PCB independent block dry film copper thick compensation design method

Abstract

This invention discloses a design method for copper thickness compensation of independent PCB dry film, comprising: when the independent block is a regular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the independent block dry film is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the independent block dry film increases by 1mil; when the independent block is an irregular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the independent block dry film is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the independent block dry film increases by 1mil; when the independent block is a grid and the copper thickness after electroplating is ≤1OZ, the complete independent block dry film grid is ≥8mil×8mil, and for every 1OZ increase in the copper thickness after electroplating, the grid size compensation of the independent block dry film increases by 2mil; the length of each side of the incomplete independent block dry film grid is ≥6min, and for every 1OZ increase in the copper thickness after electroplating, the compensation of each side of the independent block dry film grid increases by 2mil. The PCB independent block dry film copper thickness compensation design method provided by the present invention sets the dry film size of the independent block to ensure the connection performance and stability of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a design method for compensating the thickness of dry film copper on an independent PCB block. Background Technology

[0002] As circuit boards (PCBs) continue to upgrade, they are becoming smaller, lighter, thinner, and finer, placing increasingly higher demands on trace width and spacing, resulting in increasingly finer trace widths. An independent circuit board (IC) is a functionally independent circuit unit on a PCB, typically containing multiple electronic components such as resistors, fuses, and integrated circuits, and achieving a specific function through specific circuit design. IICs enhance the performance and reliability of PCBs through functional isolation, modular design, signal processing, and power management.

[0003] Dry film coating is a lamination technology that involves attaching a polymer film containing a photosensitizer to copper foil, followed by exposure, development, and etching processes to create intricate circuits. The width of the dry film directly affects the width and spacing of the conductors on the circuit board. A suitable dry film width allows for precise control of conductor width and spacing, improving circuit board performance and stability, and ensuring the accuracy and reliability of signal transmission.

[0004] The purpose of this invention is to provide a design method for compensating the thickness of dry film copper in independent blocks of PCBs, so as to improve the performance and stability of circuit boards. Summary of the Invention

[0005] The purpose of this invention is to provide a design method for compensating the dry film copper thickness of independent PCB blocks, which sets the dry film size of the independent blocks to ensure the connection performance and stability of the circuit board.

[0006] The technical solution of the present invention is as follows:

[0007] A design method for PCB independent block dry film copper thickness compensation includes:

[0008] When the independent block is a regular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil.

[0009] When the independent block is an irregular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil.

[0010] When the independent block is grid-shaped and the copper thickness after electroplating is ≤1OZ, the complete independent block dry film grid is ≥8mil×8mil, and for every 1OZ increase in the copper thickness after electroplating, the grid size compensation of the complete independent block dry film increases by 2mil; the length of each side of the incomplete independent block dry film grid is ≥6min, and for every 1OZ increase in the copper thickness after electroplating, the compensation of each side of the incomplete independent block dry film grid increases by 2mil.

[0011] Furthermore, when the independent block dry film is a regular shape, the shape of the independent block dry film is a triangle, quadrilateral, trapezoid, or circle.

[0012] Furthermore, when the independent block dry film is an irregular shape, the shape of the independent block dry film is arc-shaped.

[0013] Compared with existing technologies, the PCB independent block dry film copper thickness compensation design method provided by this invention has the following advantages:

[0014] The PCB independent block dry film copper thickness compensation design method provided by the present invention pre-adjusts the design size of dry film patterns with different design shapes to ensure that the final pattern after exposure, development and etching is consistent with the design and meets the design requirements after the manufacturing process is completed, thereby ensuring the performance and reliability of the circuit board. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the dry film design in this invention, where the independent blocks are regular shapes;

[0017] Figure 2 This is a schematic diagram of the dry film design in this invention, where the independent blocks are irregular shapes;

[0018] Figure 3 This is a schematic diagram of the dry film design in this invention, where the independent blocks are grid-like. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below.

[0020] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0021] A design method for PCB independent block dry film copper thickness compensation includes:

[0022] When the independent block is a regular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil.

[0023] like Figure 1 As shown, when the independent block is triangular or trapezoidal, the corresponding shape of the independent block dry film is triangular or trapezoidal. The minimum design width of the independent block dry film is designed as follows: when the independent block dry film is triangular, the length of each side is ≥5mil; when the independent block dry film is trapezoidal, the minimum value among the length of the upper base, the length of the lower base, or the distance between the upper and lower bases is the minimum design width, and its value is ≥5mil. Figure 1 In this design, the trapezoidal dry membrane block is a long trapezoid, and the distance between its upper and lower bases is the minimum design width of the dry membrane structure. The independent blocks can also be circular, in which case the minimum design width of the dry membrane block is its diameter. In addition, the independent blocks can also be quadrilateral, pentagonal, or hexagonal, and correspondingly, the minimum design width of the dry membrane block is the side length of each side.

[0024] For every 1oz increase in the copper thickness after electroplating, the size compensation of the independent dry film increases by 1mil. This means that the overall size of the independent dry film increases by 1mil. For example, if the independent dry film is triangular, the length of each side increases by 1mil. If the independent dry film is trapezoidal, the length of the upper base, the length of the lower base, or the distance between the upper and lower bases each increases by 1mil.

[0025] When the independent block is an irregular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil.

[0026] like Figure 2 As shown, the irregular independent blocks have an arc-shaped structure, and the corresponding independent block dry film is also arc-shaped. When the copper thickness increases by 1 oz after electroplating, the dimensional compensation of the independent block dry film increases by 1 mil.

[0027] When the independent block is grid-shaped and the copper thickness after electroplating is ≤1OZ, the complete independent block dry film grid is ≥8mil×8mil, and for every 1OZ increase in the copper thickness after electroplating, the grid size compensation of the complete independent block dry film increases by 2mil; the length of each side of the incomplete independent block dry film grid is ≥6min, and for every 1OZ increase in the copper thickness after electroplating, the compensation of each side of the incomplete independent block dry film grid increases by 2mil.

[0028] like Figure 3 As shown, a complete independent block dry film grid (such as...) Figure 3 The grid pattern in the image (a) is either square or circular. When it is square, a grid ≥ 8mil × 8mil indicates that its side length is greater than 8mil. When it is circular, a grid ≥ 8mil × 8mil indicates that its diameter is greater than 8mil. Incomplete, independent block dry film grids (such as...) Figure 3 In the grid pattern b), its shape is a portion of a complete independent block dry film grid. When the copper thickness increases by 1 oz after electroplating, the size compensation of the independent block dry film grid increases by 2 mil, that is, the side length of each side increases by 2 mil, or its diameter increases by 2 mil.

[0029] The PCB independent block dry film copper thickness compensation design method provided by the present invention pre-adjusts the design size of dry film patterns with different design shapes to ensure that the final pattern after exposure, development and etching is consistent with the design and meets the design requirements after the manufacturing process is completed, thereby ensuring the performance and reliability of the circuit board.

[0030] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A design method for compensating the thickness of dry film copper in independent PCB blocks, characterized in that, include: When the independent block is a regular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil. When the independent block is an irregular shape and the copper thickness after electroplating is ≤1OZ, the minimum design width of the dry film of the independent block is ≥5mil; and for every 1OZ increase in the copper thickness after electroplating, the size compensation of the dry film of the independent block increases by 1mil. When the independent block is grid-shaped and the copper thickness after electroplating is ≤1OZ, the complete independent block dry film grid is ≥8mil×8mil, and for every 1OZ increase in the copper thickness after electroplating, the grid size compensation of the complete independent block dry film increases by 2mil; the length of each side of the incomplete independent block dry film grid is ≥6min, and for every 1OZ increase in the copper thickness after electroplating, the compensation of each side of the incomplete independent block dry film grid increases by 2mil.

2. The PCB independent block dry film copper thickness compensation design method according to claim 1, characterized in that, When the independent block dry film is a regular shape, the shape of the independent block dry film is a triangle, quadrilateral, trapezoid, or circle.

3. The PCB independent block dry film copper thickness compensation design method according to claim 2, characterized in that, When the independent block dry film is an irregular shape, the shape of the independent block dry film is arc-shaped.

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