Busbar welding method and busbar assembly

Abstract

This invention relates to the field of busbar welding technology, and discloses a busbar welding method and a busbar assembly. The busbar welding method includes: folding the end of the busbar to form a folded structure with a first drain groove; the end overlapping a conductive sheet on which solder is placed, the folded structure being located on one side of the solder, and the opening of the first drain groove facing the solder; welding the end; wherein the first drain groove is used to attract molten solder to flow towards the folded structure. When used for welding the connection between the busbar and the conductive sheet in the junction box, this invention can prevent excessive solder from flowing into the lead hole and causing outflow, ensuring that the solder can fully fill the space between the end and the conductive sheet, reducing the risk of cold solder joints in the busbar; in addition, the solder flowing to the first drain groove fully wets and coats the folded structure, forming multiple layers of solder after cooling, which helps to increase the welding pull between the conductive sheet and the busbar, ensuring a stable connection between the conductive sheet and the busbar.

Description

Technical Field

[0001] This invention relates to the field of busbar welding technology, and more specifically to busbar welding methods and busbar assemblies. Background Technology

[0002] A photovoltaic (PV) power generation system mainly consists of three parts: PV modules, a controller, and an inverter. Within the PV modules, busbars and junction boxes are interconnected, and the junction boxes are then connected to external power lines to collect and transmit the current generated by the PV modules.

[0003] For small junction boxes with limited internal space, the relevant technologies generally connect the busbars by welding. This involves inserting the busbar into the junction box and then welding it to the conductive sheet of the junction box using a welding head. However, the connection between the busbar and the conductive sheet is prone to poor soldering, which in turn affects the reliability and safety of the photovoltaic module. Summary of the Invention

[0004] In view of this, the present invention provides a busbar welding method and a busbar assembly to solve the problem of busbars being prone to poor soldering.

[0005] In a first aspect, the present invention provides a busbar welding method, comprising: folding the end of a busbar to form a folded structure having a first flow channel; the end being overlapped on a conductive sheet on which solder is placed, the folded structure being located on one side of the solder, and the opening of the first flow channel facing the solder; welding the end; wherein the first flow channel is used to attract molten solder to flow toward one side of the folded structure.

[0006] Beneficial effects: During the welding process, the solder melts upon heating and then solidifies upon cooling, connecting the end and the conductive sheet together. The first drainage groove attracts the molten solder to flow towards the folded structure, thereby reducing the amount of solder flowing in the opposite direction. When used to weld the busbar and the conductive sheet in the junction box, the busbar welding method can prevent excessive solder from flowing into the lead hole and causing outflow, ensuring that the solder can fully fill the space between the end and the conductive sheet, reducing the risk of cold solder joints in the busbar. In addition, the solder flowing to the first drainage groove fully wets and coats the folded structure, forming multiple layers of solder after cooling, which helps to increase the welding pull between the conductive sheet and the busbar, ensuring a stable connection between the conductive sheet and the busbar.

[0007] In one optional embodiment, welding the end comprises: pressing the end onto the solder with a welding head, causing the folded structure to deform under pressure, and reducing the volume of the first drainage channel; heating the end with the welding head, causing the solder to melt, and attracting the solder using capillary action in the first drainage channel; and removing the welding head from the end, causing the folded structure to rebound, increasing the volume of the first drainage channel, and further attracting the solder.

[0008] Beneficial effects: First, the first channel can attract solder using capillary action. On this basis, the elasticity of the busbar increases the volume of the first channel, which can further attract uncured solder to flow to one side of the first channel when the busbar rebounds. This helps to fill the newly formed space between the end of the busbar and the conductive sheet after rebounding, and also further reduces the solder flowing to the lead hole side, thereby better reducing the risk of cold solder joints in the busbar.

[0009] In one alternative embodiment, the folded structure abuts against the conductive sheet before the solder melts.

[0010] Beneficial effects: By first bringing the folded structure and the conductive sheet into contact before melting the solder, it is possible to prevent the molten solder from flowing out of the gap between the folded structure and the conductive sheet, ensuring that the solder can fully fill the space between the end and the conductive sheet; in addition, after contact, a second flow channel is formed between the folded structure and the conductive sheet, and the second flow channel can also utilize capillary action to further attract the solder to flow towards the folded structure side.

[0011] In one alternative embodiment, the initial thickness h1 of the folded structure is greater than the thickness h0 of the unmelted solder, and the thickness h2 of the busbar is less than the thickness h0 of the unmelted solder.

[0012] Beneficial effects: h1 is greater than h0, which helps to ensure that the folded structure presses against the conductive sheet before the end of the solder, ensuring that the folded structure presses against the conductive sheet before welding; h2 is less than h0, which can prevent the first drainage groove from completely disappearing after the folded structure is pressed, ensuring that the first drainage groove can normally attract solder.

[0013] In one alternative embodiment, between the end of the folded busbar and the end overlapping the conductive sheet on which solder is placed, the end further includes passing through a lead hole into the housing of the junction box, the length L of the lead hole being greater than the initial thickness h1 of the folded structure.

[0014] Beneficial effects: The operating space in the junction box is limited. Inserting the lead wire hole after folding the outer end first facilitates the production of the folding structure. Using a larger lead wire hole can prevent the folding structure from being squeezed during the insertion process and can also prevent the folding structure from scratching the adhesive on the bottom of the box, reducing the risk of poor soldering of the busbar.

[0015] In one alternative embodiment, the width w1 of the unmelted solder is greater than the width w2 of the end.

[0016] Beneficial effects: After being heated and melted, the solder is attracted by capillary action, resulting in a decrease in size in the width direction and an increase in size in the length direction. This allows it to fully fill the space between the end and the conductive sheet. Using solder with a relatively large width dimension ensures that the solder has sufficient volume.

[0017] In one alternative implementation, in the lapped state, the folded structure abuts against the side of the solder.

[0018] Beneficial effect: The folding structure against the side allows the opening of the first channel to be as close as possible to the solder, thereby improving the attraction effect of the first channel on the solder.

[0019] Secondly, the present invention also provides a bus assembly, including a conductive sheet, solder, and a bus bar, wherein the solder is disposed on the top of the conductive sheet, and the end of the bus bar is connected to the conductive sheet through the solder. The end includes a folded structure, the folded structure forming a first drainage groove, and the solder fills at least a portion of the first drainage groove.

[0020] Beneficial effects: During welding, the molten solder is attracted by the first channel, thereby filling at least part of the first channel after solidification. The attraction effect of the first channel can reduce the solder flowing to the other side, reduce the risk of solder flowing out along the busbar, and make the welding between the conductive sheet and the busbar tighter.

[0021] In one optional embodiment, a junction box is further included, the junction box including a box body, the conductive sheet being disposed in the box body, a through lead hole being opened at the bottom of the box body, the bus bar passing through the lead hole, and the folding structure being connected to the end of the solder away from the lead hole.

[0022] Beneficial effects: During soldering, the folded structure attracts the solder to flow away from the lead hole, thereby reducing the mass of solder flowing into the lead hole and reducing the risk of solder flowing out of the lead hole along the busbar.

[0023] In one alternative embodiment, a second drain groove is formed between the folded structure and the conductive sheet, and the solder fills at least a portion of the second drain groove.

[0024] Beneficial effects: The second drain groove can attract solder, and the first and second drain grooves work together to produce a stronger attraction effect. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of busbar welding in related technologies;

[0027] Figure 2 This is a schematic diagram illustrating the principle of a busbar welding method according to an embodiment of the present invention, showing a busbar assembly welded using the busbar welding method;

[0028] Figure 3 This is a schematic diagram illustrating the principle of a busbar welding method according to an embodiment of the present invention, showing the difference between the width of the solder and the width of the end.

[0029] Figure 4 This is a schematic diagram of a busbar assembly according to an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Box body; 2. Lead wire hole; 3. Busbar; 301. Folding structure; 302. First lead groove; 4. Conductive sheet; 5. Solder; 6. Second lead groove; 7. Welding head. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a," "an," and "comprising" as used herein may also mean including the plural forms. The terms "comprising," "including," and "having" are inclusive and therefore indicate the presence of the stated features, elements, and / or components, but do not exclude the presence or addition of one or more other features, elements, components, and / or combinations thereof.

[0034] Although terms such as "first," "second," etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Furthermore, in the description of this invention, unless otherwise expressly specified and limited, the terms "set up" and "connected" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a direct connection or an indirect connection via an intermediate medium. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0035] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "end," "length," "inner," "outer," etc. Such spatial relative terms are intended to include different orientations of the mechanism in use or operation, in addition to those depicted in the figure. For example, if the mechanism in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The mechanism may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0036] In related technologies, the busbar 3 is connected to the conductive sheet 4 of the junction box by welding, which poses a risk of poor soldering.

[0037] There are several reasons for cold solder joints. For example, on the one hand, during the soldering process, the soldering head 7 presses the busbar 3 against the solder 5 (e.g., solder). After the soldering head 7 leaves the busbar 3, the busbar 3 tends to spring back, resulting in a gap at the contact surface between the busbar 3 and the solder 5, thus causing a cold solder joint. On the other hand, referring to... Figure 1 Busbar 3 passes through lead hole 2 into junction box. Some of the molten solder 5 will flow into the gap between busbar 3 and lead hole 2 due to capillary action, resulting in insufficient solder 5 between busbar 3 and conductive sheet 4. This creates a gap at the contact surface between busbar 3 and solder 5, causing a cold solder joint. If too much solder 5 flows into lead hole 2, the solder 5 may overcome the surface tension limitation and flow out of lead hole 2 along busbar 3 (e.g., ...). Figure 1 (As indicated by the middle arrow), this makes the degree of poor soldering even more serious.

[0038] Poor soldering will prevent the solder 5 from effectively wetting the busbar 3 as a whole, resulting in insufficient bonding strength between the conductive sheet 4 and the busbar 3, low welding pull, and easy loosening and disconnection after long-term use, posing a potential quality risk.

[0039] Regarding the springback issue of busbar 3, some related technologies suppress springback by excessively bending busbar 3 before soldering, while others add clips in the junction box to hold busbar 3 in place to prevent springback, thus effectively reducing the risk of cold solder joints. However, there is currently a lack of suitable solutions for insufficient solder 5 caused by the flow of solder 5.

[0040] The following is combined with Figure 2 and Figure 3 This describes embodiments of the present invention. It should be noted that... Figure 1 , Figure 2 , Figure 3 For illustrative purposes only, the dimensions and positional relationships of the various structures in the figure are exaggerated and magnified to varying degrees for ease of observation.

[0041] Reference Figure 2 and Figure 3 According to an embodiment of the present invention, a busbar welding method includes the following steps:

[0042] Step S110: Fold the end of the busbar 3 to form a folded structure 301 with a first drainage groove 302.

[0043] like Figure 2 As shown, after folding, a portion of the ends of the busbars 3 are stacked to form a folded structure 301, with gaps between the stacked busbars 3 forming the first drainage groove 302.

[0044] exist Figure 2 In the illustrated embodiment, the end is folded only once to form a double-layered folded structure 301. In other embodiments not shown, the end may be folded multiple times as needed to form a folded structure 301 with more layers and a more complex shape. The present invention does not limit this.

[0045] Step S120: The end overlaps on the conductive sheet 4 on which the solder 5 is placed, the folding structure 301 is located on one side of the solder 5, and the opening of the first channel 302 faces the solder 5.

[0046] Understandably, after overlapping onto the conductive sheet 4, the end extends from one side of the solder 5 to the other side, while the bottom surface of the end contacts the solder 5. By selecting a busbar 3 of appropriate length, the end crosses the solder 5 after overlapping, with the folded structure 301 located on one side of the solder 5 and the other end of the busbar 3 located on the other side of the solder 5, to facilitate subsequent soldering. Figure 3 As shown, the end extends along the length direction (X direction) from one side of solder 5 to the other side of solder 5.

[0047] Step S130: Welding end, wherein the first flow channel 302 is used to attract the molten solder 5 to flow to one side of the folded structure 301.

[0048] Specifically, step S140 includes:

[0049] Step S131: The welding head 7 heats the end, the solder 5 melts, and the first channel 302 uses capillary action to attract the solder 5.

[0050] In this invention, the solder 5 is welded by the welding head 7. The welding head 7 presses down on the end, and the end is heated first. Then, the heat is conducted to the solder 5 through the contact surface between the end and the solder 5, causing the solder 5 to melt. After cooling and solidification, the end and the conductive sheet 4 are connected together. The molten solder 5 is fluid and can flow between the end and the conductive sheet 4, thereby filling the space between the end and the conductive sheet 4. The solder 5 is attracted by the first flow channel 302, thereby flowing towards the folded structure 301.

[0051] According to the busbar welding method provided by the present invention, it is suitable for welding the busbar 3 and the conductive sheet 4 in the junction box. The busbar 3 passes through the lead hole 2 opened in the box body 1 of the junction box. The first drainage groove 302 can attract the molten solder 5 to flow towards the folded structure 301 side, thereby reducing the amount of solder 5 flowing towards the lead hole 2 side, avoiding excessive flow of solder 5 into the lead hole 2 and causing outflow, ensuring that the solder 5 can fully fill the space between the end and the conductive sheet 4, reducing the risk of poor soldering of the busbar 3; in addition, the solder 5 flowing towards the first drainage groove 302 fully wets and wraps the folded structure 301, and forms multiple layers of solder 5 after cooling, which helps to increase the welding pull between the conductive sheet 4 and the busbar 3, ensuring a stable connection between the conductive sheet 4 and the busbar 3.

[0052] Reference Figure 2 and Figure 3 According to another embodiment of the present invention, a busbar welding method includes the following steps:

[0053] Step S210: Fold the end of the busbar 3 to form a folded structure 301 with a first drainage groove 302.

[0054] Step S220: The end is inserted into the junction box body 1 through the lead hole 2.

[0055] Busbar 3 and junction box are used to collect the current generated by the photovoltaic module and output it externally. Busbar 3 passes through lead hole 2 into junction box for soldering connection. Specifically, busbar 3 is connected to diode in junction box through conductive plate 4.

[0056] Optionally, in some embodiments, step S210 is performed before step S220, that is, the end is folded over and then inserted into the junction box through the lead hole 2. Since the end is constrained by the junction box after passing through the lead hole 2, the operating space in the junction box is limited. Folding the end over externally first and then inserting it into the lead hole 2 can facilitate the fabrication of the folding structure 301.

[0057] Furthermore, in some embodiments, the length L of the lead hole 2 is greater than the initial thickness h1 of the folded structure 301. The initial thickness h1 refers to the thickness of the folded structure 301 when the external fold is completed. Using a larger lead hole 2 ensures that the folded structure 301 is not squeezed by the lead hole 2 when passing through it, thus preventing the folded structure 301 from being compressed and causing deformation of the first drainage groove 302. In addition, some junction boxes are fixed by adhesive at the bottom, and using a larger lead hole 2 can also prevent the folded structure 301 from scratching the adhesive, reducing the risk of poor soldering of the busbar 3.

[0058] Step S230: The end overlaps on the conductive sheet 4 on which the solder 5 is placed, the folding structure 301 is located on the side of the solder 5 away from the lead hole 2, and the opening of the first channel 302 faces the solder 5.

[0059] Optionally, in some embodiments, in the lapped state, the folded structure 301 abuts against the side of the solder 5. The folded structure 301 abutting against the side allows the opening of the first drainage groove 302 to be as close as possible to the solder 5, thereby improving the attraction effect of the first drainage groove 302 on the solder 5.

[0060] Optionally, refer to Figure 3 In some embodiments, the width w1 of the unmelted solder 5 is greater than the width w2 of the end. After being heated and melted, the solder 5 is attracted by capillary action, decreasing in size in the width direction (Y direction) and increasing in size in the length direction, thereby fully filling the space between the end and the conductive sheet 4. Using a solder 5 with a relatively large width ensures that the solder 5 has sufficient volume to meet the filling requirements and reduces the risk of cold solder joints.

[0061] Step S240: Welding end, wherein the first flow channel 302 is used to attract the molten solder 5 to flow to one side of the folded structure 301.

[0062] Optionally, in some embodiments, step S240 further includes:

[0063] Step S241: The welding head 7 presses its end onto the solder 5, causing the folded structure 301 to deform under pressure, and the volume of the first drainage groove 302 to decrease.

[0064] Specifically, during the process of the welding head 7 pressing down on the end, the bottom of the folded structure 301 abuts against the conductive sheet 4. Under the pressure of the welding head 7 and the supporting force of the conductive sheet 4, the folded structure 301 is deformed by pressure, and its thickness decreases from the initial thickness, which correspondingly reduces the volume of the first drainage groove 302.

[0065] Understandably, in the lapped state, the contact between the solder 5 and the end may not be tight. The downward pressure of the solder head 7 can also make the end more fully contact the solder 5 so as to facilitate heat transfer between the solder 5 and the end.

[0066] In addition, in some embodiments, after the folded structure 301 abuts against the conductive sheet 4, a second flow channel 6 can be formed between the folded structure 301 and the conductive sheet 4. The second flow channel 6 can also utilize capillary action to further attract the solder 5 to flow towards the folded structure 301.

[0067] Since the busbar 3 is open in the width direction (Y direction) and some of the busbar 3 surfaces are covered with solder 5, the solder 5 can still flow from one side of the contact area between the folded structure 301 and the conductive sheet 4 to the other side when the folded structure 301 is in contact with the conductive sheet 4, thus achieving full wetting and wrapping of the folded structure 301.

[0068] Step S242: The welding head 7 heats the end, the solder 5 melts, and the first channel 302 uses capillary action to attract the solder 5.

[0069] It is understood that the downward pressure of the welding head 7 and the heating of the welding head 7 may be performed in parallel or sequentially. Optionally, in some embodiments, the folded structure 301 abuts against the conductive sheet 4 before the solder 5 melts. In other words, the welding head 7 first presses down, and after ensuring that the folded structure 301 abuts against the conductive sheet 4, the solder 5 is then heated and melted. By first making the folded structure 301 and the conductive sheet 4 abut against each other before melting the solder 5, it is possible to prevent the molten solder 5 from flowing out of the gap between the folded structure 301 and the conductive sheet 4, ensuring that the solder 5 can fully fill the space between the end and the conductive sheet 4.

[0070] Furthermore, in order to ensure the order of contact and melting, in some embodiments, the initial thickness h1 of the folding structure 301 is greater than the thickness h0 of the unmelted solder 5, and the thickness h2 of the busbar 3 is less than the thickness h0 of the unmelted solder 5.

[0071] h1 being greater than h0 helps ensure that the folded structure 301 abuts against the conductive sheet 4 before the end is pressed against the solder 5, ensuring that the folded structure 301 abuts against the conductive sheet 4 before welding; h2 being less than h0 can prevent the first drainage groove 302 from completely disappearing after the folded structure 301 is pressed, ensuring that the first drainage groove 302 can normally attract the solder 5.

[0072] Step S243: The welding head 7 leaves the end, the folded structure 301 rebounds, the volume of the first drainage groove 302 increases, and further attracts the solder 5.

[0073] It is understandable that the busbar 3 is made of elastic material. After the pressure of the solder head 7 is removed, the busbar 3 can spring back. Some related technologies use limiting structures (such as clips) to limit the springback of the busbar 3 to avoid the springback causing poor soldering. However, this cannot solve the problem of solder 5 flowing to the lead hole 2.

[0074] This invention utilizes the elasticity of the busbar 3 in reverse, causing the volume of the first channel 302 to increase during rebound, thereby generating a negative pressure attraction effect. This can further attract the uncured solder 5 to flow towards the first channel 302 side when the busbar 3 rebounds. On the one hand, this helps to fill the newly formed space between the end of the busbar 3 after rebound and the conductive sheet 4. On the other hand, it also further reduces the amount of solder 5 flowing towards the lead hole 2 side, thereby better reducing the risk of cold solder joints in the busbar 3.

[0075] The present invention also provides a bus assembly, wherein the bus assembly uses the bus bar welding method provided by the present invention to weld the bus bar 3.

[0076] The busbar assembly is welded using the busbar welding method provided by this invention, and therefore has the beneficial effects brought by the busbar welding method, which will not be elaborated here.

[0077] Figure 4 A bus component according to an embodiment of the present invention is shown, with reference to Figure 4 The busbar assembly includes a conductive sheet 4, solder 5 and busbar 3. The solder 5 is disposed on the top of the conductive sheet 4. The end of the busbar 3 overlaps the solder 5 and includes a folding structure 301. The folding structure 301 forms a first channel 302, and the solder 5 fills at least part of the first channel 302.

[0078] During welding, the molten solder 5 is attracted by the first channel 302, thereby filling at least part of the first channel 302 after solidification. The attraction of the first channel 302 can direct and guide the flow of the solder 5, reduce the solder 5 flowing away from the side of the folded structure 301, reduce the risk of the solder 5 flowing out along the busbar 3, and make the welding between the conductive sheet 4 and the busbar 3 tighter.

[0079] Specifically Figure 4 In the illustrated embodiment, the folding structure 301 undergoes one fold, thus comprising a first segment, a second segment, and a third segment connected sequentially. The second segment extends in an arc shape, and the first, second, and third segments enclose a first drainage groove 302, which communicates with the outside at the end furthest from the second segment. In other embodiments not shown, the folding structure 301 may undergo more folds, thereby increasing the number of layers and the number of first drainage grooves 302; this invention does not limit this.

[0080] Optionally, in some embodiments, the bus assembly further includes a junction box, which includes a housing 1, a conductive sheet 4 disposed inside the housing 1, and a through-hole 2 (along the Z-direction and height direction) at the bottom of the housing 1. A busbar 3 passes through the through-hole 2, and a folding structure 301 is connected to the end of the solder 5 away from the through-hole 2. During soldering, the folding structure 301 attracts the solder 5 to flow away from the through-hole 2, thereby reducing the mass of the solder 5 flowing into the through-hole 2 and reducing the risk of the solder 5 flowing out of the through-hole 2 along the busbar 3.

[0081] Optionally, in some embodiments, a second channel 6 is formed between the folded structure 301 and the conductive sheet 4, and solder 5 fills at least a portion of the second channel 6. The second channel 6 is capable of attracting solder 5, and the first channel 302 and the second channel 6 cooperate with each other to produce a stronger attraction effect.

[0082] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method for welding busbars, characterized in that, include: The end of the folded busbar (3) forms a folded structure (301) with a first drainage groove (302); The end overlaps on the conductive sheet (4) on which the solder (5) is placed, the folding structure (301) is located on one side of the solder (5), and the opening of the first drainage groove (302) faces the solder (5). Weld the ends; The first channel (302) is used to attract the molten solder (5) to flow toward the folded structure (301).

2. The busbar welding method according to claim 1, characterized in that, The welding of the ends includes: The welding head (7) presses the end onto the solder (5), the folded structure (301) is deformed under pressure, and the volume of the first drainage groove (302) decreases; The welding head (7) heats the end, the solder (5) melts, and the first channel (302) attracts the solder (5) by capillary action; When the welding head (7) leaves the end, the folding structure (301) rebounds, and the volume of the first drainage groove (302) increases, further attracting the solder (5).

3. The busbar welding method according to claim 2, characterized in that, Before the solder (5) melts, the folded structure (301) abuts against the conductive sheet (4).

4. The busbar welding method according to claim 3, characterized in that, The initial thickness h1 of the folded structure (301) is greater than the thickness h0 of the unmelted solder (5), and the thickness h2 of the busbar (3) is less than the thickness h0 of the unmelted solder (5).

5. The busbar welding method according to claim 1, characterized in that, Between the end of the folded busbar (3) and the end overlapping the conductive sheet (4) on which solder (5) is placed, the end also includes the end passing through the lead hole (2) into the junction box body (1), the length L of the lead hole (2) being greater than the initial thickness h1 of the folded structure (301).

6. The busbar welding method according to claim 1, characterized in that, The width w1 of the unmelted solder (5) is greater than the width w2 of the end.

7. The busbar welding method according to claim 1, characterized in that, In the lapped state, the folded structure (301) abuts against the side of the solder (5).

8. A bus component, characterized in that, include: Conductive sheet (4); Solder (5) is disposed on the top of the conductive sheet (4); The busbar (3) is connected to the conductive sheet (4) at its end by the solder (5). The end includes a folded structure (301) with a first channel groove (302) formed therein, and the solder (5) fills at least a portion of the first channel groove (302).

9. The busbar assembly according to claim 8, characterized in that, It also includes a junction box, which includes a box body (1), a conductive sheet (4) disposed inside the box body (1), a through lead hole (2) opened at the bottom of the box body (1), a busbar (3) passing through the lead hole (2), and a folding structure (301) connected to the end of the solder (5) away from the lead hole (2).

10. The busbar assembly according to claim 8, characterized in that, A second channel (6) is formed between the folded structure (301) and the conductive sheet (4), and the solder (5) fills at least a portion of the second channel (6).

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