一种高模量环氧树脂基结构胶材料及其制备方法
By optimizing the compounding of high-functionality epoxy resin, nano-reinforcing fillers, and toughening agents, the problem of insufficient modulus in traditional epoxy resin-based structural adhesives has been solved, resulting in structural adhesive materials that combine high modulus and toughness, suitable for aerospace and high-end automotive manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU LUHU WEINING NEW MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2025-08-28
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional epoxy resin-based structural adhesives are difficult to meet the high rigidity and deformation resistance requirements of aerospace and high-end automotive manufacturing in terms of modulus, and the addition of inorganic fillers may lead to a decrease in toughness and unstable bonding performance.
The high-functionality bisphenol F epoxy resin is compounded with alicyclic epoxy resin, combined with aromatic amine and acid anhydride curing agents, nano-reinforcing fillers such as surface-modified nano silica, nano calcium carbonate and modified multi-walled carbon nanotubes, toughening agents such as carboxyl-terminated butadiene nitrile rubber and EPDM rubber, and additives such as polyether-modified polysiloxane, etc., to improve modulus and toughness through uniform dispersion and chemical reaction.
The prepared high-modulus epoxy resin-based structural adhesive material maintains excellent bonding performance while achieving a tensile modulus of 8.3-9.6 GPa and a flexural modulus of 10.6-11.9 GPa, meeting the needs of high-end fields and possessing good impact resistance and stable modulus characteristics.
Smart Images
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