A high-temperature resistant and antistatic chip packaging material and its preparation method

Abstract

This invention provides a high-temperature resistant and antistatic chip packaging material, prepared from the following components in parts by weight: 50-55 parts polystyrene resin, 5-6 parts crosslinking agent, 0.5-1 part lubricant, 0.3-0.6 parts antioxidant, 1-2 parts additives, 16-20 parts antistatic agent, and 1-1.5 parts toughening agent. This invention also provides a method for preparing this high-temperature resistant and antistatic chip packaging material. The high-temperature resistant and antistatic chip packaging material provided by this invention has strong high-temperature resistance and antistatic properties.

Description

Technical Field

[0001] This invention relates to a packaging material, and more particularly to a high-temperature resistant and antistatic chip packaging material and its preparation method. Background Technology

[0002] Against the backdrop of the rapid development of the electronics industry, electronic components are continuously advancing towards miniaturization, high performance, and integration. In the processing, storage, and use stages of many fields such as automotive electronics, aerospace electronic equipment, and high-end smartphone manufacturing, they often face the severe challenges of high-temperature environments. For example, the ambient temperature of electronic control units in automotive engine compartments exceeds 100°C during operation, and aerospace electronic systems face extreme high temperatures during flight. However, traditional packaging materials are difficult to adapt to high-temperature conditions, easily leading to deformation and performance degradation, which affects the quality and reliability of components.

[0003] Furthermore, electronic components are extremely sensitive to static electricity; even minute electrostatic discharges can damage them. Existing packaging materials often lack sufficient electrostatic protection, increasing the risk of electrostatic hazards. While polystyrene (PS) is easy to process, relatively inexpensive, and lightweight, ordinary PS materials have shortcomings in high-temperature resistance and antistatic properties. Most packaging materials currently on the market fail to simultaneously meet the requirements of high-temperature resistance and antistatic properties, and the high prices of similar products from high-end foreign brands limit their use by domestic companies. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a high-temperature resistant and antistatic chip packaging material, which has strong high-temperature resistance and antistatic properties.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows:

[0006] A high-temperature resistant and antistatic chip packaging material is prepared from the following components in parts by weight: 50-55 parts polystyrene resin, 5-6 parts crosslinking agent, 0.5-1 part lubricant, 0.3-0.6 parts antioxidant, 1-2 parts additives, 16-20 parts antistatic agent, and 1-1.5 parts toughening agent.

[0007] Furthermore, the polystyrene resin described in this invention is a HIPS resin with a melt index of 6 to 9 g / 10 min under test conditions of 200°C and 5 kg.

[0008] Furthermore, the crosslinking agent of the present invention is composed of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1.

[0009] Furthermore, the lubricant described in this invention is ethylene bis-stearamide.

[0010] Furthermore, the antioxidant of the present invention is composed of antioxidant 245 and antioxidant 300 in a mass ratio of 1:1.

[0011] Furthermore, the adjuvant described in this invention is ethyl 5-aminoisoxazole-3-carboxylate.

[0012] Furthermore, the antistatic agent of the present invention is prepared by the following steps:

[0013] A1. Add scandium chloride to deionized water and mix evenly to obtain a scandium chloride solution. Add antimony tin oxide to the scandium chloride solution and then add ammonia water dropwise to adjust the pH value to 11. Stir for 20-30 minutes to obtain a mixed solution. Filter the mixed solution to obtain filter residue. Dry the filter residue for 8-10 hours and then heat treat it at 400-500℃ for 2-3 hours to obtain scandium oxide coated antimony tin oxide.

[0014] A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed evenly with carbon black, heated to 1400-1500℃ and held for 1-2 hours, and then cooled to room temperature to obtain an antistatic agent.

[0015] Furthermore, in step A1 of the preparation of the antistatic agent of the present invention, the mass ratio of scandium chloride, deionized water, and antimony tin oxide is 1:25:5, the mass fraction of ammonia water is 25%, and the drying temperature is 100°C; in step A2, the mass ratio of scandium oxide coated antimony tin oxide to carbon black obtained in step A1 is 10:3.

[0016] Furthermore, the toughening agent described in this invention is SBS.

[0017] Another technical problem to be solved by the present invention is to provide a method for preparing the above-mentioned high-temperature resistant and antistatic chip packaging material.

[0018] To solve the above technical problems, the technical solution is as follows:

[0019] A method for preparing a high-temperature resistant and antistatic chip packaging material includes the following steps:

[0020] B1. Weigh each component according to the weight percentage, add each component to the mixer, and stir at 400-600 rpm for 25-35 minutes to obtain the mixture;

[0021] B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the speed of the twin-screw extruder is 50-80 rpm, the temperature range of melt extrusion is 210-250℃, and the length-to-diameter ratio is 30:1.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1) The crosslinking agent used in this invention is composed of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane. The latter can enhance the stability of the internal structure of the chip packaging material, improve the chip packaging material's resistance to deformation under high temperature conditions, and thus improve the high temperature resistance of the chip packaging material.

[0024] 2) Antimony tin oxide has good electrical conductivity, but its heat resistance is poor. Therefore, this invention prepares scandium oxide-coated antimony tin oxide by hydrothermal method with scandium chloride and antimony tin oxide, and then prepares an antistatic agent with scandium carbide-coated antimony tin oxide structure by carbothermal reduction method with carbon black. Scandium carbide has excellent high temperature resistance, so the antistatic agent has good high temperature resistance and antistatic properties. However, its dispersion stability in chip packaging materials is not ideal, and it cannot fully exert its excellent performance. In this regard, the additive used in this invention - ethyl 5-aminoisoxazole-3-carboxylate can play a good dispersing role, which can effectively improve the dispersion stability of the antistatic agent, thereby improving the high temperature resistance and antistatic properties of the chip packaging material. Detailed Implementation

[0025] The present invention will now be described in detail with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0026] Example 1

[0027] The high-temperature resistant and antistatic chip packaging material is prepared from the following components in parts by weight: 54 parts polystyrene resin, 5.7 parts crosslinking agent, 0.8 parts lubricant, 0.5 parts antioxidant, 1.6 parts additives, 18 parts antistatic agent, and 1.4 parts toughening agent. The polystyrene resin is HIPS resin with a melt index of 7 g / 10 min under test conditions of 200℃ and 5 kg. The crosslinking agent consists of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1. The lubricant is ethylene bis-stearamide. The antioxidant consists of antioxidant 245 and antioxidant 300 in a mass ratio of 1:1. The additive is ethyl 5-aminoisoxazole-3-carboxylate, and the toughening agent is SBS.

[0028] The antistatic agent is prepared by the following steps:

[0029] A1. Scandium chloride was added to deionized water and mixed evenly to obtain a scandium chloride solution. Tin antimony oxide was added to the scandium chloride solution, and then 25% ammonia water was added dropwise to adjust the pH value to 11. The mass ratio of scandium chloride, deionized water and tin antimony oxide was 1:25:5. The mixture was stirred for 25 minutes to obtain a mixed solution. The mixed solution was filtered to obtain a filter residue. The filter residue was dried at 100℃ for 9 hours and then heat-treated at 450℃ for 2.5 hours to obtain scandium oxide-coated tin antimony oxide.

[0030] A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed with carbon black at a mass ratio of 10:3. The mixture is heated to 1450°C and held at that temperature for 1.5 hours. After cooling to room temperature, an antistatic agent is obtained.

[0031] The preparation method of Example 1 includes the following steps:

[0032] B1. Weigh each component according to the weight percentage, add each component to the mixer, and mix at 500 rpm for 30 minutes to obtain the mixture;

[0033] B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the twin-screw extruder has a rotation speed of 70 rpm, a melt extrusion temperature range of 210-250℃, and a length-to-diameter ratio of 30:1.

[0034] Example 2

[0035] The high-temperature resistant and antistatic chip packaging material is prepared from the following components in parts by weight: 55 parts polystyrene resin, 6 parts crosslinking agent, 1 part lubricant, 0.6 parts antioxidant, 2 parts additives, 20 parts antistatic agent, and 1.5 parts toughening agent. The polystyrene resin is HIPS resin with a melt index of 8 g / 10 min under test conditions of 200℃ and 5 kg. The crosslinking agent consists of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1. The lubricant is ethylene bis-stearamide. The antioxidant consists of antioxidant 245 and antioxidant 300 in a mass ratio of 1:1. The additive is ethyl 5-aminoisoxazole-3-carboxylate, and the toughening agent is SBS.

[0036] The antistatic agent is prepared by the following steps:

[0037] A1. Scandium chloride is added to deionized water and mixed evenly to obtain a scandium chloride solution. Tin antimony oxide is added to the scandium chloride solution, and then 25% ammonia water is added dropwise to adjust the pH value to 11. The mass ratio of scandium chloride, deionized water and tin antimony oxide is 1:25:5. The mixture is stirred for 30 minutes to obtain a mixed solution. The mixed solution is filtered to obtain a filter residue. The filter residue is dried at 100℃ for 10 hours and then heat-treated at 400℃ for 3 hours to obtain scandium oxide coated tin antimony oxide.

[0038] A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed with carbon black at a mass ratio of 10:3. The mixture is heated to 1480℃ and held at that temperature for 2 hours. After cooling to room temperature, an antistatic agent is obtained.

[0039] The preparation method of Example 2 includes the following steps:

[0040] B1. Weigh each component according to the weight percentage, add each component to the mixer, and mix at 600 rpm for 25 minutes to obtain the mixture;

[0041] B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the twin-screw extruder has a rotation speed of 80 rpm, a melt extrusion temperature range of 210-250℃, and a length-to-diameter ratio of 30:1.

[0042] Example 3

[0043] The high-temperature resistant and antistatic chip packaging material is prepared from the following components in parts by weight: 52 parts polystyrene resin, 5.4 parts crosslinking agent, 0.6 parts lubricant, 0.4 parts antioxidant, 1.2 parts additives, 17 parts antistatic agent, and 1.2 parts toughening agent. The polystyrene resin is HIPS resin with a melt index of 6 g / 10 min under test conditions of 200℃ and 5 kg. The crosslinking agent consists of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1. The lubricant is ethylene bis-stearamide. The antioxidant consists of antioxidant 245 and antioxidant 300 in a mass ratio of 1:1. The additive is ethyl 5-aminoisoxazole-3-carboxylate, and the toughening agent is SBS.

[0044] The antistatic agent is prepared by the following steps:

[0045] A1. Scandium chloride was added to deionized water and mixed evenly to obtain a scandium chloride solution. Tin antimony oxide was added to the scandium chloride solution, and then 25% ammonia water was added dropwise to adjust the pH value to 11. The mass ratio of scandium chloride, deionized water and tin antimony oxide was 1:25:5. The mixture was stirred for 28 minutes to obtain a mixed solution. The mixed solution was filtered to obtain a filter residue. The filter residue was dried at 100℃ for 9.5 hours and then heat-treated at 450℃ for 3 hours to obtain scandium oxide-coated tin antimony oxide.

[0046] A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed with carbon black at a mass ratio of 10:3. The mixture is heated to 1400℃ and held for 2 hours. After cooling to room temperature, an antistatic agent is obtained.

[0047] The preparation method of Example 3 includes the following steps:

[0048] B1. Weigh each component according to the weight percentage, add each component to the mixer, and mix at 500 rpm for 25 minutes to obtain the mixture;

[0049] B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the twin-screw extruder has a rotation speed of 60 rpm, a melt extrusion temperature range of 210-250℃, and a length-to-diameter ratio of 30:1.

[0050] Example 4

[0051] The high-temperature resistant and antistatic chip packaging material is prepared from the following components in parts by weight: 50 parts polystyrene resin, 5 parts crosslinking agent, 0.5 parts lubricant, 0.3 parts antioxidant, 1 part additive, 16 parts antistatic agent, and 1 part toughening agent. The polystyrene resin is HIPS resin with a melt index of 9 g / 10 min under test conditions of 200℃ and 5 kg. The crosslinking agent consists of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1. The lubricant is ethylene bis-stearamide. The antioxidant consists of antioxidant 245 and antioxidant 300 in a mass ratio of 1:1. The additive is ethyl 5-aminoisoxazole-3-carboxylate, and the toughening agent is SBS.

[0052] The antistatic agent is prepared by the following steps:

[0053] A1. Scandium chloride is added to deionized water and mixed evenly to obtain a scandium chloride solution. Tin antimony oxide is added to the scandium chloride solution, and then 25% ammonia water is added dropwise to adjust the pH value to 11. The mass ratio of scandium chloride, deionized water and tin antimony oxide is 1:25:5. The mixture is stirred for 20 minutes to obtain a mixed solution. The mixed solution is filtered to obtain a filter residue. The filter residue is dried at 100℃ for 8 hours and then heat-treated at 500℃ for 2 hours to obtain scandium oxide coated tin antimony oxide.

[0054] A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed with carbon black at a mass ratio of 10:3. The mixture is heated to 1500℃ and held for 1 hour. After cooling to room temperature, an antistatic agent is obtained.

[0055] The preparation method of Example 4 includes the following steps:

[0056] B1. Weigh each component according to the weight percentage, add each component to the mixer, and mix at 400 rpm for 35 minutes to obtain the mixture;

[0057] B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the twin-screw extruder has a rotation speed of 50 rpm, a melt extrusion temperature range of 210-250℃, and a length-to-diameter ratio of 30:1.

[0058] Comparative Example 1:

[0059] The difference from Example 1 is that the crosslinking agent in the component is replaced with pure dicumyl peroxide, that is, the crosslinking agent does not contain N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane.

[0060] Comparative Example 2:

[0061] The difference from Example 1 is that the components do not include the adjuvant ethyl 5-aminoisoxazole-3-carboxylate.

[0062] Comparative Example 3:

[0063] The difference from Example 1 is that the components do not include an antistatic agent, thus omitting the preparation step of the antistatic agent.

[0064] Comparative Example 4:

[0065] The difference from Example 1 is that the antistatic agent in the components is replaced with pure antimony tin oxide, and the preparation step of the antistatic agent is omitted.

[0066] Experiment Example 1: High Temperature Resistance Test

[0067] The heat distortion temperature of the chip packaging materials prepared in Examples 1-4, Comparative Examples 1, 2, and 4 were determined according to ASTM D648 standard, with a test pressure of 1.8 MPa. A higher heat distortion temperature indicates better high-temperature resistance. The test results are shown in Table 1.

[0068]

[0069] Table 1

[0070] As shown in Table 1, the heat distortion temperatures of Examples 1-4 of the present invention are all relatively high, indicating that the high-temperature resistant and antistatic chip packaging material prepared by the present invention has good high-temperature resistance. Some components of Comparative Examples 1, 2, and 4 differ from those of Example 1. Compared with Example 1, the heat distortion temperature of Comparative Example 4 is significantly lower, indicating that the antistatic agent prepared by the present invention has a significantly better effect on improving the high-temperature resistance of the chip packaging material compared to antimony tin oxide. Compared with Example 1, the heat distortion temperatures of Comparative Examples 1 and 2 are both lower, indicating that N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in the crosslinking agent and the additive ethyl 5-aminoisoxazole-3-carboxylate in the present invention also play a role in improving the high-temperature resistance of the chip packaging material.

[0071] Experiment Example 2: Antistatic Performance Test

[0072] The surface resistivity of the encapsulation materials prepared in Examples 1-4 and Comparative Examples 2-3 was measured according to ASTM D257 standard. The test temperature was 25°C and the humidity was 50%. Lower surface resistivity indicates better antistatic performance. The test results are shown in Table 2.

[0073]

[0074] Table 2

[0075] As shown in Table 2, the surface resistivity of Examples 1-4 of the present invention is relatively low, indicating that the high-temperature resistant antistatic chip packaging material prepared by the present invention has good antistatic performance. Some components of Comparative Examples 2-3 differ from those of Example 1. Compared with Example 1, the surface resistivity of Comparative Example 3 is significantly increased, indicating that the antistatic agent used in the present invention can effectively improve the antistatic performance of the chip packaging material. Compared with Example 1, the surface resistivity of Comparative Example 2 is also increased, indicating that the additive ethyl 5-aminoisoxazole-3-carboxylate used in the present invention can also improve the antistatic performance of the chip packaging material.

[0076] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A high-temperature resistant and antistatic chip packaging material, characterized in that: It is prepared from the following components in parts by weight: 50-55 parts polystyrene resin, 5-6 parts crosslinking agent, 0.5-1 part lubricant, 0.3-0.6 parts antioxidant, 1-2 parts additives, 16-20 parts antistatic agent, and 1-1.5 parts toughening agent; wherein the crosslinking agent is composed of dicumyl peroxide and N-(2-aminoethyl)-3-aminopropylmethyldiethoxysilane in a mass ratio of 4:1; and the additive is ethyl 5-aminoisoxazole-3-carboxylate. The antistatic agent is prepared by the following steps: A1. Add scandium chloride to deionized water and mix evenly to obtain a scandium chloride solution. Add antimony tin oxide to the scandium chloride solution and then add ammonia water dropwise to adjust the pH value to 11. Stir for 20-30 minutes to obtain a mixed solution. Filter the mixed solution to obtain filter residue. Dry the filter residue for 8-10 hours and then heat treat it at 400-500℃ for 2-3 hours to obtain scandium oxide coated antimony tin oxide. A2. Under argon protection, the scandium oxide-coated tin antimony oxide obtained in step A1 is mixed evenly with carbon black, heated to 1400-1500℃ and held for 1-2 hours, and then cooled to room temperature to obtain an antistatic agent.

2. The high-temperature resistant and antistatic chip packaging material according to claim 1, characterized in that: The polystyrene resin is a HIPS resin with a melt index of 6-9 g / 10 min under the test conditions of 200℃ and 5 kg.

3. The high-temperature resistant and antistatic chip packaging material according to claim 1, characterized in that: The lubricant is ethylene bis-stearamide.

4. The high-temperature resistant and antistatic chip packaging material according to claim 1, characterized in that: The antioxidant is composed of antioxidant 245 and antioxidant 300 in a mass ratio of 1:

1.

5. The high-temperature resistant and antistatic chip packaging material according to claim 1, characterized in that: In step A1 of the preparation of the antistatic agent, the mass ratio of scandium chloride, deionized water, and antimony tin oxide is 1:25:5, the mass fraction of ammonia is 25%, and the drying temperature is 100℃; in step A2, the mass ratio of scandium oxide coated antimony tin oxide to carbon black obtained in step A1 is 10:

3.

6. The high-temperature resistant and antistatic chip packaging material according to claim 1, characterized in that: The toughening agent is SBS.

7. A method for preparing a high-temperature resistant and antistatic chip packaging material according to any one of claims 1 to 6, characterized in that: Includes the following steps: B1. Weigh each component according to the weight percentage, add each component to the mixer, and stir at 400-600 rpm for 25-35 minutes to obtain the mixture; B2. Add the mixture obtained in step B1 to a twin-screw extruder, melt extrude it, and then pelletize it to obtain a high-temperature resistant and antistatic chip packaging material; the speed of the twin-screw extruder is 50-80 rpm, the temperature range of melt extrusion is 210-250℃, and the length-to-diameter ratio is 30:1.

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