电源散热模块的热管布局优化方法及散热系统
By establishing a mathematical model that shows the synergistic effect of roughness parameters on heat dissipation performance, and combining three-dimensional fluid-thermal coupling numerical simulation and multi-objective optimization algorithm, the surface roughness of the power supply heat sink casing is optimized, solving the problems of low heat dissipation efficiency or high cost in the existing technology, and achieving efficient and economical heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TAIYUAN YONGMING HENGDONGYUAN ELECTRONICS CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the surface roughness design of the power supply heat sink casing fails to systematically consider the synergistic effect of convective heat transfer and radiative heat transfer, resulting in low heat dissipation efficiency or increased cost, and failing to achieve optimal matching.
By establishing a mathematical model that shows the synergistic effect of surface roughness parameters on heat dissipation performance, and combining three-dimensional fluid-thermal coupling numerical simulation and multi-objective optimization algorithm, the surface roughness parameters are optimized. Iterative optimization is then performed using an improved multi-objective particle swarm optimization algorithm and a BP neural network. Finally, the optimal roughness is achieved through experimental verification and adjustment of the manufacturing process.
The optimization achieves multiple objectives of minimum thermal resistance, minimum voltage drop, and minimum mass, improving heat dissipation efficiency, reducing manufacturing costs, and ensuring the reliability and practicality of the optimization results.
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