Rfid electronic tag, method of making and using, article, article overwrap

Abstract

This invention provides an RFID electronic tag, a method for its preparation and use, a product, and product packaging. The RFID electronic tag includes: a support layer, a first coating layer, a second coating layer, an antenna, and a chip. The second coating layer is located on one or both sides of the support layer, and the first coating layer is located between the support layer and the second coating layer. The area of ​​the first coating layer is smaller than the area of ​​the second coating layer. For a single-sided RFID electronic tag, the antenna is located on the surface of the second coating layer away from the support layer. For a double-sided RFID electronic tag, the antennas on both sides are located on the surfaces of the support layer and the second coating layer away from the support layer, respectively, or on the surfaces of the second coating layer and the second coating layer away from the support layer, respectively. The antennas on both sides are interconnected through a bridging point, and the chip is electrically connected to the antenna. This invention solves the problem of poor mechanical strength at the electrical connection points of existing fragile RFID tags, and improves the yield rate in the production process of fragile RFID tags.

Description

Technical Field

[0001] This invention relates to the field of radio frequency and radio frequency tag anti-counterfeiting technology, specifically to an RFID electronic tag, a preparation method and a method of use, a commodity, and commodity packaging. Background Technology

[0002] Radio Frequency Identification (RFID) technology automatically identifies target objects and acquires relevant data through radio frequency signals. Identification requires no human intervention, can operate in various environments, and can identify multiple tags simultaneously, offering quick and convenient operation. Since 2004, RFID technology has experienced rapid development, showing broad application potential in warehousing and logistics, product anti-counterfeiting, product distribution, and product maintenance tracking. In product anti-counterfeiting applications, RFID, with its security, efficiency, speed, large storage capacity, and ability to freely modify stored information, is hailed as the next-generation "electronic guardian."

[0003] Meanwhile, radio frequency identification (RFID) technology, due to the globally unique UID code of its chip, stable information, extremely high imitation cost, ability to store large amounts of information, and simple reading and writing capabilities, allows consumers to easily identify the identity of goods through dedicated identification devices provided by merchants, and can be used to achieve full-process tracking of goods in circulation.

[0004] Traditional fragile RFID tag structures consist of a full-coverage coating on a substrate. These tags are attached to the product using pressure-sensitive adhesive. To achieve transfer, the peel force between the substrate and the coating must be less than the peel force between the adhesive and the product. However, the adhesion between the pressure-sensitive adhesive and the product is usually not very strong, meaning the peel force between the adhesive and the product is already small. Consequently, the peel force between the substrate and the coating is even smaller. This results in a weak peel force between the aluminum foil at the chip bonding point and the substrate. If the aluminum foil at the chip bonding point breaks due to external force, an open circuit is formed between the chip and the antenna. Therefore, this increases the possibility of traditional RFID tag structures failing due to accidents during production and transportation.

[0005] Furthermore, for double-sided electronic tags, such as high-frequency electronic tags or UHF tags with double-sided structures, electrical connections between the two sides require bridging points. However, the lower peel force between the coating and the substrate also makes it easier for open circuits to form at the bridging points. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the purpose of this invention is to provide an RFID electronic tag, a preparation method and a method of use, a product, and product packaging.

[0007] An RFID electronic tag according to the present invention includes a support layer, a first coating layer, a second coating layer, an antenna, and a chip;

[0008] The second coating is located on one or both sides of the support layer, and the first coating is located between the support layer and the second coating. When the RFID electronic tag is a single-sided RFID electronic tag, the antenna is located on the surface of the second coating away from the support layer. When the RFID electronic tag is a double-sided RFID electronic tag, the antennas on both sides are located on the surface of the support layer away from the second coating and the surface of the second coating away from the support layer, or on the surface of the second coating away from the support layer on both sides. The antennas on both sides are interconnected through a bridging point. The chip is electrically connected to the antenna. When the RFID electronic tag is a single-sided RFID electronic tag, the chip and its bonding point with the antenna coincide with the projection of the first coating. When the RFID electronic tag is a double-sided RFID electronic tag, the bonding point and the bridging point coincide with the projection of the first coating.

[0009] The material of the support layer is selected from polymers or paper. The polymer can be PET (polyethylene terephthalate), PP (polypropylene), PVC (polyvinyl chloride), PE (polyethylene) or PC (polycarbonate), etc.; the thickness of the support layer can be between 0.1μm and 1mm.

[0010] The first coating is selected based on the different support layer materials, using materials with high adhesion to the support layer material, such as epoxy resin, acrylic resin, polyurethane, and UV-curable resin. The area of ​​the first coating is smaller than that of the second coating. When the RFID electronic tag is a single-sided RFID electronic tag, the area of ​​the first coating is larger than the area of ​​the bonding point. When the RFID electronic tag is a double-sided RFID electronic tag, the area of ​​the first coating is larger than the area of ​​the bonding point and the bridging point. The thickness of the first coating is 0.1μm to 200μm.

[0011] The second coating is selected based on the different materials of the support layer, and is made of materials with lower adhesion and higher brittleness than the support layer material. However, the material of the second coating must have high adhesion to the first coating, such as PMMA, PS, epoxy resin, acrylic resin, polyurethane, and UV-curable resin. The thickness of the second coating is 0.1μm to 200μm.

[0012] The first coating is a single coating, or two or more discontinuous single coatings;

[0013] The 90-degree peel force F1 between the second coating and the first coating, and the 90-degree peel force F2 between the first coating and the support layer are both greater than the 90-degree peel force F3 between the second coating and the support layer.

[0014] F1≥2N / 25mm&F2≥2N / 25mm&F3<2N / 25mm.

[0015] The antennas include: aluminum etched antennas, copper etched antennas, conductive silver paste printed antennas, conductive polymer printed antennas, chemically plated copper antennas, or vacuum-plated copper or vacuum-plated aluminum antennas.

[0016] The method for preparing an RFID electronic tag with anti-transfer function according to the present invention includes the following steps:

[0017] Step 1: Prepare a first coating layer on the support layer, then prepare a second coating layer covering the entire surface. The area of ​​the first coating layer is smaller than that of the second coating layer. The first and second coating layers can be prepared by methods such as coating or printing.

[0018] Step 2: Fabricate an antenna on the surface of the product from Step 1;

[0019] When the RFID electronic tag is a single-sided RFID electronic tag, the chip bonding point coincides with the projection of the first coating:

[0020] On the surface of the second coating away from the support layer, conductive silver paste or conductive polymer material is directly printed to form a printed antenna.

[0021] or:

[0022] An aluminum or copper foil is bonded to the surface of the second coating away from the support layer with an adhesive, and then an antenna pattern is printed on the aluminum or copper foil. After etching with acid or alkali and deinking treatment, an etched antenna is formed.

[0023] or:

[0024] Conductive material is first printed as a seed layer on the surface of the second coating away from the support layer, and then copper is deposited on the seed layer by chemical deposition to obtain a chemically plated copper antenna.

[0025] or:

[0026] On the surface of the second coating away from the support layer, copper or aluminum is directly vacuum plated through a template to form a vacuum copper-plated antenna or a vacuum aluminum-plated antenna.

[0027] When the RFID electronic tag is a double-sided RFID electronic tag, the chip and its bonding point with the antenna coincide with the projection of the first coating, and the bridging points on both sides of the support layer also coincide with the projection of the first coating:

[0028] Conductive silver paste or conductive polymer material is directly printed on the surface of the support layer away from the second coating layer and the surface of the second coating layer away from the support layer, or on the surfaces of the second coating layer on both sides away from the support layer, to form a printed antenna;

[0029] or:

[0030] Aluminum foil or copper foil is bonded to the surface of the support layer away from the second coating layer and the surface of the second coating layer away from the support layer, or the surfaces of the second coating layer away from the support layer on both sides, by adhesive bonding. Then, an antenna pattern is printed on the aluminum foil or copper foil. After etching and deinking treatment with acid or alkali solution, an etched antenna is formed.

[0031] or:

[0032] Conductive material is first printed as a seed layer on the surface of the support layer away from the second coating layer and the surface of the second coating layer away from the support layer, or on the surfaces of the second coating layer away from the support layer on both sides. Then, copper is deposited on the seed layer by chemical deposition to obtain a chemically plated copper antenna.

[0033] or:

[0034] On the surface of the support layer away from the second coating layer and on the surface of the second coating layer away from the support layer, or on the surfaces of the second coating layer on both sides away from the support layer, copper or aluminum is directly vacuum plated using a template to form a vacuum copper-plated antenna or a vacuum aluminum-plated antenna.

[0035] Step 3: Electrically connect the chip to the antenna to obtain the RFID electronic tag.

[0036] As described above, the RFID electronic tag is a double-sided RFID electronic tag. After the antennas located at the bridge points on both sides of the support layer are connected through the bridge process, the chip is then bonded to the antenna.

[0037] According to a method of using the RFID electronic tag provided by the present invention, an adhesive is coated on any side of the RFID electronic tag and then affixed to the surface of the product or the outer packaging of the product.

[0038] According to the present invention, a commodity or commodity packaging includes the aforementioned RFID electronic tag.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] The RFID tag with anti-transfer function provided by this invention solves the problem of poor mechanical strength at the electrical connection position of existing fragile RFID tags due to the presence of the first coating, thereby improving the yield rate in the production process of fragile RFID tags and reducing the accidental damage rate during the use of existing fragile tags.

[0041] Furthermore, the RFID tag with anti-transfer function provided by the present invention has a single-use performance when the side containing the second coating is attached to the product or its outer packaging. That is, once the anti-transfer RFID tag is attached to the product, it cannot be peeled off or transferred. Once peeled off or transferred, its physical structure is destroyed, and the information it contains cannot be read, thus achieving the purpose of not being able to be used again. Attached Figure Description

[0042] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0043] Figure 1 A schematic diagram of an RFID electronic tag with anti-transfer function;

[0044] Figure 2 A top-view diagram of an RFID electronic tag with anti-transfer functionality;

[0045] Figure 3 A schematic diagram of a double-sided RFID electronic tag with anti-transfer functionality;

[0046] Figure 4 This is a top view of the front and back of a double-sided RFID electronic tag with anti-transfer functionality.

[0047] Figure label:

[0048] Detailed Implementation

[0049] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0050] like Figure 1 and Figure 3 As shown, the RFID electronic tag with anti-transfer function of the present invention consists of a support layer 1, a first coating layer 2, a second coating layer 3, an antenna 4, and a chip 5.

[0051] The second coating 3 is located on one side of the support layer 1, or may be located on both sides of the support layer simultaneously. The first coating 2 is located between the support layer 1 and the second coating 3, and the antenna 4 may be located on the other side of the second coating 3. Figure 3 As shown, if the RFID electronic tag 4 is a double-sided RFID electronic tag, the antenna 4 can be located on the surface of the support layer 1 away from the second coating layer 3 and the surface of the second coating layer 3 away from the support layer 1, or it can be located on the surfaces of the second coating layer 3 on both sides away from the support layer 1. The antennas on both sides are the first part antenna 41 and the second part antenna 42, respectively. The two are interconnected through the bridging point 6. The chip 5 is bonded to the antenna 4. Preferably, the chip 5 is bonded to the antenna 4 with special adhesive. The special adhesive includes, but is not limited to, anisotropic conductive adhesive, isotropic conductive adhesive and non-conductive adhesive.

[0052] When the RFID electronic tag is a single-sided RFID electronic tag, the chip 5 and its bonding point with the antenna 4 coincide with the projection of the first coating 2. When the RFID electronic tag is a double-sided RFID electronic tag, the bonding point and the bridging point 6 coincide with the projection of the first coating 2. That is, the chip 5 and its bonding point with the antenna 4 and the bridging point 6 can be completely projected onto the first coating 2.

[0053] Conductive adhesives can be conductive thermosetting resins, such as NAMICS XH9850, UNINWELL 6998, Tri-Bond TB3373C, or Delo MONOPOX AC268, or other commonly used conductive thermosetting resins. They are generally epoxy resins doped with metal particles, and there are no special requirements.

[0054] The material of the support layer 1 is selected from polymers or paper. The polymer can be PET (polyethylene terephthalate), PP (polypropylene), PVC (polyvinyl chloride), PE (polyethylene), or PC (polycarbonate), etc. The thickness of the support layer 1 can be between 0.1 μm and 1 mm.

[0055] The first coating 2 is selected based on the material of the support layer 1, using a material with high adhesion to the support layer 1, such as epoxy resin, acrylic resin, polyurethane, or UV-curable resin. The area of ​​the first coating 2 is smaller than that of the second coating 3. When the RFID tag is a single-sided RFID tag, the area of ​​the first coating 2 is larger than the area of ​​the bonding point. When the RFID tag is a double-sided RFID tag, the area of ​​the first coating 2 is larger than the area of ​​the bonding point and the bridging point 6, meaning that the projection of the bonding point and the bridging point 6 onto the tag can be completely inside the first coating 2. Furthermore, the first coating 2 is located below the bonding point and the bridging point 6 of the chip 5. The thickness of the first coating 2 is 0.1 μm to 200 μm. Preferably, the thickness of the first coating 2 is 1 μm to 40 μm.

[0056] The first coating 2 can be prepared by coating, printing, etc.; the second coating 3 is selected based on the material of the support layer 1, using a material with lower adhesion and higher brittleness, but at the same time, the material of the second coating 3 must have high adhesion to the first coating 2, such as PMMA (polymethyl methacrylate), PS (polystyrene), epoxy resin, acrylic resin, polyurethane, UV-curable resin, etc.; the second coating 3 can be prepared by coating, printing, etc.; the thickness of the second coating 3 is 0.1μm to 200μm. Figure 2 and Figure 4 As shown, the second coating 3 can be a single coating or two or more discontinuous single coatings. Preferably, the thickness of the second coating 3 is 1 μm to 50 μm.

[0057] The 90-degree peel force F1 between the second coating 3 and the first coating 2, and the 90-degree peel force F2 between the first coating 2 and the support layer 1, must both be greater than or equal to 2N / 25mm. The 90-degree peel force F3 between the second coating 3 and the support layer 1 must be less than 2N / 25mm. That is, F1≥2N / 25mm&F2≥2N / 25mm&F3<2N / 25mm. The measurement method shall be performed in accordance with Method 4 of GB / T2792-2014 Test Method for Peel Strength of Adhesive Tape: Test Method for 180° Peel Strength of Adhesive Tape to Anti-adhesive Material and Appendix B Test Method for 90° Peel Strength of Adhesive Tape.

[0058] The antenna 4 can be an aluminum etched antenna, a copper etched antenna, a conductive silver paste printed antenna, a conductive polymer printed antenna, a chemically plated copper antenna, or a vacuum-plated copper or vacuum-plated aluminum antenna, etc. It can be prepared using the methods reported in literature such as "Research on Screen Printing Process Parameters of Smart Tag Antennas", "Conductive Ink and Printed Antenna Technology for Electronic Tag RFID", "Three Manufacturing Methods of RFID Antennas", "Manufacturing RFID Antennas by Gravure Etching Method", "Principles, Applications and Prospects of Chemical Copper Plating", and "Introduction to Vacuum Aluminization Process".

[0059] The method for preparing an RFID electronic tag with anti-transfer function according to the present invention includes the following steps:

[0060] Step 1: Prepare a first coating 2 on the support layer 1 by coating or printing, and then prepare a second coating 3 by coating or printing the entire surface. The area of ​​the first coating 2 is smaller than that of the second coating 3. The material of the first coating 2 has a strong bond with the support layer 1 and is not easy to separate. The material of the second coating 3 has a lower bond with the support layer 1 and is easy to release, while it has a higher bond with the first coating 2 and is more brittle and easy to break.

[0061] Step 2: On the surface of the second coating 3 of the product from Step 1, directly print conductive silver paste or conductive polymer material to form a printed antenna. This can be done using screen printing, gravure printing, flexographic printing, or offset printing. If it is a double-sided RFID electronic tag, a second coating needs to be prepared on the other side of the support layer 1, or on the other side of the support layer 1, using the same method, and another part of the antenna needs to be prepared on the surface of the second coating away from the support layer.

[0062] The conductive polymers, such as polyacetylene, polythiophene, polyaniline, polyphenylenevinylene, or polyphenylene, and the methods for screen printing, gravure printing, flexographic printing, or offset printing, are detailed in relevant manuals or literature, such as "Research on Screen Printing Process Parameters of Smart Tag Antennas" and "Conductive Ink and Printed Antenna Technology for Electronic Tag RFID," and will not be repeated here. This embodiment provides the following reference example:

[0063] Aluminum or copper foil is bonded to the second coating 3 above with an adhesive, and then an antenna pattern is printed on the aluminum or copper foil. After etching with acid or alkali and deinking treatment, an etched antenna is formed. The printing methods that can be used are screen printing, gravure printing, flexographic printing, offset printing, etc. For specific details, please refer to the methods reported in literature such as "Three Methods of Manufacturing RFID Antennas" and "Manufacturing RFID Antennas by Gravure Etching".

[0064] or:

[0065] Conductive material is first printed on the second coating 3 as a seed layer, and then copper is deposited on the seed layer by chemical deposition to obtain a chemically plated copper antenna.

[0066] The conductive material is selected from Raycus's RL1206, ACHESON's E-820B or EO-427SS, etc., or:

[0067] On the second coating 3 mentioned above, copper or aluminum is directly vacuum plated using a template to form a vacuum copper-plated antenna or a vacuum aluminum-plated antenna. For the methods of vacuum copper plating and vacuum aluminum plating, please refer to the methods reported in literature such as "Principles, Applications and Prospects of Chemical Copper Plating" and "Introduction to Vacuum Aluminum Plating Process".

[0068] To prepare a double-sided RFID tag, the same method must be used to prepare a portion of the antenna on the other side of the support layer 1, or on the surface of the second coating layer on the other side of the support layer 1 away from the support layer, during the preparation process described above.

[0069] Step 3: Bond the chip to the antenna formed above using thermosetting conductive adhesive. The chip bonding point should coincide with the projection of the first coating 2. This can be achieved through antenna design and positioning coating, positioning printing and other processes. Use an RFID reader that matches the chip to input data and obtain the RFID electronic tag with anti-transfer function.

[0070] For double-sided RFID electronic tags, the antennas at the bridging points on both sides of the support layer 1 need to be connected through a bridging process. The bridging point 6 must coincide with the projection of the first coating layer 2. This can be achieved through antenna design and positioning coating, positioning printing, and other processes. Then, the chip is bonded to the antenna using thermosetting conductive adhesive. The chip bonding point must coincide with the projection of the first coating layer 2. This can also be achieved through antenna design and positioning coating, positioning printing, and other processes, thereby obtaining the RFID electronic tag with anti-transfer function.

[0071] When using the label of this invention, an adhesive is applied to either side of the label before it is affixed to the surface of the product or its outer packaging. The presence of the first coating solves the problem of poor mechanical strength at the electrical connection points of existing fragile RFID tags, improving the yield rate in the production process and reducing the accidental damage rate during use. Furthermore, when the side containing the second coating is affixed to the product or its outer packaging, when the RFID tag is to be peeled off, the connection between the second coating 3 and the support layer 1 begins to separate. Under the combined action of the second and first coatings, the portion of the second coating 3 connected to the first coating 2 breaks off from the rest. The RFID chip, antenna bridging point, and part of the antenna adhere to the support layer and detach from the surface of the product or its outer packaging. The remaining antenna portion adheres to the surface of the product or its outer packaging as the second coating breaks off. The breakage of the antenna renders the RFID tag unable to read or write, thus achieving a secure and anti-counterfeiting effect.

[0072] Meanwhile, because the support layer has a first coating layer with high adhesion to it, and the chip bonding points and the bridging points of the double-sided RFID electronic tags all coincide with the projection of the first coating layer, the chip bonding points, the bridging points of the double-sided RFID electronic tags and the support layer have high bonding strength. This avoids the loosening or breakage of the chip bonding points during subsequent processing and customer use, reducing the probability of RFID tag performance degradation or damage, thereby improving the yield of RFID tag products.

[0073] like Figure 3 As shown, for a double-sided RFID tag, after fabricating the first antenna portion 41 on the second coating 3 on one side of the support layer, a second antenna portion 42 needs to be fabricated on the other side of the support layer (or on the second coating 3 on the other side). Alternatively, the second antenna portion 42 can be fabricated first on the other side of the support layer (or on the second coating 3 on the other side), and then the first antenna portion 41 can be fabricated on the second coating 3 on one side of the support layer. Since there are antennas on both sides of the support layer, conduction is achieved by puncturing the support layer. In addition to the chip bonding points, the bridging points are also prone to loosening or breakage due to the traditional method of only having a second coating, affecting the bridging conduction effect. This results in a decrease or damage to the performance of the double-sided RFID tag, leading to a high product scrap rate. Therefore, the method described in this invention can also effectively enhance the strength of the bridging points, thereby improving the yield of RFID tags.

[0074] Example 1

[0075] Using 50-micron electronic-grade PET as a support layer, acrylic resin is coated locally on its surface as the first coating layer, and dried in an infrared oven to a thickness of 5 microns. Then, a UV-curable resin is coated on the same side of the support layer as the second coating layer, cured using a 5 kW UV curing device for 10 seconds to a thickness of 20 microns. Conductive silver paste is then screen-printed onto the second coating layer using a 400-mesh screen, and after drying, it forms an RFID antenna. Through antenna design, the bonding point between the RFID chip and the antenna coincides with the projection of the first coating layer. Finally, the RFID chip is bonded with thermosetting conductive adhesive. Data is then recorded using an RFID reader / writer compatible with the chip to obtain the product.

[0076] Example 2

[0077] Using 50-micron electronic-grade PET as a support layer, epoxy resin is locally printed on its surface as a first coating with a thickness of 2 microns using gravure printing. Then, a UV-curable resin is coated on the same side of the support layer as a second coating, which is then cured using a 10-kilowatt UV curing device for 5 seconds, resulting in a coating thickness of 20 microns. A 16-micron thick aluminum foil is then bonded to the second coating with an adhesive. An antenna pattern is then printed on the aluminum foil using gravure printing. After acid or alkali etching and deinking treatment, an etched antenna is formed. The bonding point between the RFID chip and the antenna is aligned with the projection of the first coating. Finally, the RFID chip is bonded using thermosetting conductive adhesive. Data is then entered using an RFID reader compatible with the chip to obtain the product.

[0078] Example 3

[0079] Using 50-micron electronic-grade PET as a support layer, epoxy resin is locally printed as a first coating with a thickness of 3 microns on its surface using gravure printing. Then, PMMA is printed as a second coating on the same side of the support layer using gravure printing, with a thickness of 5 microns. A 16-micron thick aluminum foil is then bonded to the second coating with an adhesive. Simultaneously, a 9-micron thick aluminum foil is also bonded to the other side of the support layer. Antenna patterns are then printed on the aluminum foils on both sides using gravure printing. After acid or alkaline etching and deinking treatment, an etched antenna is formed. The antenna design ensures that the bonding points between the RFID chip and the antenna, as well as the bridging points of the antennas on both sides of the support layer, coincide with the projection of the first coating. The antennas at the bridging points on both sides of the support layer are connected using a bridging process. Finally, the RFID chip is bonded using thermosetting conductive adhesive. Data is then entered using an RFID reader / writer compatible with the chip to obtain the product.

[0080] Example 4

[0081] Using 50-micron electronic-grade PET as a support layer, a 5-micron thick polyurethane resin is applied as the first coating layer on its surface through a coating printing process. Then, a UV-curable resin is printed on the same side of the support layer using offset printing as the second coating layer. This is then cured using a 5-kilowatt UV curing device for 1 second, resulting in a 2-micron thick coating. Next, a conductive material is printed as a seed layer using gravure printing, and copper is deposited on the seed layer using chemical deposition to obtain a chemically plated copper antenna. The antenna design aligns the bonding point between the RFID chip and the antenna with the projection of the first coating layer. Finally, the RFID chip is bonded using a thermosetting conductive adhesive. Data is then entered using an RFID reader compatible with the chip to obtain the product.

[0082] Example 5

[0083] Using 30-micron electronic-grade PET as a support layer, epoxy resin is locally printed as the first coating with a thickness of 3 microns on its surface by gravure printing. Then, PS is printed as the second coating on the same side of the support layer by gravure printing, with a thickness of 5 microns. Then, partial antennas are formed by vacuum-plating aluminum directly on the second coating using a template. Partial antennas are also formed on the other side of the support layer by vacuum-plating aluminum. The antenna design ensures that the bonding points of the RFID chip and the antenna, as well as the bridging points of the antennas on both sides of the support layer, coincide with the projection of the first coating. Then, the antennas at the bridging points on both sides of the support layer are made conductive through a bridging process. Finally, the RFID chip is bonded with thermosetting conductive adhesive. Data is recorded using an RFID reader that matches the chip to obtain the product.

[0084] Example 6

[0085] Using 80gsm coated paper as the support layer, acrylic resin is applied locally as the first coating layer on its surface and dried in an infrared oven to a thickness of 5 micrometers. Next, a UV-curable resin is applied to the same side of the support layer as the second coating layer and cured using a 10kW UV curing device for 2 seconds to a thickness of 15 micrometers. Conductive silver paste is then screen-printed onto the second coating layer using a 400-mesh screen, and after drying, it forms an RFID antenna. Through antenna design, the bonding point between the RFID chip and the antenna coincides with the projection of the first coating layer. Finally, the RFID chip is bonded with thermosetting conductive adhesive. Data is then recorded using an RFID reader / writer compatible with the chip to obtain the product.

[0086] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0087] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An RFID electronic tag, characterized in that, include: Support layer (1), first coating layer (2), second coating layer (3), antenna (4) and chip (5); The second coating (3) is located on one or both sides of the support layer (1), and the first coating (2) is located between the support layer (1) and the second coating (3). The area of ​​the first coating (2) is smaller than the area of ​​the second coating (3). When the RFID electronic tag is a single-sided RFID electronic tag, the antenna (4) is located on the surface of the second coating (3) away from the support layer (1); When the RFID electronic tag is a double-sided RFID electronic tag, the antennas (4) on both sides are located on the surface of the support layer (1) away from the second coating (3) and the surface of the second coating (3) away from the support layer (1), or on the surface of the second coating (3) on both sides away from the support layer (1). The antennas (4) on both sides are connected to each other through the bridge point (6). The chip (5) is electrically connected to the antenna (4). When the RFID electronic tag is a single-sided RFID electronic tag, the chip (5) and the bonding point between it and the antenna (4) coincide with the projection of the first coating (2), and the area of ​​the first coating (2) is larger than the area of ​​the bonding point; When the RFID electronic tag is a double-sided RFID electronic tag, the bonding point and the bridging point (6) coincide with the projection of the first coating (2), and the area of ​​the first coating (2) is larger than the area of ​​the bonding point and the bridging point (6); The 90-degree peel force F1 between the second coating (3) and the first coating (2) and the 90-degree peel force F2 between the first coating (2) and the support layer (1) are greater than the 90-degree peel force F3 between the second coating (3) and the support layer (1).

2. The RFID electronic tag according to claim 1, characterized in that, The first coating (2) is a single coating or two or more discontinuous single coatings; And / or, F1≥2N / 25mm, F2≥2N / 25mm, F3<2N / 25mm.

3. The RFID electronic tag according to claim 1, characterized in that, The thickness of the support layer (1) is 0.1 μm to 1 mm; And / or, the thickness of the first coating (2) is 0.1 μm to 200 μm; And / or, the thickness of the second coating (3) is 0.1 μm to 200 μm; And / or, the antenna (4) includes: an aluminum etched antenna, a copper etched antenna, a conductive silver paste printed antenna, a conductive polymer printed antenna, a chemically plated copper antenna, a vacuum-plated copper antenna, or a vacuum-plated aluminum antenna. And / or, the material of the support layer (1) includes polymer or paper; And / or, the first coating (2) is selected based on the material of the support layer (1) to have a bonding strength that meets the preset requirements with the support layer (1); And / or, the second coating (3) is selected based on the materials of the support layer (1) and the first coating (2) to have a bonding strength that meets preset requirements with the support layer (1) and the first coating (2).

4. The RFID electronic tag according to claim 3, characterized in that, The polymers include: polyethylene terephthalate, polypropylene, polyvinyl chloride, polyethylene, or polycarbonate; And / or, the material of the first coating (2) includes: epoxy resin, acrylic resin, polyurethane or photocurable resin; And / or, the material of the second coating (3) includes: PMMA, PS, epoxy resin, acrylic resin, polyurethane or photocurable resin.

5. A method for preparing an RFID electronic tag according to any one of claims 1-4, characterized in that, include: Step 1: Prepare a first coating (2) on the support layer (1), and then prepare a second coating (3) on the full surface. The area of ​​the first coating (2) is smaller than that of the second coating (3). Step 2: Fabricate an antenna (4) on the surface of the product from Step 1; Step 3: Electrically connect the chip (5) to the antenna (4) to obtain an RFID electronic tag.

6. The method for preparing an RFID electronic tag according to claim 5, characterized in that, When the RFID electronic tag is a single-sided RFID electronic tag, step 2 includes: On the surface of the second coating (3) away from the support layer (1), conductive silver paste or conductive polymer material is directly printed to form a printed antenna; Alternatively, aluminum foil or copper foil can be bonded to the surface of the second coating (3) away from the support layer (1) with an adhesive, and then an antenna pattern can be printed on the aluminum foil or copper foil. After etching with acid or alkali and deinking treatment, an etched antenna can be formed. Alternatively, on the surface of the second coating (3) away from the support layer (1), a conductive material is first printed as a seed layer, and then copper is deposited on the seed layer by chemical deposition to obtain a chemically plated copper antenna. Alternatively, on the surface of the second coating (3) away from the support layer (1), copper or aluminum can be directly vacuum plated through a template to form a vacuum copper-plated antenna or a vacuum aluminum-plated antenna.

7. The method for preparing an RFID electronic tag according to claim 5, characterized in that, When the RFID electronic tag is a double-sided RFID electronic tag, step 2 includes: Conductive silver paste or conductive polymer material is directly printed on the surface of the support layer (1) away from the second coating layer (3) and the surface of the second coating layer (3) away from the support layer (1), or on the surfaces of the second coating layer (3) on both sides away from the support layer (1) to form a printed antenna; Alternatively, aluminum foil or copper foil can be bonded to the surface of the support layer (1) away from the second coating layer (3) and the surface of the second coating layer (3) away from the support layer (1), or to the surfaces of the second coating layer (3) on both sides away from the support layer (1) by adhesive bonding, and then an antenna pattern can be printed on the aluminum foil or copper foil. After etching and deinking treatment with acid or alkali solution, an etched antenna can be formed. Alternatively, on the surface of the support layer (1) away from the second coating layer (3) and the surface of the second coating layer (3) away from the support layer (1), or on the surfaces of the second coating layer (3) on both sides away from the support layer (1), a conductive material is first printed as a seed layer, and then copper is deposited on the seed layer by chemical deposition to obtain a chemically plated copper antenna. Alternatively, on the surface of the support layer (1) away from the second coating layer (3) and the surface of the second coating layer (3) away from the support layer (1), or on the surfaces of the second coating layer (3) on both sides away from the support layer (1), copper or aluminum can be directly vacuum plated by a template to form a vacuum copper-plated antenna or a vacuum aluminum-plated antenna.

8. The method for preparing an RFID electronic tag according to claim 7, characterized in that, Step 2 also includes: After the antennas at the bridge points (6) on both sides of the support layer (1) are connected by the bridge process, the chip (5) is then bonded to the antenna (4). And / or, the first coating (2) and the second coating (3) are prepared by coating or printing.

9. A method of using an RFID electronic tag according to any one of claims 1-4, characterized in that, Apply adhesive to either side of the RFID tag and then attach it to the surface of the product or its outer packaging.

10. A commodity, characterized in that, Includes the RFID electronic tag as described in any one of claims 1-4.

11. A product outer packaging, characterized in that, Includes the RFID electronic tag as described in any one of claims 1-4.

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