Ion processing apparatus with vertical degree of freedom and surface treatment method

Abstract

The application discloses ion processing equipment with vertical direction freedom, which comprises a base, the upper surface of the base is fixedly connected with a shell, the inner wall of the shell is fixedly connected with a lifting track perpendicular to the base, a sliding block is slidably connected in the lifting track, the side, away from the lifting track, of the sliding block is fixedly connected with a rotating platform, the rotating platform is fixedly connected with a carrier above the rotating platform, and the inner wall, opposite to the lifting track, in the shell is fixedly connected with an ion beam emitter. Meanwhile, the application also relates to a surface treatment method using the equipment. The equipment can adjust the relative position between the equipment and the ion beam in the vertical direction through the setting of the lifting track, so that the processing range of the ion processing equipment is expanded.

Description

Technical Field

[0001] This invention belongs to the technical field of ion processing equipment, and relates to ion processing equipment with vertical degree of freedom, as well as surface treatment methods using the equipment. Background Technology

[0002] Currently, the market demand for the machining of ultra-thin cylindrical tubes and complex cylindrical parts is increasing. This is especially true in the fields of semiconductor and electronic device thin film fabrication and high-precision mechanical parts manufacturing, where precise thinning and surface polishing at the micron or even nanometer level are required. This demand has spurred the development of new processing equipment capable of achieving high-precision machining of ultra-thin cylindrical tubes and complex cylindrical parts without compromising sample quality.

[0003] However, while traditional mechanical polishing equipment can polish or thin tall cylindrical samples, it is prone to surface scratches, stress concentration, and insufficient precision control during processing. Furthermore, for cylindrical samples, difficulties in sample clamping lead to challenges in controlling roundness. These limitations make mechanical polishing unsuitable for the high-precision machining of complex parts, especially at the micro-nano scale, where the accumulation of errors from mechanical methods significantly impacts the final product quality.

[0004] Ion processing technology is widely used in material surface treatment and thinning. Traditional ion polishers only support sample rotation in a plane. This design is suitable for polishing or thinning planar samples, but it is somewhat inadequate when polishing or thinning cylindrical samples. When the height of the cylinder is greater than the beam spot diameter of the ion beam, traditional ion polishers cannot completely cover the entire side of the cylinder, and cannot achieve uniform polishing or thinning of the entire cylindrical surface. Summary of the Invention

[0005] The purpose of this invention is to provide an ion processing device with vertical degree of freedom, which solves the problem that existing ion processing devices are not suitable for polishing or thinning tall cylindrical samples.

[0006] The technical solution adopted in this invention is an ion processing device with vertical degrees of freedom, including a base, an outer shell fixedly connected to the upper surface of the base, a lifting track perpendicular to the base fixedly connected to the inner wall of the outer shell, a slider slidably connected inside the lifting track, a rotating platform fixedly connected to the side of the slider away from the lifting track, a stage fixedly connected above the rotating platform, and an ion beam emitter fixedly connected to the inner wall of the outer shell opposite to the lifting track.

[0007] The invention is further characterized by: The lifting track is driven by a stepper motor or a servo motor.

[0008] The lifting track, rotating platform, and ion beam emitter are all connected to the same PID controller.

[0009] Another technical solution adopted in this invention is: The surface treatment method and specific steps are as follows: Step 1: Input the geometric parameters, material properties, and processing target of the sample to be processed into the PID controller; Step 2: Generate the rotation speed of the rotating platform based on the geometric parameters of the sample to be processed; Step 3: Adjust the rotation speed of the rotary platform according to the material properties of the sample to be processed and the processing target; Step 4: Obtain the moving speed of the slider on the lifting track based on the rotation speed of the rotating platform; Step 5: Start the ion beam emitter and control the device according to the rotation speed of the rotating platform and the movement speed of the lifting track until the processing is completed.

[0010] The invention is further characterized by: In step 1, when the sample to be processed is a cylinder, the geometric parameters include height H and diameter D. When the sample to be processed is a gear, the geometric parameters include module m, number of teeth z, and tooth height h. The processing objectives of the sample to be processed include the thickness reduction during processing and the surface roughness after processing; The material properties of the sample to be processed include the elongation and thermal conductivity of the material.

[0011] In step 2, when the sample to be processed is a cylinder, the initial rotation speed of the rotating platform is... Calculate using the following formula:

[0012] in, The minimum rotational speed to ensure basic uniformity, This refers to the maximum permissible rotational speed of the rotating platform. When the sample to be processed is a gear, the rotation speed of the rotating platform Calculate using the following formula:

[0013] in, This is the base rotational speed of the rotating platform. This represents the tooth height of the gear. The module of the gear is used, and the basic rotational speed is taken as 50%-80% of the maximum rotational speed of the rotating platform.

[0014] In step 3, the initial rotation speed of the rotating platform The correction is made according to the following formula:

[0015] in, This is the corrected rotational speed of the rotating platform. The target thickness correction factor is... For target roughness correction factor, Target material property correction factor; When the target thickness is greater than 30μm When the target thickness is between 10μm and 30μm When the target thickness is less than 10μm ; Target material property correction factor The possible values ​​are shown in the table below:

[0016] When the target roughness Ra is greater than 0.5 μm When the target roughness is between 0.1 μm and 0.5 μm When the target roughness benefit is 0.1 μm .

[0017] The moving speed of the slider on the lifting track in step 4 Calculate using the following formula:

[0018] in, The diameter of the ion beam spot emitted by the ion beam emitter. The overlap ratio of the ion beam spots. The calculation method is as follows:

[0019] Where d is the scanning spacing of the ion beam emitter.

[0020] Step 5: If the thickness reduction exceeds the tolerance during operation, the sliding block's movement speed needs to be adjusted according to the actual situation. The adjustment method is as follows:

[0021] in The adjusted slider movement speed, To adjust the moving speed of the front slider, To account for the thickness difference between the processed and unprocessed areas of the sample, To reduce the thickness to the target.

[0022] Step 5: If the device deviates in the vertical direction during operation, adjust it according to the following method: Step 5.1: Calculate the deviation value during the operation. The calculation method is as follows:

[0023] in This represents the vertical displacement deviation. This represents the actual displacement in the vertical direction. This represents the target displacement in the vertical direction. For the deviation of the rotation speed, This is the actual rotation speed. The target rotation speed is set in advance; Step 5.2: Adjust the deviation according to the PID control law, which is as follows:

[0024] in, To control the quantity, , , These are the proportional, integral, and derivative gains, respectively. This is the deviation value; when a deviation occurs in the vertical displacement... When an error occurs in the horizontal rotation ; Step 5.3: The PID controller determines the control quantity based on the input... Adjust the movement of the slider or rotating platform.

[0025] The beneficial effects of this invention are: 1. This invention enables the stage to move along the Z-axis by setting up a lifting track. The relative position between the workpiece on the stage and the ion beam emitted by the ion beam emitter can be adjusted according to the processing requirements, thereby enabling the processing of workpieces that exceed the diameter of the ion beam spot and expanding the processing range of the ion processing equipment.

[0026] 2. The surface treatment method provided by the present invention determines the rotation speed of the rotating platform and the lifting speed of the lifting track by combining the characteristics of the material to be processed and the processing target with the relevant parameters of the ion beam emitter. The operating conditions of the ion processing equipment can be selected according to the actual processing requirements, thereby reducing the error between the processing target and the actual processing effect. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the ion processing equipment with vertical degree of freedom according to the present invention; Figure 2 This is a flowchart of the surface treatment method of the present invention.

[0028] In the diagram: 1. Base; 2. Outer shell; 3. Lifting rail; 4. Slider; 5. Rotating platform; 6. Stage; 7. Ion beam emitter; 8. PID controller. Detailed Implementation

[0029] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0030] Example 1: like Figure 1 As shown, it includes a base 1, an outer shell 2 fixedly connected to the upper surface of the base 1, a lifting track 3 perpendicular to the base 1 fixedly connected to the inner wall of the outer shell 2, a slider 4 slidably connected inside the lifting track 3, a rotating platform 5 fixedly connected to the side of the slider 4 away from the lifting track 3, a platform 6 fixedly connected above the rotating platform 5, and an ion beam emitter 7 fixedly connected to the inner wall of the outer shell 2 opposite to the lifting track 3.

[0031] The lifting track 3 is driven by a stepper motor or a servo motor.

[0032] The lifting track 3, the rotating platform 5, and the ion beam emitter 7 are all connected to the same PID controller 8.

[0033] The ion processing equipment provided in this application can move the stage 6 vertically during actual processing, thereby expanding the processing area of ​​the ion beam. At the same time, the arrangement of the rotating platform 5 allows the position of the processed object relative to the ion beam emitter 7 to be adjusted through the coordinated cooperation of the lifting track 3 and the rotating platform 5, while keeping the ion beam fixed, thereby expanding the processing range of the ion beam.

[0034] Example 2: Using the apparatus in Example 1: like Figure 2 As shown, the surface treatment method and its specific steps are as follows: Step 1: Input the geometric parameters, material properties and processing target of the sample to be processed into the PID controller 8; Step 2: Generate the rotation speed of the rotating platform 5 based on the geometric parameters of the sample to be processed; Step 3: Adjust the rotation speed of the rotating platform 5 according to the material properties of the sample to be processed and the processing target; Step 4: Obtain the moving speed of slider 4 on lifting track 3 based on the rotation speed of rotating platform 5; Step 5: Start the ion beam emitter 7 and control the device according to the rotation speed of the rotating platform 5 and the moving speed of the lifting track 3 until the processing is completed.

[0035] In step 1, when the sample to be processed is a cylinder, the geometric parameters include height H and diameter D. When the sample to be processed is a gear, the geometric parameters include module m, number of teeth z, and tooth height h. The processing objectives of the sample to be processed include the thickness reduction during processing and the surface roughness after processing; The material properties of the sample to be processed include the elongation and thermal conductivity of the material.

[0036] The basic shape of the sample to be processed can be determined by the cylinder height H and diameter D, or the gear module m, number of teeth z and tooth height h, which provides a data basis for the subsequent calculation of the rotation speed of the rotating platform 5.

[0037] When ion beams are used to thin the surface of a workpiece, the elongation of the specific workpiece will affect the interaction time between the ion beam and the workpiece surface, while the thermal conductivity will affect the processing efficiency of the ion beam on the processing area and surrounding area. By combining the elongation and thermal conductivity of the material with the thinning thickness during processing and the surface roughness after processing, different processing parameters can be obtained for different needs.

[0038] Example 3: Based on Example 2: In step 2, when the sample to be processed is a cylinder, the initial rotation speed of the rotating platform 5 is... Calculate using the following formula:

[0039] in, The minimum rotational speed to ensure basic uniformity, The maximum permissible rotational speed for rotary platform 5; When the sample to be processed is a gear, the rotation speed of the rotating platform 5 is... Calculate using the following formula:

[0040] in, The base rotational speed of the rotating platform 5, This represents the tooth height of the gear. The module of the gear is used, and the basic rotational speed is taken as 50%-80% of the maximum rotational speed of the rotating platform.

[0041] To prevent the ion beam from remaining in one area for too long during ion beam processing, which could lead to excessive processing time and uneven surface finish, a minimum rotation speed is used. It is involved in the calculation of the rotation speed of the rotating platform.

[0042] For mechanical structures that provide rotational functions, factors such as the strength limitations of the materials that make up the mechanical structure, the load-bearing capacity of the bearings, and the resonance problem of the mechanical structure may cause damage to a certain mechanical structure once it exceeds a certain speed during rotation. Therefore, this method incorporates the maximum speed of the platform into the calculation formula when determining the initial speed to avoid the device from failing to operate normally due to excessively high speed.

[0043] Example 4: Based on Example 2: In step 3, the initial rotation speed of the rotating platform 5 is... The correction is made according to the following formula:

[0044] in, This is the corrected rotational speed of the rotating platform. For target thickness correction factor, For target roughness correction factor, Target material property correction factor; When the target thickness is greater than 30μm When the target thickness is between 10μm and 30μm When the target thickness is less than 10μm ; Target material property correction factor The possible values ​​are shown in the table below:

[0045] When the target roughness Ra is greater than 0.5 μm When the target roughness is between 0.1 μm and 0.5 μm When the target roughness benefit is 0.1 μm .

[0046] The rotation speed correction factor of the rotating platform is selected based on the target thickness, target roughness, thermal conductivity and elongation of the object to be processed. This directly affects the residence time of the ion beam on the object, ensuring uniform coverage of the ion beam on the object surface, thereby achieving a more precise processing effect.

[0047] Example 5: Based on Example 2: The moving speed of slider 4 on lifting track 3 in step 4 Calculate using the following formula:

[0048] in, The diameter of the ion beam spot emitted by ion beam emitter 7. The overlap ratio of the ion beam spots. The calculation method is as follows:

[0049] Where d is the scanning spacing of the ion beam emitter 7.

[0050] In actual ion beam emission, the ion beam has a certain width, which is determined by the rotational speed n of the rotating platform and the diameter of the ion beam spot. Example 6: Based on Example 2: Step 5: If the thickness reduction exceeds the tolerance during operation, the moving speed of slider 4 needs to be adjusted according to the actual situation. The adjustment method is as follows:

[0051] in To adjust the moving speed of slider 4, To adjust the moving speed of the front slider 4, To account for the thickness difference between the processed and unprocessed areas of the sample, To reduce the thickness to the target.

[0052] Step 5: If the device deviates in the vertical direction during operation, adjust it according to the following method: Step 5.1: Calculate the deviation value during the operation. The calculation method is as follows:

[0053] in This represents the vertical displacement deviation. This represents the actual displacement in the vertical direction. This represents the target displacement in the vertical direction. For the deviation of the rotation speed, This is the actual rotation speed. The target rotation speed is set in advance; Step 5.2: Adjust the deviation according to the PID control law, which is as follows:

[0054] in, To control the quantity, , , These are the proportional, integral, and derivative gains, respectively. This is the deviation value; when a deviation occurs in the vertical displacement... When an error occurs in the horizontal rotation ; Step 5.3: The PID controller 8 determines the control quantity based on the input... Adjust the movement of slider 4 or rotating platform 5.

[0055] In actual processing, issues such as control deviations and transmission deviations in mechanical structures may cause the actual motion of the processed object to differ from the calculated motion. To prevent errors from accumulating and failing to achieve the processing target, this method introduces an adjustment method for the deviation value to improve system stability.

[0056] Example 7: Based on Example 2: The surface treatment method for machining a cylinder includes the following specific steps: Step 1: Measure the geometric parameters and material properties of the sample to be processed, determine the height H of the cylinder to be processed to be 50 mm, the diameter D to be 50 mm, the elongation of the cylinder itself to be processed to be 6%, the thermal conductivity to be 120 W / m·K, then determine the thinning thickness during processing to be 100 μm, and the surface roughness after processing to be 0.5 μm, and input these values ​​into PID controller 8: Step 2: The minimum rotational speed of the rotating platform 5 used in this device to ensure basic uniformity. It is 10 rpm, the maximum speed. The initial speed of the rotating platform is calculated to be 60 rpm. ; Step 3: Based on the material properties of the sample to be processed, determine the target thickness correction factor. The target roughness correction factor is 1. The target material property correction factor is 0.5. The value is 1.5, and the final calculated rotation speed of the rotating platform 5 is n = 37.5 rpm; Step 4: Confirm the diameter of the ion beam The scanning spacing d of the ion beam emitter 7 is 2.8 mm, and the overlap rate of the ion beam spot is 4 mm. The value is 30%, and then the moving speed of the slider 4 on the lifting track 3 is obtained based on the rotation speed of the rotating platform 5. ; Step 5: Fix the object to be processed on the rotating platform and start the ion beam emitter 7. The control device operates according to the rotation speed of the rotating platform 5 and the moving speed of the lifting track 3 until the processing is completed.

[0057] The finished workpiece was measured, and the actual surface roughness was 0.35 μm, and the actual thinning thickness was 105 μm.

Claims

1. A surface treatment method, characterized in that, The specific steps are as follows: Step 1: Input the geometric parameters, material properties and processing target of the sample to be processed into the PID controller (8); Step 2: Generate the rotation speed of the rotating platform (5) based on the geometric parameters of the sample to be processed; Step 3: Adjust the rotation speed of the rotating platform (5) according to the material properties of the sample to be processed and the processing target; Step 4: Obtain the moving speed of the slider (4) on the lifting track (3) based on the rotation speed of the rotating platform (5); Step 5: Start the ion beam emitter (7), and control the device according to the rotation speed of the rotating platform (5) and the moving speed of the lifting track (3) until the processing is completed; In step 1, when the sample to be processed is a cylinder, the geometric parameters include height H and diameter D; when the sample to be processed is a gear, the geometric parameters include module m, number of teeth z, and tooth height h. The processing objectives of the sample to be processed include the thickness reduction during processing and the surface roughness after processing; The material properties of the sample to be processed include the elongation and thermal conductivity of the material; In step 2, when the sample to be processed is a cylinder, the initial rotation speed of the rotating platform (5) is... Calculate using the following formula: in, The minimum rotational speed to ensure basic uniformity, The maximum permissible rotational speed of the rotating platform (5); When the sample to be processed is a gear, the rotation speed of the rotating platform (5) Calculate using the following formula: in, The base rotational speed of the rotating platform (5) This represents the tooth height of the gear. The module of the gear is given, and the basic rotational speed is taken as 50%-80% of the maximum rotational speed of the rotating platform. The above surface treatment method uses an ion processing device with vertical degrees of freedom, including a base (1), a shell (2) fixedly connected to the upper surface of the base (1), a lifting track (3) perpendicular to the base (1) fixedly connected to the inner wall of the shell (2), a slider (4) slidably connected inside the lifting track (3), a rotating platform (5) fixedly connected to the side of the slider (4) away from the lifting track (3), a stage (6) fixedly connected above the rotating platform (5), and an ion beam emitter (7) fixedly connected to the inner wall of the shell (2) opposite to the lifting track (3).

2. The surface treatment method according to claim 1, characterized in that, The lifting track (3) is driven by a stepper motor or a servo motor.

3. The surface treatment method according to claim 1, characterized in that, The lifting track (3), rotating platform (5) and ion beam emitter (7) are all connected to the same PID controller (8).

4. The surface treatment method according to claim 1, characterized in that, In step 3, the initial rotation speed of the rotating platform (5) is... The correction is made according to the following formula: in, This is the corrected rotational speed of the rotating platform. The target thickness correction factor is... For target roughness correction factor, Target material property correction factor; When the target thickness is greater than 30 μm When the target thickness is between 10μm and 30μm When the target thickness is less than 10μm ; The target material property correction factor The possible values ​​are shown in the table below: When the target roughness Ra is greater than 0.5 μm When the target roughness is between 0.1 μm and 0.5 μm When the target roughness is less than 0.1 μm .

5. The surface treatment method according to claim 1, characterized in that, The moving speed of the slider (4) on the lifting track (3) in step 4 Calculate using the following formula: in, This is the corrected rotational speed of the rotating platform. The diameter of the ion beam spot emitted by the ion beam emitter (7) is given. The overlap ratio of the ion beam spots. The calculation method is as follows: Where d is the scanning spacing of the ion beam emitter (7).

6. The surface treatment method according to claim 1, characterized in that, When the thickness reduction of the device in step 5 exceeds the tolerance during operation, the moving speed of the slider (4) needs to be adjusted according to the actual situation. The adjustment method is as follows: in The adjusted moving speed of slider (4) To adjust the moving speed of the front slider (4), To account for the thickness difference between the processed and unprocessed areas of the sample, To reduce the thickness to the target.

7. The surface treatment method according to claim 1, characterized in that, When the device in step 5 deviates in vertical displacement during operation, it should be adjusted according to the following method: Step 5.1: Calculate the deviation value during the operation. The calculation method is as follows: in This represents the vertical displacement deviation. This represents the actual displacement in the vertical direction. This represents the target displacement in the vertical direction. For the deviation of the rotation speed, This is the actual rotation speed. The target rotation speed is set in advance; Step 5.2: Adjust the deviation according to the PID control law, which is as follows: in, To control the quantity, , , These are the proportional, integral, and derivative gains, respectively. This is the deviation value; when a deviation occurs in the vertical displacement... When an error occurs in the horizontal rotation ; Step 5.3: The PID controller (8`) based on the control quantity Adjust the moving speed of the slider (4) or the movement of the rotating platform (5).

Images