Intelligent chip repair device and method

Abstract

The application discloses a kind of intelligent chip repair device and method, it is related to intelligent chip repair equipment technical field, including workbench, workbench is equipped with intelligent chip inspection transparent plate, the top of intelligent chip inspection transparent plate is provided with moving beam plate, the first load plate is provided in moving beam plate, the side of first load plate is provided with second load plate, the side of second load plate is provided with loading frame, multiple connecting rods are provided in loading frame, the clamping plate is equipped in the bottom of connecting rod, the side of lifting frame in the top of fixed beam plate is equipped with pulse laser, transmission assembly is provided in lifting frame.The application eliminates the overshoot and chattering of traditional servo system, so that the pulse laser enters the ultra-stable stationary state instantaneously after completing the angle adjustment, ensuring that the laser focusing spot can precisely act on the micron-level bridging or virtual welding point without drift, achieving high-reliability repair operation, greatly improving the repair precision and reliability of intelligent chip.

Description

Technical Field

[0001] This invention relates to the field of intelligent chip repair equipment technology, and specifically discloses an intelligent chip repair device and method. Background Technology

[0002] The interface of smart chips widely adopts ball grid array packaging, also known as BGA packaging. Its bottom surface features an array of micron-sized solder balls, which are the core for achieving electrical and mechanical connections. Reflow soldering technology is the most critical process for achieving high-density connections. This technology uses a precisely controlled reflow oven to subject the PCB board with printed solder paste to a precise temperature profile of preheating, isothermal control, reflow, and cooling. This causes all BGA solder balls and PCB pads to melt simultaneously and form a strong metallurgical bond. Reflow soldering technology can efficiently complete high-quality soldering of thousands of solder joints in one pass, perfectly meeting the development needs of smart chips for high pin counts, high signal frequencies, and miniaturization, and significantly improving production automation and efficiency.

[0003] Currently, reflow soldering technology often suffers from two typical defects: bridging and cold solder joints. First, bridging primarily manifests as excess solder connecting adjacent solder balls, creating a short circuit. The main contributing factors to bridging are: insufficient stencil aperture precision during solder paste printing, excessive solder paste due to poor demolding, and excessively rapid temperature rise during reflow. Second, cold solder joints occur when the solder balls fail to form an effective intermetallic compound layer with the pads, resulting in unreliable connections. This phenomenon usually stems from oxidation on the pad or solder ball surface, coupled with improper reflow temperature profile settings that prevent the flux from effectively removing oxides. This leads to internal stress between the chip and the PCB substrate due to a mismatch in thermal expansion coefficients, causing cracks in the fragile solder joint interface.

[0004] The aforementioned issues not only directly affect the electrical performance, connectivity, and signal integrity of smart chips, but also pose a serious challenge to the long-term reliability of the products. Therefore, most smart chip manufacturers need to use smart chip inspection boards to inspect the reflow soldering quality of the chip interface surfaces. These inspection boards primarily employ X-ray inspection technology, which provides non-destructive imaging of the BGA solder ball interface surfaces. By analyzing the shape, contour, density, and internal structure of the solder joints, the presence of reflow soldering defects such as bridging, cold solder joints, and voids can be accurately determined, thereby assessing the soldering quality. Subsequently, a pulsed laser is used, with its laser beam precisely focused on the defect points, enabling micron-level precision repair of the reflow soldering defects in the smart chip. Currently, most pulsed lasers are driven by a single motor to adjust the laser beam emission angle. However, this existing technology is prone to significant overshoot and jitter after the motion is completed due to system inertia and lack of control. This instability will directly cause the focused spot to drift on the processing surface, making it impossible for the laser pulse to accurately target the preset micron-level defect point, resulting in repair failure. It may even damage the surrounding normal solder ball structure, seriously affecting the accuracy and reliability of smart chip repair. Summary of the Invention

[0005] To address the problems of low repair accuracy and poor reliability in current smart chip repair processes, this invention provides a smart chip repair device and method.

[0006] To address the above problems, in a first aspect, the present invention provides the following technical solution: A smart chip repair device includes a workbench on which a smart chip inspection plate is fixedly mounted. The smart chip inspection plate is used to inspect and identify BGA solder balls that have failed reflow soldering at the smart chip interface. Above the smart chip inspection plate is a movable beam plate that can move horizontally along the X-axis. A first load plate that can move horizontally along the Y-axis is located on the side of the movable beam plate facing the smart chip inspection plate. A second load plate that can rotate along the X-axis is located on the side of the first load plate. A loading frame that can move vertically along the Z-axis is located on the side of the second load plate. The loading frame contains multiple vertical supports that move along the Z-axis. A linear displacement connecting rod is connected to a clamping plate at its bottom. The clamping plate is used to stably clamp the smart chip inside the smart chip inspection board. A fixed beam plate is provided on the side of the moving beam plate facing away from the smart chip inspection board and is fixedly connected to the workbench. A lifting frame that moves vertically along the Z-axis is provided above the fixed beam plate. A pulsed laser is provided on the side of the lifting frame. A rotatable transmission component is provided inside the lifting frame. The transmission component is used to drive the pulsed laser to rotate along the Y-axis with high precision and ensure that the pulsed laser is in a super-stable static state after rotation. The pulsed laser is used to repair the BGA solder balls on the interface surface of the smart chip.

[0007] Preferably, a first electric lead screw guide is fixedly installed on the workbench. The first electric lead screw guide is arranged horizontally along the X-axis. A first I-beam is fastened to the sliding end of the first electric lead screw guide. The top of the first I-beam is fastened to the bottom of the moving beam plate. A first servo motor for providing power to the first electric lead screw guide is installed at the end of the first electric lead screw guide.

[0008] Preferably, a second electric lead screw guide is fixedly installed on the side of the movable beam plate facing the intelligent chip inspection plate. The second electric lead screw guide is arranged horizontally along the Y-axis. A second servo motor for providing power to the end of the second electric lead screw guide is installed. A second I-beam is fastened to the sliding end of the second electric lead screw guide. The second I-beam is fastened to one side of the first load plate. A through slot is provided on the workbench to facilitate the rotation of the second load plate. A servo turntable is fixedly installed on the other side of the first load plate. The rotation output end of the servo turntable is fastened to the second load plate.

[0009] Preferably, a third electric lead screw guide is fixedly installed on the side of the second load plate. The third electric lead screw guide is arranged vertically along the Z-axis direction. A third servo motor for providing power to the third electric lead screw guide is installed on the top of the third electric lead screw guide. A third I-beam is fastened to the sliding end of the third electric lead screw guide. The third I-beam is fastened to the loading frame.

[0010] Preferably, a guide cylinder arranged vertically in the Z-axis direction is fixedly installed inside the loading frame. A loading plate is fixedly connected to the guide rod end of the guide cylinder. A slide rail is provided below the guide cylinder and is tightly connected to the inner side of the loading frame. The slide rail is arranged vertically in the Z-axis direction. A slidingly fitted slider is installed on the slide rail. The slider is tightly connected to the loading plate. An ear plate is fixedly installed on the inner side of the loading plate. The top end of the connecting rod is tightly connected to the ear plate. A position sensor is fixedly installed on the outer wall of the connecting rod. A sleeve block is fixedly installed at the bottom end of the connecting rod. Multiple square through slots are opened on the clamping plate. The sleeve block is interference-fitted with the square through slots.

[0011] Preferably, a square frame is provided below the square through slot, which is fastened to the clamping plate.

[0012] Preferably, a fourth electric lead screw guide rail is fastened to the fixed beam plate. The fourth electric lead screw guide rail is arranged vertically along the Z-axis direction. A fourth servo motor for providing power to the fourth electric lead screw guide rail is provided on the side of the fourth electric lead screw guide rail. The lifting frame is fastened to the sliding end of the fourth electric lead screw guide rail. A fifth servo motor is fixedly installed on the side of the lifting frame. The fifth servo motor is driven and cooperates with the pulse laser through a transmission component.

[0013] Preferably, the transmission assembly includes a driven rotating rod connected to the output end of the fifth servo motor. The driven rotating rod is horizontally arranged along the Y-axis. A support sleeve is fixedly installed inside the lifting frame. The outer wall of the driven rotating rod is rotatably engaged with the support sleeve. A transmission disk is provided inside the lifting frame. The outer wall of the transmission disk is rotatably engaged with the inner wall of the lifting frame. Multiple uniformly arranged and circumferentially arrayed external brackets are fixedly installed on the outer wall of the transmission disk. An arc-shaped plate is fixedly installed on the outer wall of the driven rotating rod. An arc-shaped groove is provided on the inner side of the inner end of the external bracket. The outer peripheral wall of the arc-shaped plate is rotatably engaged with the inner groove wall of the arc-shaped groove. A drive rotating rod is fixedly installed on the disk surface facing away from the driven rotating rod. The drive rotating rod is fastened to the pulse laser.

[0014] Preferably, the transmission disc has a central groove on the side facing the driven rod. Multiple strip-shaped through-slots are arranged radially around the central groove. An external bracket is positioned between two adjacent strip-shaped through-slots. An extension plate is fixedly mounted on the end of the driven rod, and a transmission cylinder is fixedly mounted on the side of the extension plate. The transmission cylinder is arranged parallel to the driven rod. The outer peripheral wall of the external bracket is arc-shaped, and the transmission cylinder slides in contact with the inner wall of the strip-shaped through-slots and the outer peripheral wall of the external bracket.

[0015] On the other hand, the present invention also provides a smart chip repair method, the method comprising: S1: Place the smart chip on the smart chip test board with the interface side of the smart chip facing down, so that the X-rays emitted from the smart chip test board can irradiate the interface side of the smart chip. The interface side of the smart chip is imaged by the X-ray imaging system to accurately locate and identify BGA solder balls with bridging problems and cold solder joint problems on the interface side of the smart chip. S2: By controlling the first electric lead screw guide rail and the second electric lead screw guide rail, the position of the clamping plate in the X-axis and Y-axis directions is adjusted, and under the coordinated control of the third electric lead screw guide rail and the fourth electric lead screw guide rail, the smart chip with problems is stably clamped by the clamping plate. S3: By controlling the servo turntable, the gripping plate rotates 180° along the X-axis, arranging the interface face of the smart chip upwards. By starting the fifth servo motor, the driven rotating rod rotates. Each rotation of the driven rotating rod causes the outer peripheral wall of the arc plate to rotate and engage with the inner groove wall of the arc groove in the single external bracket. At the same time, the transmission cylinder slides and engages with the inner groove wall of the strip through groove and the outer peripheral wall of the external bracket, causing the transmission disk to rotate. This causes the pulsed laser to rotate along the Y-axis and then reach a super-stable stationary state. The focused spot emitted by the pulsed laser then repairs the BGA solder balls that have bridging or cold solder joint problems.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention assembles a transmission component inside the lifting frame. When the fifth servo motor drives the driven rotating rod to rotate, the transmission cylinder fixed on it starts from the center groove of the transmission disk, embeds itself into the radial strip groove, and then slides against the outer bracket of the arc-shaped outer peripheral wall, thereby driving the transmission disk to rotate. After the rotation is completed, the transmission cylinder can re-enter the center groove and instantly cut off the rotation driving force of the transmission disk, thus entering an ultra-stable static state. The above-mentioned cooperation structure eliminates the overshoot and jitter caused by inertia or encoder feedback delay in traditional servo systems. It allows the pulse laser to instantly enter an ultra-stable static state after completing the angle adjustment. This absolute stability ensures that the laser focused spot can accurately act on micron-level bridging or cold solder joints without drift. By vaporizing excess solder or local remelting, a highly reliable repair operation is achieved, greatly improving the repair accuracy and reliability of smart chips. 2. In this invention, the first electric lead screw guide rail drives the moving beam plate to move along the X-axis, providing a wide range of positioning for the clamping mechanism. The second electric lead screw guide rail controls the precise positioning of the Y-axis, and the servo turntable can drive the entire clamping plate to rotate 180°, accurately flipping the smart chip from the smart chip inspection plate to the repair working condition. This flipping action avoids manual operation and ensures that the chip's posture is controllable during the transfer process. At the same time, the loading plate and clamping plate, driven by the guide cylinder and reinforced by the slide rail and slider, achieve flexible and stable gripping of the chip through multiple square frames, eliminating the risk of slippage or pressure damage, and avoiding electrostatic damage and physical impact damage that may be introduced by manual intervention. It is suitable for batch repair scenarios of high-value chips. 3. On the one hand, this invention allows for customization of the transmission components under different operating conditions. Operators can adjust the number of slots and external brackets on the transmission disk according to the array density and spacing of different chip BGA solder balls, thereby changing the angle of a single rotation of the pulsed laser to ensure that the laser beam can cover all defect points with the optimal path. On the other hand, position sensors on multiple connecting rods can monitor the stress at each point in real time, ensuring that chips of different sizes and weights, from tiny sensor chips to large AI processors, can be clamped stably and evenly, preventing internal cracks caused by stress concentration. The above-mentioned cooperative structures effectively improve the flexibility of the overall device, giving the intelligent chip repair device strong adaptability and making it easy to adapt to more advanced repair processes in the future, demonstrating a long equipment life cycle and technological foresight. Attached Figure Description

[0017] To more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the overall structure of the intelligent chip repair device of the present invention; Figure 2 This is a schematic diagram of the intelligent chip inspection plate arrangement structure of the present invention; Figure 3 This is a schematic diagram of the movable beam plate installation structure of the present invention; Figure 4 This is a schematic diagram of the installation structure of the first load board and the second load board of the present invention. Figure 5 This is a schematic diagram of the loading rack installation structure of the present invention; Figure 6 This is a schematic diagram of the loading plate mounting structure of the present invention; Figure 7 This is a schematic diagram of the square frame mounting structure of the present invention; Figure 8 This is a schematic diagram of the lifting frame installation structure of the present invention; Figure 9 This is a schematic diagram of the transmission component arrangement structure of the present invention; Figure 10 This is a schematic diagram of the driven rotating rod mounting structure of the present invention; Figure 11 This is a schematic diagram of the arc-shaped plate and transmission cylinder mounting structure of the present invention; Figure 12 This is a schematic diagram of the transmission disc structure of the present invention; Figure 13 This is a schematic diagram of the drive rotor arrangement structure of the present invention; In the diagram: 1. Workbench, 2. Intelligent chip inspection plate, 3. Moving beam plate, 4. First load plate, 5. Second load plate, 6. Loading frame, 7. Connecting rod, 8. Clamping plate, 9. Fixed beam plate, 10. Lifting frame, 11. Pulsed laser, 12. Transmission assembly, 1201. Driven rotating rod, 1202. Transmission disc, 1203. External bracket, 1204. Arc plate, 1205. Arc groove, 1206. Drive rotating rod, 1207. Disc center groove, 1208. Strip through groove, 1209. Extension plate, 1210. Transmission cylinder, 13. First electric lead screw guide rail. 14. First I-beam base, 15. First servo motor, 16. Second electric lead screw guide rail, 17. Second servo motor, 18. Second I-beam base, 19. Through slot, 20. Servo turntable, 21. Third electric lead screw guide rail, 22. Third servo motor, 23. Third I-beam base, 24. Guide cylinder, 25. Loading plate, 26. Slide rail, 27. Slider, 28. Ear plate, 29. Position sensor, 30. Socket block, 31. Square through slot, 32. Square frame, 33. Fourth electric lead screw guide rail, 34. Fourth servo motor, 35. Fifth servo motor, 36. Support sleeve. Detailed Implementation

[0018] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0019] This specific embodiment provides an intelligent chip repair device, such as... Figures 1-10As shown, the device includes a workbench 1, which has a two-layer structure. The lower layer houses the space for the device's controllers, and multiple cooling fans are installed on the lower outer shell of the workbench 1 to ensure the long-term stable operation of the controllers. Universal locking casters can be installed on the bottom of the workbench 1 for easy movement and positioning. The upper layer of the workbench 1 is the intelligent chip repair area. Protective partitions can be added to the outer perimeter of the upper layer to form a closed area, preventing airborne dust from adversely affecting the intelligent chip repair work. A control panel can be added to the outer perimeter of the upper layer of the workbench 1 to allow operators to control the overall operation process of the device.

[0020] A smart chip inspection plate 2 is fixedly installed on the platform between the upper and lower layers of the workbench 1. The smart chip inspection plate 2 is a relatively mature existing technology. It has multiple inspection slots on its upper part to facilitate the placement of smart chips. An X-ray detection system is set inside it. When the smart chip is placed in its inspection slot, the X-ray detection system can perform imaging processing on the BGA solder ball array on the interface surface of the smart chip to generate clear two-dimensional or three-dimensional images. Through professional image analysis software, the system can automatically identify and judge various quality states of the solder joints, including detecting bridging short circuits caused by excessive solder, cold solder joints or pillow effects caused by poor wetting, and void defects inside the solder, thereby achieving efficient, accurate and non-destructive evaluation of the reliability of the soldered connection.

[0021] Two first electric lead screw guide rails 13 are fixedly installed on the platform of the workbench 1. Both first electric lead screw guide rails 13 are arranged horizontally along the X-axis and on both sides of the intelligent chip inspection plate 2. The sliding ends of the two first electric lead screw guide rails 13 are fastened to first I-beam seats 14. The tops of the two first I-beam seats 14 are simultaneously fastened to the bottom of the moving beam plate 3. The ends of the two first electric lead screw guide rails 13 are equipped with first servo motors 15 for providing them with power. The two first servo motors 15 are arranged inside the lower layer of the workbench 1, so that they jointly drive the moving beam plate 3 to move horizontally along the X-axis, so as to flexibly adjust the arrangement position of the moving beam plate 3 in this device.

[0022] A second electric lead screw guide rail 16 is fixedly installed on the side of the movable beam plate 3 facing the intelligent chip inspection plate 2. One second electric lead screw guide rail 16 is provided and is arranged horizontally along the Y-axis. A second servo motor 17 for providing power to the end of the second electric lead screw guide rail 16 is installed. A second I-beam 18 is fastened to the sliding end of the second electric lead screw guide rail 16. The second I-beam 18 is fastened to one side of the first load plate 4, allowing the second electric lead screw guide rail 16 to drive the first load plate 4 to move horizontally along the Y-axis. A servo turntable 20 is fixedly installed on the other side of the first load plate 4. The stable support end of the servo turntable 20 is fastened to the first load plate 4, and the rotation output end of the servo turntable 20 is fastened to the second load plate 5, allowing the servo turntable 20 to drive the second load plate 5 to rotate along the X-axis.

[0023] A third electric lead screw guide rail 21 is fixedly installed on the side of the second load plate 5. One third electric lead screw guide rail 21 is provided and arranged vertically along the Z-axis. A third servo motor 22 for supplying power to the third electric lead screw guide rail 21 is installed on its top. A third I-beam 23 is fastened to the sliding end of the third electric lead screw guide rail 21. The third I-beam 23 is fastened to the loading frame 6, thereby driving the loading frame 6 to move vertically along the Z-axis.

[0024] Two guide cylinders 24 are fixedly installed inside the loading frame 6. The two guide cylinders 24 are symmetrically arranged and both are vertically arranged in the Z-axis direction. The guide rod ends of the guide cylinders 24 are vertically downward, and the bottom of each cylinder is fixedly connected to a loading plate 25. Each guide cylinder 24 has a slide rail 26 on its lower side, which is tightly connected to the inner side of the loading frame 6. The slide rail 26 is vertically arranged in the Z-axis direction, and each slide rail 26 has a slidingly engaged slider 27. The slider 27 is tightly connected to the loading plate 25, and the engagement structure between the slider 27 and the slide rail 26 provides stability for the vertical movement of the loading plate 25. Multiple ear plates 28 are fixedly installed inside each loading plate 25. A connecting rod 7 is tightly connected inside each ear plate 28. The top end of the connecting rod 7 is tightly connected to the ear plate 28, and a position sensor 29 is fixedly installed on the outer wall of the connecting rod 7 to obtain the vertical position of the connecting rod 7 in real time. A socket block 30 is fixedly installed at the bottom end of the connecting rod 7. Below the multiple connecting rods 7, a common clamping plate 8 is provided. The clamping plate 8 has multiple square through slots 31, the number of which is the same as the number of connecting rods 7. Each socket block 30 is interference-fitted with a square through slot 31, thereby combining the multiple connecting rods 7 with the clamping plate 8 into a secure, integrated structure. Furthermore, below each square through slot 31, a square frame 32 is provided, which is securely connected to the clamping plate 8. The shape and size of the inner groove of the square frame 32 can be adapted to the smart chip, thus facilitating stable clamping of the smart chip within the inspection plate 2.

[0025] A fixed beam plate 9 is provided on the side of the movable beam plate 3 facing away from the intelligent chip inspection plate 2. The bottom of the fixed beam plate 9 is fastened to the platform of the workbench 1. A fourth electric lead screw guide rail 33 is fastened on the fixed beam plate 9. There is one fourth electric lead screw guide rail 33, which is arranged vertically along the Z-axis. A fourth servo motor 34 for providing power to the fourth electric lead screw guide rail 33 is provided on its side. The sliding end of the fourth electric lead screw guide rail 33 is arranged on the side close to the intelligent chip inspection plate 2. A lifting frame 10 is fastened to the sliding end of the fourth electric lead screw guide rail 33. The lifting frame 10 can be vertically displaced along the Z-axis under the drive of the fourth electric lead screw guide rail 33. A fifth servo motor 35 is fixedly installed on one side of the lifting frame 10, and a pulsed laser 11 is provided on the other side of the lifting frame 10. A transmission assembly 12 is provided inside the lifting frame 10, and the fifth servo motor 35 is driven and cooperated with the pulsed laser 11 through the transmission assembly 12.

[0026] The transmission assembly 12 includes a driven rotating rod 1201, which is horizontally arranged along the Y-axis and connected to the output end of the fifth servo motor 35 via a coupling. A support sleeve 36 is fixedly installed inside the lifting frame 10, and the support sleeve 36 is vertically arranged along the Z-axis with its bottom firmly connected to the inner wall of the lifting frame 10; the outer wall of the driven rotating rod 1201 rotatably engages with the support sleeve 36.

[0027] The lifting frame 10 is equipped with a transmission disk 1202, which is a trapezoidal disc structure. The end with the larger outer diameter is close to the pulse laser 11 and its outer wall is rotatably engaged with the inner wall of the lifting frame 10. Multiple uniformly arranged and circumferentially arrayed external brackets 1203 are fixedly installed on the outer wall of the end with the smaller outer diameter of the transmission disk 1202. An arc plate 1204 is fixedly installed on the outer wall of the driven rotating rod 1201. The inner side of the outer end of the external bracket 1203 is tightly connected to the outer wall of the transmission disk 1202, and the outer peripheral wall of the external bracket 1203 is an arc surface. An arc groove 1205 is provided on the inner side of the inner end of the external bracket 1203, and the outer peripheral wall of the arc plate 1204 is rotatably engaged with the inner groove wall of the arc groove 1205. The transmission disc 1202 has a central groove 1207 on its surface facing the driven rod 1201. Multiple strip-shaped through slots 1208 are radially arranged around the central groove 1207. An external bracket 1203 is positioned between adjacent strip-shaped through slots 1208, ensuring that the number of strip-shaped through slots 1208 is the same as the number of external brackets 1203. An extension plate 1209 is fixedly installed at the end of the driven rod 1201. The extension plate 1209 is perpendicular to the driven rod 1201 and symmetrically arranged with an arc-shaped plate 1204 on both sides of the driven rod 1201. A transmission cylinder 1210 is fixedly installed on the side of the extension plate 1209. The transmission cylinder 1210 is arranged parallel to the driven rotating rod 1201. The outer peripheral wall of the outer bracket 1203 is an arc-shaped surface. The transmission cylinder 1210 slides in contact with the inner groove wall of the strip-shaped through groove 1208 and the outer peripheral wall of the outer bracket 1203. When the driven rotating rod 1201 rotates under the drive of the fifth servo motor 35, the extension plate 1209 and the arc-shaped plate 1204 rotate simultaneously. The initial position of the transmission cylinder 1210 is set in the center groove 1207. The rotation of the moving rod 1201 causes the transmission cylinder 1210 to enter the strip-shaped through groove 1208, and the outer wall of the transmission cylinder 1210 slides against the inner wall of the strip-shaped through groove 1208. When the transmission cylinder 1210 moves to the outside of the transmission disk 1202, the outer wall of the transmission cylinder 1210 slides against the outer peripheral wall of the external bracket 1203. Combined with the rotation of the arc plate 1204, the transmission disk 1202 rotates within the lifting frame 10. When the driven rod 1201 rotates 180°, the transmission disk 1202 is in a super-stable static state. The operator can adjust the arrangement of the strip-shaped through groove 1208 and the external bracket 1203 according to the density of the ball grid array on the smart chip interface surface, so as to adjust the angle of a single rotation of the transmission disk 1202.

[0028] A drive rod 1206 is fixedly mounted on the disk surface of the transmission disk 1202 on the side opposite to the driven rod 1201. The drive rod 1206 is tightly connected to the outer housing of the pulsed laser 11, so that the drive rod 1206 can drive the pulsed laser 11 to rotate along the Y-axis. The laser beam emitted by the pulsed laser 11 vaporizes excess solder through ablation, achieving physical isolation. For poor solder joints, the laser performs local remelting, activates the wettability of the solder, and forms a reliable metallurgical bond. When dealing with internal voids, the laser can remove bad solder joints layer by layer and induce the deposition and filling of new material.

[0029] The foregoing has described in detail an embodiment of a smart chip repair device. Based on the smart chip repair device described in the above embodiment, this invention also provides a smart chip repair method corresponding to the device, including the following steps: S1: The operator places the smart chip in the inspection tank of the smart chip inspection plate 2, with the interface side of the smart chip facing down, so that the X-ray emitted from the smart chip inspection plate 2 can irradiate the interface side of the smart chip. The interface side of the smart chip is imaged by the X-ray imaging system to accurately locate and identify BGA solder balls with bridging problems and cold solder joint problems on the interface side of the smart chip. S2: By controlling the first electric lead screw guide rail 13 and the second electric lead screw guide rail 16, the X-axis and Y-axis positions of the clamping plate 8 are adjusted. Under the coordinated control of the third electric lead screw guide rail 21 and the fourth electric lead screw guide rail 33, the faulty smart chip is stably clamped by the clamping plate 8, thereby removing the faulty smart chip from the smart chip inspection plate 2, which facilitates subsequent repair work. S3: By controlling the servo turntable 20, the clamping plate 8 is rotated 180° along the X-axis, arranging the interface surface of the smart chip facing upwards. By starting the fifth servo motor 35, the driven rotating rod 1201 is rotated. Each rotation of the driven rotating rod 1201 causes the outer peripheral wall of the arc plate 1204 to rotate and engage with the inner groove wall of the arc groove 1205 in the single external bracket 1203. At the same time, the transmission cylinder 1210 slides and engages with the inner groove wall of the strip through groove 1208 and the outer peripheral wall of the external bracket 1203, causing the transmission disk 1202 to rotate. This causes the pulsed laser 11 to rotate along the Y-axis and remain in a super-stable static state after rotation. The focused light spot emitted by the pulsed laser 11 repairs the BGA solder balls that have bridging or cold solder joint problems.

[0030] Compared with existing technologies, this invention addresses the industry problem of poor positioning stability and low repair accuracy of pulsed lasers during the repair of smart chips. Through a series of innovative mechanical and control system designs, it achieves a revolutionary performance improvement.

[0031] Driven by the fifth servo motor, the driven rod rotates, causing the transmission cylinder fixed on it to start from the center groove of the transmission disk, move along the radial strip groove, and slide into the arc-shaped outer wall of the outer bracket. After rotation, it accurately returns to the center groove and instantly cuts off the rotation driving force. This mechanical self-locking mechanism ensures that the transmission disk and pulse laser can instantly reach an ultra-stable static state, completely eliminating the overshoot and jitter phenomena of traditional systems. This allows the laser focused spot to accurately target micron-level defects without drift, thereby achieving ultra-high precision repair operations by vaporizing excess solder or local remelting, significantly improving repair reliability and yield.

[0032] Meanwhile, this invention integrates a highly intelligent multi-axis collaborative motion system. Two sets of first electric lead screw guide rails collaboratively drive the moving beam plate to move along the X-axis, while the second electric lead screw guide rail controls the precise positioning of the Y-axis. In conjunction with the servo turntable, the gripping plate achieves a precise 180° rotation, enabling the chip to be automatically transferred from the inspection station to the repair station. The gripping device, driven by a guide cylinder and reinforced by a slide rail slider mechanism, achieves flexible and stable gripping of the chip through multiple square frames. This not only eliminates the risks of slippage and pressure damage in traditional manual operations but also avoids electrostatic damage and physical impact damage, realizing fully automated operation and significantly improving the efficiency and safety of batch repair of high-value chips.

[0033] Furthermore, this device demonstrates exceptional process adaptability and technological foresight. Operators can flexibly adjust the number of slots and external brackets on the drive plate to change the laser rotation angle based on the array density and spacing of different chip BGA solder balls, ensuring optimal repair path coverage. Simultaneously, position sensors on the connecting rod monitor the clamping force in real time, ensuring uniform and stable support for chips of various sizes, from micro-sensor chips to large AI processors, preventing stress concentration damage. This modular and customizable design concept gives the device strong continuous adaptability, easily compatible with future more advanced repair processes, demonstrating a long equipment lifespan and technological foresight. In conclusion, this invention has very broad application prospects.

[0034] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A smart chip repair device, comprising a workbench (1), characterized in that, A smart chip inspection plate (2) is fixedly installed on the workbench (1). The smart chip inspection plate (2) is used to inspect and troubleshoot BGA solder balls that have not passed the reflow soldering test on the smart chip interface. A moving beam plate (3) that is horizontally displaced along the X-axis is provided above the smart chip inspection plate (2). A first load plate (4) that is horizontally displaced along the Y-axis is provided on the side of the moving beam plate (3) facing the smart chip inspection plate (2). A second load plate (5) that can rotate along the X-axis is provided on the side of the first load plate (4). A loading frame (6) that is vertically displaced along the Z-axis is provided on the side of the second load plate (5). Multiple connecting rods (7) that are vertically displaced along the Z-axis are provided inside the loading frame (6). The bottom of the connecting rods (7) is connected to a clamping plate (8). The clamping plate (8) is used to stably clamp the smart chip inspection plate. 2) The smart chip inside, the moving beam plate (3) is provided with a fixed beam plate (9) that is fastened to the workbench (1) on the side facing away from the smart chip inspection plate (2). A lifting frame (10) that is vertically displaced along the Z-axis is provided above the fixed beam plate (9). A pulsed laser (11) is provided on the side of the lifting frame (10). A rotatable transmission component (12) is provided inside the lifting frame (10). A fifth servo motor (35) is fixedly installed on the side of the lifting frame (10). The fifth servo motor (35) is driven and cooperated with the pulsed laser (11) through the transmission component (12). The transmission component (12) is used to drive the pulsed laser (11) to rotate along the Y-axis with high precision and ensure that the pulsed laser (11) is in an ultra-stable static state after rotation. The pulsed laser (11) is used to repair the BGA solder balls on the interface surface of the smart chip. The transmission assembly (12) includes a driven rotating rod (1201) connected to the output end of the fifth servo motor (35). The driven rotating rod (1201) is arranged horizontally along the Y-axis. A support sleeve (36) is fixedly installed inside the lifting frame (10). The outer wall of the driven rotating rod (1201) is rotatably engaged with the support sleeve (36). A transmission disc (1202) is provided inside the lifting frame (10). The outer wall of the transmission disc (1202) is rotatably engaged with the inner wall of the lifting frame (10). Multiple uniformly arranged rods are fixedly installed on the outer wall of the transmission disc (1202). An external bracket (1203) is evenly arranged and distributed in a circular array. An arc plate (1204) is fixedly installed on the outer wall of the driven rotating rod (1201). An arc groove (1205) is provided on the inner side of the inner end of the external bracket (1203). The outer peripheral wall of the arc plate (1204) and the inner groove wall of the arc groove (1205) are rotatably engaged. A drive rotating rod (1206) is fixedly installed on the disk surface of the transmission disk (1202) on the side facing away from the driven rotating rod (1201). The drive rotating rod (1206) is fastened to the pulse laser (11). The transmission disc (1202) has a central groove (1207) on its surface facing the driven rotating rod (1201). Multiple strip-shaped through slots (1208) are arranged radially around the central groove (1207) on the transmission disc (1202). An external bracket (1203) is provided between adjacent strip-shaped through slots (1208). An extension plate (1209) is fixedly installed at the end of the driven rotating rod (1201), and a transmission cylinder (1210) is fixedly installed on the side of the extension plate (1209). The transmission cylinder (1210) is arranged parallel to the driven rotating rod (1201). The outer peripheral wall of the outer bracket (1203) is an arc-shaped surface. The transmission cylinder (1210) slides in fit with the inner groove wall of the strip through groove (1208) and the outer peripheral wall of the outer bracket (1203).

2. The intelligent chip repair device according to claim 1, characterized in that, The workbench (1) is fixedly installed with a first electric screw guide rail (13), which is arranged horizontally along the X-axis. The sliding end of the first electric screw guide rail (13) is fastened to a first I-beam seat (14), the top of the first I-beam seat (14) is fastened to the bottom of the moving beam plate (3), and the end of the first electric screw guide rail (13) is equipped with a first servo motor (15) for providing power to it.

3. The intelligent chip repair device according to claim 1, characterized in that, The movable beam plate (3) is fixedly installed with a second electric screw guide rail (16) on the side facing the intelligent chip inspection plate (2). The second electric screw guide rail (16) is arranged horizontally along the Y-axis. The end of the second electric screw guide rail (16) is equipped with a second servo motor (17) for providing power to it. The sliding end of the second electric screw guide rail (16) is fastened to a second I-beam seat (18). The second I-beam seat (18) is fastened to one side of the first load plate (4). The workbench (1) is provided with a through slot (19) to facilitate the rotation of the second load plate (5). The other side of the first load plate (4) is fixedly installed with a servo turntable (20). The rotation output end of the servo turntable (20) is fastened to the second load plate (5).

4. The intelligent chip repair device according to claim 1, characterized in that, A third electric lead screw guide (21) is fixedly installed on the side of the second load plate (5). The third electric lead screw guide (21) is arranged vertically along the Z-axis. A third servo motor (22) for providing power to the third electric lead screw guide (21) is installed on the top of the third electric lead screw guide (21). A third I-beam (23) is fastened to the sliding end of the third electric lead screw guide (21). The third I-beam (23) is fastened to the loading frame (6).

5. The intelligent chip repair device according to claim 1, characterized in that, The loading frame (6) is fixedly installed with a guide cylinder (24) arranged vertically in the Z-axis direction. The guide rod end of the guide cylinder (24) is fixedly connected to the loading plate (25). Below the guide cylinder (24) is a slide rail (26) that is tightly connected to the inner side of the loading frame (6). The slide rail (26) is arranged vertically in the Z-axis direction. A sliding block (27) is installed on the slide rail (26). The sliding block (27) is tightly connected to the loading plate (25). An ear plate (28) is fixedly installed on the inner side of the loading plate (25). The top end of the connecting rod (7) is tightly connected to the ear plate (28). A position sensor (29) is fixedly installed on the outer wall of the connecting rod (7). A socket block (30) is fixedly installed at the bottom end of the connecting rod (7). Multiple square through slots (31) are opened on the clamping plate (8). The socket block (30) is interference-fitted with the square through slots (31).

6. The intelligent chip repair device according to claim 5, characterized in that, Below the square through slot (31) is a square frame (32) that is fastened to the clamping plate (8).

7. The intelligent chip repair device according to claim 1, characterized in that, A fourth electric screw guide rail (33) is fastened on the fixed beam plate (9). The fourth electric screw guide rail (33) is arranged vertically along the Z-axis. A fourth servo motor (34) for providing power to the fourth electric screw guide rail (33) is provided on the side. The lifting frame (10) is fastened to the sliding end of the fourth electric screw guide rail (33).

8. A method for repairing a smart chip, comprising the smart chip repair apparatus according to any one of claims 1-7, characterized in that, The method includes: S1: Place the smart chip on the smart chip inspection board (2), with the interface side of the smart chip facing down, so that the X-ray emitted from the smart chip inspection board (2) irradiates the interface side of the smart chip. The interface side of the smart chip is imaged by the X-ray imaging system to accurately locate and identify the BGA solder balls with bridging problems and cold solder joint problems on the interface side of the smart chip. S2: By controlling the first electric lead screw guide (13) and the second electric lead screw guide (16), the position of the clamping plate (8) in the X-axis direction and the Y-axis direction is adjusted, and under the coordinated control of the third electric lead screw guide (21) and the fourth electric lead screw guide (33), the smart chip with problems is stably clamped by the clamping plate (8). S3: By controlling the servo turntable (20), the clamping plate (8) is rotated 180° along the X-axis direction, and the interface surface of the smart chip is arranged facing upwards. By starting the fifth servo motor (35), the driven rotating rod (1201) is rotated. For each rotation of the driven rotating rod (1201), the outer peripheral wall of the arc plate (1204) rotates and engages with the inner groove wall of the arc groove (1205) in the single external bracket (1203). At the same time, the transmission cylinder (1210) slides and engages with the inner groove wall of the strip through groove (1208) and the outer peripheral wall of the external bracket (1203) in turn, causing the transmission disk (1202) to rotate, thereby causing the pulse laser (11) to rotate along the Y-axis direction and to be in an ultra-stable static state after its rotation, so that the focused light spot emitted by the pulse laser (11) can repair the BGA solder balls with bridging problems and cold solder joint problems.

Images