An optical module assembly system

Abstract

The application discloses an optical module assembly system, comprising a sticking control unit, which is used for judging a sticking stage according to a real-time sticking position, performing sticking control calculation based on the sticking stage and sticking time, and obtaining a sticking control calculation result; a tape sticking unit, which is used for outputting a sticking speed and a sticking pressure corresponding to the sticking control calculation result according to the sticking control calculation result; the sticking stage comprises an initial contact stage, a main sticking stage and a finishing pressure maintaining stage; in the initial contact stage, a speed curve of exponential growth and a hyperbolic tangent pressure curve are used to realize soft and stable contact of a sticking head and an optical module assembly. In the main sticking stage, a speed fluctuation term and a pressure multi-parameter feedback control are introduced to dynamically adapt to unevenness of a tape surface or material change. In the finishing pressure maintaining stage, a linearly decaying speed control and a pressure decay curve are used to maintain minimum pressure at the end of sticking, so that tape rebound or false sticking is improved.

Description

Technical Field

[0001] This invention relates to the field of optical module processing technology, and in particular to an optical module assembly system. Background Technology

[0002] Currently, most mainstream planar tape laminating machines used in optical module production on the market use traditional PLCs (Programmable Logic Controllers) as the core control unit, responsible for regulating process parameters and managing equipment operation. In terms of specific control strategies, the vast majority of equipment still employs the classic PID control mode to adjust key process parameters. PID control, by real-time acquisition of the deviation between the actual parameter value and the preset target value, outputs an adjustment signal after proportional, integral, and derivative calculations, achieving closed-loop stable control of a single parameter, and has a mature application foundation in conventional industrial scenarios.

[0003] However, the adjustment logic of this control mode is limited to the correction of deviation of a single parameter. During the bonding process of the optical module, if the pressure is too high and the speed is too fast, it is easy to cause damage to the precision components of the optical module or the tape to be stretched and shifted. If the pressure is insufficient and the speed is too slow, it will cause the tape to be poorly bonded. Summary of the Invention

[0004] Therefore, in order to overcome the above-mentioned shortcomings, the present invention provides an optical module assembly system, comprising: The data acquisition unit is used to obtain the real-time attachment position and record the attachment time. The attachment control unit is used to determine the attachment stage based on the real-time attachment position, perform attachment control calculations based on the attachment stage and attachment time, and obtain the attachment control calculation results. The tape application unit is used to output the application speed and application pressure corresponding to the application control calculation result based on the application control calculation result; The attachment stage includes: the initial contact stage, the main body attachment stage, and the final pressure holding stage; The method for calculating adhesion control based on the adhesion stage and adhesion time includes: The attachment control calculation during the initial contact phase is performed as follows: ; ; in, v t The application speed is measured in millimeters per second. v 0 The initial target velocity is expressed in millimeters per second. F t The initial real-time attachment pressure is expressed in Newtons. F 0The initial stage target pressure is expressed in Newtons. τ F This is the pressure-time constant, expressed in seconds. τ v The velocity-time constant is expressed in seconds. t The attachment time is in seconds; The calculation method for attachment control during the main body attachment stage is as follows: ; ; in, v 1 The target bonding speed during the main body bonding stage is expressed in millimeters per second. Δv The velocity fluctuation range is expressed in millimeters per second. A Surface adaptability coefficient; f The periodic frequency of the speed adjustment during the main body attachment stage, measured in Hertz; k p This is the time-varying proportionality coefficient; α This is the speed weighting coefficient; β For strain weighting coefficients; ε 0 represents the target strain rate of the tape; ε t This refers to the real-time strain rate of the tape. k i The integral coefficient; This is the integral term for the error; This represents the rate of change of the tape strain. e ( τ ) is the error function; dτ For time differentiation; k d These are the differential coefficients; The calculation method for adhesion control during the final pressure holding stage is as follows: ; ; in, v 2 The target bonding speed during the final pressure holding stage is expressed in millimeters per second. t 0 represents the start time of the final pressure holding phase, in seconds; t e This is the end time of the final pressure holding phase, in seconds. n The pressure decay index; F h The minimum holding pressure at the end of attachment, in Newtons; F max This represents the maximum pressure at the start of the final pressure holding phase.

[0005] This invention acquires position and time information in real time through a data acquisition unit. The attachment control unit dynamically calculates speed and pressure parameters based on the attachment stage. In the initial contact stage, an exponentially increasing speed curve and a hyperbolic tangent pressure curve ensure smooth and stable contact between the attachment head and the optical module assembly, preventing damage to precision components or tape stretching / misalignment due to excessive pressure or speed. In the main attachment stage, speed fluctuation terms and multi-parameter pressure feedback control are introduced to dynamically adapt to uneven tape surfaces or material changes, reducing tape strain fluctuations. In the final pressure holding stage, linearly decaying speed control and a pressure decay curve maintain minimum pressure at the end of attachment to improve tape rebound or incomplete adhesion.

[0006] Furthermore, the tape application unit includes a tape application module, which includes: Tape application mechanism; The third power unit drives the tape application mechanism to move vertically. The second power unit drives the tape application mechanism to move longitudinally in a linear motion. The first power unit drives the tape application mechanism to move laterally in a linear motion.

[0007] The tape application unit drives the tape application mechanism to achieve horizontal, vertical, and linear movements through the first power unit, the second power unit, and the third power unit, respectively. The position of the application mechanism can be adjusted in three directions according to the application requirements of the optical module.

[0008] Furthermore, the tape application unit also includes a conveying module, which is disposed below the tape application module; The conveying module includes: The conveyor drives the linear movement of the PCB. A blocking mechanism is installed on the conveyor and is located on the front and rear sides of the conveyor belt attaching station. The blocking mechanism blocks the movement of PCBs on the conveyor.

[0009] The conveyor can drive the linear movement of the PCB, realizing the automatic flow of the PCB between different workstations and reducing the intervention of manual handling and positioning. The blocking mechanism can temporarily block the PCB, and the restriction can be released after the attachment is completed, so that the PCB can continue to flow with the conveyor to the next process. This realizes the seamless connection between PCB conveying and attachment processes in optical module assembly, improves the continuity and automation of production, and reduces the intensity of manual operation and error risk.

[0010] Furthermore, the blocking mechanism includes: Fourth power unit; The stop block is located above the conveyor and is driven to move vertically by a fourth power device.

[0011] When the PCB is transported to the mounting station, the stop can descend to a preset height to block the PCB from moving forward; after mounting is completed, the stop can rise above the conveyor to avoid interfering with the subsequent transport of the PCB.

[0012] Furthermore, the conveying module may also include a first lifting mechanism, which is disposed on the inner lower side of the conveying mechanism, and the first lifting mechanism includes: Fifth power unit; The lifting plate is driven to move vertically by the fifth power device.

[0013] The first lifting mechanism drives the lifting plate to move vertically through the fifth power unit. When the PCB is in the bonding station, it can rise from the inside and below the conveyor mechanism to support the bottom of the PCB, provide a working plane for the tape bonding mechanism, and lift the PCB upward to reduce the impact of conveyor belt friction or vibration on tape bonding.

[0014] Furthermore, the conveying module also includes: PCB temporary storage station, which is located at the tail end of the conveyor; A support block is installed at the bottom of the PCB temporary storage station and is rotatably connected to the conveyor. Elastic elements are installed on the shaft of the support block and the conveyor. The second lifting mechanism is located at the bottom of the PCB temporary storage station and inside the conveyor.

[0015] Furthermore, the second lifting mechanism includes: Sixth power unit; The lifting block is driven to move vertically by the sixth power device.

[0016] When the second lifting mechanism lifts the PCB upwards, the PCB squeezes the carrier block, causing it to rotate upwards. When the PCB is fully in the temporary storage station, the carrier block returns to its original position under the rebound action of the elastic element. At this time, the PCB is stored in the temporary storage station, which can realize the temporary storage of PCBs that have been tape-applied, improving the continuity and efficiency of the overall production.

[0017] Furthermore, the first lifting mechanism is provided in two sets, and the tape attaching unit further includes a PCB flipping module, which is disposed between the two sets of the first lifting mechanism. The PCB flipping mechanism includes: A clamp, used to hold or release the PCB; The eleventh power unit drives the gripper to rotate 180°. The tenth power unit drives the clamp to move vertically.

[0018] After the first lifting mechanism of the first group supports the PCB and completes the first side attachment, the tenth power unit drives the clamp to rise and hold the PCB. The eleventh power unit drives the clamp to precisely rotate 180°, and then the second lifting mechanism of the second group takes over and completes the second side attachment, which improves the automation level of double-sided attachment.

[0019] Furthermore, the tape application unit also includes: A PCB storage station, in which a predetermined number of PCBs are stacked; The transfer module transfers PCBs from the PCB storage station to the conveying module via this transfer station.

[0020] The transfer module automatically transfers the stacked PCBs in the PCB storage station to the conveying module, realizing the automated connection of storage, transfer and conveying, and improving production efficiency.

[0021] The present invention has the following advantages: This invention acquires position and time information in real time through a data acquisition unit. The attachment control unit dynamically calculates speed and pressure parameters based on the attachment stage. In the initial contact stage, an exponentially increasing speed curve and a hyperbolic tangent pressure curve ensure smooth and stable contact between the attachment head and the optical module assembly, preventing damage to precision components or tape stretching / misalignment due to excessive pressure or speed. In the main attachment stage, a speed fluctuation term and multi-parameter pressure feedback control (based on speed deviation, tape strain rate error, and their integral and differential terms) are introduced to dynamically adapt to uneven tape surfaces or material changes, reducing tape strain fluctuations. In the final pressure holding stage, linearly decaying speed control and a pressure decay curve maintain minimum pressure at the end of attachment to improve tape rebound or incomplete adhesion. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the logical structure of the assembly system; Figure 2 yes Figure 1 The diagram shows the structure of the tape application unit. Figure 3 yes Figure 2 A side view of the tape application unit shown; Figure 4 yes Figure 3 The diagram shows the structure of the PCB storage station in the tape application unit. Figure 5 yes Figure 4 A cross-sectional view of the PCB storage station shown; Figure 6 yes Figure 4 The diagram shows the structure of the movable limit mechanism in the PCB storage station. Figure 7 yes Figure 1 The diagram shows the structure of the conveying module in the tape application unit. Figure 8 yes Figure 7 A schematic diagram of the blocking mechanism in the conveying module is shown. Figure 9 yes Figure 7 A schematic diagram of the first lifting mechanism in the conveying module shown; Figure 10 yes Figure 7 A schematic diagram of the second lifting mechanism in the conveying module shown; Figure 11 yes Figure 3 The diagram shows the structure of the PCB flipping module in the tape application unit. Figure 12 yes Figure 3 The diagram shows the structure of the transfer module in the tape application unit. Figure 13 yes Figure 1 The diagram shows the structure of the tape application module in the tape application unit. In the picture: 10. Data acquisition unit; 20. Adhesive application control unit; 30. Tape application unit; 40. Material database; 100. Workbench; 200. Tape application module; 210. First power unit; 220. Second power unit; 230. Third power unit; 240. Tape application mechanism; 300. Conveying module; 310. Conveyor; 320. PCB temporary storage station; 330. Blocking mechanism; 331. Stop block; 332. Fourth power unit; 340. First lifting mechanism; 341. Lifting plate; 342. Fifth power unit; 350. Second lifting mechanism; 351. Sixth power unit; 352. Lifting block; 360. Bearing block; 400. Transfer module; 410. Seventh power unit; 420. Slide table; 430. Eighth power unit; 440. Vacuum suction cup; 500. PCB storage station; 510. Side limiting frame; 520. Movable limiting mechanism; 521. Movable limiting frame; 522. Adjusting screw; 523. Fixed table; 530. Bearing plate; 540. Ninth power unit; 550. First lead screw; 600, PCB flip-up module; 610, tenth power unit; 620, frame; 630, carriage; 640, eleventh power unit; 650, clamp; 660, second lead screw. Detailed Implementation

[0023] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0024] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0025] As described in the background section, the adjustment logic of the control mode is limited to the correction of deviation of a single parameter. However, during the bonding process of the optical module, if the pressure is too high and the speed is too fast, it is easy to cause damage to the precision components of the optical module or the tape to be stretched and shifted. If the pressure is insufficient and the speed is too slow, it will cause the tape to be poorly bonded.

[0026] Example 1: Therefore, in order to solve the above-mentioned technical problems existing in the prior art, this embodiment provides an optical module assembly system, including: Data acquisition unit 10 is used to acquire the real-time attachment position and record the attachment time; The attachment control unit 20 is used to determine the attachment stage based on the real-time attachment position, perform attachment control calculations based on the attachment stage and attachment time, and obtain the attachment control calculation results. The tape application unit 40 is used to output the application speed and application pressure corresponding to the application control calculation result based on the application control calculation result. The attachment stage includes: the initial contact stage, the main body attachment stage, and the final pressure holding stage; The method for calculating adhesion control based on the adhesion stage and adhesion time includes: The attachment control calculation during the initial contact phase is performed as follows: ; ; in, v t The application speed is measured in millimeters per second. v 0 The initial target velocity is expressed in millimeters per second. F t The initial real-time attachment pressure is expressed in Newtons. F 0 The initial stage target pressure is expressed in Newtons. τ F This is the pressure-time constant, expressed in seconds. τ v The velocity-time constant is expressed in seconds. t The attachment time is in seconds; The calculation method for attachment control during the main body attachment stage is as follows: ; ; in, v 1 The target bonding speed during the main body bonding stage is expressed in millimeters per second. Δv The velocity fluctuation range is expressed in millimeters per second. A Surface adaptability coefficient; f The periodic frequency of the speed adjustment during the main body attachment stage, measured in Hertz; k p This is the time-varying proportionality coefficient; α This is the speed weighting coefficient; β For strain weighting coefficients; ε 0 represents the target strain rate of the tape; ε t This refers to the real-time strain rate of the tape. k i The integral coefficient; This is the integral term for the error; This represents the rate of change of the tape strain. e ( τ ) is the error function; dτ For time differentiation; k d These are the differential coefficients; The calculation method for adhesion control during the final pressure holding stage is as follows: ; ; in, v 2 The target bonding speed during the final pressure holding stage is expressed in millimeters per second. t 0 represents the start time of the final pressure holding phase, in seconds;t e This is the end time of the final pressure holding phase, in seconds. n The pressure decay index; F h The minimum holding pressure at the end of attachment, in Newtons; F max This represents the maximum pressure at the start of the final pressure holding phase.

[0027] Specifically, the method for determining the attachment stage based on the real-time attachment position is as follows: ; in, H This represents the percentage of the application progress. p t For real-time attachment position; p 0 To determine the starting position for attachment; p 1 The center point is attached.

[0028] when H When the percentage is less than or equal to 10%, the current attachment stage is the initial contact stage; when... H When the percentage is greater than 10% and less than or equal to 90%, the current attachment stage is the topic attachment stage; when... H When the adhesion rate is greater than 90%, the current adhesion stage is the final pressure holding stage.

[0029] It should be noted that, in this embodiment, the... exp The natural exponential function has a base that is a mathematical constant. e The k p , k i , k d The PID control parameters are determined by the material of the tape. In this embodiment, the assembly system may further include a material database 30, which stores information on tape materials and their properties. k p , k i , k d The corresponding parameter table allows the attachment control unit to retrieve the appropriate parameter from the material database based on the actual tape material. k p , k i , k d Parameters. Furthermore, in this embodiment, the speed fluctuation amplitude is the difference between the real-time attachment speed and the target attachment speed during the subject attachment stage.

[0030] In addition, in this embodiment, the error function is calculated as follows: ; This embodiment acquires position and time information in real time through a data acquisition unit. The attachment control unit dynamically calculates speed and pressure parameters based on the attachment stage. In the initial contact stage, an exponentially increasing speed curve and a hyperbolic tangent pressure curve ensure smooth and stable contact between the attachment head and the optical module assembly, preventing damage to precision components or tape stretching / misalignment due to excessive pressure or speed. In the main attachment stage, speed fluctuation terms and multi-parameter pressure feedback control (based on speed deviation, tape strain rate error, and their integral and derivative terms) are introduced to dynamically adapt to uneven tape surfaces or material changes, reducing tape strain fluctuations. In the final pressure holding stage, linearly decaying speed control and a pressure decay curve maintain minimum pressure at the end of attachment to improve tape rebound or incomplete adhesion.

[0031] like Figure 2 As shown, the tape application unit includes a tape application module 200, such as... Figure 13 As shown, the tape application module includes: Tape application mechanism 240; The third power unit 230 drives the tape application mechanism to move vertically. The second power unit 220 drives the tape application mechanism to move longitudinally in a linear motion. The first power unit 210 drives the tape application mechanism to move laterally in a linear motion.

[0032] Specifically, the first, second, and third power devices include, but are not limited to, cylinders, electric cylinders, hydraulic cylinders, or other devices capable of achieving linear movement of components. For example, in this embodiment, the conveying tape application unit further includes a worktable 100, on which the tape application mechanism can be fixedly mounted. Specifically, the first power device can be fixedly mounted on the worktable, the second power device can be connected to the first power device via a slide table, and the third power device can be connected to the second power device via a slide table. The tape application mechanism is connected to the third power device and slides in cooperation with the slide table. The tape application unit drives the tape application mechanism to achieve horizontal, vertical, and linear movements respectively through the first, second, and third power devices, and the position of the application mechanism can be adjusted in three directions according to the application requirements of the optical module.

[0033] In this embodiment, as Figure 2 As shown, the tape application unit also includes a conveying module 300, which is disposed below the tape application module; like Figure 7As shown, the conveying module includes: Conveyor 310 drives the linear motion of the PCB. A blocking mechanism 330 is installed on the conveyor and is located on the front and rear sides of the conveyor belt attaching station. The blocking mechanism blocks the movement of the PCB on the conveyor.

[0034] Specifically, the conveyor is fixedly installed on the workbench, and can be used as follows: Figure 7 The aforementioned dual-belt conveyor supports the PCB by having two sets of parallel belts contacting the bottom edge of the PCB. The conveyor drives the PCB in linear motion, enabling automatic transfer of the PCB between different workstations and reducing manual handling and positioning interventions. A blocking mechanism can temporarily obstruct the PCB; once attachment is complete, the restriction is lifted, allowing the PCB to continue its journey with the conveyor to the next process. This achieves seamless integration of PCB transport and attachment processes in optical module assembly, improving production continuity and automation while reducing the intensity of manual operation and the risk of errors.

[0035] For example, such as Figure 8 As shown, the blocking mechanism includes: Fourth power unit 332; Stop 331 is positioned above the conveyor and is driven to move vertically by a fourth power device.

[0036] Specifically, the fourth power unit can be a pneumatic cylinder, an electric cylinder, a hydraulic cylinder, or other devices that can achieve linear movement of components. When the PCB is transported to the bonding station, the stop can be lowered to a preset height to block the PCB from moving forward. After bonding is completed, the stop can be raised above the conveyor to avoid interfering with the subsequent transport of the PCB.

[0037] like Figure 7 As shown, the fourth power unit can be installed on the outside of the conveyor, with one side of the stop block connected to the fourth power unit and the other side extending above the conveyor belt.

[0038] like Figure 7 As shown, the conveying module may further include a first lifting mechanism 340, which is disposed on the inner lower side of the conveying mechanism, such as... Figure 9 As shown, the first lifting mechanism includes: Fifth power unit 342; The lifting plate 341 is driven to move vertically through the fifth power device.

[0039] Specifically, the fifth power unit can be selected from pneumatic cylinders, electric cylinders, hydraulic cylinders, or other devices capable of achieving linear movement of components. This fifth power unit is fixedly mounted on the conveyor frame, and the lifting plate is connected to the fifth power unit. By driving the lifting plate to move vertically linearly through the fifth power unit, it can rise from the inside and below the conveyor mechanism when the PCB is in the bonding position, providing support for the bottom of the PCB, providing a working plane for the tape bonding mechanism, and lifting the PCB upwards, reducing the impact of conveyor belt friction or vibration on tape bonding.

[0040] In this embodiment, as Figure 7 As shown, the conveying module further includes: PCB temporary storage station 320 is located at the tail end of the conveyor. The support block 360 is set at the bottom of the PCB temporary storage station and is rotatably connected to the conveyor. Elastic elements are installed on the shaft of the support block and the conveyor. The second lifting mechanism 350 is located at the bottom of the PCB temporary storage station and is positioned inside the conveyor.

[0041] like Figure 10 As shown, the second lifting mechanism includes: Sixth power unit 351; The lifting block 352 is driven to move vertically through the sixth power device.

[0042] In this embodiment, the sixth power device can be selected from cylinders, electric cylinders, hydraulic cylinders, or other devices capable of achieving linear movement of components, such as... Figure 7 As shown, the sixth power unit can be installed on the frame inside the conveyor. The lifting block is connected to the sixth power unit, which drives the lifting block to move vertically. When the second lifting mechanism lifts the PCB upward, the PCB squeezes the carrier block, causing it to rotate upward. When the PCB is fully in the temporary storage position, the carrier block returns to its original position under the rebound action of the elastic element. At this time, the PCB is stored in the temporary storage position, which can realize the temporary storage of PCBs that have been tape-applied, improving the continuity and efficiency of the overall production.

[0043] In this embodiment, the first lifting mechanism is provided in two sets, and the tape attaching unit further includes a PCB flipping module 600, which is disposed between the two sets of the first lifting mechanism, such as... Figure 11 As shown, the PCB flipping mechanism includes: Clamp 650, used to clamp or release the PCB; The eleventh power unit 640 drives the gripper to rotate 180°. The tenth power unit 610 drives the clamp to move vertically.

[0044] Specifically, the eleventh power unit can be a motor, a rotary cylinder, or other device capable of driving the gripper to rotate, and the tenth power unit can be a motor, a rotary cylinder, or other device capable of driving the components to rotate. In addition, the PCB flipping mechanism may also include: The frame 620 is fixedly installed on the frame of the conveyor, and the tenth power unit is fixedly installed at the bottom of the frame; The second lead screw 660 is rotatably mounted on the frame and is connected to the tenth power unit. The slide 630 is slidably fitted with the frame and threadedly connected to the lead screw, and the eleventh power unit is mounted on the slide.

[0045] After the first lifting mechanism of the current group supports the PCB and completes the first side attachment, the tenth power unit drives the clamp to rise and hold the PCB, and the eleventh power unit drives the clamp to precisely rotate 180°, and then the next first lifting mechanism takes over and completes the second side attachment, which improves the automation level of double-sided attachment.

[0046] In this embodiment, as Figure 3 As shown, the tape application unit may further include: PCB storage station 500, in which a preset number of PCBs are stacked; The transfer module 400 transfers the PCBs in the PCB storage station to the conveying module through the transfer station.

[0047] The transfer module automatically transfers the stacked PCBs in the PCB storage station to the conveying module, realizing the automated connection of storage, transfer and conveying, and improving production efficiency.

[0048] Specifically, such as Figure 4 , 5 As shown, the PCB storage station includes: Side limiting frame 510; The support plate 530 is set inside the side limiting frame; The ninth power unit 540 drives the bearing plate to move vertically. In this embodiment, the ninth power device may be a motor, a rotary cylinder, or other device capable of driving components. The PCB storage station may also include a first lead screw 550, which is connected to the ninth power device and is threadedly connected to the support plate.

[0049] In addition, the PCB storage station may also include a movable limiting mechanism 520, which is disposed on one side of the side limiting frame, such as... Figure 6 As shown, the movable limiting mechanism includes: A fixed platform 523 is fixed to the workbench; The movable limit frame 521 is located on one side of the limit frame and slides in cooperation with the fixed platform. Adjusting screw 522, one end of which is rotatably connected to the movable limit frame, and the adjusting screw is threadedly engaged with the fixed platform.

[0050] like Figure 12 As shown, the transfer module includes: The seventh power unit 410 is fixedly installed on the workbench; The slide 420 is driven to move linearly by the seventh power unit; The eighth power unit 430 is mounted on the slide table; Vacuum suction cup 440 is connected to the eighth power device, which drives the vacuum suction cup to move vertically.

[0051] In this embodiment, the seventh and eighth power devices can be selected as cylinders, electric cylinders, hydraulic cylinders, or other devices capable of realizing linear movement of components.

[0052] Initially, the side limiting frame and movable limiting frame of the PCB storage station form a receiving space. A preset number of PCBs are stacked on the carrier plate. The movable limiting mechanism adjusts the width by adjusting the screw to fit the PCB size. The ninth power unit drives the first lead screw to rotate, causing the carrier plate to move vertically and linearly, maintaining the top of the stacked PCBs at a preset picking height. The seventh power unit moves the slide table above the PCB storage station, and the eighth power unit drives the vacuum suction cup to descend, adsorb the top layer of PCBs, and then rises. The seventh power unit then transfers the PCBs to the conveyor of the conveyor module. The conveyor moves the PCBs linearly towards the tape application station. When the PCBs approach the application station, they are blocked by the fixed stop between the front and back application stations. The fifth power unit on the front application station drives the lifting plate to rise from below the inside of the conveyor, lifting the PCBs and detaching them from the belt surface. The first power unit drives the tape application mechanism to move laterally, the second power unit drives it to move longitudinally, and the third power unit drives it to move vertically. These three power units work together to position the application mechanism in the PCB application area. The tape application mechanism performs the application action, completing the tape application on the first side of the PCB. After the front side is applied, the first lifting mechanism descends and resets, and the PCB falls back onto the conveyor. The tenth power unit drives the second lead screw to rotate, causing the slide and clamp to rise. After the clamp clamps the PCB, the eleventh power unit rotates it 180°. After the rotation, the slide descends, placing the PCB on the first lifting mechanism at the flipping adhesive application station, where the adhesive application operation is performed, completing the front side application. After both sides are applied, the first lifting mechanism descends, the blocking mechanism block at the rear of the application station rises, and the conveyor moves the PCB towards the PCB temporary storage station at the end. The sixth power unit drives the lifting block to rise, lifting the PCB upwards and pressing the support block at the bottom of the temporary storage station to rotate it upwards. Once the PCB has fully entered the temporary storage station, the second lifting mechanism descends, and the support block resets under the action of the elastic element. The PCB is then confined to the temporary storage station, completing the entire tape application process for a single PCB.

[0053] During the above adhesive application process: the data acquisition unit acquires the real-time application position of the optical module tape and records the application time simultaneously; the application control unit calculates the application progress based on the real-time application position and determines the current application stage; based on the application stage and the application time, it calculates the real-time application speed and real-time application pressure; the tape application unit outputs the corresponding speed and pressure parameters based on the real-time application speed and real-time application pressure obtained in step three, and completes the application of the optical module tape.

[0054] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An optical module assembly system, characterized in that, include: The data acquisition unit is used to obtain the real-time attachment position and record the attachment time. The attachment control unit is used to determine the attachment stage based on the real-time attachment position, perform attachment control calculations based on the attachment stage and attachment time, and obtain the attachment control calculation results. The tape application unit is used to output the application speed and application pressure corresponding to the application control calculation result based on the application control calculation result; The attachment stage includes: the initial contact stage, the main body attachment stage, and the final pressure holding stage; The method for calculating adhesion control based on the adhesion stage and adhesion time includes: The attachment control calculation during the initial contact phase is performed as follows: ； ； in, v t The application speed is measured in millimeters per second. v 0 The initial target velocity is expressed in millimeters per second. F t The initial real-time attachment pressure is expressed in Newtons. F 0 The initial stage target pressure is expressed in Newtons. τ F This is the pressure-time constant, expressed in seconds. τ v The velocity-time constant is expressed in seconds. t The attachment time is in seconds; The calculation method for attachment control during the main body attachment stage is as follows: ； ； in, v 1 The target bonding speed during the main body bonding stage is expressed in millimeters per second. Δv The velocity fluctuation range is expressed in millimeters per second. A Surface adaptability coefficient; f The periodic frequency of the speed adjustment during the main body attachment stage, measured in Hertz; k p This is the time-varying proportionality coefficient; α This is the speed weighting coefficient; β For strain weighting coefficients; ε 0 represents the target strain rate of the tape; ε t This refers to the real-time strain rate of the tape. k i The integral coefficient; This is the integral term for the error; This represents the rate of change of the tape strain. e ( τ ) is the error function; d τ For time differentiation; k d These are the differential coefficients; The calculation method for adhesion control during the final pressure holding stage is as follows: ； ； in, v 2 The target bonding speed during the final pressure holding stage is expressed in millimeters per second. t 0 represents the start time of the final pressure holding phase, in seconds; t e This is the end time of the final pressure holding phase, in seconds. n The pressure decay index; F h The minimum holding pressure at the end of attachment, in Newtons; F max This represents the maximum pressure at the start of the final pressure holding phase.

2. The optical module assembly system according to claim 1, characterized in that, The tape application unit includes a tape application module, which includes: Tape application mechanism; The third power unit drives the tape application mechanism to move vertically. The second power unit drives the tape application mechanism to move longitudinally in a linear motion. The first power unit drives the tape application mechanism to move laterally in a linear motion.

3. The optical module assembly system according to claim 2, characterized in that, The tape application unit also includes a conveying module, which is disposed below the tape application module; The conveying module includes: The conveyor drives the linear movement of the PCB. A blocking mechanism is installed on the conveyor and is located on the front and rear sides of the conveyor belt attaching station. The blocking mechanism blocks the movement of PCBs on the conveyor.

4. The optical module assembly system according to claim 3, characterized in that, The blocking mechanism includes: Fourth power unit; The stop block is located above the conveyor and is driven to move vertically by a fourth power device.

5. The optical module assembly system according to claim 3, characterized in that, The conveying module may further include a first lifting mechanism, which is disposed on the inner lower side of the conveying mechanism, and the first lifting mechanism includes: Fifth power unit; The lifting plate is driven to move vertically by the fifth power device.

6. The optical module assembly system according to claim 3, characterized in that, The conveying module also includes: PCB temporary storage station, which is located at the tail end of the conveyor; A support block is installed at the bottom of the PCB temporary storage station and is rotatably connected to the conveyor. Elastic elements are installed on the shaft of the support block and the conveyor. The second lifting mechanism is located at the bottom of the PCB temporary storage station and inside the conveyor.

7. The optical module assembly system according to claim 6, characterized in that, The second lifting mechanism includes: Sixth power unit; The lifting block is driven to move vertically by the sixth power device.

8. The optical module assembly system according to claim 5, characterized in that, The first lifting mechanism has two sets, and the tape attaching unit further includes a PCB flipping module, which is disposed between the two sets of the first lifting mechanism. The PCB flipping module includes: A clamp, used to hold or release the PCB; The eleventh power unit drives the gripper to rotate 180°. The tenth power unit drives the clamp to move vertically.

9. The optical module assembly system according to claim 3, characterized in that, The tape application unit further includes: A PCB storage station, in which a predetermined number of PCBs are stacked; The transfer module transfers PCBs from the PCB storage station to the conveyor module.

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