Liquid cooling system, electronic device, and dehumidification method
By detecting the dew point temperature, dynamically adjusting the coolant temperature, and activating the dehumidification device, the condensation problem of the liquid cooling system in high humidity environments was solved, thus improving safety and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INSPUR SUZHOU INTELLIGENT TECH CO LTD
- Filing Date
- 2025-10-15
- Publication Date
- 2026-07-21
Smart Images
Figure CN120936007B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a liquid cooling system, electronic equipment, and dehumidification method. Background Technology
[0002] Liquid cooling devices rely on the flow of coolant to remove heat during normal operation. Therefore, in order to dissipate heat efficiently, the temperature of the coolant is usually set to be low. However, excessively low liquid temperature also poses a risk of condensation, especially in high humidity environments. When the surface temperature of the cold plate is lower than the ambient dew point temperature, water vapor will condense into liquid water, which may lead to electrical short circuits, equipment corrosion, or even fire hazards. Therefore, how to reduce condensation has become an urgent technical problem to be solved. Summary of the Invention
[0003] This application provides a liquid cooling system, electronic device, and dehumidification method to at least solve the problem of how to reduce condensation in related technologies.
[0004] This application provides a liquid cooling system, including: a liquid cooling device, a detection device, a dehumidification device, a detection module, and a controller. The liquid cooling device includes a cold plate disposed on a heating element. The detection device is disposed on the cold plate and is used to detect the presence of a target substance on the surface of the cold plate. The detection module is used to detect the ambient temperature, ambient humidity, and cold plate temperature. The controller is connected to the detection device, the dehumidification device, and the detection module, and is used to: obtain the dew point temperature based on the ambient temperature and ambient humidity; when the cold plate temperature is less than or equal to a first temperature threshold and the detection device does not detect the target substance, increase the inlet coolant temperature of the cold plate based on the dew point temperature, the cold plate temperature, the heating element temperature, and the target temperature of the heating element, wherein the first temperature threshold is equal to the difference between the dew point temperature and a temperature safety threshold; when the target substance is generated on the surface of the cold plate, control the dehumidification device to start.
[0005] This application also provides a dehumidification method, comprising: obtaining a dew point temperature based on ambient temperature and ambient humidity; when the cold plate temperature is less than or equal to a first temperature threshold and no target substance is generated on the surface of the cold plate, adjusting the inlet coolant temperature of the cold plate based on the dew point temperature, the cold plate temperature, the temperature of the heating device, and the target temperature of the heating device, wherein the first temperature threshold is equal to the difference between the dew point temperature and the temperature safety threshold; and activating the dehumidification device when the target substance is generated on the surface of the cold plate.
[0006] This application also provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of any of the above dehumidification methods.
[0007] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of any of the above dehumidification methods.
[0008] This application allows the target substance to be dew. When the cold plate temperature is less than or equal to a first temperature threshold and no target substance is generated on the surface of the cold plate, it indicates that condensation is about to form on the outer surface of the cold plate. In this case, the controller adjusts the cold plate inlet coolant temperature based on the dew point temperature, cold plate temperature, heating element temperature, and the target temperature of the heating element to prevent condensation. Furthermore, the cold plate inlet coolant temperature is related to the dew point temperature, cold plate temperature, heating element temperature, and the target temperature of the heating element; therefore, the control of the cold plate inlet coolant temperature can be more precise. If condensation forms on the surface of the cold plate, the dehumidification device is directly activated to quickly remove the condensation, thereby reducing the risk of electrical short circuits, equipment corrosion, or even fires within the node. If there is a risk of condensation but no condensation has formed, the controller adjusts the cold plate inlet coolant temperature to reduce the risk. If condensation forms on the surface of the cold plate, the dehumidification device is activated to dehumidify the surface, thereby reducing resource waste. Attached Figure Description
[0009] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0010] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the node structure in the diagram; Figure 3 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 4 A flowchart illustrating a dehumidification method provided in an embodiment of this application; Figure 5 This is another structural schematic diagram of a liquid cooling system provided in an embodiment of this application; Figure 6 This is a flowchart illustrating the operation of the liquid cooling system provided in an embodiment of this application. Detailed Implementation
[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0012] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.
[0013] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0014] Figure 1 This is a schematic diagram of the structure of an electronic device 5000 provided in an embodiment of this application.
[0015] Please see Figure 1 The electronic equipment 5000 includes a cabinet 4000 and multiple nodes 3000. The cabinet 4000 has a storage space, and the multiple nodes 3000 are located within the storage space of the cabinet 4000.
[0016] For example, the multiple nodes 3000 in the electronic device 5000 may include computing nodes, switching nodes, and storage nodes. For instance, a computing node may be a server, a switching node may be a switch, and a storage node may have storage capabilities.
[0017] Figure 2 for Figure 1 The structural diagram of node 3000 in the diagram.
[0018] Please see Figure 2 Node 3000 includes chassis 3100 and heat-generating device 3200 disposed within chassis 3100.
[0019] For example, if node 3000 is a computing node, the heat-generating device 3200 may include other heat-generating electronic devices such as CPU (central processing unit) and GPU (graphics processing unit).
[0020] The heating element 3200 can be mounted on the circuit board 3300, and the circuit board 3300 can supply power to the heating element 3200.
[0021] Figure 3 Another structural schematic diagram of the electronic device 5000 provided in the embodiments of this application.
[0022] Please see Figure 3 The electronic device 5000 may also include a liquid cooling device 2000, which can be used to dissipate heat from the heat-generating device 3200.
[0023] The liquid cooling device 2000 may include a cold plate 2100, a liquid outlet pipe 2200, a water tank 2300, a valve 2400, a circulating pump 2500, a heat exchanger 2600, and a liquid inlet pipe 2700.
[0024] The cold plate 2100 is disposed on the heating element 3200. The cold plate 2100 includes an inlet and an outlet. The outlet of the cold plate 2100 is connected to one end of the liquid outlet pipe 2200, and the inlet of the cold plate 2100 is connected to one end of the liquid inlet pipe 2700. A water tank 2300, a valve 2400, a circulating pump 2500 and a heat exchanger 2600 are arranged sequentially between the liquid outlet pipe 2200 and the liquid inlet pipe 2700. The inlet of the water tank 2300 is connected to the end of the liquid outlet pipe 2200 away from the cold plate 2100, and the heat exchanger 2600 is connected to the end of the liquid inlet pipe 2700 away from the cold plate 2100.
[0025] The coolant flows out of the water tank 2300 and passes through the valve 2400, the circulation pump 2500 and the heat exchanger 2600 in sequence. Then it enters the cold plate 2100 through the liquid inlet pipe 2700. After absorbing the heat from the heating device 3200 in the cold plate 2100, the coolant flows out from the outlet of the cold plate 2100 and then returns to the water tank 2300 through the liquid outlet pipe 2200.
[0026] It enters the pipe, flows through the node, and then returns to the water tank.
[0027] Among them, the liquid cooling device 2000, due to its superior heat dissipation efficiency, is gradually replacing traditional air cooling solutions and becoming the mainstream heat dissipation solution in the field of high-performance computing.
[0028] When the liquid cooling unit 2000 is working normally, it relies on the flow of coolant to carry away heat and cool down. Therefore, in order to dissipate heat efficiently, the temperature of the coolant is usually set to be low. However, if the liquid temperature is too low, there is a risk of condensation. Especially in high humidity environments, when the surface temperature of the cold plate 2100 is lower than the ambient dew point temperature, water vapor will condense into liquid water, which may lead to electrical short circuits, equipment corrosion, or even fire and other safety hazards.
[0029] Based on this, embodiments of this application provide a dehumidification method.
[0030] Figure 4 This is a flowchart of a dehumidification method provided in an embodiment of this application.
[0031] Please see Figure 4 The dehumidification method may include the following steps S1-S3.
[0032] S1. Obtain the dew point temperature based on the ambient temperature and humidity.
[0033] In some examples, the dew point temperature satisfies the following formula (1), and the controller 400 can obtain the dew point temperature T_dew(k) according to formula (1).
[0034] Formula (1): .
[0035] In formula (1), T_dew(k) is the dew point temperature, Ho is the ambient humidity, and To is the ambient temperature.
[0036] The ambient humidity Ho can be the ambient humidity inside the chassis 3100 of node 3000. An ambient humidity sensor H1 is installed inside the chassis 3100 to detect the ambient humidity Ho inside the chassis 3100.
[0037] The ambient temperature To can be the ambient temperature inside the chassis 3100 of node 3000. An ambient temperature sensor T1 is installed inside the chassis 3100 to detect the ambient temperature To inside the chassis 3100.
[0038] Therefore, when the ambient temperature To and ambient humidity Ho change, the dew point temperature T_dew(k) will also change accordingly. In other words, the dew point temperature T_dew(k) can change dynamically with the ambient temperature To and ambient humidity Ho, thus making the obtained dew point temperature T_dew(k) more accurate.
[0039] When the temperature of the cold plate 2100 is lower than the dew point temperature T_dew(k), condensation will not occur on the outer surface of the cold plate 2100.
[0040] When the temperature of the cold plate 2100 is greater than or equal to the dew point temperature T_dew(k), condensation will occur on the outer surface of the cold plate 2100.
[0041] S2. When the cold plate temperature is less than or equal to the first temperature threshold and no target substance is generated on the surface of the cold plate, the inlet coolant temperature of the cold plate is increased according to the dew point temperature, the cold plate temperature, the temperature of the heating device, and the target temperature of the heating device. The first temperature threshold is equal to the difference between the dew point temperature and the temperature safety threshold.
[0042] The cold plate 2100 is equipped with a cold plate temperature sensor T2 inside or on its surface. The cold plate temperature sensor T2 is used to detect the temperature of the cold plate 2100.
[0043] The target substance can be dew.
[0044] First temperature threshold Ts = Dew point temperature T_dew(k) - Temperature safety threshold δT.
[0045] If the cold plate temperature T_cold(k) ≤ the first temperature threshold Ts, and no target substance is generated on the surface of the cold plate 2100, it indicates that condensation is about to occur on the outer surface of the cold plate 2100. At this time, condensation can be prevented and the risk of condensation reduced by adjusting the inlet coolant temperature of the cold plate.
[0046] Furthermore, the inlet coolant temperature of the cold plate is related to the dew point temperature T_dew(k), the cold plate temperature T_cold(k), the heating element temperature T_C(k), and the target temperature of the heating element. The target temperature of the heating element can be a constant. Therefore, the inlet coolant temperature f(k) of the cold plate can be dynamically adjusted according to the dew point temperature T_dew(k), the cold plate temperature, and the heating element temperature, thereby improving the accuracy of the inlet coolant temperature f(k) of the cold plate and reducing resource waste.
[0047] S3. When the target substance is generated on the surface of the cold plate, the dehumidification device is turned on.
[0048] In the event of condensation on the surface of the cold plate 2100, the dehumidification device is activated directly to quickly remove the condensation from the surface of the cold plate 2100, thereby reducing the risk of electrical short circuits, equipment corrosion, or even fires inside the node 3000.
[0049] In addition, in the dehumidification method provided in this application embodiment, when the cold plate temperature T_cold(k) ≤ dew point temperature T_dew(k) - temperature safety threshold δT, and no target substance is generated on the surface of the cold plate 2100, that is, when there is a risk of condensation, the risk of condensation is reduced by adjusting the temperature of the cold plate inlet coolant. When condensation occurs on the surface of the cold plate 2100, the dehumidification device is turned on to dehumidify the surface of the cold plate 2100, thereby reducing resource waste.
[0050] Figure 4 Another flowchart of the dehumidification method provided in the embodiments of this application.
[0051] Please see Figure 4In some embodiments, when the cold plate temperature T_cold(k) is less than or equal to the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100, the inlet coolant temperature of the cold plate satisfies the following formula (2).
[0052] Formula (2): .
[0053] In formula (2), f(k) is the temperature of the inlet coolant of the cold plate 2100 at time k, f(k-1) is the temperature of the inlet coolant of the cold plate at time k-1, Kp is the proportional coefficient, Ti is the integral coefficient, u(k) is the first temperature deviation at time k, and u(k-1) is the first temperature deviation at time k-1.
[0054] The temperature f(k) of the inlet coolant of the cold plate 2100 at time k can be understood as the target temperature of the inlet coolant of the cold plate 2100.
[0055] The inlet of the cold plate 2100 is equipped with an inlet temperature sensor T3, which can obtain the inlet coolant temperature of the cold plate. The inlet coolant temperature f(k-1) at time k-1 can be the actual temperature of the inlet coolant at time k-1.
[0056] The proportional coefficient Kp is a constant, and the integral coefficient Ti is a constant.
[0057] Where u(k) satisfies the following formula (3).
[0058] Formula (3): .
[0059] In formula (3), T_cold(k) is the cold plate temperature at time k, δT is the temperature safety threshold, T_C(k) is the temperature of the heating device at time k, T_tar is the target temperature of the heating device, α is the first weighting coefficient, β is the second weighting coefficient, and α+β=1.
[0060] The cold plate 2100 is equipped with a cold plate temperature sensor T2 inside or on its surface. The cold plate temperature T_cold(k) at the current time k can be the temperature detected by the cold plate temperature sensor at the current time k.
[0061] The heating device 3200 is equipped with a first temperature sensor, which is used to obtain the internal temperature of the heating device 3200. The temperature of the heating device T_C(k) at the current time k can be the temperature detected by the first temperature sensor at the current time k.
[0062] The temperature safety threshold is a constant, but it can be adjusted.
[0063] The target temperature T_tar of the heating device can be a constant.
[0064] The first weighting coefficient α is a constant, and the second weighting coefficient β is a constant. The first weighting coefficient α and the second weighting coefficient β can be dynamically adjusted.
[0065] The inlet coolant temperature f(k) of the cold plate is dynamically related to the first temperature deviation u(k) at time k, the first temperature deviation u(k-1) at time k-1, and the inlet coolant temperature f(k-1) at time k-1. u(k) is dynamically related to the dew point temperature T_dew(k), the cold plate temperature T_cold(k) at time k, and the heating device temperature T_C(k) at time k. Therefore, the inlet coolant temperature f(k) of the cold plate can be dynamically adjusted according to the dew point temperature T_dew(k), the cold plate temperature T_cold(k) at time k, and the heating device temperature T_C(k) at time k, thereby improving the accuracy of the inlet coolant temperature f(k) of the cold plate and reducing resource waste.
[0066] In some embodiments, when the cold plate temperature T_cold(k) is less than or equal to the first temperature threshold Ts, α > β, that is, when T_cold(k) ≤ T_dew(k) - δT, α > β.
[0067] By making α > β, the first temperature deviation u(k) at the current time k can be increased, which in turn increases the temperature f(k) of the coolant at the inlet of the cold plate at time k, thereby increasing the temperature of the cold plate 2100 and reducing the risk of condensation.
[0068] In some embodiments, when the cold plate temperature T_cold(k) is greater than the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100, α=β.
[0069] In the case where T_cold(k)>T_cold(k)-δT, there is no risk of condensation on the surface of the cold plate 2100, or the risk of condensation is low. In this case, α=β can reduce the temperature f(k) of the coolant at the inlet of the cold plate at time k, which can reduce the temperature of the coolant and thus improve the heat dissipation effect of the liquid cooling system 1000 on the heat-generating device 3200.
[0070] In some embodiments, when the cold plate temperature T_cold(k) is greater than the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100, the opening of the valve 2400 of the liquid cooling device 2000 is adjusted according to the heating device temperature T_C(k) and the target temperature T_tar of the heating device 3200.
[0071] The larger the opening degree of valve 2400, the greater the flow rate of coolant in liquid cooling device 2000, and the better the heat dissipation effect of liquid cooling device 2000. When the difference between the temperature T_C(k) of the heat-generating device and the target temperature T_tar is large, the opening degree of valve 2400 of liquid cooling device 2000 is increased, thereby accelerating the cooling rate of heat-generating device 3200.
[0072] Specifically, the opening degree of valve 2400 of liquid cooling device 2000 is adjusted according to the temperature T_C(k) of heating device 3200 and the target temperature T_tar of heating device 3200. Therefore, the opening degree of valve 2400 can be dynamically adjusted according to the temperature T_C(k) of heating device, thereby improving the accuracy of temperature adjustment of heating device T_C(k) and avoiding waste of resources.
[0073] In some embodiments, when the cold plate temperature T_cold(k) is greater than the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100, the valve opening of the liquid cooling device 2000 satisfies the following formula (4).
[0074] Formula (4): .
[0075] In formula (4), w(k) is the target opening degree of the valve of the liquid cooling device 2000 at time k, w(k-1) is the opening degree of the valve of the liquid cooling device 2000 at time k-1, t(k) is the second temperature deviation at time k, t(k) = T_C (k)-T_tar, t(k-1) is the second temperature deviation at time k-1, Kc is the valve proportional coefficient, and Ti is the integral coefficient.
[0076] The valve opening w(k-1) of the liquid cooling device 2000 at time k-1 can be considered as the actual valve opening of the liquid cooling device 2000 at time k-1. The unit of opening is %.
[0077] If T_cold(k)>T_dew(k)-δT and no target substance is generated on the surface of the cold plate 2100, it means that there is no risk of condensation on the surface of the cold plate 2100, and the liquid cooling device 2000 can resume normal mode to dissipate heat from the heat-generating device 3200.
[0078] The target opening degree w(k) of the valve 2400 of the liquid cooling device 2000 at time k is related to the temperature T_C(k) of the heating device at time k and the target temperature T_tar, thereby improving the accuracy of the valve 2400 opening degree adjustment of the liquid cooling device 2000.
[0079] Specifically, when the temperature of the heating element 3200 is higher than the target temperature T_tar, the opening of valve 2400 is increased to enhance the heat dissipation effect of the liquid cooling device 2000. When the temperature of the heating element 3200 is lower than the target temperature T_tar, the opening of valve 2400 is decreased.
[0080] Furthermore, when T_cold(k) > T_dew(k) - δT and no target substance is generated on the surface of the cold plate 2100, the dehumidification device 200 is turned off.
[0081] This application also provides a liquid cooling system 1000.
[0082] Figure 5 This is another structural schematic diagram of a liquid cooling system 1000 provided in an embodiment of this application.
[0083] Please see Figure 5 The liquid cooling system 1000 includes: a liquid cooling device 2000, a detection device 100, a dehumidification device 200, a detection module 300, and a controller 400. The liquid cooling device 2000 includes a cold plate 2100.
[0084] The detection device 100 is disposed on the cold plate 2100 and is used to detect whether condensation occurs on the surface of the cold plate 2100.
[0085] The dehumidification device 200 is used to remove condensation on the surface of the cold plate 2100.
[0086] The detection module 300 is used to detect the ambient temperature To, ambient humidity Ho, and cold plate temperature T_cold(k). The detection module 300 may include an ambient temperature sensor T1, an ambient humidity sensor H1, and a cold plate temperature sensor T2.
[0087] For example, controller 400 may include MCU (microcontroller unit).
[0088] The controller 400 is connected to the detection device 100, the dehumidification device 200, and the detection module 300. Therefore, the controller 400 can receive condensation information detected by the detection device 100, as well as ambient temperature To, ambient humidity Ho, and cold plate temperature T_cold(k) obtained by the detection module 300.
[0089] Controller 400 is configured to obtain dew point temperature T_dew(k) based on ambient temperature To and ambient humidity Ho.
[0090] The controller 400 is configured to: adjust the inlet coolant temperature of the cold plate based on the dew point temperature T_cold(k), the cold plate temperature T_cold(k), the temperature of the heating element, and the target temperature of the heating element when the cold plate temperature T_cold(k) is less than or equal to a first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100; and control the dehumidification device 200 to turn on when condensation occurs on the surface of the cold plate 2100. The first temperature threshold Ts is equal to the difference between the dew point temperature T_dew(k) and the temperature safety threshold δT.
[0091] Specifically, if the cold plate temperature T_cold(k) ≤ dew point temperature T_dew(k) - temperature safety threshold δT, and no target substance is generated on the surface of the cold plate 2100, then condensation is about to occur on the outer surface of the cold plate 2100. In this case, condensation can be prevented by adjusting the inlet coolant temperature of the cold plate.
[0092] When condensation occurs on the surface of the cold plate 2100, the dehumidification device is turned on directly to quickly remove the condensation on the surface of the cold plate 2100, thereby reducing the risk of electrical short circuits, equipment corrosion, or even fire inside the node 3000.
[0093] In addition, it can reduce resource waste.
[0094] In some examples, the dew point temperature T_dew(k) satisfies the following formula (1), and the controller 400 can obtain the dew point temperature T_dew(k) according to formula (1).
[0095] Formula (1): .
[0096] In formula (1), T_dew(k) is the dew point temperature, Ho is the ambient humidity, and To is the ambient temperature.
[0097] In some embodiments, the detection module 300 is further configured to detect the inlet coolant temperature of the cold plate. The detection module 300 may also include an inlet temperature sensor T3, which is connected to the controller 400. Therefore, the inlet temperature sensor T3 can send the detected cold plate inlet temperature to the controller 400.
[0098] The controller 400 is used to control the temperature of the inlet coolant to satisfy the following formula (2) when the cold plate temperature T_cold(k) is less than or equal to the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100.
[0099] Formula (2): .
[0100] Where f(k) is the temperature of the inlet coolant of the cold plate 2100 at time k, f(k-1) is the temperature of the inlet coolant of the cold plate at time k-1, Kp is the proportional coefficient, Ti is the integral coefficient, u(k) is the first temperature deviation at time k, and u(k-1) is the first temperature deviation at time k-1.
[0101] Where u(k) satisfies the following formula (3).
[0102] Formula (3): .
[0103] Where T_cold(k) is the cold plate temperature at time k, δT is the temperature safety threshold, T_C(k) is the temperature of the heating device at time k, T_tar is the target temperature of the heating device at 3200, α is the first weighting coefficient, β is the second weighting coefficient, and α+β=1.
[0104] The controller 400 can adjust the temperature of the inlet coolant according to the PID (Proportional-Integral-Derivative) algorithm.
[0105] In some embodiments, the controller 400 is configured to: control α > β when the cold plate temperature T_cold(k) is less than or equal to a first temperature threshold Ts. The controller 400 can control the value of α based on the cold plate temperature T_cold(k).
[0106] In some embodiments, the controller 400 is configured to: control α=β when the cold plate temperature T_cold(k) is greater than a first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100.
[0107] In some embodiments, the controller 400 is configured to adjust the opening of the valve 2400 of the liquid cooling device 2000 according to the temperature of the heating device T_cold(k) and the target temperature T_tar of the heating device 3200 when the cold plate temperature T_cold(k) is greater than the first temperature threshold Ts and the detection device 100 does not detect the target substance.
[0108] Specifically, the opening degree of valve 2400 of liquid cooling device 2000 is adjusted according to the temperature T_C(k) of heating device 3200 and the target temperature T_tar of heating device 3200. Therefore, the opening degree of valve 2400 can be dynamically adjusted according to the temperature T_C(k) of heating device, thereby improving the accuracy of temperature adjustment of heating device T_C(k) and avoiding waste of resources.
[0109] In some embodiments, the controller 400 is used to: adjust the opening of the valve 2400 of the liquid cooling device 2000 when the cold plate temperature T_cold(k) is greater than the first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100, wherein the opening of the valve 2400 of the liquid cooling device 2000 satisfies the following formula (4).
[0110] Formula (4): .
[0111] Where w(k) is the target opening degree of valve 2400 of liquid cooling device 2000 at time k, w(k-1) is the opening degree of valve 2400 of liquid cooling device 2000 at time k-1, t(k) is the second temperature deviation at time k, t(k) = T_C (k)-T_tar, t(k-1) is the second temperature deviation at time k-1, Kc is the valve proportional coefficient, and Ti is the integral coefficient.
[0112] In some embodiments, the controller 400 is further configured to: control the opening degree of valve 2400 of the liquid cooling device 2000 to be greater than or equal to the minimum opening degree Nc_min, and less than or equal to the maximum opening degree Nc_max. By ensuring that the opening degree of valve 2400 is greater than or equal to Nc_min, the heat dissipation effect of the liquid cooling device 2000 can be guaranteed. And by ensuring that the opening degree of valve 2400 is less than or equal to the maximum opening degree Nc_max, the risk of condensation on the cold plate 2100 when the coolant temperature is low can be reduced.
[0113] In some embodiments, the controller 400 is further configured to: control the dehumidification device 200 to shut down when the cold plate temperature T_cold(k) is greater than a first temperature threshold Ts and no target substance is generated on the surface of the cold plate 2100.
[0114] In some embodiments, the dehumidification device 200 includes a heating element, wherein the heating element is connected to the controller 400.
[0115] When condensation occurs on the surface of the cold plate 2100, the controller 400 activates the heating device to dehumidify. The heating device has a good dehumidification effect and can accelerate the dehumidification speed.
[0116] For example, the heating device may include multiple heating fins, thereby increasing the thermal conductivity of the heating device and thus improving its dehumidification effect.
[0117] In other examples, the dehumidification device 200 may also include a fan that drives airflow to dehumidify the surface of the cold plate 2100.
[0118] In some embodiments, the liquid cooling system 1000 may further include a monitoring module 500, which is connected to a controller 400. The controller 400 is used to send ambient temperature To, ambient humidity Ho, cold plate temperature T_cold(k), cold plate inlet coolant temperature, valve 2400 opening degree, proportional coefficient Kp, integral coefficient Ti, first weighting coefficient α, and second weighting coefficient β to the monitoring module 500. The monitoring module 500 is used to store ambient temperature To, ambient humidity Ho, cold plate temperature T_cold(k), cold plate inlet coolant temperature, valve 2400 opening degree, proportional coefficient Kp, integral coefficient Ti, first weighting coefficient α, and second weighting coefficient β.
[0119] For example, the monitoring module 500 can be a BMC (baseboard management controller). For instance, the BMC and the MCU can be connected via an I2C (Inter-Integrated Circuit) bus.
[0120] The monitoring module 500 can store the ambient temperature To, ambient humidity Ho, cold plate temperature T_cold(k), cold plate inlet coolant temperature, valve 2400 opening degree, proportional coefficient Kp, integral coefficient Ti, first weighting coefficient α and second weighting coefficient β, so that the above data can be easily retrieved from the monitoring module 500.
[0121] In addition, the monitoring module 500 can generate status information based on at least one of the ambient temperature To, ambient humidity Ho, cold plate temperature T_cold(k), and cold plate inlet coolant temperature.
[0122] For example, status information can reflect the operating status of a liquid cooling system.
[0123] For example, the monitoring module 500 can plot a cold plate temperature curve based on the cold plate temperature T_cold(k) acquired over a period of time. If the cold plate temperature curve is abnormal in a certain period of time, it can be determined that the liquid cooling system 1000 is operating abnormally. At this time, the monitoring module 500 can control the alarm module to issue an alarm message. For example, the alarm module can be a buzzer, and the monitoring module 500 can control the buzzer to issue an alarm sound.
[0124] For example, the monitoring module 500 can draw a temperature curve based on the ambient temperature To obtained over a period of time, so that maintenance personnel can determine the trend of ambient temperature changes based on the temperature curve.
[0125] In addition, the monitoring module 500 can analyze and judge whether the first weighting coefficient α, the second weighting coefficient β and the proportional coefficient Kp are set appropriately, so as to better set the temperature of the cold plate inlet coolant, the first weighting coefficient α, the second weighting coefficient β and the proportional coefficient Kp according to the different loads or environments of the node 3000.
[0126] When the system cannot prevent the risk of condensation through PID control, for example, in the case of valve 2400 malfunction or circulation pump 2500 malfunction, monitoring module 500 can control node 3000 and liquid cooling device 2000 to shut down in order to avoid damage to node 3000 and liquid cooling device 2000.
[0127] In some examples, the liquid cooling system 1000 may also include a first power supply module 600, which is connected to the monitoring module 500, dehumidifier 200, controller 400, circulation pump 2500 and valve 2400, etc., so that the first power supply module 600 can supply power to the monitoring module 500, dehumidifier 200, controller 400, circulation pump 2500 and valve 2400.
[0128] In some embodiments, node 3000 may further include a second power supply module, which may be connected to circuit board 3300, so that the second power supply module can provide power to electronic devices disposed on circuit board 3300, such as heating device 3200.
[0129] The second power supply module is reused as the first power supply module 600.
[0130] Figure 6 This is a flowchart illustrating the operation of the liquid cooling system provided in an embodiment of this application.
[0131] Please see Figure 6 The working process of the liquid cooling system 1000 may include the following steps S01 to S10.
[0132] S01. The node and liquid cooling system are powered on. Specifically, after power-on, the monitoring module 500 sends a power-on command, and the node 3000 and the controller 400 receive the power-on command. After the node 3000 starts up, the temperature of the heat-generating device 3200 rises rapidly.
[0133] S02, Controller 400 controls the circulation pump 2500 and valve 2400 to open, and the liquid cooling system 1000 is in normal mode.
[0134] In the normal mode, the liquid cooling system 1000 does not adjust the temperature of the inlet cooling fluid of the cold plate 2100, and the dehumidification device 200 is turned off.
[0135] After node 3000 is started, controller 400 controls circulating pump 2500 and valve 2400 to be at minimum opening. As heating device 3200 heats up, controller 400 can adjust the opening of valve 2400 according to formula (3).
[0136] S03, Controller 400 periodically detects the cold plate temperature T_cold(k), ambient temperature To, ambient humidity Ho, and the temperature of the heating element T_C(k).
[0137] Specifically, the detection module 300 sends the monitored ambient temperature To, ambient humidity Ho, and cold plate temperature T_cold(k) to the controller 400. Furthermore, the controller 400 can also be connected to the heating device 3200, and a first temperature sensor configured inside the heating device 3200 can be connected to the controller 400, allowing the controller 400 to obtain the temperature of the heating device 3200 from the first temperature sensor. In addition, the controller 400 calculates the ambient dew point temperature T_dew(k) according to formula (4), converting the ambient humidity Ho and ambient temperature To into the ambient dew point temperature T_dew(k).
[0138] Next, the controller 400 can dynamically adjust the opening of the valve 2400 and the circulating pump 2500 according to the algorithm to adapt to the current working state.
[0139] S04. Determine whether T_cold(k) ≤ T_dew(k) - δT is satisfied. If yes, proceed to step S05. Otherwise, return to step S03.
[0140] S05, the liquid cooling system 1000 enters the anti-condensation mode, increasing the first weighting coefficient α.
[0141] This increases the temperature f(k) of the coolant at the inlet of the cold plate, thereby increasing the temperature of the cold plate 2100 and preventing condensation from forming on the cold plate 2100.
[0142] S06. The detection device checks for condensation. If yes, proceed to step S07; otherwise, return to step S03.
[0143] S07, Liquid cooling system 1000 enters emergency mode, dehumidification device 200 is activated.
[0144] S08. When no condensation is detected, turn off the dehumidifier 200.
[0145] S09. When there is no risk of condensation, the liquid cooling system 1000 returns to normal mode, and the first weighting coefficient α returns to its normal value.
[0146] Here, the first weighting coefficient α returning to its normal value means that the first weighting coefficient α equals 0.5.
[0147] After step S09, step S10 can be executed, or you can return to step S03.
[0148] S10, node 3000 and liquid cooling system 1000 are shut down.
[0149] In addition, the workflow may also include S11, where the controller 400 sends the monitored data, the set parameters and the valve 2400 opening degree to the monitoring module 500 in real time, and the monitoring module 500 can analyze and judge the recorded data information.
[0150] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.
[0151] Embodiments of this application also provide a computer-readable storage medium storing a computer program configured to execute the steps in any of the above-described dehumidification method embodiments when running.
[0152] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.
[0153] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described dehumidification method embodiments.
[0154] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above-described dehumidification method embodiments.
[0155] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0156] The foregoing has provided a detailed description of a liquid cooling system, electronic device, dehumidification method, computer-readable storage medium, and computer program product provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A liquid cooling system, characterized in that, include: A liquid cooling device, including a cold plate, wherein the cold plate is disposed on a heat-generating device; A detection device is disposed on the cold plate, and the detection device is used to detect whether a target substance exists on the surface of the cold plate; Dehumidifier; The detection module is used to detect ambient temperature, ambient humidity, and cold plate temperature. A controller, connected to the detection device, the dehumidification device, and the detection module, is used to: obtain the dew point temperature based on the ambient temperature and the ambient humidity; When the cold plate temperature is less than or equal to a first temperature threshold and the detection device does not detect the target substance, the inlet coolant temperature of the cold plate is increased according to the dew point temperature, the cold plate temperature, the heating device temperature, and the target temperature of the heating device, wherein the first temperature threshold is equal to the difference between the dew point temperature and the temperature safety threshold. When the target substance is generated on the surface of the cold plate, the dehumidification device is turned on. The detection module is also used to detect the temperature of the coolant at the inlet of the cold plate. The controller is configured to control the temperature of the inlet coolant to satisfy the following conditions when the cold plate temperature is less than or equal to the first temperature threshold and the detection device does not detect the target substance: ; Where f(k) is the temperature of the inlet coolant of the cold plate at time k, f(k-1) is the temperature of the inlet coolant of the cold plate at time k-1, Kp is the proportional coefficient, Ti is the integral coefficient, u(k) is the first temperature deviation at time k, and u(k-1) is the first temperature deviation at time k-1. Where u(k) satisfies: ; Wherein, T_dew(k) is the dew point temperature, T_cold(k) is the cold plate temperature at the current time k, δT is the temperature safety threshold, T_C(k) is the temperature of the heating device at the current time k, T_tar is the target temperature of the heating device, α is the first weighting coefficient, β is the second weighting coefficient, and α+β=1; The controller is configured to control α > β when the temperature of the cold plate is less than or equal to the first temperature threshold.
2. The liquid cooling system according to claim 1, characterized in that, The controller is configured to adjust the opening of the valve of the liquid cooling device according to the temperature of the heating device and the target temperature of the heating device when the temperature of the cold plate is greater than the first temperature threshold and the detection device does not detect the target substance.
3. The liquid cooling system according to claim 1 or 2, characterized in that, The dehumidification device includes a heating element, which is connected to the controller.
4. The liquid cooling system according to claim 1 or 2, characterized in that, It also includes: a monitoring module connected to the controller, the controller being used to send the ambient temperature, the ambient humidity, the cold plate temperature and the cold plate inlet coolant temperature to the monitoring module, the monitoring module being configured to generate status information based on at least one of the ambient temperature, the ambient humidity, the cold plate temperature and the cold plate inlet coolant temperature.
5. An electronic device, characterized in that, include: A server rack and multiple nodes disposed within the server rack, each node including a chassis and heat-generating devices disposed within the chassis; The liquid cooling system as described in any one of claims 1-4, wherein the cold plate of the liquid cooling device of the liquid cooling system is disposed on the heat-generating device.
6. A dehumidification method for use in a liquid cooling system as described in any one of claims 1-4, characterized in that, include: Dew point temperature is obtained based on ambient temperature and humidity; When the cold plate temperature is less than or equal to the first temperature threshold and no target substance is generated on the surface of the cold plate, the inlet coolant temperature of the cold plate is increased according to the dew point temperature, the cold plate temperature, the heating element temperature, and the target temperature of the heating element, wherein the first temperature threshold is equal to the difference between the dew point temperature and the temperature safety threshold. When the target substance is generated on the surface of the cold plate, the dehumidification device is activated. When the temperature of the cold plate is less than or equal to the first temperature threshold, and no target substance is generated on the surface of the cold plate, the temperature of the inlet coolant is controlled to satisfy: ; Where f(k) is the temperature of the inlet coolant of the cold plate at time k, f(k-1) is the temperature of the inlet coolant of the cold plate at time k-1, Kp is the proportional coefficient, Ti is the integral coefficient, u(k) is the first temperature deviation at time k, and u(k-1) is the first temperature deviation at time k-1. Where u(k) satisfies: ; Wherein, T_dew(k) is the dew point temperature, T_cold(k) is the cold plate temperature at the current time k, δT is the temperature safety threshold, T_C(k) is the temperature of the heating device at the current time k, T_tar is the target temperature of the heating device, α is the first weighting coefficient, β is the second weighting coefficient, and α+β=1.
7. The dehumidification method according to claim 6, characterized in that, When the temperature of the cold plate is greater than the first temperature threshold and no target substance is generated on the surface of the cold plate, the opening of the valve of the liquid cooling device is adjusted according to the temperature of the heating device and the target temperature of the heating device.
8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the dehumidification method as described in claim 6 or 7.
9. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the dehumidification method as described in claim 6 or 7.