Wafer cleaning machine with recycling function

Abstract

The application discloses a wafer cleaning machine with a recycling function and relates to the technical field of cleaning equipment. When the wafer is washed by the cleaning liquid, the equipment drives the wafer to rotate, so that the uniformity of the cleaning is ensured; however, when the wafer rotates, the wafer is prone to relative sliding with the fixing part at the fixed position, so that scratches are caused at the edge position of the wafer, and the use of the wafer is affected. Through cooperation of the pad strip and the rubber block, after the wafer is placed, the rubber block is moved downward to contact the wafer by rotating the lead screw, so that the wafer is clamped in the middle by the pad strip and the rubber block; meanwhile, when the wafer is clamped, the material characteristics of the rubber block are utilized, the elastic deformation is realized when the wafer is contacted, the clamping pressure is buffered, wafer breakage is avoided, the contact area between the deformed rubber block and the wafer is increased, the friction force is increased, relative sliding between the wafer and the pad block is avoided when the wafer rotates, the edge position of the wafer is not abraded, and the use of the wafer is affected.

Description

Technical Field

[0001] This invention relates to the field of cleaning equipment technology, specifically to a wafer cleaning machine with a recycling function. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. Generally, high-purity polycrystalline silicon is made into large single crystals, which are then grown into silicon ingots. After grinding, polishing, slicing and other processes, it is formed into a circular thin wafer with a certain thickness and diameter. Its surface is extremely smooth and flat, and the silicon atoms inside are arranged in a regular crystal structure. It is the basic material for manufacturing semiconductor chips. Various circuit elements can be made on its surface through a series of complex processes such as photolithography and etching, making it an IC product with specific electrical functions. Because wafers can be contaminated with particles, metal impurities, organic matter, natural oxide layers and other contaminants during production, transportation, storage and various process links, these contaminants may cause short circuits, open circuits or performance degradation. Therefore, they need to be removed through strict cleaning processes. When cleaning wafers, the wafers usually need to be fixed in the cleaning position. At the same time, when rinsing the wafers with cleaning fluid, the equipment drives the wafers to rotate to ensure uniform cleaning. However, during rotation, the wafers in the fixed position are prone to relative sliding with the fixing parts, which can cause scratches on the edges of the wafers and affect their use. In addition, the cleaning fluid is prone to clogging when it is recycled. Summary of the Invention

[0003] To achieve the above objectives, the present invention provides the following technical solution: A wafer cleaning machine with recycling function includes: The frame has a liquid pump and a liquid tank fixedly installed on its outer side. The liquid tank is fixedly connected to the liquid pump inlet through a pipe. A cleaning cylinder is fixedly installed on the top of the frame, and an outer ring cover is fixedly installed on the bottom of the outer side of the cleaning cylinder. A recycling mechanism is installed on the top of the frame and is fixedly connected to the outer ring cover via a pipe; A rinsing mechanism is installed on top of the cleaning cylinder and is fixedly connected to the outlet of the liquid pump via a pipe. The outer side of the cleaning cylinder is evenly provided with water outlet grooves and heat dissipation grooves, with the heat dissipation grooves located above the water outlet grooves. The outer ring cover is located at the water outlet groove of the cleaning cylinder. A top plate and a bottom plate are fixedly installed on the inner wall of the cleaning cylinder. An inner turntable is rotatably installed at the center of the top of the top plate. An inclined groove block is fixedly installed on the top of the inner turntable. The inclined groove blocks are evenly installed along the center of the inner turntable, and the opposite surfaces of the inclined groove blocks are inclined surfaces that slope inward from top to bottom. A lead screw is rotatably installed on the inner wall of the inclined groove block, and an inner sliding plate is slidably installed on the inner wall of the inclined groove block. The inner wall of the inner sliding plate is threaded to the outer side of the lead screw, and the end of the inner sliding plate away from the inclined groove block is curved upward and has a protrusion at the bottom. A slot is provided, and a rubber block is fixedly installed in the slot of the inner slide plate. Through the cooperation of the pad and the rubber block, after the wafer is placed, the rubber block moves down to contact the wafer by rotating the screw, so that the wafer is clamped in the middle by the pad and the rubber block. At the same time, the material characteristics of the rubber block are utilized to buffer the clamping pressure through elastic deformation upon contact, so as to avoid the wafer from breaking or being damaged. At the same time, the deformed rubber block increases the contact area with the wafer, increases the friction, and prevents relative sliding between the wafer and the pad during rotation, which would cause wear on the edge of the wafer and affect its use. A pad is fixedly installed on the inclined surface of the inclined slot block, and the pad is symmetrically installed along the center position of the axis of the inclined slot block.

[0004] Preferably, the chassis is located between the water outlet tank and the heat dissipation tank, the top plate is located above the heat dissipation tank, and a motor is fixedly installed at the center of the bottom of the top plate. The top plate and the chassis cooperate, and a connecting pipe connects the space between the top of the top plate and the bottom of the chassis, so that the cleaning fluid carries the contaminants through the connecting pipe from the top of the top plate to the bottom of the chassis. With the help of the heat dissipation tank of the cleaning cylinder, when the motor is working, heat is transferred to the flowing cleaning fluid through the air and the connecting pipe, which improves the cooling effect on the motor. The output end of the motor is fixedly connected to the bottom of the inner turntable, and the top of the inner turntable is evenly provided with arc grooves. A connecting pipe is fixedly installed between the top plate and the chassis.

[0005] Preferably, the rinsing mechanism includes a support plate, the bottom of which is fixedly connected to the outside of the cleaning cylinder, and a cylinder is fixedly installed on the top of the support plate. The output end of the cylinder passes through the support plate and extends to its bottom. A fixing cover is fixedly installed on the output end of the cylinder. A spray pipe is fixedly installed on the inner wall of the fixing cover. A fixing pipe is fixedly installed on the outside of the spray pipe. The end of the fixing pipe away from the spray pipe is fixedly connected to the outlet of the liquid pump through a pipe.

[0006] Preferably, a connecting cover is fixedly installed at the bottom of the outer side of the fixed cover. The outer diameter of the connecting cover gradually increases from top to bottom, and a baffle is fixedly installed at the bottom of the connecting cover. The outer diameter of the baffle matches the inner diameter of the cleaning cylinder, and guide grooves are evenly formed on the outer side of the baffle. Through the cooperation of the baffle and the bottom ring, before the cleaning fluid is discharged for cleaning, the bottom ring and the baffle are inserted into the cleaning cylinder to block the splashing cleaning fluid during rinsing, thus preventing the cleaning fluid from splashing during rinsing. At the same time, the guide groove of the baffle provides a guiding path for the splashing cleaning fluid when sprayed from the nozzle, preventing it from accumulating on the outer side of the baffle. A bottom ring is fixedly installed at the bottom of the baffle, and the outer diameter of the bottom ring gradually decreases from top to bottom. An inner baffle and a slag collection tank are fixedly installed on the inner wall of the nozzle. The inner baffle and slag collection tank work together to allow filtered foreign matter to be carried into the slag collection tank during the cleaning fluid filtration process. Simultaneously, the inner baffle restricts the flow of the cleaning fluid, preventing it from directly impacting the slag collection tank and causing foreign matter to spread again, leading to filter blockage, intermittent spraying of the cleaning fluid, and splashing. The slag collection tank is located at the bottom of the inner baffle, and the outer diameter of the inner baffle gradually increases from top to bottom. The inner baffle is located inside the fixed pipe, and a filter is fixedly installed on the inner wall of the slag collection tank, with the outer diameter of the filter gradually increasing from top to bottom.

[0007] Preferably, the recycling mechanism includes a bottom chamber, an inlet pipe fixedly installed on the side of the bottom chamber near the cleaning cylinder, and an outer ring cover fixedly connected to the end of the inlet pipe away from the bottom chamber via a pipe. A top chamber is fixedly installed on the top of the bottom chamber, and an outlet pipe is fixedly installed on the outer side of the top chamber. A bottom pad is fixedly installed on the inner wall of the bottom chamber. A groove is formed at the center of the bottom pad near the inlet pipe, and the groove of the bottom pad corresponds to the position of the inlet pipe. By cooperating with the inlet pipe, the groove of the bottom pad provides space for the liquid to be introduced when cleaning liquid and contaminants are introduced. At the same time, the groove provides space for solid contaminants to accumulate, avoiding the accumulation of solid contaminants at the introduction position and causing blockage. A sponge board is fixedly installed on the top of the bottom pad, and the outer side of the sponge board is tightly attached to the inner wall of the bottom chamber.

[0008] Preferably, the bottom of the top compartment is provided with a rectangular groove, and the top compartment is connected to the bottom compartment through the rectangular groove. A through-groove plate is fixedly installed on the inner wall of the top compartment. A through-groove is provided on the side of the top of the through-groove plate near the outlet pipe. A sieve plate is fixedly installed at the rectangular groove of the top compartment. An inclined through-groove is evenly provided on the top of the sieve plate, and the bottom of the sieve plate is tightly fitted with the top of the sponge plate. There is a space between the sieve plate and the through-groove plate.

[0009] This invention provides a wafer cleaning machine with a recycling function. It has the following beneficial effects: I. This wafer cleaning machine with recycling function uses a pad and a rubber block. After the wafer is placed in, rotating the screw causes the rubber block to move down and contact the wafer, clamping it between the pad and the rubber block. During clamping, the rubber block's material properties allow for elastic deformation upon contact, buffering the clamping pressure and preventing wafer breakage. The deformed rubber block also increases the contact area with the wafer, increasing friction and preventing relative sliding between the wafer and the pad during rotation, which could cause wear on the wafer's edges and affect its usability.

[0010] II. This wafer cleaning machine with recycling function uses a top plate and a bottom plate to connect the space between the top of the top plate and the bottom of the bottom plate through a connecting pipe. This allows the cleaning fluid to carry contaminants from the top of the top plate to the bottom of the bottom plate through the connecting pipe. Combined with the heat dissipation tank of the cleaning cylinder, when the motor is working, heat is transferred to the flowing cleaning fluid through the air and the connecting pipe, which improves the cooling effect on the motor.

[0011] Third, this wafer cleaning machine with recycling function, through the cooperation of the baffle and the bottom ring, allows the bottom ring and the baffle to penetrate into the cleaning cylinder before the cleaning fluid is discharged for cleaning. During rinsing, the splashing cleaning fluid is blocked, preventing the cleaning fluid from splashing. At the same time, the guide groove of the baffle provides a guiding path for the cleaning fluid splashed when it is sprayed out of the nozzle, preventing it from accumulating on the outside of the baffle.

[0012] IV. This wafer cleaning machine with recycling function, through the cooperation of the inner baffle and the slag collection tank, allows the filtered foreign matter to be carried into the slag collection tank when the cleaning liquid is filtered. At the same time, the inner baffle restricts the introduction of cleaning liquid, preventing the cleaning liquid from directly impacting the slag collection tank and causing the foreign matter in the slag collection tank to be impacted and then spread again, causing the filter cover to become blocked, resulting in intermittent spraying of cleaning liquid and splashing of cleaning liquid.

[0013] 5. This wafer cleaning machine with recycling function uses the groove of the bottom plate to cooperate with the inlet tube. When the cleaning liquid and contaminants are introduced, the groove provides space for the liquid to be introduced, and at the same time, the groove provides space for solid contaminants to accumulate, so as to avoid solid contaminants accumulating at the inlet position and causing blockage during the introduction. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a wafer cleaning machine with recycling function according to the present invention; Figure 2 This is a side view of the structure of a wafer cleaning machine with recycling function according to the present invention; Figure 3 This is a partial structural schematic diagram of a wafer cleaning machine with recycling function according to the present invention; Figure 4 This is a partial top view of a wafer cleaning machine with recycling function according to the present invention; Figure 5 This is a partial structural cross-sectional view of a wafer cleaning machine with recycling function according to the present invention; Figure 6 This is a partial structural side view of a wafer cleaning machine with recycling function according to the present invention; Figure 7 This is a schematic diagram of the rinsing mechanism of the present invention; Figure 8 This is a partial sectional view of the rinsing mechanism of the present invention; Figure 9 This is a schematic diagram of the recycling mechanism of the present invention; Figure 10 This is a sectional view of the recycling mechanism of the present invention; Figure 11 This is a partial structural cross-sectional view of the recycling mechanism of the present invention.

[0015] In the diagram: 1. Frame; 2. Flushing mechanism; 3. Recovery mechanism; 4. Cleaning cylinder; 5. Liquid tank; 6. Liquid pump; 7. Outer ring cover; 8. Inner turntable; 9. Inclined trough block; 10. Top plate; 11. Connecting pipe; 12. Base plate; 13. Motor; 14. Lead screw; 15. Pad strip; 16. Inner sliding plate; 17. Rubber block; 201. Support plate; 202. Cylinder; 203. Fixing cover; 204. Spray pipe; 205. Bottom ring; 206. Baffle cover; 207. Connecting cover; 208. Inner baffle cover; 209. Filter cover; 210. Slag collection trough; 211. Fixing pipe; 31. Bottom chamber; 32. Outlet pipe; 33. Top chamber; 34. Through trough plate; 35. Screen plate; 36. Sponge board; 37. Inlet pipe; 38. Bottom pad plate. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] First embodiment, such as Figures 1 to 6 As shown, the present invention provides a technical solution: A wafer cleaning machine with recycling function includes: The frame 1 has a liquid pump 6 and a liquid tank 5 fixedly installed on its outer side. The liquid tank 5 is fixedly connected to the liquid inlet of the liquid pump 6 through a pipe. A cleaning cylinder 4 is fixedly installed on the top of the frame 1. An outer ring cover 7 is fixedly installed on the bottom of the outer side of the cleaning cylinder 4. The recycling mechanism 3 is installed on the top of the frame 1 and is fixedly connected to the outer ring cover 7 through a pipe. The rinsing mechanism 2 is installed on the top of the cleaning cylinder 4 and is fixedly connected to the outlet of the liquid pump 6 through a pipe. The outer side of the cleaning cylinder 4 is evenly provided with water outlet grooves and heat dissipation grooves, with the heat dissipation grooves located above the water outlet grooves. The outer ring cover 7 is located at the water outlet groove of the cleaning cylinder 4. A top plate 10 and a bottom plate 12 are fixedly installed on the inner wall of the cleaning cylinder 4. An inner turntable 8 is rotatably installed at the center of the top of the top plate 10. When fixing the wafer, the worker places the wafer on the top of the inner turntable 8, and the wafer contacts the bottom edge of the wafer through the symmetrically installed pads 15 on the inclined surface of the inclined slot block 9, thus lifting the wafer. Provides support, and then by rotating the lead screw 14, utilizing the threaded connection between the lead screw 14 and the inner wall of the inner slide plate 16, the inner slide plate 16 moves up and down under the restriction of the inclined slot block 9. The inclined slot block 9 is fixedly installed on the top of the inner turntable 8. The inclined slot blocks 9 are evenly installed along the center position of the inner turntable 8, and the opposite surfaces of the inclined slot blocks 9 are inclined surfaces that slope inward from top to bottom. The lead screw 14 is rotatably installed on the inner wall of the inclined slot block 9, and an inner slide block is slidably installed on the inner wall of the inclined slot block 9. Plate 16, the inner wall of the inner slide plate 16 is threaded to the outer side of the lead screw 14, and the end of the inner slide plate 16 away from the inclined block 9 is raised upward and has a protrusion at the bottom. The bottom of the protrusion of the inner slide plate 16 has a slot. A rubber block 17 is fixedly installed at the slot of the inner slide plate 16. When fixed, the inner slide plate 16 moves downward, so that the rubber block 17 fixedly installed at the protrusion of the inner slide plate 16 contacts the top of the wafer. By rotating the lead screw 14, the inner slide plate 16 moves downward, increasing the contact pressure of the rubber block 17 on the wafer. During rinsing, the motor 13 drives the inner turntable 8 to rotate, so that the inner turntable 8 drives the inclined block 9 to rotate. The wafer is clamped and fixed by the rubber block 17 and the pad strip 15, so that the wafer is driven to rotate inside the cleaning cylinder 4. With the cleaning fluid discharged by the rinsing mechanism 2, the top of the wafer is cleaned. A pad strip 15 is fixedly installed on the inclined surface of the inclined block 9. The pad strip 15 is symmetrically installed along the center position of the axis of the inclined block 9.

[0018] The base 12 is located between the water outlet tank and the heat dissipation tank, the top plate 10 is located above the heat dissipation tank, the motor 13 is fixedly installed at the center of the bottom of the top plate 10, the output end of the motor 13 is fixedly connected to the bottom of the inner turntable 8, and the top of the inner turntable 8 is evenly provided with arc-shaped through grooves, and a connecting pipe 11 is fixedly installed between the top plate 10 and the base 12.

[0019] The second embodiment is based on the first embodiment; please refer to [link / reference]. Figures 7 to 8As shown, the rinsing mechanism 2 includes a support plate 201. The bottom of the support plate 201 is fixedly connected to the outside of the cleaning cylinder 4, and a cylinder 202 is fixedly installed on the top of the support plate 201. The output end of the cylinder 202 passes through the support plate 201 and extends to its bottom. A fixing cover 203 is fixedly installed on the output end of the cylinder 202. A spray pipe 204 is fixedly installed on the inner wall of the fixing cover 203. A fixing pipe 211 is fixedly connected to the outlet of the liquid pump 6 through a pipe, so that the liquid pump 6 drives the cleaning liquid in the liquid tank 5, which is introduced into the spray pipe 204 through the fixing pipe 211 and discharged from the bottom of the spray pipe 204. Before rinsing the wafers inside the impact cleaning cylinder 4, after the wafers are placed in, the cylinder 202 drives the fixed cover 203, causing the nozzle 204, connecting cover 207, and baffle 206 to move downwards, so that the baffle 206 extends into the interior of the cleaning cylinder 4. When entering, the bottom ring 205 installed at the bottom of the baffle 206 first extends into the cleaning cylinder 4. The bottom ring 205 is guided by its gradually decreasing outer diameter from top to bottom. A fixed pipe 211 is fixedly installed on the outside of the nozzle 204. The end of the fixed pipe 211 away from the nozzle 204 is fixedly connected to the outlet of the liquid pump 6 through a pipe.

[0020] A connecting cover 207 is fixedly installed on the bottom of the outer side of the fixed cover 203. The outer diameter of the connecting cover 207 gradually increases from top to bottom, and a baffle 206 is fixedly installed on the bottom of the connecting cover 207. The outer diameter of the baffle 206 matches the inner diameter of the cleaning cylinder 4, and guide grooves are evenly opened on the outer side of the baffle 206. A bottom ring 205 is fixedly installed on the bottom of the baffle 206. The outer diameter of the bottom ring 205 gradually decreases from top to bottom. An inner baffle 208 and a slag collection trough 210 are fixedly installed on the inner wall of the spray pipe 204. The slag collection trough 210 is located at the bottom of the inner baffle 208, and the outer diameter of the inner baffle 208 gradually increases from top to bottom. During rinsing, the slag passes through the baffle. Guide grooves are evenly provided on the outer side of 206 to provide a guide gap for the splashed cleaning fluid, so that the liquid can be introduced into the top of the top plate 10 through the guide grooves. At the same time, when the cleaning fluid is introduced into the spray pipe 204 through the fixed pipe 211, it is blocked by the inner baffle 208, so that the cleaning fluid is guided downward from the top of the inner baffle 208. When sprayed, it is filtered by the filter cover 209. The filter cover 209 blocks foreign objects and enters the slag collection tank 210 for collection under the drive of the cleaning fluid flow. The inner baffle 208 is located inside the fixed pipe 211. The filter cover 209 is fixedly installed on the inner wall of the slag collection tank 210. The outer diameter of the filter cover 209 gradually increases from top to bottom.

[0021] The third embodiment is based on embodiments one and two; please refer to [link / reference]. Figures 9 to 11As shown, the recycling mechanism 3 includes a bottom chamber 31. An inlet pipe 37 is fixedly installed on the side of the bottom chamber 31 near the cleaning cylinder 4. The end of the inlet pipe 37 away from the bottom chamber 31 is fixedly connected to the outer ring cover 7 via a pipe. A top chamber 33 is fixedly installed on the top of the bottom chamber 31. An outlet pipe 32 is fixedly installed on the outer side of the top chamber 33. A bottom pad 38 is fixedly installed on the inner wall of the bottom chamber 31. A groove is formed at the center of the bottom pad 38 near the inlet pipe 37, and the groove of the bottom pad 38 corresponds to the position of the inlet pipe 37. The cleaning fluid after rinsing the wafers carries the flushed contaminants... The contaminant is introduced into the bottom chamber 31 through the connection between the inlet pipe 37 and the outer ring cover 7. During the introduction, the cleaning liquid and contaminant are introduced into the groove through the corresponding groove of the bottom pad plate 38 and the inlet pipe 37. As the introduction continues, the liquid level in the bottom chamber 31 rises, and the cleaning liquid and contaminant come into contact with the sponge plate 36. As the liquid level continues to rise, the liquid passes through the sponge plate 36 and the sieve plate 35 and enters the interior of the top chamber 33. The sponge plate 36 is fixedly installed on the top of the bottom pad plate 38, and the outer side of the sponge plate 36 is tightly attached to the inner wall of the bottom chamber 31.

[0022] The top chamber 33 has a rectangular groove at its bottom, and the top chamber 33 is connected to the bottom chamber 31 through the rectangular groove. A through-slot plate 34 is fixedly installed on the inner wall of the top chamber 33. A through-slot is opened on the side of the top of the through-slot plate 34 near the outlet pipe 32. A sieve plate 35 is fixedly installed at the rectangular groove of the top chamber 33. During the process of passing through the sponge plate 36 and the sieve plate 35, the contaminants in the cleaning fluid are filtered. The cleaning fluid after entering the top chamber 33 first concentrates in the gap between the sieve plate 35 and the through-slot plate 34 and settles in the gap. Then, as the liquid level gradually rises, it is introduced into the top of the through-slot plate 34 through the through-slot position and finally discharged through the outlet pipe 32 for recycling. The top of the sieve plate 35 has evenly opened inclined through-slots, and the bottom of the sieve plate 35 is tightly attached to the top of the sponge plate 36. There is a space between the sieve plate 35 and the through-slot plate 34.

[0023] In use, the worker places the wafer to be cleaned into the cleaning cylinder 4 and clamps it in place. Then, the liquid pump 6 and motor 13 are started, so that the motor 13 drives the inner turntable 8 to make the wafer rotate inside the cleaning cylinder 4. At the same time, the liquid pump 6 drives the cleaning liquid in the liquid tank 5 to be discharged from the rinsing mechanism 2 and sprays the cleaning liquid onto the top of the wafer. With the rotation of the wafer, the wafer is cleaned. The cleaning liquid that has completed the rinsing work is introduced from the top of the top plate 10 to the bottom of the bottom plate 12 through the connecting pipe 11, and then introduced into the recovery mechanism 3 through the outer ring cover 7. The recovery mechanism 3 filters the cleaning liquid and then discharges it for recycling.

[0024] When fixing the wafer, the worker places the wafer on top of the inner turntable 8, and the shims 15, which are symmetrically installed on the inclined surface of the sloping block 9, contact the bottom edge of the wafer to provide support. Then, by rotating the lead screw 14, the inner slide plate 16 moves up and down under the restriction of the sloping block 9 through the threaded connection between the lead screw 14 and the inner wall of the inner slide plate 16. During fixing, the inner slide plate 16 moves downward, so that the rubber block 17, which is fixedly installed at the protrusion position of the inner slide plate 16, contacts the top of the wafer. By rotating the lead screw 14, the inner slide plate 16 moves downward, increasing the contact pressure of the rubber block 17 on the wafer. During rinsing, the motor 13 drives the inner turntable 8 to rotate, which in turn drives the sloping block 9 to rotate. The wafer is clamped and fixed by the rubber block 17 and the shims 15, and is moved to rotate inside the cleaning cylinder 4. The cleaning fluid discharged by the rinsing mechanism 2 cleans the top of the wafer.

[0025] In the rinsing mechanism 2, the fixed pipe 211 is fixedly connected to the outlet of the liquid pump 6 via a pipe, so that the liquid pump 6 drives the cleaning liquid in the liquid tank 5, which is introduced into the spray pipe 204 through the fixed pipe 211 and discharged from the bottom of the spray pipe 204, impacting the wafers inside the cleaning cylinder 4. Before rinsing the wafers, after the wafers are placed in, the fixed cover 203 is driven by the cylinder 202, causing the spray pipe 204, the connecting cover 207, and the baffle 206 to move downwards, so that the baffle 206 penetrates into the interior of the cleaning cylinder 4. During entry, the bottom ring 205 installed at the bottom of the baffle 206 first extends into the cleaning cylinder 4, utilizing... The bottom ring 205 has a gradually decreasing outer diameter from top to bottom, which guides the liquid as it penetrates deeper. During rinsing, guide grooves are evenly provided on the outside of the baffle 206 to provide a guide gap for the splashed cleaning fluid, allowing the liquid to be guided into the top of the top plate 10 through the guide grooves. At the same time, when the cleaning fluid is introduced into the spray pipe 204 through the fixed pipe 211, it is blocked by the inner baffle 208, which guides the cleaning fluid downward from the top of the inner baffle 208. When sprayed out, it is filtered by the filter cover 209, which blocks foreign objects and collects them in the slag collection tank 210 under the drive of the cleaning fluid flow.

[0026] In the recycling mechanism 3, the cleaning fluid after rinsing the wafers carries the flushed contaminants into the bottom chamber 31 through the connection between the inlet pipe 37 and the outer ring cover 7. During the introduction, the cleaning fluid and contaminants are introduced into the groove of the bottom pad plate 38 through the correspondence between the groove and the inlet pipe 37. As the introduction continues, the liquid level in the bottom chamber 31 rises, and the cleaning fluid and contaminants come into contact with the sponge plate 36. As the liquid level continues to rise, the cleaning fluid passes through the sponge plate 36 and the sieve plate 35 into the interior of the top chamber 33. During the process of passing through the sponge plate 36 and the sieve plate 35, the contaminants in the cleaning fluid are filtered. The cleaning fluid after entering the top chamber 33 first concentrates in the gap between the sieve plate 35 and the through-channel plate 34, where it settles. Then, as the liquid level gradually rises, it is introduced into the top of the through-channel plate 34 through the through-channel position, and finally discharged through the outlet pipe 32 for recycling.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning machine with recycling function, characterized in that, include: A frame (1) is fixedly installed with a liquid pump (6) and a liquid tank (5) on the outside of the frame (1). The liquid tank (5) is fixedly connected to the liquid inlet of the liquid pump (6) through a pipe. A cleaning cylinder (4) is fixedly installed on the top of the frame (1). An outer ring cover (7) is fixedly installed on the bottom of the outer side of the cleaning cylinder (4). The recycling mechanism (3) is installed on the top of the frame (1) and is fixedly connected to the outer ring cover (7) through a pipe; A rinsing mechanism (2) is installed on the top of the cleaning cylinder (4) and is fixedly connected to the outlet of the liquid pump (6) through a pipe. The outer side of the cleaning cylinder (4) is evenly provided with a water outlet groove and a heat dissipation groove, and the heat dissipation groove is located above the water outlet groove. The outer ring cover (7) is located at the water outlet groove of the cleaning cylinder (4). The inner wall of the cleaning cylinder (4) is fixedly installed with a top plate (10) and a bottom plate (12). An inner turntable (8) is rotatably installed at the center of the top of the top plate (10). An inclined groove block (9) is fixedly installed on the top of the inner turntable (8). The inclined groove blocks (9) are evenly installed along the center of the inner turntable (8), and the opposite surfaces of the inclined groove blocks (9) are inclined surfaces that slope inward from top to bottom. A lead screw (14) is rotatably installed on the inner wall of the inclined groove block (9), and an inner slide plate (16) is slidably installed on the inner wall of the inclined groove block (9). The inner wall of the inner slide plate (16) is threadedly connected to the outer side of the lead screw (14). The end of the inner slide plate (16) away from the inclined groove block (9) is raised upward and a protrusion is provided at the bottom. A slot is provided at the bottom of the protrusion of the inner slide plate (16). A rubber block (17) is fixedly installed at the slot of the inner slide plate (16). A pad (15) is fixedly installed on the inclined surface of the inclined groove block (9). The pad (15) is symmetrically installed along the center position of the axis of the inclined groove block (9). The rinsing mechanism (2) includes a support plate (201), the bottom of which is fixedly connected to the outside of the cleaning cylinder (4), and a cylinder (202) is fixedly installed on the top of the support plate (201). The output end of the cylinder (202) passes through the support plate (201) and extends to its bottom, and a fixing cover (203) is fixedly installed on the output end of the cylinder (202). The recycling mechanism (3) includes a bottom chamber (31), an inlet pipe (37) is fixedly installed on the side of the bottom chamber (31) near the washing cylinder (4), the end of the inlet pipe (37) away from the bottom chamber (31) is fixedly connected to the outer ring cover (7) through a pipe, a top chamber (33) is fixedly installed on the top of the bottom chamber (31), and an outlet pipe (32) is fixedly installed on the outside of the top chamber (33).

2. The wafer cleaning machine with recycling function according to claim 1, characterized in that: The base (12) is located between the water outlet tank and the heat dissipation tank. The top plate (10) is located above the heat dissipation tank. A motor (13) is fixedly installed at the center of the bottom of the top plate (10). The output end of the motor (13) is fixedly connected to the bottom of the inner turntable (8). The top of the inner turntable (8) is evenly provided with arc-shaped through grooves. A connecting pipe (11) is fixedly installed between the top plate (10) and the base (12).

3. A wafer cleaning machine with recycling function according to claim 1, characterized in that: The inner wall of the fixed cover (203) is fixedly installed with a nozzle (204), and the outer side of the nozzle (204) is fixedly installed with a fixed pipe (211). The end of the fixed pipe (211) away from the nozzle (204) is fixedly connected to the outlet of the liquid pump (6) through a pipe.

4. A wafer cleaning machine with recycling function according to claim 3, characterized in that: A connecting cover (207) is fixedly installed at the bottom of the outer side of the fixed cover (203). The outer diameter of the connecting cover (207) gradually increases from top to bottom. A baffle (206) is fixedly installed at the bottom of the connecting cover (207). The outer diameter of the baffle (206) is adapted to the inner diameter of the cleaning cylinder (4). Guide grooves are evenly opened on the outer side of the baffle (206). A bottom ring (205) is fixedly installed at the bottom of the baffle (206). The outer diameter of the bottom ring (205) gradually decreases from top to bottom.

5. A wafer cleaning machine with recycling function according to claim 4, characterized in that: The inner wall of the nozzle (204) is fixedly equipped with an inner baffle (208) and a slag collection trough (210). The slag collection trough (210) is located at the bottom of the inner baffle (208), and the outer diameter of the inner baffle (208) gradually increases from top to bottom. The inner baffle (208) is located inside the fixed pipe (211). The inner wall of the slag collection trough (210) is fixedly equipped with a filter cover (209), and the outer diameter of the filter cover (209) gradually increases from top to bottom.

6. A wafer cleaning machine with recycling function according to claim 1, characterized in that: A base plate (38) is fixedly installed on the inner wall of the bottom compartment (31). A groove is provided at the center of the base plate (38) near the inlet pipe (37), and the groove of the base plate (38) corresponds to the position of the inlet pipe (37). A sponge plate (36) is fixedly installed on the top of the base plate (38), and the outer side of the sponge plate (36) is tightly fitted to the inner wall of the bottom compartment (31).

7. A wafer cleaning machine with recycling function according to claim 6, characterized in that: The top compartment (33) has a rectangular groove at its bottom and is connected to the bottom compartment (31) through the rectangular groove. A through groove plate (34) is fixedly installed on the inner wall of the top compartment (33). A through groove is provided on the side of the top of the through groove plate (34) near the outlet pipe (32).

8. A wafer cleaning machine with recycling function according to claim 7, characterized in that: A sieve plate (35) is fixedly installed at the rectangular groove of the top compartment (33). The top of the sieve plate (35) is evenly provided with oblique through grooves, and the bottom of the sieve plate (35) is closely attached to the top of the sponge plate (36). There is a space between the sieve plate (35) and the through groove plate (34).

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