A temperature control structure and a fan rotating speed control system using the same

Abstract

The application belongs to the technical field of device heat dissipation, and particularly relates to a temperature control structure and a fan rotating speed control system using the temperature control structure. The temperature control structure comprises a heat transfer structure, the heat transfer structure is in heat conduction connection with a heat generating device, a metal block is arranged on the heat transfer structure, the metal block is in heat conduction connection with the heat transfer structure, the metal block is in contact with a piezoelectric ceramic or a pressure sensor, and the piezoelectric ceramic or the pressure sensor is electrically connected with a temperature control module. The fan rotating speed control system comprises the temperature control structure, a fan electrically connected with the temperature control module in the temperature control structure, the temperature control structure and the fan are arranged in a case, and the fan is electrically connected with the temperature control structure through a fan wire. The structure can automatically adjust the rotating speed of a heat dissipation fan according to the temperature of the heat generating device, does not depend on a traditional temperature sensor, solves the installation and arrangement problems of the temperature sensor, and has simple metal block, piezoelectric ceramic or pressure sensor structure, can improve reliability, and realizes miniaturized design.

Description

Technical Field

[0001] This invention belongs to the field of equipment heat dissipation technology, specifically relating to a temperature control structure and a fan speed control system using the temperature control structure. Background Technology

[0002] like Figure 1 The diagram shows the structure of an air-cooled chassis. The main components include circuit boards (i.e., air-cooling modules, cold plate structure), a backplate assembly, a heatsink enclosure, cooling fans, and a fan shroud. The cooling fans are housed within the shroud, which is located at the bottom of the chassis and connects to the outside. Circuit boards are inserted into the chassis, and their outer walls have heat dissipation fins. Airflow is formed between the circuit boards and between the chassis and the circuit boards. An exhaust vent is located on the top panel of the chassis. The cooling fans draw in cool air from the outside and deliver it into the airflow structure, carrying away the heat generated by the circuit boards during operation and expelling it through the exhaust vent. With increasing integration, the heat dissipation of the circuit boards is increasing, requiring more cooling air to meet the cooling demands. This necessitates higher fan speeds, which present the following problems:

[0003] 1) In order to cope with the increasing heat dissipation of the circuit board, it is necessary to increase the air intake for cooling, which requires increasing the speed of the cooling fan. The higher the speed of the cooling fan, the lower the reliability of the cooling fan.

[0004] 2) The heat dissipation of the circuit board is getting higher and higher, and the temperature of the cooling fan's working area is getting higher and higher, which leads to a decrease in the thermal reliability of the device;

[0005] 3) The higher the speed of the cooling fan, the louder the noise, which affects the user experience.

[0006] In existing technologies, the cooling fan control of air-cooled chassis typically uses temperature sensors as temperature measuring devices. The fan speed is controlled based on the measured temperature. Temperature sensors are usually thermocouples, requiring two wires connected to different locations, making installation complex and space-consuming. As circuit boards become increasingly integrated, the space available for temperature sensors is limited, making installation and placement difficult. Furthermore, thermocouple-based temperature sensors are bulky and have poor reliability. Summary of the Invention

[0007] To solve the above-mentioned technical problems, the present invention provides a temperature control structure and a fan speed control system using the temperature control structure, which can automatically adjust the speed of the cooling fan according to the device temperature, avoid the cooling fan from rotating at full speed all the time, and no longer rely on traditional temperature sensors, thus solving the installation and placement problems of temperature sensors and realizing the reliability and miniaturization of the system.

[0008] The objective of this invention is achieved through the following technical solution. A temperature control structure according to this invention includes a heat transfer structure, which is thermally connected to a heating element. A metal block is disposed on the heat transfer structure and is thermally connected to it. The metal block is in contact with a piezoelectric ceramic I or a pressure sensor I, and the piezoelectric ceramic I or the pressure sensor I is electrically connected to a temperature control module.

[0009] Compared with the prior art, the advantages of the present invention are:

[0010] This invention proposes a temperature control structure where the device heats up, causing a metal block to deform, which in turn causes a piezoelectric ceramic or pressure sensor to generate an electrical signal. The electrical signal can control the speed of the cooling fan through the temperature control module, enabling the structure to automatically adjust the speed of the cooling fan according to the temperature of the heat-generating device. This eliminates the need for traditional temperature sensors, solving the installation and placement problems of temperature sensors. Furthermore, the structure of the metal block, piezoelectric ceramic, or pressure sensor is simple, which can improve reliability and achieve miniaturization.

[0011] Furthermore, an insulating block is provided on the heat transfer structure, and the insulating block is thermally connected to the heat transfer structure. The insulating block is in contact with the piezoelectric ceramic II or the pressure sensor II, and the piezoelectric ceramic II or the pressure sensor II is electrically connected to the temperature control module. The metal block and the insulating block are arranged in groups, and the distance between the metal block and the insulating block in the same group on the heat transfer structure is similar so that the metal block, the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0012] Compared with the prior art, the advantages of the present invention are:

[0013] When the temperature control structure operates under vibration conditions, the vibration will cause relative displacement between the metal block I and the piezoelectric ceramic I or the pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block I. After setting up an insulation block, the insulation block will only deform due to vibration. After the electrical signals of the piezoelectric ceramic or pressure sensor corresponding to the insulation block are transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signals generated due to temperature deformation, cancels the electrical signals generated under vibration conditions, corrects the erroneous electrical signals generated under vibration conditions, and makes the temperature control more accurate.

[0014] Furthermore, the temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

[0015] Furthermore, the temperature control structure has a dynamic compensation function. The initial contact deformation between the metal block and piezoelectric ceramic I or pressure sensor I, and between the insulation block and piezoelectric ceramic II or pressure sensor II, under static and initial temperature conditions is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0. When the heating device heats up, the deformation of the metal block is Δx1. The actual deformation of the metal block due to temperature is Δx1-Δx0. The voltage generated by the deformation of Δx1 on piezoelectric ceramic I or pressure sensor I is V1. The temperature control module receives voltage V0 and voltage V1 and calculates and outputs the operating voltage or current of the refrigeration equipment when it is static.

[0016] When the temperature control structure vibrates, the deformation of the piezoelectric ceramic I or pressure sensor I and piezoelectric ceramic II or pressure sensor II at the corresponding positions of the metal block and the insulation block due to vibration is set to Δx2. The total deformation of the metal block and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2, and the voltage corresponding to piezoelectric ceramic I or pressure sensor I is V3. The total deformation of the insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2, and the voltage corresponding to piezoelectric ceramic II or pressure sensor II is V4. The difference between the deformation of the metal block I and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the voltage output by the temperature control module remains unchanged to achieve dynamic compensation function.

[0017] Furthermore, a thermally conductive pad is provided between the heating device and the heat transfer structure.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] Thermal pads can ensure that the heating element and the heat transfer structure are in full contact.

[0020] Furthermore, the piezoelectric ceramic I or pressure sensor I, the piezoelectric ceramic II or pressure sensor II, and the temperature control module are integrated and mounted on the PCB board.

[0021] A fan speed control system is provided for heat dissipation of functional chips in a cold plate structure inside a chassis. The functional chips are heat-generating devices. The system includes the temperature control structure and a fan electrically connected to the temperature control module in the temperature control structure. The temperature control structure and the fan are installed in the chassis. The fan is electrically connected to the temperature control structure through a fan wire, which includes a power supply wire, a speed control wire, and a signal feedback wire.

[0022] Furthermore, the cold plate structure includes a cold plate shell, a PCB board is disposed inside the cold plate shell, and a functional chip, a temperature control module, a piezoelectric ceramic I or pressure sensor I, and a piezoelectric ceramic II or pressure sensor II are integrated on the PCB board. The cold plate shell is thermally connected to the functional chip. The inner wall of the cold plate shell is provided with a metal block that contacts the piezoelectric ceramic I or pressure sensor I and a heat insulation block that contacts the piezoelectric ceramic II or pressure sensor II. A module connector that is connected to the PCB board and extends out of the cold plate shell is disposed on the cold plate structure. The module connector is inserted into the backplane connector of the backplane assembly inside the chassis, and the fan is electrically connected to the backplane assembly.

[0023] Furthermore, the cold plate structure includes a cold plate housing, a functional chip inside the cold plate housing is thermally connected to the cold plate housing, the cold plate housing is thermally connected to the chassis housing, the chassis housing is equipped with a temperature control device, the temperature control device includes a temperature control device housing, the temperature control device housing is thermally connected to the chassis housing, a temperature control PCB board is installed inside the temperature control device housing, the temperature control PCB board integrates a temperature control module, piezoelectric ceramic I or pressure sensor I, and piezoelectric ceramic II or pressure sensor II, the inner wall of the temperature control device housing is provided with a metal block in contact with piezoelectric ceramic I or pressure sensor I, and a heat insulation block in contact with piezoelectric ceramic II or pressure sensor II; the temperature control device is electrically connected to the back panel assembly, and the back panel assembly is electrically connected to the fan.

[0024] Furthermore, the chassis housing is provided with an air inlet and an air outlet. When the fan is working, it sends out the hot air inside the chassis housing and draws in the cold air; or, the chassis housing is enclosed, and the cold plate structure is in contact with the chassis housing to transfer heat to the chassis housing, and the fan dissipates heat from the chassis housing.

[0025] Compared with the prior art, the advantages of the present invention are:

[0026] The temperature control structure of this invention can be used in open or sealed enclosures.

[0027] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of the present invention more obvious and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an air-cooled chassis in the prior art;

[0029] Figure 2 This is a schematic diagram of a temperature control structure according to Embodiment 1 of the present invention;

[0030] Figure 3 This is a schematic diagram of a second embodiment of a temperature control structure according to the present invention;

[0031] Figure 4 for Figure 3 The illustrated embodiment is a cross-sectional view of the cold plate structure.

[0032] Figure 5 for Figure 4 A magnified view of a portion of the image;

[0033] Figure 6 for Figure 3 The illustrated embodiment is a cross-sectional view of the chassis.

[0034] Figure 7 for Figure 6 A partially enlarged schematic diagram of the medium temperature control device;

[0035] Figure 8 This is a schematic diagram of an embodiment 1 of a fan speed control system using a temperature control structure according to the present invention;

[0036] Figure 9 This is a schematic diagram of a second embodiment of a fan speed control system using a temperature control structure according to the present invention;

[0037] Figure 10 This is a schematic diagram of the temperature control module in embodiment 1 or 2 of the temperature control structure of the present invention;

[0038] Figure 11 This is a topology diagram of the temperature control module in embodiment 1 or 2 of the present invention.

[0039] Figure 12 This is a cross-sectional schematic diagram of a temperature control structure embodiment 2 of the present invention;

[0040] Figure 13 for Figure 12 The illustrated embodiment is a schematic diagram of vibration.

[0041] Figure label:

[0042] 1-Functional chip, 2-Thermal conductive pad, 3-Heat transfer structure, 4-Metal block, 41-Metal block I, 42-Metal block II, 5-Piezoelectric ceramic, 51-Piezoelectric ceramic I, 52-Piezoelectric ceramic II, 6-PCB board, 7-Cold plate housing, 8-Heat dissipation boss, 9-Module connector, 10-Backplane assembly, 11-Cold plate structure, 12-Cooling fan, 13-Inner housing, 14-Heat dissipation structure, 15-Outer housing, 16-External fan, 17-Temperature control device, 18-Temperature control device housing, 19-Temperature control module, 20-Temperature control PCB board. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Embodiment 1 of the temperature control structure of the present invention, as follows: Figure 2 As shown, this embodiment is illustrated by integrating the piezoelectric ceramic 5 and the functional chip 1 onto a PCB board 6. The piezoelectric ceramic 5 and the functional chip 1 are integrated onto the PCB board 6. A thermally conductive pad 2 is placed between the functional chip 1 and the heat transfer structure 3 to ensure a stable and reliable thermal connection between them. A metal block 4 is placed at the other end of the heat transfer structure 3, and the metal block 4 is in contact with the piezoelectric ceramic 5. The heat transfer structure 3 is made of a thermally conductive material, capable of transferring heat from the functional chip 1 to the metal block 4.

[0045] The piezoelectric ceramic 5 has the piezoelectric effect, that is, when the piezoelectric ceramic 5 is deformed, it will generate an electrical signal. The electrical signal can be used to control the fan speed and thus control the fan flow.

[0046] When the equipment is working, the heat from the functional chip 1 is transferred to the heat transfer structure 3 through the thermally conductive pad 2. The heat is then transferred from the heat transfer structure 3 to the metal block 4. The metal block 4 has the characteristics of high thermal conductivity and high expansion coefficient. After being heated, the metal block 4 expands and deforms. The deformation of the metal block 4 acts on the piezoelectric ceramic 5, which generates an electrical signal. The electrical signal is amplified to form a suitable current (voltage) to control the fan speed, thereby controlling the fan flow and the temperature of the equipment.

[0047] A temperature control module is installed on PCB board 6. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 11 As shown, the piezoelectric ceramic 5 is electrically connected to the temperature control module via the PCB board 6, enabling the transmission of the electrical signal generated by the piezoelectric ceramic 5 to the temperature control module 6.

[0048] The power supply provides appropriate voltage (current) to components such as amplifier circuits, memory modules, and control logic circuits.

[0049] The amplifier circuit amplifies the input piezoelectric ceramic signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the cooling fan.

[0050] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as the power of the functional chip, the expansion of the metal block, the voltage (current) of the piezoelectric ceramic, and the temperature.

[0051] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs signals to control the power of the cooling fan and the priority of multiple piezoelectric ceramics working at the same time, based on the data of the storage module.

[0052] If the heat dissipation of the functional chip 1 on the PCB board 6 is set to W, then the temperature corresponding to the heat transfer structure 3 is t.

[0053] The relationship between t and W can be expressed as follows:

[0054] t = f(W) (0.1)

[0055] When the temperature of the heat transfer structure 3 is t, the expansion amount Δx of the metal block 4 (the expansion amount, deformation amount, or displacement amount mentioned in this invention refers to the expansion amount, deformation amount, or displacement amount generated by the interaction between the metal block and the piezoelectric ceramic) can be expressed as:

[0056] Δx=f(t) (0.2)

[0057] When the expansion of the piezoelectric ceramic 5 into the metal block 4 is Δx, the change in voltage (current) ΔV can be expressed as:

[0058] ΔV=f(Δx) (0.3)

[0059] When the voltage (current) changes by ΔV, the operating voltage V of the cooling fan after adjustment by the temperature control module is:

[0060] V=f(ΔV) (0.4)

[0061] The expression for the operating voltage V and the flow rate Q of the cooling fan is as follows:

[0062] Q = f(V) (0.5)

[0063] Combining equations 1.1 to 1.5, we can obtain the relationship between the heat dissipation of functional chip 1 and the airflow of the cooling fan. From this, we can derive the control principle of the temperature control structure as follows: Figure 10 As shown.

[0064] This embodiment enables automatic adjustment of the cooling fan speed based on device temperature, preventing the cooling fan from running at full speed continuously. Furthermore, it eliminates the reliance on traditional temperature sensors, solving the installation and placement challenges of temperature sensors and achieving both system reliability and miniaturization.

[0065] Embodiment 2 of the temperature control structure of the present invention, such as Figure 3As shown. The difference between this embodiment and embodiment 1 is that the metal block 4 on the heat transfer structure 3 is replaced with two closely spaced metal blocks I 41 and II 42. A heat insulation plate is provided between metal block II 42 and the heat transfer structure 3 to prevent heat from being transferred from the heat transfer structure 3 to metal block II 42. Correspondingly, on the PCB board 6, the piezoelectric ceramic 5 is replaced with piezoelectric ceramic I 51 and piezoelectric ceramic II 52. Piezoelectric ceramic I 51 is in contact with metal block I 41, and piezoelectric ceramic II 52 is in contact with metal block II 42.

[0066] When the temperature control structure is used under vibration conditions, the structure and components inside the temperature control structure will deform. The deformation caused by vibration and temperature may cause the electrical signal generated by the piezoelectric ceramic to be distorted.

[0067] Ideally, the electrical signal output by the piezoelectric ceramic I 51 is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I 41, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I 51. Figure 12 , Figure 13 As shown, under vibration conditions, the expansion of metal block I 41 due to temperature is Δx1, and the deformation (i.e., displacement) of PCB board 6 at the corresponding positions of metal block I 41 and metal block II 42, as well as piezoelectric ceramics I 51 and II 52 on PCB board 6 due to vibration is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2>Δx1, piezoelectric ceramic I 51 loosens from contact with metal block I 41, and the pressure on piezoelectric ceramic I 51 decreases or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2<Δx1, although piezoelectric ceramic I 51 does not detach from contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on piezoelectric ceramic I 51; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I 51 and metal block I 41 increases, and the pressure on piezoelectric ceramic I 51 increases. All of the above situations will lead to inaccurate electrical signals generated by the piezoelectric ceramic I 51 (the electrical signal is too large or too small under different vibration conditions under the same temperature conditions).

[0068] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I 41 is in thermally conductive contact with heat transfer structure 3, and the heat from heat transfer structure 3 can be transferred to metal block I 41. Metal block I 41 can automatically deform and expand with temperature changes, and the output electrical signal of piezoelectric ceramic I 51 can change with temperature changes. A heat insulation plate is provided between metal block II 42 and heat transfer structure 3 to achieve heat insulation connection, prevent heat from being transferred to metal block II 42, and thus prevent metal block II 42 from expanding and deforming due to temperature changes.

[0069] The initial contact deformation Δx0 is maintained between metal block I 41 and piezoelectric ceramic I 51, and between metal block II 42 and piezoelectric ceramic II 52, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When functional chip 1 starts working and generating heat, the deformation of metal block I 41 is Δx1. Metal block II 42 is thermally insulated from the heat transfer structure 3 and does not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I 41 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when Δx0 is deformed is V0, and the voltage generated by the piezoelectric ceramic when Δx1 is deformed is V1. There is a corresponding relationship between the deformation and the voltage generated by the piezoelectric ceramic. This relationship can be pre-stored in the storage module. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the deformation caused by temperature. Then, the calculated voltage is converted into the voltage required by the cooling fan and transmitted to the cooling fan to dissipate heat from functional chip 1.

[0070] When the temperature control structure vibrates under the above temperature conditions (i.e., when metal block I 41 expands by Δx1), and the positions of metal block I 41 and metal block II 42 are close, the vibration deformation of the piezoelectric ceramics on the PCB board at the corresponding positions is consistent or has a very small difference, and can be set to Δx2. At this time, the total deformation of metal block I 41 and piezoelectric ceramic I 51 is Δx1±Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I 51 is V3. The total deformation of metal block II 42 and piezoelectric ceramic II 52 is Δx0±Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 52 is V4. Since the difference in deformation between metal block I 41 and metal block II 42 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration), the temperature control module receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This ensures that the voltage output by the temperature control module remains unchanged and is not affected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage is converted into the voltage required by the cooling fan and transmitted to the cooling fan to dissipate heat from the cold plate structure, thereby realizing the dynamic compensation function.

[0071] When the temperature control structure is working, the heat from the functional chip 1 is transferred to the heat transfer structure 3 through the thermally conductive pad 2. The metal block I 41 deforms due to the increased temperature. This deformation acts on the piezoelectric ceramic I 51, and the piezoelectric effect of I 51 generates an electrical signal (voltage or current). This signal is processed and amplified by the temperature control module to form a suitable current (voltage), which is then transmitted to the cooling fan. This controls the fan speed, further altering the temperature of the functional chip 1. The temperature control module also corrects the electrical signal emitted by the piezoelectric ceramic I 51 under vibration conditions by receiving the electrical signal generated by the piezoelectric ceramic II 52, preventing vibration from affecting the accuracy of the electrical signal.

[0072] In Embodiment 3 of the temperature control structure of the present invention, an improvement is made on the basis of Embodiment 1 or 2. The functional chip 1 can be replaced with other heat-generating devices that generate heat and need to be cooled during operation, such as the entire functional module or chassis.

[0073] In embodiment 4 of the temperature control structure of the present invention, an improvement is made on the basis of embodiment 1 or 2. The thermally conductive pad 2 may not be provided between the functional chip 1 or other heating device and the heat transfer structure 3, that is, the functional chip 1 or other heating device and the heat transfer structure 3 are in direct contact.

[0074] In embodiment 5 of the temperature control structure of the present invention, an improvement is made on the basis of embodiment 1 or 2. The heat transfer structure 3 can be a whole, or it can be a heat transfer structure 3 in which multiple structures are in contact with each other or form a heat transfer link with thermal connectors.

[0075] In Embodiment 6 of the present invention, an improvement is made on the basis of Embodiment 1 or 2. The metal block can be integrally set with the heat transfer structure 3, or the metal block and the heat transfer structure 3 can be thermally connected through other heat-conducting components.

[0076] In Embodiment 7 of the temperature control structure of the present invention, an improvement is made on the basis of Embodiment 2. The piezoelectric ceramic can be replaced with a pressure sensor, so that metal block I is in contact with pressure sensor I and metal block II is in contact with pressure sensor II.

[0077] In embodiment 8 of the temperature control structure of the present invention, improvements are made based on embodiments 1 or 2. Besides being integrated onto the PCB board 6, the functional chip 1 or other heating devices, piezoelectric ceramics or pressure sensors, and temperature control module can be adjusted according to the application scenario. The functional chip 1 or other heating devices, piezoelectric ceramics or pressure sensors, and temperature control module can be electrically connected via wires. Alternatively, the functional chip 1 or other heating devices can be set up separately, while the piezoelectric ceramics or pressure sensors and temperature control modules can be integrated onto the PCB board 6.

[0078] In Embodiment 9 of the present invention, an improvement is made on the basis of Embodiment 2. The metal block II 42 can be replaced with other forms of non-thermal insulating blocks, such as plastic blocks, and the insulating blocks are placed close to the metal block I 41.

[0079] In Embodiment 10 of the present invention, an improvement is made on the basis of Embodiment 1 or 2. Multiple metal blocks or multiple groups of metal blocks (including metal block I and metal block II) can be set according to the number and distribution of the heating devices to accurately monitor the temperature of the heating devices and feed it back to the temperature control module.

[0080] In Embodiment 11 of the present invention, an improvement is made on the basis of Embodiment 1 or 2. The fan can be replaced with other cooling devices that can dissipate heat from the heat-generating device, such as thermoelectric coolers, environmental control systems, etc.

[0081] In existing technology, multiple cold plate structures are installed inside the chassis, and a PCB board 6 is set within each cold plate structure. A functional chip 1 is mounted on the PCB board 6. A fan is installed on the chassis, and heat dissipation is achieved through the fan when the cold plate structures inside the chassis are in operation. Currently, the speed control mode of the fan speed control system is determined by the type of functional chip and the communication link, as follows:

[0082] a) Regarding functional chip 1, in the field of heat dissipation technology, the type of functional chip 1 depends on whether it has a temperature control module designed inside. For example, some functional chips 1 have some pins for temperature control. These pins are electrically connected to the fan, and the fan can change its speed according to the power of functional chip 1.

[0083] (b) Regarding the communication link, the complete communication link of the chassis consists of the following electrical structures in sequence: cold plate structure (board), LRM / VPX connector, backplane assembly, and fan. Within these electrical structures, it is necessary to determine whether the cold plate structure contains traces connecting to the temperature control pins of functional chip 1, whether the LRM / VPX connector has pins connecting to the traces on the cold plate structure, whether the backplane assembly has traces controlling fan speed, and whether the fan has speed control functionality. A communication link exists only if the cold plate structure, LRM / VPX connector, backplane assembly, and fan all have connectivity functions; otherwise, there is no communication link.

[0084] This results in the following fan speed control modes, as shown in Table 1.

[0085]

[0086]

[0087] Table 1 Fan Speed ​​Control Mode

[0088] According to the speed regulation mode in Table 1 and Figure 2 , Figure 3 The structural diagram shows that, for existing control modes that rely on external sensors, the temperature control structure of this invention can be improved, thereby deriving two fan control structures:

[0089] 1) Integrated temperature control structure: When the communication link is complete, the temperature control structure is integrated into the PCB board in the cold plate structure, and the control signal is transmitted to the fan through the PCB board.

[0090] 2) External temperature control structure: When the communication link is incomplete or there is no communication link, the temperature control structure is designed independently and connected to the back panel or housing of the equipment (e.g., chassis) to transmit the control limit signal to the fan.

[0091] When an integrated temperature control structure is used within the chassis to control the fan speed, such as Figure 4 , Figure 5 , Figure 8 The diagram shows an embodiment 1 of a fan speed control system using the aforementioned temperature control structure according to the present invention. In this embodiment, an embodiment 2 of the temperature control structure is selected for more accurate temperature measurement. The cold plate structure inside the chassis includes a cold plate housing 7. A PCB board 6 is disposed in the cavity inside the cold plate housing 7. A module connector 9 is disposed at the rear end of the PCB board 6. The module connector 9 extends out of the cold plate housing 7 and is used to mate with the backplane connector on the backplane assembly inside the chassis. In this embodiment, the module connector 9 is an LRM connector or a VPX connector. Multiple heat dissipation teeth are distributed on the outer side wall of the cold plate housing 7 to increase the heat dissipation area.

[0092] Multiple functional chips 1 are distributed on the side of the PCB board 6. These functional chips 1, as devices requiring heat dissipation, generate heat during the operation of the cold plate structure. Thermally conductive pads 2 are adhered to the functional chips 1. Heat dissipation protrusions 8, corresponding to the positions of the functional chips 1, are distributed on the inner wall of the cold plate housing 7. The thermally conductive pads 2 are tightly attached to the heat dissipation protrusions 8. The heat generated by the functional chips 1 is transferred to the cold plate housing 7 through the thermally conductive pads 2 and the heat dissipation protrusions 8, achieving a thermally conductive connection between the functional chips 1 and the cold plate housing 7. In this embodiment, the heat dissipation protrusions 8 and the cold plate housing 7 are integrally formed.

[0093] Metal blocks I 41 and II 42 are disposed on the inner wall of the cold plate shell 7. The distance between metal blocks I 41 and II 42 is small, such as... Figure 5 As shown. Piezoelectric ceramics I51 and II52, corresponding to the positions of metal block I 41 and metal block II 42, are disposed on PCB board 6. Metal block I 41 is in contact with piezoelectric ceramic I 51, and metal block II 42 is in contact with piezoelectric ceramic II 52. A heat insulation plate is disposed between metal block II 42 and the cold plate housing 7.

[0094] In this embodiment, in order to reduce the volume of metal block I 41 and metal block II 42, metal block I 41 and metal block II 42 are provided on one of the heat dissipation protrusions 8, such as... Figure 4 , Figure 5 As shown.

[0095] Heat from the cold plate housing 7 is conducted to the metal block I 41. The heated metal block I 41 expands and compresses the corresponding piezoelectric ceramic I 51, causing the piezoelectric ceramic I 51 to generate an electrical signal. A temperature control module is integrated on the PCB board 6.

[0096] A backplate assembly 10 is provided at the rear of the chassis. After the cold plate structure 11 is inserted into the chassis, the module connector 6 on the cold plate structure 11 is inserted into the backplate connector on the backplate 10.

[0097] A cooling fan 12 is installed at the bottom of the chassis. The cavity containing the cooling fan 12 is connected to the outside to form an air inlet. The cavity containing the cooling fan 12 is connected to the cavity containing the cold plate structure 11. The cavity containing the cold plate structure 11 is connected to the outside to form an air outlet. The cooling fan 12 is electrically connected to the backplate assembly 10.

[0098] There are air ducts between the cold plate structures 11 and between the cold plate structures 11 and the chassis shell for air to pass through. When the cooling fan 12 is working, the cold air from outside enters from the air inlet, passes through the cavity of the cooling fan and then passes through the air duct, carrying away the heat dissipated by the cold plate structures 11, and then the hot air is sent out from the air outlet 61.

[0099] The electrical signal generated by the piezoelectric ceramic (including piezoelectric ceramic I and piezoelectric ceramic II) is input to the temperature control module. After processing by the temperature control module, a suitable cooling fan current (voltage) is output. The cooling fan current (voltage) is transmitted to the cooling fan 12 through the PCB board 6, module connector 9, backplane connector, and backplane, controlling the speed of the cooling fan 12. This speed of the cooling fan 12 follows the power of the functional chip 1, thereby regulating the cooling fan flow and thus the temperature of the functional chip 1.

[0100] The cooling fan is connected to the backplane inside the chassis via a fan cable, which includes a power cable, a speed control cable, and a signal feedback cable. A power supply board is located inside the chassis, supplying power to the cooling fan via the power cable. An electrical signal from the temperature control module is transmitted to the cooling fan via the backplane and the speed control cable to control the fan speed, thereby regulating the airflow. The status of the cooling fan is transmitted to the backplane and the temperature control module via the signal feedback cable for monitoring the fan's condition.

[0101] Multiple cold plate structures 11 can be installed inside the chassis. A cooling fan control module is set on the back panel assembly. The cooling fan control module receives the electrical signals output by the temperature control modules of the multiple cold plate structures and selects the largest electrical signal (corresponding to the highest temperature) to control the rotation of the cooling fan, ensuring that the cooling fan flow can meet the cooling requirements.

[0102] This invention proposes a fan speed control system that can automatically adjust the speed of the cooling fan 12 according to the temperature of the functional chip 1, eliminating the need for traditional temperature sensors, solving the installation and layout problems of temperature sensors, achieving system reliability and miniaturization design, effectively controlling the temperature rise of the cold plate structure (board), and effectively improving the reliability of heat dissipation of electronic devices.

[0103] In another embodiment of a fan speed control system, to accurately measure the temperature of each functional chip 1, metal blocks I 41 and II 42 (close to the corresponding functional chip 10) can be provided on each heat dissipation protrusion 8, with a piezoelectric ceramic attached to each metal block. The heat emitted by the functional chip 1 is absorbed by the nearest metal block, causing the metal block to expand and generate an electrical signal in the corresponding piezoelectric ceramic. Due to the short heat transfer path, the metal block can be precisely deformed according to the heat generated by the functional chip 1, allowing the piezoelectric ceramic to accurately generate an electrical signal based on the heat generated by the functional chip 1. The electrical signal generated by the piezoelectric ceramic on the same PCB board 6 is transmitted to the temperature control module on the PCB board, which selects the highest value for processing and sends it to the cooling fan.

[0104] In another embodiment of a fan speed control system, the cold plate structure is provided with two or more sets of metal blocks (including metal block I 41 and metal block II 42) and piezoelectric ceramics (including piezoelectric ceramic I 51 and piezoelectric ceramic II 52), not limited to the number and position of the functional chip 1, for monitoring the temperature at multiple locations in the cold plate structure. The temperature control module on the PCB board 6 outputs an electrical signal to drive the cooling fan according to the electrical signal corresponding to the maximum deformation (i.e., the highest temperature).

[0105] In another embodiment of a fan speed control system, the cooling fan 12 can be located on the outside of the chassis housing. The heat emitted by the functional chip 1 in the cold plate structure 11 is transferred to the chassis housing through the cold plate housing 7. The cooling fan 12 blows cold air onto the chassis housing to dissipate heat from the chassis.

[0106] When an external temperature control structure is used inside the chassis to control the fan speed, such as Figure 6 , Figure 7 , Figure 9As shown, this is Embodiment 2 of a fan speed control system using the above-mentioned temperature control structure according to the present invention. In this embodiment, the temperature control structure is selected for more accurate temperature measurement.

[0107] The chassis is designed as a double-layered shell, consisting of an inner shell 13 and an outer shell 15. A heat dissipation structure 14 is installed in the cavity between the inner shell 13 and the outer shell 15. The heat dissipation structure 14 is in thermal contact with the inner shell 13 and the outer shell 15. The heat dissipation structure 14 is made of a thin plate that is folded back and forth. Figure 9 As shown, heat from the inner casing 13 is transferred to the heat dissipation structure 14, which increases the heat dissipation area and accelerates heat dissipation. An external fan 16 is installed on the outer casing 15. The cavity between the inner casing 13 and the outer casing 15 is connected to the outside. When the external fan 16 operates, it blows cool air into the cavity between the inner casing 13 and the outer casing 15, which can carry away the heat from the heat dissipation structure 14. The external fan 16 is electrically connected to the backplate assembly 10.

[0108] After the cold plate structure 11 is inserted into the chassis, it comes into contact with the inner shell 13. When the cold plate structure 11 is running, the internal functional chip generates heat. The heat is first transferred to the cold plate shell of the cold plate structure 11, and then transferred to the inner shell 13. The inner shell 13 then transfers the heat to the heat dissipation structure 14.

[0109] A temperature control device 17 is installed on the inner housing 1. The housing 18 of the temperature control device is thermally connected to the inner housing 1, and the temperature control device 17 is communicatively connected to the backplane assembly 10. In order to better measure the temperature, the temperature control device 17 is located near the temperature-sensitive chip inside the cold plate structure 11, so as to ensure more accurate monitoring of the temperature of the temperature-sensitive chip, and control the operation of the external fan 16 according to the monitored temperature to ensure that the temperature of the temperature-sensitive chip is within the normal range.

[0110] In this embodiment, the temperature control device 17 is installed at the rear end of the inner casing 1 of the chassis, such as... Figure 3 As shown, a cavity is provided at the rear of the chassis, exposing the inner housing 1 within the cavity. The temperature control device 17 is installed on the inner wall of the inner housing 13. In this embodiment, the temperature control device 17 is located on the inner housing 13 at the top of the chassis.

[0111] The temperature control device 17 is integrated and enclosed by a temperature control device housing 18. In this embodiment, the top outer wall of the temperature control device housing 18 contacts the inner housing 13. Metal blocks I 41 and II 42 are disposed on the inner wall of the temperature control device housing 18. The distance between metal blocks I 41 and II 42 is small. Figure 7 As shown. A temperature control PCB board 20 is disposed in the inner cavity of the temperature control device housing 18. The temperature control PCB board 20 is disposed in the inner cavity of the temperature control device housing 18 via a bracket (not shown in the figure). The temperature control PCB board 20 is electrically connected to the back panel assembly 10.

[0112] The temperature control PCB board 20 has piezoelectric ceramics I 51 and II 52 corresponding to the positions of metal block I 41 and metal block II 42, respectively. Metal block I 41 is in contact with piezoelectric ceramic I 51, and metal block II 42 is in contact with piezoelectric ceramic II 52. An insulation plate is provided between metal block II 42 and the temperature control device housing 18 to prevent heat from the temperature control device housing 18 from being transferred to metal block II 42. The temperature control module 19 is integrated on the temperature control PCB board 20.

[0113] The heat from the inner shell 13 is transferred to the temperature control device shell 18, and the heat from the temperature control device shell 18 is conducted to the metal block I 41. After the metal block I 41 is heated and expands, it can compress the corresponding piezoelectric ceramic I 51. The piezoelectric ceramic has a piezoelectric effect, which generates an electrical signal when the piezoelectric ceramic is deformed. The temperature control module 19 can use the electrical signal to control the speed of the external fan 16.

[0114] When the cold plate structure 11 is working, heat is transferred to the temperature control device housing 18 through the inner shell 13. The temperature of the metal block I 41 rises and deforms. The deformation of the metal block I 41 acts on the piezoelectric ceramic I 51. The piezoelectric effect of the piezoelectric ceramic I 51 generates an electrical signal (voltage or current). The electrical signal is processed and amplified by the temperature control module 19 to form a suitable current (voltage), which is transmitted to the external fan 16 through the back plate assembly 10, thereby controlling the speed of the external fan 16 and further changing the temperature of the cold plate structure 11. The temperature control module 19 corrects the electrical signal emitted by the piezoelectric ceramic I 51 under vibration conditions by receiving the electrical signal generated by the piezoelectric ceramic II 52, so as to avoid the vibration affecting the accuracy of the electrical signal.

[0115] In this embodiment, metal block I 41 and metal block II 42 are disposed on the top inner wall of the temperature control device housing 18 to shorten the distance with the inner housing 13.

[0116] An external fan speed control system can be directly installed and used on a traditional chassis. At the same time, an external fan 16 can be installed on the chassis, which facilitates the improvement of existing air-cooled chassis. Especially for sealed chassis, an external fan 16 and a temperature control device 17 can be directly installed on the outside of the chassis.

[0117] In another embodiment of Embodiment 2 of the present invention, a fan speed control system using the above-described temperature control structure, the temperature control device 17 can be directly electrically connected to the external fan 16.

[0118] In another embodiment of a fan speed control system using the above-described temperature control structure according to the present invention, the external fan 16 can be replaced by the cooling fan 12 in an embodiment of a fan speed control system using the above-described temperature control structure, and the cooling fan 12 directly dissipates heat to the cold plate structure 11 inside the chassis.

[0119] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature control structure, comprising a heat transfer structure (3), characterized in that: The heat transfer structure (3) is thermally connected to the heating device. A metal block (4) is provided on the heat transfer structure (3). The metal block (4) is thermally connected to the heat transfer structure (3). The metal block (4) is in contact with the piezoelectric ceramic I (51) or the pressure sensor I. The piezoelectric ceramic I (51) or the pressure sensor I is electrically connected to the temperature control module. The heat transfer structure (3) is provided with an insulating block, which is thermally connected to the heat transfer structure (3). The insulating block is in contact with the piezoelectric ceramic II (52) or the pressure sensor II. The piezoelectric ceramic II (52) or the pressure sensor II is electrically connected to the temperature control module. The metal block and the insulating block are arranged in groups. The distance between the metal block and the insulating block in the same group on the heat transfer structure (3) is close so that the metal block, the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions. The temperature control structure has a dynamic compensation function. The initial contact deformation between the metal block and the piezoelectric ceramic I (51) or the pressure sensor I, and between the insulating block and the piezoelectric ceramic II (52) or the pressure sensor II in the static and initial temperature state is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate voltage V0. The heating device heats up, and the deformation of the metal block is Δx1. The actual deformation of the metal block due to temperature is Δx1-Δx0. When Δx1 is deformed, the voltage generated by the piezoelectric ceramic I (41) or the pressure sensor I is V1. The temperature control module receives voltage V0 and voltage V1 and outputs the working voltage or current of the refrigeration equipment when it is static after processing. When the temperature control structure vibrates, the deformation of the piezoelectric ceramic I (51) or pressure sensor I, piezoelectric ceramic II (52) or pressure sensor II at the corresponding positions of the metal block and the insulation block due to vibration is set to Δx2. The total deformation of the metal block and the corresponding piezoelectric ceramic I (51) or pressure sensor I is Δx1±Δx2. The voltage corresponding to piezoelectric ceramic I (51) or pressure sensor I is V3. The total deformation of the insulation block and the corresponding piezoelectric ceramic II (52) or pressure sensor II is Δx0±Δx2. The voltage corresponding to piezoelectric ceramic II (52) or pressure sensor II is V4. The difference between the deformation of the metal block and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the voltage output by the temperature control module remains unchanged to achieve dynamic compensation function.

2. The temperature control structure according to claim 1, characterized in that: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

3. A temperature control structure according to any one of claims 1-2, characterized in that: A thermally conductive pad (2) is provided between the heating device and the heat transfer structure (3).

4. A temperature control structure according to any one of claims 1-2, characterized in that: The piezoelectric ceramic I (51) or pressure sensor I, piezoelectric ceramic II (52) or pressure sensor II, and temperature control module are integrated on the PCB board (6).

5. A fan speed control system for dissipating heat from a functional chip (1) in a cold plate structure (11) inside a chassis, wherein the functional chip (1) is a heat-generating device, characterized in that: The system includes a temperature control structure as described in any one of claims 1-4, and a fan electrically connected to the temperature control module in the temperature control structure. The temperature control structure and the fan are disposed in a chassis. The fan is electrically connected to the temperature control structure through a fan wire, which includes a power supply wire, a speed control wire, and a signal feedback wire.

6. A fan speed control system according to claim 5, characterized in that: The chassis includes a chassis shell, and the cold plate structure (11) includes a cold plate shell (7). A PCB board (6) is installed inside the cold plate shell (7). A functional chip (1), a temperature control module, a piezoelectric ceramic I (51) or a pressure sensor I, a piezoelectric ceramic II (52) or a pressure sensor II are integrated on the PCB board (6). The cold plate shell (7) is thermally connected to the functional chip (1). The inner wall of the cold plate shell (7) is provided with a metal block that contacts the piezoelectric ceramic I (51) or the pressure sensor I, and an insulating block that contacts the piezoelectric ceramic II (52) or the pressure sensor II. A module connector (9) is provided on the cold plate structure (11) that is connected to the PCB board (6) and extends out of the cold plate shell (7). The module connector (9) is inserted into the backplate connector of the backplate assembly (12) inside the chassis. The fan is electrically connected to the backplate assembly (12).

7. A fan speed control system according to claim 5, characterized in that: The cold plate structure (11) includes a cold plate shell (7), a functional chip (1) inside the cold plate shell (7) is thermally connected to the cold plate shell, the cold plate shell (7) is thermally connected to the chassis shell, the chassis shell is provided with a temperature control device (17), the temperature control device (17) includes a temperature control device shell (18), the temperature control device shell (18) is thermally connected to the chassis shell, the temperature control device shell (18) is provided with a temperature control PCB board (20), the temperature control PCB board (20) is integrated with a temperature control module, a piezoelectric ceramic I (51) or a pressure sensor I, a piezoelectric ceramic II (52) or a pressure sensor II, the inner wall of the temperature control device shell (18) is provided with a metal block that contacts the piezoelectric ceramic I (51) or the pressure sensor I, and an insulating block that contacts the piezoelectric ceramic II (52) or the pressure sensor II; the temperature control device (17) is electrically connected to the back plate assembly (12), and the back plate assembly (12) is electrically connected to the fan.

8. A fan speed control system according to claim 6 or 7, characterized in that: The chassis is equipped with an air inlet and an air outlet. When the fan is working, it sends out the hot air inside the chassis and draws in the cold air. Alternatively, the chassis can be enclosed, with a cold plate structure in contact with the chassis to transfer heat to the chassis, and a fan to dissipate heat from the chassis.

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