Laser slotting method, device and circuit board based on ultra-short pulse laser

Abstract

The present disclosure provides a kind of laser slotting processing method, equipment and circuit board based on ultra-short pulse laser, belongs to laser processing technical field, the method comprises: according to the processing information of groove structure, the line groove processing parameter of groove structure is obtained, provides ultra-short pulse laser beam, line beam group is formed by regulating and controlling ultra-short pulse laser beam, and groove structure is formed on circuit board by using line beam group and processing.The multiple line grooves of using line beam group are processed on circuit board, so that multiple line grooves are stacked to form groove structure, realize with " line processing " mode instead of " point processing " mode on circuit board to make groove structure, help to significantly reduce processing data processing burden and improve processing efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of laser processing technology, and in particular to a laser grooving processing method, equipment and circuit board based on ultrashort pulse laser. Background Technology

[0002] Laser grooving technology is widely used to process various groove structures on circuit boards. This technology uses a laser beam to create spot-by-spot processing on the circuit board, layering these spots to form the desired groove structure (i.e., a "point processing" mode). However, with increasing demands for the functionality and performance of circuit boards, there is a need to process more complex and refined groove structures. Current laser grooving technologies cannot meet the high-efficiency processing requirements for these various groove structures. Summary of the Invention

[0003] This disclosure aims to at least address one of the technical problems existing in the related art. To this end, embodiments of this disclosure provide a laser grooving processing method, laser grooving processing equipment, and circuit board based on ultrashort pulse lasers, which helps to improve the processing efficiency of grooving structures and reduce the data processing burden of grooving structure processing.

[0004] To achieve the above objectives, in a first aspect, embodiments of this disclosure provide a laser processing method based on ultrashort pulse lasers, the processing method comprising: The machining parameters of the groove structure are obtained based on the machining information of the groove structure. An ultrashort pulse laser beam is provided, and the ultrashort pulse laser beam is modulated to form a line beam group, wherein the laser parameters of each line beam in the line beam group are matched with the groove processing parameters; Using the aforementioned line beam group, the groove structure is formed on the circuit board. In a second aspect, embodiments of this disclosure provide a laser grooving processing apparatus for grooving circuit boards, the laser grooving processing apparatus comprising a laser, a beam control system, a processing platform, and a controller; wherein, The laser is used to provide an ultrashort pulse laser beam under the control of the controller; The beam control system is used to control the ultrashort pulse laser beam to form a line beam group under the control of the controller; The processing platform is used to carry the circuit board and move the circuit board under the control of the controller; The controller is configured with a slot structure processing mode. When the slot structure processing mode is enabled, the processing method described in the first aspect is executed to perform slot processing on the circuit board.

[0005] Thirdly, embodiments of this disclosure provide a circuit board including a slot structure, the slot structure being processed using the processing method described in the first aspect or the laser slotting processing equipment described in the second aspect.

[0006] Fourthly, embodiments of this disclosure provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described method.

[0007] The beneficial effects of the embodiments disclosed herein are as follows: Compared with the prior art, which uses a "point processing" mode to process slot structures on circuit boards, the embodiments disclosed herein utilize the slot processing parameters of the slot structure to control the ultrashort pulse laser beam, so that the laser parameters of each line beam in the line beam group formed by the ultrashort pulse laser beam are matched with the slot processing parameters. By using this line beam group to process multiple slots on the circuit board, multiple slots processed based on the line beam group on the circuit board form a slot structure. This realizes the replacement of the "point processing" mode with the "line processing" mode to create slot structures on the circuit board, which helps to significantly reduce the processing data processing burden and improve processing efficiency.

[0008] Additional aspects and advantages of this disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this disclosure. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a structural block diagram of a laser grooving processing device based on an ultrashort pulse laser provided in this embodiment of the disclosure; Figure 2 This is a schematic flowchart of a laser grooving method based on ultrashort pulse laser provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of a line beam formed based on an ultrashort pulse laser beam, provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the first groove structure provided in an embodiment of this disclosure; Figure 5 This is a schematic diagram of the second groove structure provided in an embodiment of this disclosure; Figure 6 This is a schematic diagram of the groove structure to be processed according to an embodiment of this disclosure; Figure 7 The processing provided in the embodiments of this disclosure Figure 6 A schematic diagram of the machining process for the groove structure shown; Figure 8 The processing provided in the embodiments of this disclosure Figure 6 Another schematic diagram of the machining process for the groove structure shown; Figure 9 This is a schematic diagram of the internal structure of the controller provided in an embodiment of this disclosure.

[0011] The following specific embodiments will further illustrate this disclosure in conjunction with the accompanying drawings. Detailed Implementation

[0012] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0013] Laser grooving technology is widely used to process various groove structures on circuit boards. This technology uses a laser beam to create points on the circuit board, which are then superimposed to form the desired groove structure (i.e., a "point-by-point processing" mode). However, in this point-by-point processing method, the processing data for each adjacent pair of laser spots is discrete. Each processing point in the groove structure has independent coordinates and processing parameters. Data processing requires precise control of the laser beam's position and dwell time at each processing point, leading to low processing efficiency and increased data processing burden. With increasing demands for circuit board functionality and performance, more complex and refined groove structures need to be processed on circuit boards, but current laser grooving technologies cannot meet the high-efficiency processing requirements for various groove structures.

[0014] Based on this, this disclosure provides a laser grooving processing method, laser grooving processing equipment, and circuit board based on ultrashort pulse laser, which can significantly improve the processing efficiency of processing groove structures on circuit boards and reduce the data processing burden during the processing.

[0015] To facilitate understanding of the technical implementation of this disclosure, the application of this disclosure will be explained first: The laser grooving method provided in this disclosure can be applied to the laser grooving equipment provided in this disclosure. Specific application environments include... Figure 1 As shown, the laser grooving processing equipment 200 includes at least: a laser 11, a beam control system 12, a processing platform 13, and a controller 14. Optionally, the laser grooving processing equipment 200 disclosed herein may specifically be a nanosecond laser grooving processing equipment, an ultrafast laser grooving processing equipment, or a hybrid laser grooving processing equipment including nanosecond lasers and / or ultrafast lasers, etc.

[0016] The controller 14 is electrically coupled to the laser 11, the beam control system 12 and the processing platform 13 respectively, so as to realize the automated control of the laser 11, the beam control system 12 and the processing platform 13 respectively.

[0017] Along the optical propagation path of the laser beam provided by the laser 11, a beam control system 12 and a processing platform 13 are sequentially arranged. The laser 11 emits an ultrashort pulse laser beam under the control of the controller 14. The beam control system 12 provides an optical transmission path for the incident laser beam and performs control processing, so that the controlled laser beam forms a line beam that exits from the beam control system and enters the processing platform 13. The bearing surface of the processing platform 13 can hold the circuit board 300 to be processed. The controller 14 controls the relative movement between the line beam incident on the processing platform 13 and the circuit board 300, allowing the circuit board 300 to form a groove structure through laser beam processing.

[0018] In this disclosure, the laser 11 can emit an ultrashort pulse laser beam. Specifically, the laser 11 can be one or a combination of lasers selected from nanosecond lasers, picosecond lasers, femtosecond lasers, etc., depending on the processing requirements. The laser 11 can be selected to provide suitable laser pulse wavelength and pulse frequency parameters according to the processing requirements. The power, spot size, repetition rate, and other parameters of the laser beam emitted by the laser 11 can all be set according to the processing requirements.

[0019] In this disclosure, the beam control system 12 includes at least a beam deflection component 121. The beam deflection component can be used to adjust the beam spot formed on the circuit board to deflect and move, so that the laser beam emitted from the beam control system 12 can perform laser processing on different positions on the circuit board.

[0020] It is understood that, in addition to the beam deflection component 121, the beam control system 12 may also include a beam scaling component. Figure 1 (Not shown in the image) and / or lens assembly 124. The specific combination in the beam control system 12 can be set according to the processing needs of the laser grooving processing equipment. The lens assembly 124 can be positioned between the beam deflection assembly 121 and the processing platform 13. The lens assembly 124 is used to adjust the focal length, thereby affecting the spot size and energy density distribution formed by the laser beam at the processing position of the workpiece. The beam scaling assembly can be positioned between the beam deflection assembly 121 and the lens assembly 124, or between the laser 11 and the beam deflection assembly. The beam scaling assembly is used to perform beam contraction or expansion processing on the laser beam to control the cross-sectional size of the beam. The various devices in the beam control system 12 cooperate with each other to transmit and control the laser beam, forming a line beam that matches the grooving processing parameters.

[0021] In this disclosure, the controller 14 may be a control terminal with relevant software deployed, which may be, but is not limited to, a desktop computer, laptop computer, tablet computer, Internet of Things device, smartphone, etc. The controller 14 is configured with a slot structure processing mode. When the slot structure processing mode is enabled, the controller 14 can execute the steps of the laser slotting processing method provided in this disclosure to perform slotting processing on the circuit board.

[0022] It should be noted that, for the sake of convenience and brevity, the specific working process of the laser grooving equipment for grooving structure processing described above can be referred to the corresponding process of the laser grooving method based on ultrashort pulse laser in the embodiments below, and will not be repeated here.

[0023] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments.

[0024] In some embodiments, please refer to Figure 2 , Figure 2 A schematic flowchart of a laser processing method based on ultrashort pulse lasers according to this disclosure is shown. This laser processing method based on ultrashort pulse lasers can be applied to the above-mentioned... Figure 1 The provided laser grooving equipment is used to perform the process, and can be executed by the controller of the laser grooving equipment, for processing various groove structures on circuit boards.

[0025] The aforementioned circuit board refers to the packaging substrate used to carry and realize the interconnection of different chips and / or electronic components. It can include various PCBs such as ordinary boards, multilayer boards, HDI (High Density Interconnector), and FPC (Flexible Printed Circuit), as well as IC substrates (Integrated Circuit Substrate) made of organic substrates, ceramic substrates, glass substrates, or other new substrates.

[0026] Specifically, such as Figure 2 As shown, the laser grooving processing method based on ultrashort pulse laser includes the following steps S11 to S13.

[0027] Step S11: Obtain the machining parameters of the groove structure based on the machining information of the groove structure.

[0028] In this context, a slot structure refers to an open structure with a certain shape and size manufactured at a designated location on a circuit board using specific processing methods, according to processing requirements. The processing information for a slot structure refers to the processing information used to provide processing requirements for the slot structure, which may include, but is not limited to, the processing location, shape, dimensions, and depth of the slot structure.

[0029] It is understood that the laser grooving method disclosed herein can be used to process through slots that penetrate the top and bottom layers of a circuit board, or to create blind slots (also known as grooves) that only penetrate a portion of the thickness of the circuit board.

[0030] A groove is a slender opening structure created on a material surface using a laser beam along a continuous processing path. Grooving parameters refer to the processing information used to guide the aforementioned processing equipment in performing groove processing. These parameters may include, but are not limited to, the groove processing path, groove width and depth, groove start position, and groove end position. The groove start and end positions correspond to the start and end points of the groove processing path. It can be understood that the extension direction of the groove processing path can be a straight line or a curve.

[0031] In this step, the processing parameters of the slot structure are obtained based on the processing information of the slot structure to be processed on the circuit board, so as to convert the slot structure processing into slot processing, which makes it easier for subsequent steps to splice the slender opening structure obtained on the circuit board through slot processing to obtain the required slot structure.

[0032] Step S12: Provide an ultrashort pulse laser beam and control the ultrashort pulse laser beam to form a line beam group.

[0033] In this process, the laser parameters of each line beam in the line beam group are matched with the machining parameters of the line groove.

[0034] In this disclosure, an ultrashort pulse laser beam refers to a laser beam formed by pulsed lasers with a pulse width less than or equal to the nanosecond level, and may include nanosecond lasers, picosecond lasers, and femtosecond lasers.

[0035] Lasers that provide ultrashort pulse laser beams include ultrafast lasers and nanosecond lasers. Ultrafast lasers provide ultrashort pulse laser beams with pulse widths less than or equal to picoseconds (including picosecond and femtosecond lasers), while nanosecond lasers provide ultrashort pulse laser beams with pulse widths on the order of nanoseconds.

[0036] Specifically, under the control of the controller, the beam deflection component adjusts the continuous deflection of the ultrashort pulse laser beam incident on the beam deflection component to form any line beam in the line beam group.

[0037] A line beam is a linear beam in which the energy distribution of an ultrashort pulse laser beam is elongated in a plane.

[0038] refer to Figure 3 The emission time of two consecutive laser pulses emitted by the laser has an interval time t. The two adjacent light spots formed on the processing plane of the circuit board corresponding to the consecutive laser pulses have a light spot spacing d (i.e., the distance between the centers of the two adjacent light spots). The light spot spacing d is related to the interval time t, the relative displacement velocity v between the light spot and the circuit board, and the repetition frequency f of the laser pulse. The corresponding relationship is: d=v*t=v / f.

[0039] Please continue reading. Figure 3 When the beam spacing d is less than the beam size D, the edges of two adjacent beams begin to partially overlap. When multiple laser pulses emitted sequentially by the laser are arranged in a continuous linear pattern on the processing plane of the circuit board, a continuous, elongated line beam L with laser energy distribution is formed on the circuit board. It can be understood that the extension direction of the line beam L can be either a straight line or a curve.

[0040] In embodiments of this disclosure, the spot size D is defined as the length of the spot along its direction of movement. For example, when the spot is circular, the spot size is the diameter of the circle (i.e., Figure 3 (as shown in dimension D); when the light spot is elliptical and the longer side of the ellipse is the direction of movement of the light spot, then the size of the light spot is the longer side of the ellipse.

[0041] It is understood that the raw ultrashort pulse laser beam provided by the laser can be controlled and transmitted by the beam control system in the laser grooving processing equipment to form a spot with a specific shape, size, and energy density distribution at the processing location of the circuit board to be processed. Typically, a circular spot is used to process the circuit board, but other shapes such as elliptical or square spots can also be controlled according to processing needs; this disclosure does not impose any limitations.

[0042] Since the laser energy of adjacent light spots will be superimposed in the overlapping area, controlling the overlap rate of the light spots that make up the line beam within a reasonable range can help improve processing efficiency and optimize the morphology of the processed structure.

[0043] In some embodiments of this disclosure, the spot overlap rate includes the overlap rate of spot areas, that is, the ratio between the overlapping area of ​​two adjacent spots and the total area of ​​a single spot. Preferably, adjusting the spot overlap rate of the line beam to be greater than or equal to 60% can make the edges of the overlapping spots formed by the line beam on the circuit board have a smaller jagged shape, and the grooves processed using this line beam have a smoother inner wall shape.

[0044] In the embodiments of this disclosure, the use of an ultrashort pulse laser to form a line beam L can fully utilize the various characteristics of ultrashort pulse lasers compared to other lasers (such as CO2 lasers), such as ultra-high peak power (up to GW to TW level), ultra-high repetition rate (up to 3MHz), extreme interaction time with materials during processing, less thermal impact on surrounding materials, and the ability to provide smaller spot size D (exemplarily, such as 10-80μm). This can result in a line beam with higher spot overlap rate and / or smaller beam width L2, which is beneficial to improving the processing quality and accuracy of line beam processing of grooves.

[0045] The laser parameters of a line beam L include the beam path L1, beam width L2, and beam processing times, which are closely related to the inherent characteristics of the pulsed laser forming the line beam L. Specifically, the beam path L1 refers to the line connecting the centers of the beam spots that make up the line beam along the beam's extension direction. When controlling the ultrashort pulse laser beam provided by the laser to form a line beam, it is only necessary to first determine the beam path of the line beam, and then control the ultrashort pulse laser to continuously and uniformly deflect along the beam path using a beam deflection component (corresponding to "line scanning"). The beam width L2 refers to the width of the beam spots that make up the line beam in the direction perpendicular to the beam's extension direction. The number of beam processing times refers to the number of times the line beam is repeatedly processed along the same beam path.

[0046] Matching the laser parameters of each line beam in the line beam group with the grooving processing parameters means that the laser parameters of each line beam match the processing information of the aforementioned processing equipment for grooving. By applying this line beam to the circuit board, the required grooves can be processed, and the line beam applied to the processing can be adjusted according to various required grooves.

[0047] It is understood that in some embodiments, the provided ultrashort pulse laser beam is specifically an ultrafast laser beam, which is modulated to form a line beam. Ultrafast lasers have higher peak power than nanosecond lasers, enabling the formation of a spot with a smaller spot size D and a higher energy density distribution at the circuit board processing location. Furthermore, during the interaction between the ultrafast laser and the circuit board substrate, cold processing accounts for a higher proportion, which is more conducive to improving the accuracy of micro-hole processing and reducing the heat impact during processing. This makes it better suited for processing groove structures on heat-sensitive substrates or circuit boards requiring fine groove structures.

[0048] Step S13: Using a line beam assembly, a groove structure is formed on the circuit board.

[0049] In embodiments of this disclosure, the circuit board is sequentially processed using a line beam group that matches the line slot processing parameters, and a line slot corresponding to each line beam of the line beam group is made on the circuit board, so as to achieve the desired slot structure.

[0050] Specifically, a continuous, elongated line beam of laser energy is applied to the location on the circuit board corresponding to the desired groove structure. This causes the material at the processing location to melt and vaporize, resulting in the removal of the material and creating a long, narrow, open groove on the circuit board. Multiple grooves are stacked to form the desired groove structure. It can be understood that the number of grooves forming the groove structure is greater than or equal to two; that is, the number of grooves to be processed, obtained from the processing information of the groove structure, is greater than or equal to two. Each groove to be processed corresponds to a specific groove processing parameter. During laser processing using a line beam group, the corresponding line beam needs to be adjusted according to the groove processing parameters of each groove to be processed to obtain the corresponding processing parameters for each groove.

[0051] When using a line beam for laser processing, the beam path is determined according to the desired groove processing path. The beam deflection component controls the spot to move continuously and uniformly along the groove processing path, thus achieving groove processing. Compared to related technologies where the beam deflection component controls the spot to deflect and process adjacent processing points sequentially (corresponding to "point processing" mode), in this embodiment, the beam spot only needs to be deflected uniformly according to the starting point, ending point, and extension direction of the groove processing path (corresponding to "line processing" mode). The processing data is simplified from point processing data to line processing data, significantly reducing data processing volume and simplifying data processing during the process.

[0052] In the embodiments of this disclosure, the processing parameters of the slot structure are obtained through the processing information of the desired slot structure. The ultrashort pulse laser beam output by the laser is controlled to be a line beam, and the line beam is controlled to perform laser processing to form the slot structure on the circuit board. On the one hand, the processing of the slot structure is converted into the processing of multiple slots. By controlling the ultrashort pulse laser beam provided by the laser to be a line beam corresponding to the processing of each slot, the desired slot structure is formed by superimposing multiple slots. This realizes the fabrication of the slot structure on the circuit board by replacing the "point processing" mode with the "line processing" mode, which significantly improves the processing efficiency and reduces the data processing burden. On the other hand, the ultrashort pulse laser beam can form a smaller spot with higher energy density by focusing, which is beneficial to improving the processing accuracy of the slot structure and making a finer slot structure. In addition, the ultrashort pulse laser selected in this disclosure has high repetition rate characteristics, which is beneficial to reducing or even eliminating the edge jaggedness of the line beam, further improving the processing quality of the slots and blind slots.

[0053] In some embodiments of this disclosure, the ultrashort pulse laser beam provided by the control laser is a line beam, and more than one embodiment can be adopted, including but not limited to: controlling the repetition frequency of the laser pulses of the ultrashort pulse laser beam (i.e., the repetition frequency of the laser pulses per unit time), and / or controlling the movement speed of the ultrashort pulse laser beam, and / or controlling the spot size parameters of the ultrashort pulse laser beam.

[0054] The velocity of the ultrashort pulse laser beam refers to the relative movement speed *v* between the laser spot formed by the ultrashort pulse laser beam on the processing plane of the circuit board and the circuit board. This relative movement speed *v* can be controlled by adjusting the movement of the circuit board and / or adjusting the deflection of the laser pulse spot.

[0055] The deflection of the laser pulse spot can be controlled by the beam deflection component 121 set in the beam control system of the laser grooving equipment. For example, the beam deflection component may be, but is not limited to, a combination of at least one or more of the following components: galvanometer, rotating mirror, AOD (Acousto-Optic Deflector).

[0056] The movement of the circuit board is controlled by the processing platform in the laser grooving equipment that supports the circuit board. Generally, considering that the beam deflection component has higher control precision and faster control efficiency than the processing platform, during the processing of the groove structure, it is preferable to adjust the movement speed of the ultrashort pulse laser beam by controlling the deflection speed of the laser pulse spot, which helps to simplify operation and improve processing accuracy.

[0057] The spot size parameter of the ultrashort pulse laser beam can be controlled by relevant optical components in the beam control system. The specific control method can be achieved by conventional techniques in this field. For example, the shape and size of the beam cross-section can be changed by using an aperture or mask, and / or the parallel beam can be focused into a small spot by using a focusing lens, and / or the beam diameter can be reduced or enlarged by using a beam scaling component. These will not be elaborated here.

[0058] Increasing the beam overlap rate of a line beam formed on a circuit board helps to create a smaller jagged edge on the edge of the optical pattern formed by the line beam, resulting in a smoother inner wall morphology for the grooves processed using this line beam. The important relationship between beam overlap rate and beam size and laser pulse repetition frequency has been presented above and will not be repeated here.

[0059] For example, the repetition rate of the ultrashort pulse laser beam can be set to 300 kHz to 600 kHz, the spot size to 20 μm to 60 μm, and the spot overlap rate to be greater than or equal to 60%.

[0060] In one specific embodiment, the ultrashort pulse laser beam output by the laser is a 532nm wavelength green picosecond laser. The repetition frequency f of the green picosecond laser is set to 400KHz. The green picosecond laser pulse is transmitted and controlled by a beam control system so that it forms a circular spot with a spot size D of 60μm on the processing plane of the circuit board. The relative moving speed v between the spot and the circuit board is controlled to be 1000m / s. Then, the spot spacing d between two adjacent spots on the circuit board is d=v / f=2.5μm. The spot spacing d between two adjacent spots is much smaller than the spot size D, that is, the overlap rate of adjacent spots is much greater than 60%. The edge of the formed line beam has a smaller serrated morphology. This line beam can enable the groove structure processed on the circuit board to have higher processing accuracy and better structural morphology.

[0061] In some embodiments of this disclosure, controlling an ultrashort pulse laser beam to form a line beam group includes: controlling the continuous deflection of the ultrashort pulse laser beam to form any one line beam in the line beam group.

[0062] For example, an ultrashort pulse laser beam is continuously deflected within a certain time period by a beam control system to form a line beam. The beam control system is positioned along the optical propagation path of the ultrashort pulse laser beam, enabling it to control the ultrashort pulse laser beam emitted by the laser and transmit the controlled line beam to the processing platform. This forms the required spot at the processing location on the circuit board, and the system can control the spot to move continuously along a specified path on the circuit board.

[0063] Furthermore, the beam deflection component 121 installed in the beam control system of the laser grooving equipment can be used to continuously deflect the ultrashort pulse laser beam within a certain time period to form a line beam. For example, the beam deflection component may include, but is not limited to, at least one or more of the following components: a galvanometer, a rotating mirror, and an AOD (Alternating Optical Discharge).

[0064] In this system, the galvanometer and / or rotating mirror, under the control of the controller, regulate the continuous deflection of the ultrashort pulse laser beam by driving the mechanical deflection of their own lenses.

[0065] Under the control of the controller, the AOD uses electrical signals to regulate the ultrashort pulse laser beam to deflect rapidly and continuously within a preset angle range.

[0066] It should be noted that, in this disclosure, the beam deflection amplitude of the line beam depends on the deflection range of the beam deflection component. For example, taking a beam deflection component 121 including a galvanometer, where the galvanometer controls the beam spot to deflect within a range of 50mm x 50mm on the circuit board, the beam deflection amplitude of the line beam in this case is less than or equal to 50mm x 50mm, meaning the beam path of the line beam can only extend within a 50mm x 50mm area. In a specific example, when the line beam extends along the side length of the galvanometer's deflection amplitude, the length of the line beam is less than or equal to 50mm.

[0067] Considering that the deflection range of the beam spot controlled by the galvanometer or rotating mirror on the circuit board is much larger than the deflection range controlled by AOD, it is preferable to set the beam deflection component 121 to include a galvanometer and / or a rotating mirror. During the transmission and control of the ultrashort pulse laser beam output by the laser through the beam control system, the beam spot formed on the circuit board by the line beam emitted from the beam control system is deflected by the galvanometer and / or rotating mirror.

[0068] It is understandable that different types of beam deflection components control the beam deflection with different deflection ranges and precisions, as well as different device costs and control complexities. Those skilled in the art can make a comprehensive selection based on processing requirements.

[0069] In some embodiments of this disclosure, the grooving processing parameters include at least one of the grooving processing path, grooving width, and grooving depth.

[0070] When the wire grooving machining parameters include the wire grooving machining path, the laser parameters of the line beam include a beam path that matches the wire grooving machining path. For example, the beam path coincides with the matching wire grooving machining path.

[0071] When the machining parameters for line grooving include the line grooving width, the laser parameters of the line beam include a beam width that matches the line grooving width. The line grooving width is directly proportional to the matching beam width. For example, considering that the energy density at the edge of the line beam is typically slightly lower than that in the central region, the ratio between the beam width and the matching line grooving width can be set to be greater than or equal to 1 and less than or equal to 1.15. Specifically, the ratio between the beam width and the matching line grooving width can be 1, 1.05, 1.1, or 1.15.

[0072] When the wire groove processing parameters include the wire groove depth, the laser parameters of the line beam include the number of beam processing operations matched to the wire groove depth. Specifically, the wire groove depth is directly proportional to the number of matching beam processing operations. That is, for circuit boards with the same substrate, the greater the required wire groove depth, the more beam processing operations are needed.

[0073] In some embodiments of this disclosure, controlling the ultrashort pulse laser beam into a line beam specifically includes: shaping the ultrashort pulse laser beam into a flat-top pulse laser beam, and controlling the flat-top pulse laser beam to form a line beam.

[0074] Specifically, the ultrashort pulse laser beam can be shaped from a Gaussian shape to a flat-top shape by a shaping component. The energy density distribution of the spot formed on the circuit board by the shaped ultrashort pulse laser beam (i.e., the flat-top pulse laser beam) is more uniform, which helps to improve the flatness of the inner wall (including the side wall and bottom wall) of the groove structure 100 finally formed on the circuit board, thereby improving the processing quality of the groove structure 100.

[0075] Furthermore, in one embodiment, if the groove structure to be processed is a blind groove, the ultrashort pulse laser beam can be shaped before any line beam of the line beam group is formed by controlling the ultrashort pulse laser beam, so that the energy density distribution of the spot formed by the line beam formed by the flat-top pulse laser beam on the circuit board is more uniform, thereby improving the processing quality of the groove structure 100.

[0076] Accordingly, in some embodiments, such as Figure 1 As shown, the beam control system 12 of the laser grooving processing equipment 200 provided in this disclosure may further include a shaping component 123. The shaping component 123 is positioned between the laser 11 and the beam deflection assembly 121, and is located on the beam propagation path of the ultrashort pulse laser beam. The shaping component 123 shapes the received ultrashort pulse laser beam from a Gaussian shape to a flat-top shape and emits the flat-top ultrashort pulse laser beam to the beam deflection assembly 121.

[0077] In some embodiments of this disclosure, obtaining the grooving processing parameters of the groove structure based on the processing information of the groove structure may include: planning multiple grooving substructures based on the processing information of the groove structure, and obtaining the grooving processing parameters corresponding to each grooving substructure. All the grooving substructures constitute the groove structure.

[0078] Specifically, planning multiple line groove substructures based on the processing information of the groove structure includes: creating groove structure processing drawings based on the processing information of the groove structure. These groove structure processing drawings include processing paths for multiple line groove substructures obtained from the division of the groove structure. Once the processing path of each line groove substructure is determined, the line groove processing parameters of each line groove substructure can be determined.

[0079] In the embodiments of this disclosure, a groove structure processing drawing is made based on the processing information of the groove structure. The groove structure processing drawing includes multiple groove processing paths. The groove processing parameters corresponding to each of the multiple groove processing paths are obtained, and the groove structure processing is converted into multiple groove processing. The required groove structure is obtained by splicing the multiple processed grooves.

[0080] For example, refer to Figure 4 The machining drawing of the groove structure, created based on the machining information of the groove structure 100, includes multiple first groove machining paths 101 and multiple second groove machining paths 201. The first groove machining path 101 corresponds to the machining of the first groove 10, and the second groove machining path 201 corresponds to the machining of the second groove 20. Furthermore, the groove machining parameters for the first groove 10 and the second groove 20 also include their respective groove widths, for example... Figure 4 As shown, the width of the first groove 10 is 102, and the width of the second groove 20 is 202.

[0081] Among them, the groove structure processing drawing refers to the processing drawing made according to the processing information of the groove structure to be processed (such as the processing position, processing shape, processing size, processing depth, etc. of the groove structure). This processing drawing is used to provide various processing information for laser grooving processing equipment to make groove structures.

[0082] The machining drawings for the groove structure can be generated by a graphics processing module. Specifically, the graphics processing module can be graphics device software installed on devices such as personal computers, laptops, smartphones, and tablets. The required machining drawings can be generated by operating the graphics device software on devices such as personal computers, laptops, smartphones, and tablets.

[0083] It is understood that in some embodiments, the laser grooving processing equipment may include a graphics processing module, which may be integrated with other components in the laser processing equipment. For example, a communication connection is established between the graphics processing module and the processor of the laser processing equipment. Graphical design software is deployed on the graphics processing module, such as AutoCAD, CorelDraw, and Illustrator. When technicians design the groove structure processing drawings in the graphic design software, they use the geometric parameters of the groove structure to be processed as a reference. The geometric parameters of the groove structure may include the shape, size, and position of the groove structure. Of course, the laser grooving processing equipment may also not include a graphics processing module. In this case, the graphics processing module and the laser grooving processing equipment are set up independently. The groove structure processing drawings are first generated on the equipment containing the graphics processing module, and then the generated groove structure processing drawings are provided to the laser grooving processing equipment to implement the laser grooving processing method based on ultrashort pulse lasers disclosed herein.

[0084] The laser grooving equipment may also include a display device, or the laser grooving equipment may be connected to an external display device so that the display device can display images related to the groove structure processing drawings, so that the operator of the laser grooving equipment can intuitively understand the grooving planning results of the groove structure and the various processing information corresponding to each grooving substructure.

[0085] In the laser grooving process for groove structures formed by splicing multiple grooves, the multiple groove substructures can be combined into, for example... Figure 4 The first groove structure 110 shown, and / or, as shown Figure 5 The second groove structure 120 is shown.

[0086] Specifically, in some embodiments of this disclosure, the processing areas of all the line slot substructures of a slot structure on the circuit board do not overlap. In this case, the step of forming the slot structure on the circuit board using line beam laser processing further includes: Using a line beam that matches each of the slotted substructures, each slotted structure is processed sequentially in the processing area of ​​the circuit board corresponding to each slotted structure.

[0087] In this context, the processing area corresponding to the slot structure on the circuit board is simply the projection area of ​​the slot structure on the circuit board.

[0088] like Figure 4 As shown, the first groove structure 110 includes multiple line groove substructures. Among these, the first line groove structure 10 extends along a first direction, and the second line groove structure 20 extends along a second direction, with the first and second directions intersecting. It is important to note that in the first groove structure 110, there is no overlap between any first line groove substructure 10 and any second line groove structure 20. Therefore, the processing paths of each line groove substructure constituting the first groove structure 110 are independent of each other. When processing on the circuit board using line beams matching each line groove substructure, there is no situation where multiple line beams are used to repeatedly laser process the same part.

[0089] In this way, to process the first slot structure 110 on the circuit board, a line beam that matches each slot substructure in the first slot structure 110 can be used to process the processing area of ​​each slot substructure on the circuit board in sequence, forming each slot substructure on the circuit board at one time, and finally forming the first slot structure 110 on the circuit board.

[0090] Please see Figure 4 as well as Figure 5 Compared to Figure 4 The first groove structure 110 shown is... Figure 5The second slot structure 120 shown also includes multiple first slot substructures 10 and multiple second slot structures 20. The difference between the second slot structure 120 and the first slot structure 110 is that any first slot substructure 10 and all second slot structures 20 form an overlapping area 30 on the circuit board.

[0091] For a second slot structure 120 with at least two slot substructures forming an overlapping area 30 on a circuit board, if the circuit board is processed sequentially using a line beam that matches each slot substructure, the laser energy of at least two line beams will repeatedly process the overlapping area, and the laser energy received by the overlapping area may even exceed the threshold, which will have an adverse effect on the flatness of the bottom wall of the slot or the integrity of the bottom circuit structure.

[0092] Based on this, it is necessary to adjust a set of line beams that pass through the same overlapping area so that the laser energy received by the overlapping area is consistent with or approximately equal to the laser energy actually required by the overlapping area. In this way, when using the set of line beams to process their respective corresponding line slot substructures, the overlapping area will not be repeatedly processed, thus avoiding unevenness of the bottom of the second slot structure 120 due to repeated processing of the overlapping area, and / or avoiding damage to the integrity of the circuit structure below the second slot structure 120.

[0093] Based on this, in some embodiments of this disclosure, for slot structures with at least two slot substructures forming overlapping areas on the circuit board, for example... Figure 5 The second groove structure 120 shown, formed on a circuit board using line beam laser processing, further includes the following steps: For a group of slotted substructures forming the same overlapping region, a line beam matching one of the slotted substructures is used to continuously scan the overlapping region, and a target line beam is used to perform a skip-grid scan of the overlapping region. In this disclosure, the target line beam is a line beam that matches the remaining slotted substructures in the group.

[0094] Continuous scanning refers to the continuous and uniform distribution of laser energy density on the circuit board by the line beam matching the line slot structure, which is continuously and uniformly distributed within a certain range before and after the overlapping area. In other words, the beam deflection component 121 controls the beam spot to continuously deflect and move along the corresponding processing path within a certain range before and after the overlapping area.

[0095] Among them, skip scanning refers to the manipulation of the target line beam so that the laser energy of the target line beam, which is continuously distributed in a long strip on the processing plane, is broken in some areas, forming a discontinuous strip distribution of laser energy for processing. The position of the discontinuity of each target line beam corresponds to the overlapping area, that is, the light spot formed by the target line beam on the circuit board is cut off in the overlapping area.

[0096] It is worth mentioning that, in this disclosure, for a group of wire groove substructures forming the same overlapping area, the group of wire groove substructures may include two or more wire groove substructures.

[0097] For example, if a set of slotted substructures forming the same overlapping area includes two slotted substructures, the overlapping area is continuously scanned using a line beam matching one of the slotted substructures to achieve laser processing of the circuit board in the overlapping area. In addition, the overlapping area is scanned in a skip-grid manner using a line beam matching the other slotted substructure to avoid the circuit board being processed again by another line beam in the overlapping area.

[0098] For example, if a set of slotted substructures forming the same overlapping area includes three slotted substructures, the overlapping area is continuously scanned by a line beam matching one of the three slotted substructures to achieve laser processing of the circuit board in the overlapping area. In addition, the overlapping area is scanned by skipping grids by line beams matching the other two slotted substructures to avoid the circuit board being processed multiple times by multiple line beams in the overlapping area.

[0099] Specifically, in the process of planning multiple line slot substructures based on the processing information of the slot structure, a line beam that is continuously scanned for each overlapping area can be planned in advance to avoid the situation where different line slots have matching line beams repeatedly processing the same overlapping position.

[0100] Furthermore, in one embodiment of this disclosure, the overlapping region is scanned using a target line beam, including: Along the beam path of the target line beam, the ultrashort pulse laser beam that forms the target line beam is continuously deflected and controlled, and the ultrashort pulse laser beam that forms the target line beam is simultaneously controlled to stop and start in the overlapping region, so that the ultrashort pulse laser beam that forms the target line beam only acts on the region outside the overlapping region.

[0101] Specifically, the multiple continuous light spots formed by the target line beam on the circuit board correspond one-to-one with the multiple laser pulses continuously emitted by the laser. The laser pulses forming the target line beam can be controlled by setting a beam control component 122 in the beam control system 12 of the laser grooving processing equipment. The beam control component 122 is positioned between the laser 11 and the beam deflection component 121 so that the laser energy distribution of the target line beam is adjusted to a discontinuous strip distribution.

[0102] For example, the beam control component 122 may include, but is not limited to, an AOM (Acousto-optic modulator). An acousto-optic modulator, also known as a laser electronic switch, can rapidly adjust the start and stop of laser pulse emission via electrical signal control. While the controller 14 controls the beam deflection component 121 to continuously deflect the laser pulses constituting the line beam along the beam path direction, the controller 14 simultaneously controls the beam control component 122 to rapidly shut down and restart the laser pulse emission in the corresponding overlapping region of the laser pulses constituting the line beam (i.e., the time period during which laser pulses are emitted in the corresponding overlapping region of the laser pulses constituting the line beam is shut off). This allows the line beam to perform skip-grid scanning of the overlapping region, avoiding over-processing of the overlapping region, which is beneficial for improving the flatness of the bottom wall morphology of the groove structure and enhancing the processing quality of the groove structure.

[0103] In another embodiment of this disclosure, a skip-grid scan of the overlapping region is performed using a target line beam, including: Along the beam path of the target line beam, the ultrashort pulse laser beam forming the target line beam is continuously deflected and controlled, and simultaneously controlled to deflect in a direction different from the beam path, so that the ultrashort pulse laser beam forming the target line beam does not act on the overlapping area.

[0104] For example, the beam control component 122 may include, but is not limited to, AOD or AOM. Both AOD and AOM can adjust the laser pulse for rapid deflection via electrical signal control. While the controller 14 controls the beam deflection component 121 to continuously deflect the laser pulses constituting the line beam along the beam path direction, the controller 14 simultaneously controls the beam control component 122 to deflect the laser pulses in the corresponding overlapping area of ​​the line beam along the non-beam path direction, without acting on the overlapping area. This allows the line beam to perform skip-grid scanning of the overlapping area, avoiding over-processing of the overlapping area, which is beneficial for improving the flatness of the bottom wall morphology of the groove structure and enhancing the processing quality of the groove structure. It is understood that when both the beam deflection component 121 and the beam control component 122 include acousto-optic deflectors, the beam deflection component 121 includes a first acousto-optic deflector, and the beam control component 122 includes a second acousto-optic deflector. The first and second acousto-optic deflectors are not shared.

[0105] In summary, any of the above embodiments can be applied to control the laser energy received in the overlapping area formed by at least two line slot substructures, so as to avoid the situation where the cumulative laser energy received in the overlapping area is too high, resulting in some slot structures being repeatedly processed and / or over-processed.

[0106] To facilitate understanding, the following will be combined with Figure 6 , Figure 7 and Figure 8 Please provide a detailed explanation. For example... Figure 6 As shown, the slot structure 100 to be processed on the circuit board can be divided into three first slot substructures 10 extending along a first direction and one second slot structure 20 extending along a second direction. The second slot structure 20 and the three first slot structures 10 respectively form overlapping regions M1, M2 and M3. Figure 7 and Figure 8 The two methods correspond to two ways of avoiding over-processing of overlapping areas.

[0107] Specifically, such as Figure 7 As shown, in the process of planning multiple line groove substructures based on the processing information of groove structure 100, the processing paths of each line groove substructure can be planned in advance to avoid the situation where the line beams of different line grooves repeatedly process the same position.

[0108] In this example, the groove structure 100 specifically includes three complete machining paths A1B1 (corresponding to machining start point A1 and machining end point B1), A2B2 (corresponding to machining start point A2 and machining end point B2), and A3B3 (corresponding to machining start point A3 and machining end point B3) of the first line groove substructure 10 extending along the first direction. Simultaneously, the groove structure 100 also includes four line groove sub-sections extending along the second direction, wherein these four line groove sub-sections are obtained by dividing the second line groove structure 20, which extends along the second direction and intersects with the first line groove structure 10, according to the positions of the overlapping regions M1, M2, and M3.

[0109] The four grooved sections are, in order, the first grooved section 210, the second grooved section 220, the third grooved section 230, and the fourth grooved section 240. The first grooved section 210 corresponds to machining paths C1 and C2 (corresponding to machining start point C1 and machining end point C2), the second grooved section 220 corresponds to machining paths C3 and C4 (corresponding to machining start point C3 and machining end point C4), the third grooved section 230 corresponds to machining paths C5 and C6 (corresponding to machining start point C5 and machining end point C6), and the fourth grooved section 240 corresponds to machining paths C7 and C8 (corresponding to machining start point C7 and machining end point C8).

[0110] Since the processing start point or processing end point of each groove sub-section does not coincide, and each groove sub-section does not intersect with any first groove sub-structure 10, the line beam corresponding to each first groove structure 10 and each groove sub-section can be directly used to process them separately, and the groove sub-structures and groove sub-sections processed according to all groove processing paths are used to form the groove structure 100 required as a whole.

[0111] Specifically, such as Figure 8As shown, in the process of planning multiple line groove substructures based on the processing information of the groove structure 100, the processing path of each line groove substructure can be planned according to the extension direction of each line groove substructure, and the continuity of each line groove substructure at the overlapping area is preserved.

[0112] In this example, the groove structure 100 specifically includes three complete machining paths A1B1 (corresponding to machining start point A1 and machining end point B1), A2B2 (corresponding to machining start point A2 and machining end point B2), and A3B3 (corresponding to machining start point A3 and machining end point B3) of the first line groove substructure 10 extending along the first direction, and also includes a complete machining path C1C8 (corresponding to machining start point C1 and machining end point C8) of the second line groove mechanism 20 extending along the second direction and intersecting with the first line groove structure 10.

[0113] The second groove structure 20 and the first groove structure 10 form overlapping areas M1 (extending line segments C2 and C3 along the second direction), M2 (extending line segments C4 and C5 along the second direction), and M3 (extending line segments C6 and C7 along the second direction). During laser processing using line beams corresponding to each groove, the three line beams corresponding to the first groove structure 10 are sequentially processed along their respective processing paths A1B1, A2B2, and A3B3. When a line beam corresponding to the second groove structure 20 scans along processing path C1C8, the beam control component 122 causes the line beam to perform laser skip-scan scanning processing on the overlapping areas M1, M2, and M3.

[0114] Specifically, the laser energy that should have been applied to the C2C3, C4C5, and C6C7 sections is reduced to zero through the beam control system. For example, the line beam is controlled by the beam control component 122 so that the laser pulse emitted by the line beam corresponding to the overlapping area is quickly shut off. Alternatively, the laser pulse emitted by the line beam corresponding to the overlapping area is deflected to another position during transmission through the beam control system so that it is not applied to the overlapping area. In this way, the line groove substructures corresponding to all the line groove processing paths are obtained, and finally the desired groove structure 100 is obtained.

[0115] Thus, by using at least one of the above two processing methods to process the required groove structure 100, it is possible to ensure that the laser energy applied to each processing position of the groove structure matches the laser energy required at that position, avoiding excessive energy accumulation in overlapping areas that could lead to over-processing. This is beneficial for improving the flatness of the bottom wall morphology of the groove structure and enhancing the processing quality of the groove structure.

[0116] It should be noted that in the processing method where the processing areas of each slot substructure on the circuit board do not overlap, the processing is directly controlled by the beam deflection component 121. When the beam deflection component 121 is a galvanometer or a rotating mirror, since the method of controlling the laser beam deflection by the galvanometer or rotating mirror is a mechanical motion, acceleration and deceleration need to be performed before and after the continuous deflection of the laser pulse controlled by the galvanometer or rotating mirror. Therefore, there is a certain delay (generally tens of microseconds), which may result in an error of 20-50μm between the starting and ending positions of the processing path of the slot substructure. This error will cause a slight gap between the segmented slots and the overlapping area on both sides, resulting in insufficient processing in a small area, or slight overlap between the segmented slots and the overlapping area, resulting in over-processing in a small area, which will have a certain adverse effect on the final slot structure processing quality or processing accuracy.

[0117] In the processing method where at least two slotted substructures form an overlapping area on the circuit board, the beam control component 122 (such as AOD or AOM) can adjust the laser pulse very quickly and the control accuracy can reach one laser pulse with virtually no delay. This makes the "skip-grid processing" accuracy of the slotted substructure in the overlapping area very high (for example, at least on the order of 5μm). As a result, the distance between the slots on both sides of the overlapping area and the overlapping area is close to zero. That is, the bottom walls of each slot passing through the overlapping area are more continuous and flat, resulting in a higher processing quality for the final slot structure.

[0118] Under reasonable conditions, it should be understood that although the steps in the flowcharts of the foregoing embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in each flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0119] like Figure 9 As shown, Figure 9This is a schematic diagram of the internal structure of a controller 14 provided for an embodiment of this disclosure. Specifically, the controller 14 may include: a processor 141, a memory 142, and a computer program stored in the memory 142 and executable on the processor 141, such as a processing program for a laser grooving method based on ultrashort pulse lasers. When the processor 141 executes the computer program, it implements the steps in the laser grooving method of any of the above embodiments, for example... Figure 2 Steps S11 to S13 are shown.

[0120] The computer program can be divided into one or more modules / units, which are stored in the memory 142 and executed by the processor 141 to perform the laser grooving processing method of any of the above embodiments. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of the computer program in the controller 14.

[0121] Those skilled in the art will understand that Figure 9 This is merely an example of controller 14 and does not constitute a limitation on controller 14. It may include more or fewer components than shown, or combine certain components, or different components. For example, controller 14 may also include input / output devices, network access devices, buses, etc.

[0122] The processor 141 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0123] The memory 142 can be an internal storage unit of the controller 14, such as a hard disk or RAM of the controller 14. The memory 142 can also be an external storage device of the controller 14, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the controller 14. Furthermore, the memory 142 can include both internal storage units and external storage devices of the controller 14. The memory 142 is used to store the computer program and other programs and data required by the controller 14. The memory 142 can also be used to temporarily store data that has been output or will be output.

[0124] It should be noted that, for the sake of convenience and brevity, the structure of the controller 14 described above can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.

[0125] Furthermore, embodiments of this disclosure also provide a circuit board having a groove structure processed using the aforementioned processing method or using the aforementioned processing equipment.

[0126] The laser grooving method based on ultrashort pulse lasers provided in the embodiments of this disclosure can improve the processing efficiency and accuracy of the groove structure, and significantly reduce the burden of processing data. Furthermore, by performing special processing on the overlapping areas of the multiple grooves that make up the groove structure, repeated processing of the overlapping areas can be avoided, which is beneficial to improving the flatness of the groove structure morphology and processing quality. More detailed information regarding the special processing of the overlapping areas of the grooves can be found in the foregoing related content, and will not be repeated here.

[0127] Preferably, in a specific embodiment of this disclosure, a conductive portion is provided within the groove structure, serving as a heat dissipation component on the circuit board to improve the heat dissipation efficiency of the circuit board. Exemplarily, the methods for providing the conductive portion within the groove structure include, but are not limited to, deposition, pressing, etc. The conductive portion includes, but is not limited to, an electroplated copper layer. It is understood that the electroplated copper layer can be achieved using existing electroplating techniques, which will not be elaborated upon here.

[0128] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0129] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.

[0130] In the embodiments provided in this application, it should be understood that the disclosed devices / controllers and methods can be implemented in other ways. For example, the device / controller embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0131] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0132] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.

[0133] Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electrical carrier signals and telecommunication signals.

[0134] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser grooving method based on ultrashort pulse laser, characterized in that, A laser grooving device is used to process groove structures on a circuit board. The laser grooving device includes a laser, a beam deflection assembly, an acousto-optic modulator, and a controller. The groove structure is a blind groove. The processing method includes: Based on the processing information of the groove structure, multiple groove substructures are planned, and groove processing parameters corresponding to each groove substructure are obtained. All groove substructures constitute the groove structure, and at least two groove substructures form an overlapping area on the circuit board. The groove processing parameters include at least the groove processing path and the groove width. The laser provides an ultrashort pulse laser beam with a pulse width less than or equal to nanoseconds. The ultrashort pulse laser beam is modulated to form a line beam group. The laser parameters of each line beam in the line beam group are matched with the groove processing parameters of one of the groove substructures. When modulating the ultrashort pulse laser beam provided by the laser to form each line beam, the beam path of the line beam is first determined. The beam deflection component controls the ultrashort pulse laser to continuously and uniformly deflect along the beam path. The beam path coincides with the matching groove processing path. When multiple laser pulses emitted sequentially by the laser form light spots that overlap along a continuous line direction on the processing plane of the circuit board, a line beam with a continuous strip-shaped laser energy distribution is formed on the circuit board. The laser parameters of each line beam include the beam width, and the ratio between the beam width and the matching groove width is greater than or equal to 1 and less than or equal to 1.

15. Processing is performed on the circuit board in the processing area corresponding to each of the slotted substructures using the line beams that match each of the slotted substructures. For a group of slotted substructures forming the same overlapping area, the overlapping area is continuously scanned using the line beam matching one of the slotted substructures, and the overlapping area is then scanned using a target line beam, which is the line beam matching the remaining slotted substructures in the group. The step of scanning the overlapping area using the target line beam includes: along the beam path of the target line beam, while the controller controls the beam deflection component to continuously deflect the laser pulses constituting the line beam along the beam path direction, the controller simultaneously controls the acousto-optic modulator to rapidly shut down and quickly restart the laser pulse emission corresponding to the overlapping area in the laser pulses constituting the line beam, so that the ultrashort pulse laser beam forming the target line beam only acts on areas outside the overlapping area, ensuring that the skip processing accuracy of the slotted substructure in the overlapping area reaches at least 5 μm.

2. The processing method according to claim 1, characterized in that, The control of the ultrashort pulse laser beam forming line beam group includes: The line beam group is formed by adjusting at least one of the repetition frequency, the velocity of the ultrashort pulse laser beam, and the spot size parameter of the ultrashort pulse laser beam.

3. The processing method according to claim 1, characterized in that, The machining parameters for the wire groove also include the wire groove depth; wherein... When the groove processing parameters include the groove depth, the laser parameters of the line beam include the number of beam processing operations that match the groove depth.

4. The processing method according to claim 1, characterized in that, The control of the ultrashort pulse laser beam to form a line beam includes: The ultrashort pulse laser beam is shaped into a flat-top pulse laser beam; The flat-top pulsed laser beam is modulated to form the line beam.

5. A laser grooving processing device, characterized in that, The laser grooving equipment, used for grooving circuit boards, includes a laser, a beam control system, a processing platform, and a controller; wherein... The laser is used to provide an ultrashort pulse laser beam under the control of the controller; The beam control system is used to control the ultrashort pulse laser beam to form a line beam group under the control of the controller. The beam control system includes a beam deflection component and an acousto-optic modulator. The beam deflection component, under the control of the controller, controls the continuous uniform deflection of the ultrashort pulse laser beam to form any line beam in the line beam group. When multiple laser pulses emitted sequentially by the laser form light spots that overlap along a continuous line direction on the processing plane of the circuit board, a line beam with a continuous strip-shaped laser energy distribution is formed on the circuit board. The acousto-optic modulator, under the control of the controller, uses a high-speed electrical signal control method to rapidly start and stop and / or rapidly deflect the ultrashort pulse laser beam to control the line beam to perform skip-grid scanning. The processing platform is used to carry the circuit board and move the circuit board under the control of the controller; The controller is configured with a slot structure processing mode. When the slot structure processing mode is enabled, the processing method described in any one of claims 1-4 is executed to perform slot processing on the circuit board.

6. The laser grooving processing equipment according to claim 5, characterized in that, The beam deflection component includes: At least one of the galvanometer and the rotating mirror is used to mechanically control the continuous deflection of the ultrashort pulse laser beam under the control of the controller. And / or, An acousto-optic deflector is used to continuously deflect the ultrashort pulse laser beam under the control of the controller using a high-speed electrical signal control method.

7. The laser grooving processing equipment according to any one of claims 5 or 6, characterized in that, The beam manipulation system also includes: A shaping component, positioned between the laser and the beam deflection assembly, is used to shape the received ultrashort pulse laser beam from a Gaussian shape to a flat-top shape under the control of the controller and then emit it to the beam deflection assembly.

8. A circuit board, characterized in that, The circuit board includes a groove structure, which is processed using the processing method according to any one of claims 1-4 or the laser grooving processing equipment according to any one of claims 5-7.

9. The circuit board according to claim 8, characterized in that, The groove structure is equipped with a conductive part.

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