一种空气调节装置

By combining a heat exchange system and a refrigerant heat dissipation device, the refrigerant state and temperature are controlled according to the temperature of electronic components, thus solving the problems of temperature rise and condensation in air conditioning devices and achieving temperature control and anti-condensation of electronic components.

CN120926497BActive Publication Date: 2026-07-17QINGDAO HISENSE HITACHI AIR CONDITIONING SYST

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
QINGDAO HISENSE HITACHI AIR CONDITIONING SYST
Filing Date
2025-08-11
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The problems of temperature rise and condensation in electronic components of air conditioning units are difficult to solve at the same time, especially in high temperature and high humidity environments, which can lead to problems such as short circuits and corrosion.

Method used

By combining a heat exchange system and a refrigerant heat dissipation device, the temperature of electronic components is detected by a first detection element. The heat exchange system is controlled to deliver refrigerant of different states and temperatures to the refrigerant heat dissipation device, thereby cooling or heating the electronic components and solving the problems of temperature rise and condensation.

Benefits of technology

Effectively controlling the temperature of electronic devices within a safe range prevents condensation, extends the lifespan of electronic devices, and reduces the risk of temperature rise.

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Abstract

本申请涉及空气调节的技术领域,公开了一种空气调节装置,包括热交换系统;冷媒散热装置;第一检测件;控制器,控制器被配置为:当第一温度大于耐受温度值时,控制热交换系统将两相态冷媒输送至冷媒散热装置,两相态冷媒中至少部分液态冷媒变为气态冷媒,冷媒散热装置被配置为给电子器件降温;当第一温度大于凝露温度值,且不大于耐受温度值时,控制热交换系统将第一过热态冷媒输送至冷媒散热装置,冷媒散热装置被配置为给电子器件降温;当第一温度不大于凝露温度值时,控制热交换系统将第二过热态冷媒输送至冷媒散热装置,冷媒散热装置被配置为给电子器件升温。本申请的空气调节装置,可以较好的解决电子器件温升和凝露的问题。
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