Integrated heat dissipation adaptive adjustment system for thermoelectric refrigerator box

Abstract

The application belongs to the technical field of equipment heat dissipation, and particularly relates to an integrated heat dissipation self-adaptive adjusting system for a thermoelectric refrigerator box, which is arranged in the box, a thermoelectric refrigerator is arranged in the box shell, a cold plate structure is inserted into the box shell, the cold plate structure comprises a cold plate structure shell, a PCB and a module connector, the cold plate structure shell is in heat conduction connection with the box shell, a functional chip is in heat conduction connection with the inner wall of the cold plate structure shell, a metal block I is arranged on the inner wall of the cold plate structure shell, the metal block I is in heat conduction connection with the cold plate structure shell, a piezoelectric ceramic I or a pressure sensor I is arranged on the PCB, the piezoelectric ceramic I or the pressure sensor I is in electric connection with a temperature control module on the PCB, and the thermoelectric refrigerator is in electric connection with a back plate assembly. The system can automatically adjust the power of the thermoelectric refrigerator according to the temperature of the functional chip, does not depend on a traditional temperature sensor, solves the installation and arrangement problems of the temperature sensor, can improve the reliability, and realizes miniaturized design.

Description

Technical Field

[0001] This invention belongs to the field of equipment heat dissipation technology, specifically relating to an integrated heat dissipation adaptive adjustment system for thermoelectric refrigeration chassis. Background Technology

[0002] like Figure 1 The thermoelectric cooling device shown is located between the inner and outer shells of the chassis. It adjusts the thermoelectric cooling power by monitoring the temperature of key components within the chassis to dissipate heat from the functional modules. For functional modules with temperature feedback, the power of the thermoelectric cooler can be automatically adjusted based on the temperature feedback. However, for functional modules without temperature feedback, the power of the thermoelectric cooler needs to be adjusted based on the temperature from a temperature sensor. Temperature sensors are typically thermocouples, requiring two wires connected at different locations, making installation complex and space-consuming. As functional modules become increasingly integrated, the space available for temperature sensors within these modules is limited, making installation and placement difficult. Furthermore, thermocouple-type temperature sensors are bulky and have relatively poor reliability. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides an external heat dissipation adaptive adjustment system for thermoelectric refrigeration enclosures, which solves the difficulties in installing and fixing temperature sensors, and achieves the integration and miniaturization of the equipment.

[0004] The objective of this invention is achieved through the following technical solution. According to this invention, an integrated heat dissipation adaptive adjustment system for a thermoelectric cooling chassis is provided, which is installed inside a chassis. The chassis includes a chassis shell, a thermoelectric cooler is disposed within the chassis shell, and a cold plate structure is inserted into the chassis shell. The cold plate structure includes a cold plate structure housing, a PCB board disposed within the cold plate structure housing, and a module connector mounted on the PCB board for connection with a backplane assembly inside the chassis. The cold plate structure housing is thermally connected to the chassis shell. The functional chip on the PCB board is thermally connected to the inner wall of the cold plate structure housing. A metal block I is disposed on the inner wall of the cold plate structure housing, and the metal block I is thermally connected to the cold plate structure housing. A piezoelectric ceramic I or a pressure sensor I is disposed on the PCB board in contact with the metal block I. The piezoelectric ceramic I or the pressure sensor I is electrically connected to a temperature control module on the PCB board. The thermoelectric cooler is electrically connected to the backplane assembly.

[0005] Compared with the prior art, the advantages of the present invention are:

[0006] This invention proposes an integrated heat dissipation adaptive adjustment system for thermoelectric cooling enclosures. The functional chip generates heat, causing the metal block to deform, which in turn causes the piezoelectric ceramic or pressure sensor to generate an electrical signal. The electrical signal controls the power of the thermoelectric cooler through a temperature control module, enabling the system to automatically adjust the power of the thermoelectric cooler according to the temperature of the functional chip. This eliminates the reliance on traditional temperature sensors. The metal block, piezoelectric ceramic, or pressure sensor can be directly arranged on the corresponding cold plate structure shell and PCB board, solving the installation and arrangement problems of temperature sensors. Furthermore, the metal block, piezoelectric ceramic, or pressure sensor has a simple structure, which improves reliability and achieves miniaturization.

[0007] Furthermore, the inner wall of the cold plate structure shell is also provided with a heat insulation block, which is thermally connected to the cold plate structure shell. A piezoelectric ceramic II or pressure sensor II is provided on the PCB board in contact with the heat insulation block. The piezoelectric ceramic II or pressure sensor II is electrically connected to the temperature control module on the PCB board. The metal block I and the heat insulation block are arranged in a group. The distance between the metal block I and the heat insulation block in the same group on the cold plate structure shell is similar so that the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0008] Compared with the prior art, the advantages of the present invention are:

[0009] When the chassis operates under vibration conditions, the vibration will cause relative displacement between the metal block I and the piezoelectric ceramic I 151 or the pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block I. After setting up the insulation block, the insulation block will only deform due to vibration. After the electrical signal of the piezoelectric ceramic or pressure sensor corresponding to the insulation block is transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signal generated due to temperature deformation, cancels the electrical signal generated under vibration conditions, corrects the erroneous electrical signal generated under vibration conditions, and makes the temperature control more accurate.

[0010] Furthermore, the temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

[0011] Furthermore, the system has a dynamic compensation function. The initial contact deformation between the metal block I and the piezoelectric ceramic I or the pressure sensor I, and between the insulating block and the piezoelectric ceramic II or the pressure sensor II, under static and initial temperature conditions is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0. The functional chip heats up, and the deformation of the metal block I is Δx1. The actual deformation of the metal block I due to temperature is Δx1-Δx0. When Δx1 is deformed, the voltage generated by the piezoelectric ceramic I or the pressure sensor I is V1. The temperature control module receives the voltages V0 and V1 and calculates and outputs the current of the thermoelectric cooler when it is static.

[0012] When the cold plate structure vibrates, the deformation of the PCB board at the corresponding positions of metal block I and insulation block due to vibration is set to Δx2. The total deformation of metal block I and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2. The voltage corresponding to piezoelectric ceramic I or pressure sensor I is V3. The total deformation of insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2. The voltage corresponding to piezoelectric ceramic II or pressure sensor II is V4. The difference between the deformation of metal block I and insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the thermoelectric cooling current output by the temperature control module remains unchanged to achieve dynamic compensation function.

[0013] Furthermore, the inner wall of the cold plate structure housing is provided with heat dissipation protrusions for thermally connecting with the functional chip.

[0014] Furthermore, the functional chip is provided with a thermally conductive pad that contacts the thermally conductive boss.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] By using thermal pads and heat dissipation bumps, the functional chip is made into full contact with the cold plate structure housing, ensuring that heat is transferred to the metal block.

[0017] Furthermore, the metal block I and the heat insulation block are mounted on the heat dissipation protrusion.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] The volume of metal block I and the insulation block can be reduced by utilizing the thickness of the heat dissipation boss.

[0020] Furthermore, the chassis housing includes an inner shell that is thermally connected to the cold plate structure shell and an outer shell located outside the inner shell. A heat insulation plate is provided between the inner shell and the outer shell, and a thermoelectric cooler that is thermally connected to the inner shell and the outer shell is nested on the heat insulation plate.

[0021] Furthermore, the outer wall of the chassis housing is provided with heat dissipation ridges.

[0022] Furthermore, a fan for heat dissipation of the chassis is provided on the outside of the chassis, and the fan is electrically connected to the backplate assembly.

[0023] Compared with the prior art, the advantages of the present invention are:

[0024] By installing cooling fins, i.e. fans, on the chassis, heat can be transferred to the chassis via a thermoelectric cooler, allowing for rapid heat dissipation.

[0025] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of the present invention more obvious and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a thermoelectric refrigeration unit casing in the prior art;

[0027] Figure 2 This is a schematic diagram of the overall assembly of the cold plate structure in an embodiment of an integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to the present invention;

[0028] Figure 3 for Figure 2 A schematic diagram of the decomposition process;

[0029] Figure 4 for Figure 2 A partial sectional view;

[0030] Figure 5 for Figure 3 Schematic diagram of the PCB board assembly;

[0031] Figure 6 for Figure 3 A three-dimensional schematic diagram of the intercooler plate cover I;

[0032] Figure 7 for Figure 4 A partially enlarged schematic diagram of the metal block and piezoelectric ceramics in the middle;

[0033] Figure 8 This is a schematic diagram illustrating the principle of an embodiment of an integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to the present invention;

[0034] Figure 9 This is a topology diagram of the temperature control module in an embodiment of an integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to the present invention;

[0035] Figure 10This is a schematic diagram of another arrangement of the metal block and piezoelectric ceramic in an embodiment of an integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to the present invention;

[0036] Figure 11 This is a schematic diagram of the heat transfer structure in an embodiment of an integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to the present invention;

[0037] Figure 12 for Figure 11 A schematic diagram of the structure shown when it vibrates;

[0038] Figure 13 This is a schematic diagram illustrating an embodiment of the integrated heat dissipation adaptive adjustment system for thermoelectric refrigeration chassis of the present invention when applied to a chassis.

[0039] Figure label:

[0040] 1-Inner shell, 2-Outer shell, 3-Insulation plate, 4-Thermoelectric cooler, 5-Heat dissipation tooth I, 6-Back plate assembly, 7-Cold plate structure, 8-PCB board, 9-Module connector, 10-Functional chip, 11-Cold plate cover I, 111-Heat dissipation tooth II, 12-Cold plate cover II, 13-Handle, 14-Screw, 151-Piezoelectric ceramic I, 152-Piezoelectric ceramic II, 16-Heat dissipation boss, 171-Metal block I, 172-Metal block II, 18-Thermal conductive pad. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] An embodiment of the integrated heat dissipation adaptive adjustment system for thermoelectric refrigeration chassis of the present invention is as follows: Figures 2 to 13 As shown. In this embodiment, the system of the present invention is applied in a chassis. Of course, in other embodiments, the system of the present invention can also be applied to other devices that require heat dissipation.

[0043] The front of the chassis has an opening for inserting the cold plate structure 7, and the rear has a backplate assembly 6 with a backplate connector. A module connector 9 is located at the rear of the cold plate structure 7. In this embodiment, the module connector 9 can be an LRM connector or a VPX connector. After the cold plate structure 7 is inserted into the chassis, the module connector 9 engages with the backplate connector, enabling signal communication between the cold plate structure 7 and the backplate assembly 6, as well as between the cold plate structures 7 themselves.

[0044] The chassis includes a chassis shell, with double-layered shells on the top, bottom, left, and right sides: an inner shell 1 and an outer shell 2. A heat insulation plate 3 is installed between the inner shell 1 and the outer shell 2. The heat insulation plate 3 has multiple holes, each containing a thermoelectric cooler 4. The two end faces of the thermoelectric cooler 4 contact the inner shell 1 and the outer shell 2, respectively. Figure 1 As shown.

[0045] After the cold plate structure 7 is inserted into the chassis, it contacts the inner shell 1. When the cold plate structure 7 is running, the functional chip 10 inside it generates heat. The heat is first transferred to the shell of the cold plate structure 7, and then to the inner shell 1. The thermoelectric cooler 4 operates, transferring the heat from the inner shell 1 to the outer shell 2. The outer shell 2 has heat dissipation fins I 5 distributed on it, dissipating the heat to the outside, thus achieving heat dissipation for the cold plate structure 7 and the chassis. By controlling the power of the thermoelectric cooler 4, the rate of heat transfer can be controlled, achieving control of the heat dissipation rate. The power of the thermoelectric cooler 4 is directly proportional to the heat dissipation rate. The thermoelectric cooler 4 is communicatively connected to the backplane assembly 6.

[0046] like Figures 2 to 7 The image shows the cold plate structure 7. The cold plate structure 7 includes a cold plate cover I 11 and a cold plate cover II 12 that are mated together. The cold plate cover I 11 and the cold plate cover II 12 form the cold plate structure shell. In this embodiment, the cold plate cover I 11 and the cold plate cover II 12 are fixed together by screws 14.

[0047] A PCB board 8 is housed in the cavity formed between cold plate cover I 11 and cold plate cover II 12. A module connector 9 is located at the rear end of the PCB board 8. The module connector 9 extends out of the cold plate structure housing and is used to mate with the backplane connector on the backplane assembly 6 inside the air-cooled chassis. In this embodiment, the module connector 9 is an LRM connector or a VPX connector.

[0048] A handle 13 is provided at the front end of the cold plate structure housing to assist in inserting or removing the cold plate structure from the air-cooled chassis.

[0049] Multiple heat dissipation teeth II 111 are distributed on the outer side wall of the cold plate cover I 11 to increase the heat dissipation area.

[0050] Multiple functional chips 10 are distributed on the side of the PCB board 8 facing the cold plate cover I 11. As devices that require heat dissipation, the functional chips 10 will generate heat during the operation of the cold plate structure 7.

[0051] The PCB board assembly consists of PCB board 8, connector 9, and functional chip 10.

[0052] A thermally conductive pad 18 is bonded to the functional chip 10. Heat dissipation protrusions 16, corresponding to the positions of the functional chip 10, are distributed on the sidewalls of the cold plate cover I 11. The thermally conductive pad 18 is tightly attached to the heat dissipation protrusions 16. The heat generated by the functional chip 10 is transferred to the cold plate cover I 11 through the thermally conductive pad 18 and the heat dissipation protrusions 16, achieving a thermally conductive connection between the functional chip 10 and the cold plate structure housing. In this embodiment, the heat dissipation protrusions 16 and the cold plate cover I 11 are integrally formed.

[0053] The inner wall of the cold plate cover I 11 is provided with metal blocks I 171 and II 172. The distance between metal blocks I 171 and II 172 is small, such as... Figure 10 As shown, piezoelectric ceramics I 151 and II 152, corresponding to the positions of metal block I 171 and metal block II 172, are disposed on PCB board 8. Metal block I 171 is in contact with piezoelectric ceramic I 151, and metal block II 172 is in contact with piezoelectric ceramic II 152. A heat insulation plate is disposed between metal block II 172 and cold plate cover I 11.

[0054] In this embodiment, in order to reduce the volume of metal block I 171 and metal block II 172, metal block I 171 and metal block II 172 are disposed on one of the heat dissipation protrusions 16, such as... Figure 4 , Figure 7 As shown.

[0055] Heat from the cold plate cover I 11 is conducted to the metal block I 171. After the metal block I 171 is heated and expands, it can compress the corresponding piezoelectric ceramic I 151. The piezoelectric ceramic has a piezoelectric effect, which generates an electrical signal when the piezoelectric ceramic I 151 is compressed and deformed. The power of the thermoelectric cooler 4 can be controlled by the electrical signal.

[0056] The heat generated by the functional chip 10 passes sequentially through the thermal pad 18, the heat dissipation boss 16, the cold plate cover I 11, and the metal block I 171, and is then compressed by the metal block I 171 to form the piezoelectric ceramic I 151, thus forming a heat transfer structure.

[0057] A temperature control module is installed on PCB board 8. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 9 As shown, the piezoelectric ceramic and the temperature control module are electrically connected via PCB board 8, enabling the electrical signals generated by the piezoelectric ceramic to be transmitted to the temperature control module for processing.

[0058] The power supply provides appropriate voltage (current) to components such as amplifier circuits, memory modules, and control logic circuits.

[0059] The amplifier circuit amplifies the input piezoelectric ceramic electrical signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the thermoelectric cooler.

[0060] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as the power of the functional chip, the expansion of the metal block, the voltage (current) of the piezoelectric ceramic, and the temperature.

[0061] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs signals to control the power of the thermoelectric cooler 4, and controls the priority when multiple piezoelectric ceramics work simultaneously, based on the data from the storage module.

[0062] The electrical signal generated by the piezoelectric ceramic (including piezoelectric ceramic I and piezoelectric ceramic II) is input to the temperature control module. After processing by the temperature control module, a suitable thermoelectric cooling current is output. The thermoelectric cooling current is transmitted to the thermoelectric cooler 4 through the PCB board 8, module connector 9, backplane connector, and backplane assembly 6, controlling the power of the thermoelectric cooler 4 so that its power follows the power of the functional chip 10, thereby adjusting the temperature of the cold plate structure and the chassis, and in turn, adjusting the temperature of the functional chip 10.

[0063] The thermoelectric cooler 4 is connected to the backplane assembly 6 inside the chassis via wires, including power supply lines, control lines, and signal feedback lines. A power supply board is installed inside the chassis, supplying power to the thermoelectric cooler 4 via the power supply lines. The electrical signal from the temperature control module is transmitted to the thermoelectric cooler 4 through the backplane assembly and control lines to control the power of the thermoelectric cooler 4, thereby regulating the temperature of the functional chip 10. The status of the thermoelectric cooler 4 is transmitted to the backplane assembly and temperature control module through the signal feedback lines to monitor the status of the thermoelectric cooler 4.

[0064] If the heat dissipation of the functional chip 10 is set to W1, then the temperature corresponding to the cold plate structure shell is t1.

[0065] The relationship between t1 and W1 can be expressed as follows:

[0066] t1=f(W1) (1)

[0067] When the shell temperature of the cold plate structure is t1, the expansion amount Δx of the metal block I13 (the expansion amount, deformation amount, or displacement amount mentioned in this invention refers to the expansion amount, deformation amount, or displacement amount generated by the metal block and the piezoelectric ceramic in the direction of interaction) can be expressed as:

[0068] Δx=f(t1) (2)

[0069] When the expansion of the piezoelectric ceramic I11 into the metal block I13 is Δx, the change in voltage (current) ΔV can be expressed as:

[0070] ΔV=f(Δx) (3)

[0071] When the voltage (current) changes by ΔV, the thermoelectric cooling current A output by the temperature control module 15 is:

[0072] A=f(ΔV) (4)

[0073] The expressions for the thermoelectric cooling current A and the power W2 of the thermoelectric cooler are as follows:

[0074] W2=f(A) (5)

[0075] The expression for the power W2 of the thermoelectric cooler and the temperature t2 of the functional chip is as follows:

[0076] t2=f(W2) (6)

[0077] Combining equations 1-6, we can obtain the relationship between the heat dissipation W1 (temperature t2 of the functional chip) and the thermoelectric cooling power W2 of the functional chip 10, as follows: Figure 8 As shown.

[0078] When the chassis and the cold plate structure inside the chassis are used under vibration conditions, the structure and components inside the cold plate structure will deform. The deformation caused by vibration and temperature may cause the electrical signal generated by the piezoelectric ceramic to be distorted.

[0079] Ideally, the electrical signal output by the piezoelectric ceramic I 151 is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I 171, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I 151. For example... Figure 11 , Figure 12 As shown, under vibration conditions, the expansion of metal block I 171 due to temperature is Δx1, and the deformation (i.e. displacement) of PCB board 8 and piezoelectric ceramics I 151 and II 152 on PCB board 8 due to vibration at the corresponding positions of metal block I 171 and metal block II 172 is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2 > Δx1, the piezoelectric ceramic I 151 loosens its contact with the metal block I 171, and the pressure on the piezoelectric ceramic I 151 decreases or even disappears. When the deformation directions of Δx1 and Δx2 are the same and Δx2 < Δx1, although the piezoelectric ceramic I 151 does not detach from the contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on the piezoelectric ceramic I 151. When the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between the piezoelectric ceramic I 151 and the metal block I 171 increases, and the pressure on the piezoelectric ceramic I 151 increases. All of the above situations will lead to inaccurate electrical signals generated by the piezoelectric ceramic I 151 (the electrical signal is larger or smaller under different vibration conditions under the same temperature conditions).

[0080] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I 171 is in thermally conductive contact with cold plate cover I 11, and the heat from cold plate cover I 11 can be transferred to metal block I 171. Metal block I 171 can automatically deform and expand with temperature changes, and the output electrical signal of piezoelectric ceramic I 151 can change with temperature. A heat insulation plate is provided between metal block II 172 and cold plate cover I 11 to achieve heat insulation connection, prevent heat from being transferred to metal block II 172, and thus prevent metal block II 172 from expanding and deforming due to temperature changes.

[0081] The initial contact deformation Δx0 is set between metal block I 171 and piezoelectric ceramic I 151, and between metal block II 172 and piezoelectric ceramic II 152, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When the cold plate structure starts working, the functional chip 10 begins to heat up. The deformation of metal block I 171 is Δx1. Metal block II 172 is thermally insulated from the cold plate cover I 11 and will not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I 171 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when deformation is Δx0 is V0, and the voltage generated by the piezoelectric ceramic when deformation is Δx1 is V1. The amount of deformation corresponds to the voltage generated by the piezoelectric ceramic. This correspondence can be stored in the storage module in advance. The temperature control module receives the voltage generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the amount of deformation caused by temperature. Then, the calculated voltage is converted into the current required by the thermoelectric cooler 4 and transmitted to the thermoelectric cooler 4 to dissipate heat from the cold plate structure.

[0082] When the cold plate structure vibrates under the aforementioned temperature conditions (i.e., when metal block I 171 expands by Δx1), and the positions of metal block I 171 and metal block II 172 are close, the vibration deformation of the piezoelectric ceramics on the PCB board at corresponding positions is consistent or has a very small difference, which can both be set to Δx2. At this time, the total deformation of metal block I 171 and piezoelectric ceramic I 151 is Δx1 ± Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I 151 is V3. The total deformation of metal block II 172 and piezoelectric ceramic II 152 is Δx0 ± Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 152 is V4. Since the difference in deformation between metal block I 171 and metal block II 172 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration), the temperature control module 15 receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This can keep the current output by the temperature control module constant and unaffected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage is converted into the current required by the thermoelectric cooler and transmitted to the thermoelectric cooler 4 to dissipate heat from the cold plate structure, thereby realizing the dynamic compensation function.

[0083] When the cold plate structure is in operation, the heat from the functional chip 10 is transferred to the cold plate cover I 11 through the thermally conductive pad 18. The temperature of the metal block I 171 rises, causing deformation. This deformation acts on the piezoelectric ceramic I 151, and the piezoelectric effect of the piezoelectric ceramic I 151 generates an electrical signal (voltage or current). This signal is processed and amplified to form a suitable current (voltage), which is transmitted through the PCB board 8, module connector 9, backplane connector, and backplane assembly. The backplane assembly controls the supply voltage (current) of the thermoelectric cooler 4, thereby controlling the power of the thermoelectric cooler and further adjusting the temperature of the cold plate structure. The temperature control module receives the electrical signal generated by the piezoelectric ceramic II 152 and corrects the electrical signal emitted by the piezoelectric ceramic I 151 under vibration conditions, preventing vibration from affecting the accuracy of the electrical signal.

[0084] Multiple cold plate structures can be installed inside the chassis. A heat dissipation control module is set on the back panel assembly. The heat dissipation control module receives electrical signals output by the temperature control modules in the multiple cold plate structures. Multiple thermoelectric coolers are distributed inside the chassis. The heat dissipation control module can adjust the power of the thermoelectric cooler at the location of a cold plate structure according to the electrical signal corresponding to the temperature of a certain cold plate structure.

[0085] This invention proposes an integrated heat dissipation adaptive adjustment system for thermoelectric cooling chassis. This system can automatically adjust the power of thermoelectric cooler 4 according to the temperature of functional chip 10, eliminating the need for traditional temperature sensors, solving the installation and layout problems of temperature sensors, improving the reliability and miniaturization design of the system, effectively controlling the temperature rise of the cold plate structure (board), and effectively improving the reliability of heat dissipation of electronic equipment.

[0086] In other embodiments, heat dissipation teeth II are distributed on the outer side wall of the cold plate cover II 12, or heat dissipation teeth II 111 are distributed on the outer side walls of both the cold plate cover I 11 and the cold plate cover II 12. The heat dissipation teeth II can accelerate the heat dissipation of the cold plate structure. The heat dissipation teeth II may not be provided on the shell of the cold plate structure.

[0087] In other embodiments, to accurately measure the temperature of each functional chip 10, metal blocks I 171 and II 172 (close to the corresponding functional chip 10) can be provided on each heat dissipation protrusion 16, with a piezoelectric ceramic attached to each metal block. The heat emitted by the functional chip 10 is absorbed by the nearest metal block, causing the metal block to expand and generate an electrical signal in the corresponding piezoelectric ceramic. Due to the short heat transfer path, the metal block can deform precisely according to the heat generated by the functional chip 10, allowing the piezoelectric ceramic to accurately generate an electrical signal based on the heat generated by the functional chip 10. The electrical signal generated by the piezoelectric ceramic on the same PCB board is transmitted to the temperature control module on the same PCB board. The temperature control module selects the highest value for processing and sends it to the thermoelectric cooler 4.

[0088] In other embodiments, the cold plate structure is provided with two or more sets of metal blocks (including metal block I 171 and metal block II 172) and piezoelectric ceramics (including piezoelectric ceramic I 151 and piezoelectric ceramic II 152), not limited to the number and position of the functional chip 10, for monitoring the temperature at multiple locations in the cold plate structure. The temperature control module on the PCB board 8 outputs an electrical signal to drive the thermoelectric cooler 4 according to the electrical signal corresponding to the maximum deformation (i.e., the highest temperature).

[0089] In other embodiments, metal block II 172 may be replaced with other forms of insulating blocks, such as plastic blocks, to insulate the cold plate structural shell.

[0090] In other embodiments, the piezoelectric ceramic can be replaced with a pressure sensor, with metal block I 171 contacting pressure sensor I and metal block II 172 contacting pressure sensor II.

[0091] In other embodiments, a fan can be installed on the outside of the chassis to accelerate the heat dissipation of the outer casing 2. The fan is electrically connected to the backplate assembly, and the fan speed can be controlled by a heat dissipation control module. The heat dissipation control module controls the fan speed according to the received electrical signal.

[0092] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated heat dissipation adaptive adjustment system for a thermoelectric cooling chassis, used for installation inside a chassis, the chassis including a chassis shell, a thermoelectric cooler (4) disposed inside the chassis shell, a cold plate structure (7) inserted inside the chassis shell, the cold plate structure (7) including a cold plate structure shell, a PCB board (8) disposed inside the cold plate structure shell, and a module connector (9) mounted on the PCB board (8) for connection with a backplate assembly (6) inside the chassis, the cold plate structure shell being thermally connected to the chassis shell, characterized in that: The functional chip (10) on the PCB board (8) is thermally connected to the inner wall of the cold plate structure shell. A metal block I (171) is provided on the inner wall of the cold plate structure shell. The metal block I (171) is thermally connected to the cold plate structure shell. A piezoelectric ceramic I (151) or a pressure sensor I is provided on the PCB board (8) in contact with the metal block I (171). The piezoelectric ceramic I (151) or the pressure sensor I is electrically connected to the temperature control module on the PCB board (8). The thermoelectric cooler (4) is electrically connected to the back plate assembly (6). The inner wall of the cold plate structure shell is also provided with an insulating The hot block, the insulating block and the cold plate structure shell are thermally connected. The PCB board (8) is provided with a piezoelectric ceramic II (152) or pressure sensor II in contact with the insulating block. The piezoelectric ceramic II (152) or pressure sensor II is electrically connected to the temperature control module on the PCB board (8). The metal block I (171) and the insulating block are arranged in a group. The distance between the metal block I (171) and the insulating block in the same group on the cold plate structure shell is close so that the metal block I (171), the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions. The system has a dynamic compensation function. The initial contact deformation between the metal block I (171) and the piezoelectric ceramic I (151) or the pressure sensor I, and between the insulating block and the piezoelectric ceramic II (152) or the pressure sensor II in the static and initial temperature state is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate voltage V0. The functional chip (10) heats up, and the deformation of the metal block I (171) is Δx1. The actual deformation of the metal block I (171) due to temperature is Δx1-Δx0. When Δx1 is deformed, the voltage generated by the piezoelectric ceramic I (151) or the pressure sensor I is V1. The temperature control module receives voltage V0 and voltage V1 and calculates and outputs the current of the thermoelectric cooler (4) when it is static. When the cold plate structure vibrates, the deformation of the PCB board at the corresponding position of the metal block I (171) and the insulation block due to vibration is set to Δx2. The total deformation of the metal block I (171) and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2. The voltage corresponding to the piezoelectric ceramic I (151) or pressure sensor I is V3. The total deformation of the insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2. The voltage corresponding to the piezoelectric ceramic II (152) or pressure sensor is V4. The difference between the deformation of the metal block I (171) and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the thermoelectric cooling current output by the temperature control module remains unchanged to achieve dynamic compensation function.

2. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 1, characterized in that: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

3. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 1, characterized in that: The inner wall of the cold plate structure housing is provided with heat dissipation bosses (16) for thermally connecting with the functional chip (10).

4. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 2, characterized in that: The functional chip (10) is provided with a thermally conductive pad (18) that contacts the heat dissipation boss (16).

5. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 2, characterized in that: The metal block I (171) and the heat insulation block are mounted on the heat dissipation boss (16).

6. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 1, characterized in that: The chassis includes an inner shell (1) that is thermally connected to the cold plate structure shell and an outer shell (2) located outside the inner shell (1). A heat insulation plate (3) is provided between the inner shell (1) and the outer shell (2). A thermoelectric cooler (4) that is thermally connected to the inner shell (1) and the outer shell (2) is nested on the heat insulation plate (3).

7. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 1, characterized in that: The outer wall of the chassis is provided with heat dissipation fins.

8. The integrated heat dissipation adaptive adjustment system for a thermoelectric refrigeration chassis according to claim 7, characterized in that: The chassis is equipped with a fan on the outside for heat dissipation of the chassis shell, and the fan is electrically connected to the backplate assembly.

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