A method for cutting 1.0 mm porcelain thickness DCB radius product

Abstract

The application discloses a method for cutting 1.0mm thick DCB round corner product. It comprises the following steps: step one, graphic front cutting; firstly, a laser cutting trajectory line is formed; the laser cutting trajectory line is sequentially connected with a first cutting auxiliary line, a second cutting auxiliary line, a reverse round corner, a third cutting auxiliary line and a fourth cutting auxiliary line; the first cutting auxiliary line and the fourth cutting auxiliary line are symmetrically arranged, the second cutting auxiliary line and the third cutting auxiliary line are symmetrically arranged, and the second cutting auxiliary line is outwardly offset from the first cutting auxiliary line; then, a front grid-shaped scribe cutting trajectory line is formed on the front of the product by laser; step two, graphic back cutting; a back cutting auxiliary line is formed on the back of the ceramic plate by laser cutting; and then, a back grid-shaped scribe cutting trajectory line is formed on the back of the product by laser. The application avoids the defects such as gap and burr caused by slicing, and improves the product yield.

Description

Technical Field

[0001] This invention relates to the field of DCB substrate manufacturing, and to a method for cutting DCB substrates. Background Technology

[0002] Currently, when cutting 1.0mm thick DCB rounded corner products, the process involves directly laser cutting one side of the motherboard, first rounding the corners, then scribing, and finally dividing it into smaller pieces. (See also...) Figure 1 However, due to the thickness of the ceramic tile, this cutting process can cause discontinuities in the ceramic edge at the junction of the rounded corner and the scribing line. Furthermore, due to the high cutting power required for the rounded corner and the overlapping of the scribing lines, [see...]. Figure 2 Slicing can cause defects such as gaps and protruding burrs. See Figure 3 . Summary of the Invention

[0003] This invention provides a method for cutting 1.0mm thick DCB rounded corner products to solve at least one of the above-mentioned technical problems.

[0004] A method for cutting 1.0mm thick DCB rounded corner products, characterized by comprising the following steps:

[0005] Step 1: Cut the graphic from the front.

[0006] First, a laser-cut trajectory line is formed around the four corner areas of the copper foil on the front side of the ceramic plate;

[0007] The laser cutting trajectory lines are sequentially connected as a first cutting auxiliary line, a second cutting auxiliary line, a rounded corner, a third cutting auxiliary line, and a fourth cutting auxiliary line;

[0008] The laser cutting trajectory line is an axially symmetrical figure, with the first cutting auxiliary line and the fourth cutting auxiliary line arranged symmetrically, and the second cutting auxiliary line and the third cutting auxiliary line arranged symmetrically.

[0009] The angle between the second cutting auxiliary line and the first cutting auxiliary line is an obtuse angle. The end of the second cutting auxiliary line furthest from the first cutting auxiliary line is offset outward by an amount of 0.03–0.05 mm.

[0010] Then, laser-formed grid-like scribing and cutting trajectory lines on the front of the product, the grid-like scribing and cutting trajectory lines being matched with the first cutting auxiliary line and the fourth cutting auxiliary line;

[0011] Step 2: Cut the back of the graphic;

[0012] Laser cutting is performed on the back of the ceramic plate to form back cutting guide lines corresponding to the positions of the second and third cutting guide lines on all the front sides;

[0013] Then, laser-form a grid-like scribing and cutting trajectory line on the back of the product, which is set to correspond to the grid-like scribing and cutting trajectory line on the front.

[0014] This invention can avoid defects such as gaps and burrs caused during the slicing process, thereby improving product yield.

[0015] More preferably, the length of the first cutting auxiliary line is 5% to 10% of the width of the sliced ​​product.

[0016] More preferably, the vertical distance from the end of the first cutting auxiliary line connecting to the second cutting auxiliary line to the fourth cutting auxiliary line is 10% to 15% of the width of the sliced ​​product.

[0017] More preferably, the cutting speed of the first cutting auxiliary line is 3-5 mm / s, the cutting power is 85%-95%, the cutting frequency is 0.5-0.8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0018] More preferably, the cutting process of the fourth cutting auxiliary line is the same as that of the first cutting auxiliary line.

[0019] More preferably, the cutting speed of the second cutting auxiliary line is 60-70 mm / s, the cutting power is 70%-80%, the cutting frequency is 5-8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0020] More preferably, the cutting process of the third cutting auxiliary line is the same as that of the second cutting auxiliary line.

[0021] More preferably, the cutting speed for the rounded corner is 3-5 mm / s, the cutting power is 85%-95%, the cutting frequency is 0.5-0.8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0022] Further preferably, the cutting speed of the front grid-like scribing trajectory line is 120-150 mm / s, the cutting power is 20%-30%, the cutting frequency is 8-10 kHz, and the cutting time is 0.20-0.30 microseconds.

[0023] Preferably, the cutting process of the back grid-like scribing cutting trajectory line is the same as that of the front grid-like scribing cutting trajectory line.

[0024] In a further preferred embodiment, before step one, when arranging the patterns on the motherboard, an additional gap is added between each small piece, with a gap distance of 3 to 5 mm.

[0025] By rearranging the product layout so that the marking lines do not overlap, the product cutting yield is improved, and defects such as protruding burrs are avoided.

[0026] Beneficial effects:

[0027] This invention changes the rounding process for thick ceramic tiles from single-sided cutting to double-sided cutting on both sides, reducing the power required for laser cutting. Simultaneously, auxiliary lines are added: on the front, the rounded corners only connect to the auxiliary lines, not the scribing lines, reducing discontinuities at the ceramic edge. The cutting auxiliary lines on the back prevent bevel defects during slicing. By rearranging the product layout to ensure the scribing lines do not overlap, the product cutting yield is improved, and defects such as protruding burrs are avoided. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of cutting in the background art;

[0029] Figure 2 This is a schematic diagram of the junction between the rounded corner line and the scribing line in the background technology.

[0030] Figure 3 This is a schematic diagram after the background technology has been cut.

[0031] Figure 4 This is a schematic diagram of the laser cutting trajectory line in specific embodiment 1 of the present invention;

[0032] Figure 5 This is a schematic diagram of the front grid-like scribing and cutting trajectory lines after forming in a specific embodiment 1 of the present invention;

[0033] Figure 6 This is a specific embodiment 1 of the present invention. Figure 5 A magnified view of a portion of the image;

[0034] Figure 7 This is a schematic diagram of the back-side cutting auxiliary lines in a specific embodiment 1 of the present invention;

[0035] Figure 8 This is a schematic diagram of the back mesh-like scribing and cutting trajectory lines after forming in a specific embodiment 1 of the present invention;

[0036] Figure 9 This is a specific embodiment 1 of the present invention. Figure 8 Enlarged view of a section of the structure;

[0037] Figure 10 This is a schematic diagram of the structure of the master template in specific embodiment 1 of the present invention;

[0038] Figure 11 This is a schematic diagram of the sliced ​​components in a specific embodiment 1 of the present invention. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figures 4 to 11 As shown in Specific Embodiment 1, a method for cutting 1.0mm thick DCB rounded corner products includes the following steps:

[0041] Step 1: Cut the graphic from the front.

[0042] First, a laser-cut trajectory line is formed around the four corner areas of the copper foil on the front side of the ceramic plate;

[0043] The laser cutting trajectory lines are sequentially connected as follows: first cutting auxiliary line 1, second cutting auxiliary line 2, rounded corner 3, third cutting auxiliary line 4, and fourth cutting auxiliary line 5; see also Figure 4 .

[0044] The laser cutting trajectory is an axially symmetrical figure. The first cutting auxiliary line 1 and the fourth cutting auxiliary line 5 are symmetrically set, and the second cutting auxiliary line 2 and the third cutting auxiliary line 4 are symmetrically set.

[0045] The angle between the second cutting auxiliary line and the first cutting auxiliary line is an obtuse angle. The end of the second cutting auxiliary line furthest from the first cutting auxiliary line is offset outwards, and the offset amount d is 0.03~0.05mm.

[0046] Then, laser-formed grid-like scribing cutting trajectory lines 6 on the front of the product, the grid-like scribing cutting trajectory lines matching the first cutting auxiliary line 1 and the fourth cutting auxiliary line; see [link / reference] Figure 5 as well as Figure 6 .

[0047] Step 2: Cut the back of the graphic;

[0048] Laser-cut back-side cutting guide lines 8 are formed on the back of the ceramic plate, corresponding to the positions of all the second cutting guide lines 2 and third cutting guide lines 4 on the front side; see [link / reference]. Figure 7 .

[0049] Then, laser-form a grid-like scribing and cutting trajectory line 9 on the back of the product. This back-side grid-like scribing and cutting trajectory line 9 corresponds to the front-side grid-like scribing and cutting trajectory line 6. (See also...) Figure 8 as well as Figure 9 .

[0050] This invention avoids defects such as gaps and burrs caused during sheet cutting, thus improving product yield. See also Figure 11 .

[0051] The ceramic plate is 1mm thick. The laser cutting trajectory can extend counterclockwise. The laser cutting trajectory lines at the four corners of the copper foil are formed counterclockwise sequentially. The fourth cutting auxiliary line of the laser cutting trajectory is collinear with the first cutting auxiliary line of the laser cutting trajectory lines at the adjacent corners.

[0052] The front-side grid-like scribing and cutting trajectory line 6 includes a rectangular frame surrounding the copper foil, and no side of the rectangular frame of adjacent copper foils overlaps. This ensures that the scribing lines do not overlap, improving the product cutting yield and avoiding defects such as protruding burrs.

[0053] The length b of the first cutting auxiliary line 1 is 5% to 10% of the width of the product after slicing.

[0054] The vertical distance c from the end of the first cutting auxiliary line 1 connecting to the second cutting auxiliary line 2 to the fourth cutting auxiliary line 5 is 10% to 15% of the width of the sliced ​​product.

[0055] The vertical distance from the end of the second cutting auxiliary line 2 (connected to the rounded corner 3) to the fourth cutting auxiliary line 5 is 10% to 15% of the width of the sliced ​​product.

[0056] The width of the product after slicing refers to the length of the shorter side of the product after slicing into a rounded rectangular shape.

[0057] The distance between the first and fourth cutting auxiliary lines and the adjacent copper foil side is 0.5mm to 1.0mm.

[0058] The length of the second cutting guide line is 5%-10% of the width of the product after slicing.

[0059] Rounded corner 3 is a 90° rounded corner where the end of the second cutting auxiliary line away from the first cutting auxiliary line and the end of the third auxiliary line away from the fourth cutting auxiliary line are tangent.

[0060] The cutting speed of the first cutting auxiliary line 1 is 3-5 mm / s, the cutting power is 85%-95%, the cutting frequency is 0.5-0.8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0061] The cutting process of the fourth cutting auxiliary line 5 is the same as that of the first cutting auxiliary line 1.

[0062] The cutting speed of the second cutting auxiliary line 2 is 60-70 mm / s, the cutting power is 70%-80%, the cutting frequency is 5-8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0063] The cutting process of the third cutting auxiliary line 4 is the same as that of the second cutting auxiliary line 2.

[0064] The cutting speed for rounded corner 3 is 3-5 mm / s, the cutting power is 85%-95%, the cutting frequency is 0.5-0.8 kHz, and the cutting time is 0.20-0.30 microseconds.

[0065] The cutting speed of the front grid-like scribing cutting trajectory line 6 is 120-150 mm / s, the cutting power is 20%-30%, the cutting frequency is 8-10 kHz, and the cutting time is 0.20-0.30 microseconds.

[0066] The cutting process of the grid-like scribing cutting trajectory line 9 on the back is the same as that of the grid-like scribing cutting trajectory line 6 on the front.

[0067] See Figure 10 Before step one, when arranging the graphics on the master board, increase the spacing between each small piece, with a spacing distance 'a' of 3-5mm. By rearranging the product layout, the scribing lines do not overlap, improving the product cutting yield and avoiding defects such as protruding burrs.

[0068] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0069] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A method for cutting 1.0mm thick DCB rounded corner products, characterized in that, Includes the following steps: Step 1: Cut the graphic from the front. First, a laser-cut trajectory line is formed around the four corner areas of the copper foil on the front side of the ceramic plate; The laser cutting trajectory lines are sequentially connected as a first cutting auxiliary line, a second cutting auxiliary line, a rounded corner, a third cutting auxiliary line, and a fourth cutting auxiliary line; The laser cutting trajectory line is an axially symmetrical figure, with the first cutting auxiliary line and the fourth cutting auxiliary line symmetrically arranged, and the second cutting auxiliary line and the third cutting auxiliary line symmetrically arranged; The angle between the second cutting auxiliary line and the first cutting auxiliary line is an obtuse angle. The end of the second cutting auxiliary line furthest from the first cutting auxiliary line is offset outward by an amount of 0.03–0.05 mm. Then, laser-formed grid-like scribing and cutting trajectory lines on the front of the product, which match the first cutting auxiliary line and the fourth cutting auxiliary line; Step 2: Cut the back of the graphic; Laser cutting is performed on the back of the ceramic plate to form back cutting guide lines corresponding to the positions of the second and third cutting guide lines on all the front sides; Then, laser-form a grid-like scribing and cutting trajectory line on the back of the product, the grid-like scribing and cutting trajectory line on the back being set in correspondence with the grid-like scribing and cutting trajectory line on the front. The cutting process of the fourth cutting auxiliary line is the same as that of the first cutting auxiliary line. The cutting process of the third cutting auxiliary line is the same as that of the second cutting auxiliary line. The cutting process of the back grid-shaped scribing cutting trajectory line is the same as that of the front grid-shaped scribing cutting trajectory line. Before step one, when arranging the graphics on the master board, add a gap between each small piece, with a gap distance of 3 to 5 mm.

2. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The length of the first cutting auxiliary line is 5% to 10% of the width of the product after slicing.

3. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The vertical distance from the end of the first cutting auxiliary line connecting to the second cutting auxiliary line to the fourth cutting auxiliary line is 10% to 15% of the width of the sliced ​​product.

4. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The first cutting auxiliary line has a cutting speed of 3-5 mm / s, a cutting power of 85%-95%, a cutting frequency of 0.5-0.8 kHz, and a cutting time of 0.20-0.30 microseconds.

5. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The cutting speed of the second cutting auxiliary line is 60-70 mm / s, the cutting power is 70%-80%, the cutting frequency is 5-8 kHz, and the cutting time is 0.20-0.30 microseconds.

6. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The rounded corner cutting speed is 3-5 mm / s, the cutting power is 85%-95%, the cutting frequency is 0.5-0.8 kHz, and the cutting time is 0.20-0.30 microseconds.

7. The method for cutting 1.0mm thick DCB rounded corner products according to claim 1, characterized in that: The cutting speed of the front grid-like scribing trajectory line is 120-150 mm / s, the cutting power is 20%-30%, the cutting frequency is 8-10 kHz, and the cutting time is 0.20-0.30 microseconds.

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