High-stability fine copper circuit and preparation method thereof

Abstract

The invention discloses a high-stability fine copper circuit and a preparation method thereof. The preparation method comprises the following steps: photoetching a fine copper circuit substrate to obtain a substrate with a curved structure on the surface; the method comprises the following steps: soaking a base material with a curved structure on the surface in a developer solution containing a chemical plating catalyst for first treatment, taking out and drying after a to-be-exposed area is completely covered with the chemical plating catalyst, and soaking the to-be-exposed area in a copper plating solution for second treatment to obtain the high-stability fine copper circuit. According to the method, the fine copper circuit base material with the bending structure is prepared, so that in the copper plating process, contact sites of the base material and copper are increased, the surface binding force of the copper and the fine copper circuit base material is improved, the service life of the fine copper circuit is prolonged, and continuous and efficient industrial production can be carried out.

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