.
[0027] The first and second movable columns have grooves at one end for inserting connecting columns. Both the first and second movable columns are splined to the rotating cylinder. A circular rotating ring is welded and fixed on the groove wall. The outer circular wall of the connecting column has a groove that mates with the rotating ring.
[0028] With the above technical solution, the connecting column can rotate axially around the rotating ring in the groove, and the rotating ring can prevent the connecting column from falling out of the groove. Rubber pads can be adhered to the groove wall to create a certain friction between the connecting column and the rotating ring. In this way, the connecting column will not rotate on its own when it moves horizontally without the action of external force, ensuring that the rollers on it can always remain horizontal.
[0029] As described above, a semiconductor chip processing fixture includes a first guide bar comprising an integrally formed first inclined guide bar and a first straight guide bar, and a second guide bar comprising an integrally formed second inclined guide bar and a second straight guide bar. Guide grooves adapted to rollers are provided on the sides of the first inclined guide bar and the first straight guide bar, as well as on the sides of the second inclined guide bar and the second straight guide bar.
[0030] The first linear guide bar and the second linear guide bar are parallel to each other, and the first inclined guide bar and the second inclined guide bar are distributed in a figure-eight shape. Multiple columns are welded and fixed on the first linear guide bar and the second linear guide bar, and the bottom end of the column is slidably connected to the base.
[0031] Through the above technical solution, the column can move along the width of the base, and the positions of the first guide bar and the second guide bar can also be adjusted to accommodate chips of different sizes, thereby improving the applicability of the equipment.
[0032] Compared with the prior art, the present invention has at least the following beneficial effects:
[0033] (1) The rotating clamping mechanism for double-sided processing: This invention utilizes the coordinated design of a rotating cylinder and a fixed frame to enable the chip to rotate 360° within the fixed frame, thereby achieving double-sided processing. The core of this innovative design lies in the rotation of the rotating cylinder driving the fixed frame to rotate, with the chip rotating synchronously with the fixed frame, thus eliminating the need to disassemble the chip for double-sided operation. Unlike traditional fixtures that require processing the front and back sides of the chip separately, this invention significantly improves work efficiency, saves operation time, and avoids the risks of repeated loading and unloading. Simultaneously, this design effectively enhances the practicality of the equipment, especially suitable for applications requiring double-sided processing or testing, improving overall production efficiency and processing accuracy.
[0034] (2) A dynamic fixing method with precise clamping and enhanced adaptability: During the chip fixing process, this invention cleverly employs an inclined design of the first and second fixing bars, enabling the clamping plates to clamp the chip in both the horizontal and vertical directions. This design ensures stable chip fixing, preventing chip displacement or tilting during processing, thereby guaranteeing processing accuracy and quality. Furthermore, the fixing bar surface is equipped with a movable bar. Through the connection between the first spring and the first clamping plate, and the cooperation between the movable bar and the slide groove, the fixing bar can automatically adjust according to the chip size, adapting to chips of different sizes. This dynamic clamping method not only improves fixing accuracy but also better addresses the challenges posed by differences in chip size, solving the problems of unstable clamping and poor adaptability in traditional fixtures.
[0035] (3) Automated operation simplifies and efficiently synchronizes movement. The fixing frame of this invention moves horizontally through a rotating cylinder, while the cooperative design of the guide component and guide bar generates a squeezing force, driving the synchronous movement of the chip clamping mechanism. This innovative design enables the chip clamping and movement to be performed simultaneously, simplifying the complexity of manual operation in traditional fixtures and reducing operation time and labor costs. In particular, during the chip clamping and movement process, the chip's positioning and clamping remain stable, avoiding processing problems caused by uneven clamping force or positional deviation in traditional technologies. Furthermore, the chip clamping and fixing functions are completed automatically during operation, reducing manual intervention, improving work efficiency, and ensuring high-precision and high-efficiency operation of the chip throughout the entire processing flow. Attached Figure Description
[0036] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0037] Figure 1 This is an overall perspective view of the present invention;
[0038] Figure 2 This is a perspective view of the fixing frame and fixing bracket of the present invention;
[0039] Figure 3 This is a sectional perspective view of the fixed frame and rotating cylinder of the present invention;
[0040] Figure 4 This is a perspective view of the second cargo frame and the second fork of the present invention;
[0041] Figure 5 This is a perspective view of the longitudinal support plate and protrusion of the present invention;
[0042] Figure 6 For the present invention Figure 3 Enlarged view of point A in the middle;
[0043] Figure 7 This is a perspective view of the first guide bar and the second guide bar of the present invention.
[0044] In the diagram: 1. Base; 2. Fixing frame; 3. Fixing frame; 4. Rotating cylinder; 5. First transverse support plate; 6. First fixing strip; 7. First clamping plate; 8. Movable strip; 9. First spring; 10. Slider; 11. Slide groove; 12. Second transverse support plate; 13. Longitudinal support plate; 14. Second fixing strip; 15. Second clamping plate; 16. Guide rod; 17. Second spring; 18. First movable column; 19. Second movable column; 20. Protrusion; 21. Lead screw; 22. Gear; 23. Rack; 24. Fixing cylinder; 25. Third spring; 26. Connecting plate; 27. Connecting column; 28. Rotating ring; 29. Roller; 30. First inclined guide strip; 31. First linear guide strip; 32. Second inclined guide strip; 33. Second linear guide strip; 34. Guide groove; 35. Column. Detailed Implementation
[0045] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0046] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.
[0047] like Figures 1-4 As shown, an embodiment of the present invention discloses a semiconductor chip processing fixture, including a base 1, a fixing frame 2 disposed on the base 1, and a clamping mechanism located on the fixing frame 2.
[0048] The clamping mechanism includes a fixed frame 3. A first transverse support plate 5 and a second transverse support plate 12 are respectively provided on the transverse sides of the fixed frame 3. The first transverse support plate 5 is fixed to the fixed frame 3 by a metal part. A longitudinal support plate 13 is provided on both longitudinal sides of the fixed frame 3. A first fixing strip 6 is provided on the surface of the first transverse support plate 5. A first clamping plate 7 is provided on the surface of the first fixing strip 6. A second fixing strip 14 is provided on the surface of the second transverse support plate 12 and the longitudinal support plate 13. A second clamping plate 15 is provided on the surface of the second fixing strip 14.
[0049] Rotating cylinders 4 are provided through both sides of the fixed frame 3. One end of the rotating cylinder 4 passes through the fixed frame 2 and is movably connected to the bearing of the fixed frame 2. The two rotating cylinders 4 are respectively provided with a first movable column 18 for driving the second transverse support plate 12 to move horizontally and a second movable column 19 for driving the longitudinal support plate 13 to move horizontally.
[0050] The first movable column 18 and the second movable column 19 are each provided with a guide component at one end, and the base 1 is provided with a first guide bar and a second guide bar that cooperate with the guide component.
[0051] Specifically, during implementation, the robotic arm places the semiconductor chip on the first fixing bar 6 and three second fixing bars 14. After the chip is placed stably, the fixing frame 2 drives the fixing frame 3 to move linearly to move the chip to the processing equipment.
[0052] During the movement, the guide component on the first movable column 18 will come into contact with the first guide strip and be subjected to horizontal compression by the first guide strip, so that the first movable column 18 will move horizontally.
[0053] The guide component on the second movable column 19 will contact the second guide bar and be subjected to horizontal compression by the second guide bar, so that the second movable column 19 will move horizontally.
[0054] When the first movable column 18 moves, it will drive the second horizontal support plate 12 to move horizontally. The second horizontal support plate 12 will drive the second fixed bar 14 on it to move. The second clamping plate 15 will move synchronously and move closer to the first clamping plate 7. In this way, the first clamping plate 7 and the second clamping plate 15 can clamp the chip horizontally.
[0055] When the second movable column 19 moves, it will drive the two longitudinal support plates 13 to move horizontally and move closer to each other. The longitudinal support plates 13 will drive the second fixing bar 14 on them to move, and the second clamping plate 15 will move synchronously. In this way, the two second clamping plates 15 can clamp the chip longitudinally by moving closer to each other.
[0056] The chip is fixed in the above manner, which facilitates chip testing, soldering and other operations. In order to avoid scratching the chip during fixing, rubber pads are glued to the surfaces of the first fixing strip 6 and the second fixing strip 14, as well as the inner surfaces of the first clamping plate 7 and the second clamping plate 15.
[0057] After testing, welding and other operations are completed, the fixed frame 2 moves the fixed frame 3 to reset. At this time, the guide component separates from the first guide bar and the second guide bar. In this way, the second transverse support plate 12 and the longitudinal support plate 13 drive the second clamping plate 15 to move in the opposite direction and reset, so that the robot can remove the chip and continue to place the chip.
[0058] In one specific embodiment of the present invention, the first transverse support plate 5, the first fixing strip 6 and the first clamping plate 7 are all welded and fixed, the second transverse support plate 12 and the longitudinal support plate 13 are both welded and fixed to the second fixing strip 14, and the second fixing strip 14 and the second clamping plate 15 are welded and fixed.
[0059] Specifically, welding can improve the overall structural strength and stability, which is beneficial for the subsequent clamping and fixing of the chip.
[0060] In one specific embodiment of the present invention, the fixing frame 2 is connected to the base 1 through a linear screw module, and a motor is provided on the fixing frame 2. The motor and the rotating cylinder 4 are connected by gear transmission.
[0061] Specifically, such as Figure 1 As shown, the linear screw module can drive the fixed frame 2 to perform linear reciprocating motion along the length direction of the base 1.
[0062] After the motor is powered on, it can drive the rotating cylinder 4 to rotate axially. The rotating cylinder 4 can drive the fixed frame 3 to rotate 180°, thereby realizing the flipping of the chip inside the fixed frame 3, so as to facilitate the processing of both sides of the chip.
[0063] The fixing frame 2 has a "U" shaped structure. This design ensures that the fixing frame 3 will not collide with the fixing frame 2 when it is flipped.
[0064] In one specific embodiment of the present invention, the surfaces of the first fixing strip 6 and the second fixing strip 14 are flush, the first clamping plate 7 and the second clamping plate 15 are both inclined, and there are acute angles between the first fixing strip 6 and the first clamping plate 7 and between the second fixing strip 14 and the second clamping plate 15.
[0065] Specifically, such as Figure 3 and Figure 4As shown, when the first clamping plate 7 and the second clamping plate 15 come into contact with the side of the chip, since the first clamping plate 7 and the second clamping plate 15 are inclined, the chip can be limited not only in the vertical direction, but also in the horizontal direction, so as to ensure the chip is fixed.
[0066] In one specific embodiment of the present invention, a movable strip 8 is provided on the surface of the first fixed strip 6, and one side of the movable strip 8 is connected to the bottom side of the first clamping plate 7 through a first spring 9. A plurality of sliding grooves 11 are provided on the surface of the first fixed strip 6, and a T-shaped slider 10 adapted to the sliding grooves 11 is integrally formed on the bottom surface of the movable strip 8.
[0067] Specifically, such as Figure 5 As shown, the opening direction of the slide groove 11 is consistent with the width direction of the first fixed strip 6. The movable strip 8 can move horizontally along the slide groove 11 through the slider 10. When the second transverse support plate 12 drives the second clamping plate 15 to move, it will also drive the chip to move towards the first clamping plate 7 until the first clamping plate 7 and the second clamping plate 15 clamp the chip on both sides laterally.
[0068] During this process, the side of the chip will contact the movable bar 8 and drive the movable bar 8 to move synchronously. When the movable bar 8 moves, it will compress the first spring 9. When the second horizontal support plate 12 drives the second clamping plate 15 to reset, the first spring 9 will gradually recover its deformation. In this way, the first spring 9 can push the movable bar 8 to reset, and the movable bar 8 can push the chip to move synchronously. This design avoids the second fixing bar 14 on the second horizontal support plate 12 from separating from the chip, and at the same time ensures that when the robot picks up the chip upward, the movement of the chip will not be blocked by the first clamping plate 7.
[0069] In one specific embodiment of the present invention, a set of guide rods 16 are welded and fixed to the side wall of the second transverse support plate 12, and the side wall of the second transverse support plate 12 is welded and fixed to the first movable column 18. One end of the guide rod 16 passes through the fixed frame 3, and a second spring 17 is sleeved on the guide rod 16. Both ends of the second spring 17 are welded and fixed to the fixed frame 3 and the side wall of the second transverse support plate 12.
[0070] Specifically, such as Figure 3 As shown, the second transverse support plate 12 can move linearly on the fixed frame 3 via the guide rod 16. When the first movable column 18 drives the second transverse support plate 12 to move horizontally, the second spring 17 is in a stretched state. When the guide on the first movable column 18 separates from the first guide strip, the second spring 17 returns to its natural length, which can drive the second transverse support plate 12 to reset, and the first movable column 18 will move synchronously and reset.
[0071] In one specific embodiment of the present invention, a protrusion 20 is formed on the bottom surface of the longitudinal support plate 13 extending vertically downward. A screw 21 threadedly connected to the protrusion 20 passes through the protrusion 20. A set of guide posts slidably connected to the protrusion 20 also passes through the protrusion 20. One end of the screw 21 passes through the fixed frame 3 and is connected to the fixed frame 3 by a bearing. One end of the guide post passes through the fixed frame 3 and is welded to the fixed frame 3.
[0072] Gears 22 are fixed to both lead screws 21 by pins. The threads of the two lead screws 21 are turned in opposite directions. A connecting plate 26 is welded to one end of the second movable column 19. Racks 23 that mesh with gears 22 are welded to both sides of the connecting plate 26.
[0073] Specifically, such as Figure 2 and 4 As shown, the protrusion 20 can move linearly on the fixed frame 3 via the guide post. When the second movable post 19 moves horizontally, it will drive the connecting plate 26 on it to move. The connecting plate 26 will drive the two racks 23 on it to move horizontally. The moving racks 23 will drive the gear 22 to rotate, and the lead screw 21 will rotate synchronously. It will also drive the longitudinal support plate 13 to move synchronously via the protrusion 20. Since the threads of the two lead screws 21 are opposite, the two longitudinal support plates 13 can move closer to each other. The two longitudinal support plates 13 will drive the second clamping plate 15 to move synchronously via the second fixed bar 14 and clamp the longitudinal sides of the chip.
[0074] In one specific embodiment of the present invention, one end of the rack 23 is inserted into the fixed cylinder 24. The fixed cylinder 24 is hollow and one side of the fixed cylinder 24 is open. A third spring 25 is provided inside the fixed cylinder 24. One end of the fixed cylinder 24 is welded and fixed to the inner wall of the fixed frame 3. Both ends of the third spring 25 are welded and fixed to the inner wall of the fixed cylinder 24 and the end face of the rack 23.
[0075] Specifically, such as Figure 2 and 4 As shown, when the rack 23 moves with the connecting plate 26, it also moves synchronously inside the fixed cylinder 24, thus ensuring that the rack 23 can maintain horizontal movement. During the movement of the rack 23, the third spring 25 will be compressed.
[0076] When the guide assembly on the second movable column 19 separates from the second guide bar, the third spring 25 loses the compression of the rack 23 and returns to its natural length, thereby pushing the rack 23 to move in the opposite direction. The rack 23 moving in the opposite direction pushes the two gears 22 to rotate. At this time, the lead screw 21 drives the two longitudinal support plates 13 to move away from each other through the protrusion 20. The longitudinal support plates 13 drive the second clamping plate 15 to move through the second fixing bar 14 and separate from the longitudinal sides of the chip.
[0077] In one specific embodiment of the present invention, the guide component includes a cylindrical connecting post 27, one end of which has a notch, and a roller 29 is axially connected inside the notch.
[0078] The first movable column 18 and the second movable column 19 have grooves at one end for inserting the connecting column 27. A circular rotating ring 28 is welded and fixed on the groove wall. The outer circular wall of the connecting column 27 has a groove that matches the rotating ring 28.
[0079] The first guide bar includes an integrally formed first inclined guide bar 30 and a first straight guide bar 31, and the second guide bar includes an integrally formed second inclined guide bar 32 and a second straight guide bar 33. The sides of the first inclined guide bar 30 and the first straight guide bar 31, as well as the sides of the second inclined guide bar 32 and the second straight guide bar 33, are provided with guide grooves 34 that are adapted to the roller 29.
[0080] Specifically, such as Figure 3 , Figure 6 and Figure 7 As shown, the first guide bar and the second guide bar are designed one in front of the other, so that the horizontal clamping and vertical clamping of the chip are performed separately.
[0081] When the fixed frame 2 drives the fixed frame 3 to move horizontally in a straight line, the first movable column 18 and the second movable column 19 move synchronously.
[0082] The movement of the first movable column 18 is as follows: When the connecting column 27 on the first movable column 18 moves to the first inclined guide bar 30, the roller 29 on the connecting column 27 moves into the guide groove 34 and rolls along the first inclined guide bar 30 through the guide groove 34. At this time, the roller 29 will be gradually squeezed by the horizontal pressure of the first inclined guide bar 30 as it rolls, and then the connecting column 27 will be squeezed synchronously and push the first movable column 18 to move until the roller 29 rolls along the guide groove 34 to the first straight guide bar 31. In this way, the first movable column 18 can maintain its moved state and continue to move horizontally and linearly with the fixed frame 3.
[0083] The movement of the second movable column 19 is as follows: When the connecting column 27 on the second movable column 19 moves to the second inclined guide bar 32, the roller 29 on the connecting column 27 moves into the guide groove 34 and rolls along the second inclined guide bar 32 through the guide groove 34. At this time, the roller 29 will be gradually squeezed by the horizontal pressure of the second inclined guide bar 32 as it rolls, and then the connecting column 27 will be squeezed synchronously and push the second movable column 19 to move until the roller 29 rolls along the guide groove 34 to the second straight guide bar 33. In this way, the second movable column 19 can maintain its moved state and continue to move horizontally and linearly with the fixed frame 3.
[0084] In one specific embodiment of the present invention, both the first movable column 18 and the second movable column 19 are splinedly connected to the rotating cylinder 4.
[0085] Specifically, the first movable column 18 and the second movable column 19 can transmit torque between themselves and the rotating cylinder 4. That is, when the rotating cylinder 4 rotates, it can drive the first movable column 18 and the second movable column 19 to rotate synchronously. When the roller 29 is located in the guide groove 34, the connecting column 27 will not rotate with the first movable column 18 and the second movable column 19, thus ensuring that the roller 29 can always be in a horizontal position.
[0086] In one specific embodiment of the present invention, the first linear guide bar 31 and the second linear guide bar 33 are parallel to each other, the first inclined guide bar 30 and the second inclined guide bar 32 are distributed in a figure-eight shape, and multiple columns 35 are welded and fixed on the first linear guide bar 31 and the second linear guide bar 33, and the bottom end of the column 35 is slidably connected to the base 1.
[0087] Specifically, such as Figure 1 As shown, when it is necessary to fix chips of different sizes, the positions of the first guide bar and the second guide bar can be adjusted by moving the column 35. This can adjust the moving distance of the first movable column 18 and the second movable column 19. Correspondingly, the moving distances of the second horizontal support plate 12 and the vertical support plate 13 also change accordingly.
[0088] The column 35 and the base 1 are sliding via guide rails or other sliding methods, and are equipped with corresponding mechanical limits to ensure that the first guide bar and the second guide bar can remain fixed after sliding.
[0089] In the description of this specification, terms such as "connection," "installation," and "fixation" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meanings of the above terms within this invention based on the specific circumstances.
[0090] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0091] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A semiconductor chip processing fixture, comprising a base (1), a mounting bracket (2) disposed on the base (1), and a clamping mechanism located on the mounting bracket (2). Its features are: The clamping mechanism includes a fixed frame (3), on which a first transverse support plate (5) and a second transverse support plate (12) are respectively provided on the transverse sides. The first transverse support plate (5) is fixed to the fixed frame (3) by a metal part. The fixed frame (3) has a longitudinal support plate (13) on both longitudinal sides. The surface of the first transverse support plate (5) is provided with a first fixing strip (6) and the surface of the first fixing strip (6) is provided with a first clamping plate (7). The surfaces of the second transverse support plate (12) and the longitudinal support plate (13) are both provided with a second fixing strip (14) and the surface of the second fixing strip (14) is provided with a second clamping plate (15). Rotating cylinders (4) are provided through the horizontal sides of the fixed frame (3). One end of the rotating cylinder (4) passes through the fixed frame (2) and is movably connected to the bearing of the fixed frame (2). The two rotating cylinders (4) are respectively provided with a first movable column (18) for driving the second horizontal support plate (12) to move horizontally and a second movable column (19) for driving the longitudinal support plate (13) to move horizontally. The first movable column (18) and the second movable column (19) are each provided with a guide component at one end, and the base (1) is provided with a first guide bar and a second guide bar that cooperate with the guide component; The surfaces of the first fixing strip (6) and the second fixing strip (14) are flush, the first clamping plate (7) and the second clamping plate (15) are both inclined, and there are acute angles between the first fixing strip (6) and the first clamping plate (7) and between the second fixing strip (14) and the second clamping plate (15). The first fixed strip (6) has a movable strip (8) on its surface. One side of the movable strip (8) is connected to the bottom side of the first clamping plate (7) through a first spring (9). The first fixed strip (6) has multiple sliding grooves (11) on its surface. The bottom surface of the movable strip (8) has a T-shaped slider (10) that matches the sliding groove (11). A set of guide rods (16) are welded and fixed to the side wall of the second transverse support plate (12). The side wall of the second transverse support plate (12) is welded and fixed to the first movable column (18). One end of the guide rod (16) passes through the fixed frame (3). A second spring (17) is sleeved on the guide rod (16). Both ends of the second spring (17) are welded and fixed to the fixed frame (3) and the side wall of the second transverse support plate (12). The bottom surface of the longitudinal support plate (13) extends vertically downward to form a protrusion (20). A threaded rod (21) is threaded through the protrusion (20). A set of guide posts is also threaded through the protrusion (20) and slidably connected to it. One end of the threaded rod (21) passes through the fixed frame (3) and is connected to the fixed frame (3) bearing. One end of the guide post passes through the fixed frame (3) and is welded to the fixed frame (3). Gears (22) are fixed to both lead screws (21) with pins. The threads of the two lead screws (21) are in opposite directions. A connecting plate (26) is welded to one end of the second movable column (19). Racks (23) that mesh with gears (22) are welded to both sides of the connecting plate (26).
2. The semiconductor chip processing fixture according to claim 1, characterized in that: One end of the rack (23) is inserted into the fixed cylinder (24). The fixed cylinder (24) is hollow and has an open side. A third spring (25) is provided inside the fixed cylinder (24). One end of the fixed cylinder (24) is welded and fixed to the inner wall of the fixed frame (3). Both ends of the third spring (25) are welded and fixed to the inner wall of the fixed cylinder (24) and the end face of the rack (23).
3. The semiconductor chip processing fixture according to claim 1, characterized in that: The guide assembly includes a cylindrical connecting post (27), one end of which has a notch, and a roller (29) is axially connected inside the notch.
4. A semiconductor chip processing fixture according to claim 3, characterized in that: The first movable column (18) and the second movable column (19) have a groove at one end for inserting the connecting column (27). Both the first movable column (18) and the second movable column (19) are splined connected to the rotating cylinder (4). A circular rotating ring (28) is welded and fixed on the groove wall. A groove that matches the rotating ring (28) is provided on the outer circular wall of the connecting column (27).
5. A semiconductor chip processing fixture according to claim 3, characterized in that: The first guide bar includes an integrally formed first inclined guide bar (30) and a first straight guide bar (31), and the second guide bar includes an integrally formed second inclined guide bar (32) and a second straight guide bar (33). The sides of the first inclined guide bar (30) and the first straight guide bar (31) as well as the sides of the second inclined guide bar (32) and the second straight guide bar (33) are provided with guide grooves (34) that are adapted to the roller (29). The first linear guide (31) and the second linear guide (33) are parallel to each other, and the first inclined guide (30) and the second inclined guide (32) are distributed in a figure-eight shape. Multiple columns (35) are welded and fixed on the first linear guide (31) and the second linear guide (33). The bottom end of the column (35) is slidably connected to the base (1).