A method and device for seismic data converted wave statics correction

Abstract

The application provides a method and device for converting wave static correction of seismic data, comprising: obtaining a geophone point file, a shot point file and a relationship file of seismic data in a target work area; obtaining P-wave surface velocity and depth data and S-wave surface velocity and depth data, determining a datum elevation, a P-wave filling velocity and an S-wave filling velocity; performing vector rotation on each shot X and Y component seismic data to generate R and T component seismic data; picking up P-wave first arrival time of each shot of Z component based on offset range; setting parameters of a low-pass filter and performing low-pass filtering on R component seismic data; and calculating shot point P-wave static correction and geophone point P-wave static correction according to the datum elevation, the P-wave filling velocity and the S-wave filling velocity. In the scheme, the established S-wave surface model is accurate, the geophone point S-wave static correction has high precision, the seismic imaging quality of the converted wave R component and T component is improved, and the scheme has wide applicability and universality in converted wave seismic exploration.

Description

Technical Field

[0001] This application relates to the fields of geophysical exploration and seismic data processing technology, and in particular to a method and apparatus for convertible wave static correction of seismic data. Background Technology

[0002] In the processing of onshore seismic data, it is usually necessary to correct the seismic data to a unified reference surface, typically a horizontal plane. Seismic exploration and interpretation theories often assume that the excitation and reception points are on the same horizontal plane and that the formation velocities are uniform. However, in reality, the ground is often uneven, the depths of different excitation points may vary, and the wave velocities in the low-velocity zone differ significantly from those in the formation, inevitably affecting the shape of the measured time-distance curve. Therefore, to eliminate these effects, it is usually necessary to perform topographic correction, excitation depth correction, and low-velocity zone correction on the raw seismic data. These corrections are invariant across different seismic interfaces at the same observation point, and are therefore collectively referred to as static corrections. Furthermore, with the development of digital processing technology, various automatic static correction methods and procedures have emerged.

[0003] A prior art method provides a static correction method for converted wave delay time. Based on the near-surface model of the P-wave recorded during converted wave exploration and the difference between the first arrival times of the P-wave and the first arrival times of the horizontal component recorded during exploration, the converted wave delay time is calculated. Then, a near-surface model of the S-wave is established based on the converted wave delay time, thereby determining the static correction amount of the S-wave at the receiving point. This prior art provides a formula for calculating the static correction amount of converted wave delay time and has been verified using actual seismic data.

[0004] Existing technologies also provide a method for convertible wave static correction in areas covered by thick weathered layers. PSV convertible wave processing differs significantly from traditional PP wave processing, including S-wave static correction, CCP superposition, PSV velocity analysis, and migration. The biggest challenge lies in S-wave static correction. S-wave velocity is largely unaffected by the water level and has no direct correlation with P-wave static correction. Sometimes, the S-wave static correction can be ten times that of the P-wave static correction. Multiplying the P-wave static correction by a scaling factor to address the S-wave static correction leads to significant errors. At the same receiver point, the X and Z components exhibit a certain first-arrival time difference, representing the travel time difference between P-waves and S-waves in the low-velocity zone. This time difference, along with near-surface P-wave / S-wave velocity ratio information, can be used to remove the influence of the low-velocity zone on the S-wave, yielding an accurate static correction. This scheme derives a relatively accurate S-wave static correction formula using multi-component first-arrival time differences and combines this with a method for obtaining the remaining static correction through common receiver point superposition, forming a complete set of methods for convertible wave static correction. A new converted wave static correction technique is provided in the prior art. First, the average velocity ratio of P-waves and S-waves in the low-velocity layer is calculated based on the acquired three-component micrologging data. Then, the converted wavelength static correction is calculated by multiplying this velocity ratio by the receiver static correction of the P-wave. Next, the converted short wavelength static correction is obtained by applying an improved common receiver superposition cross-correlation method. Finally, the residual static correction is obtained by using frequency-division surface consistency residual static correction. The existing technology provides a method for the research and application of static correction of converted waves for complex structures. The specific steps are as follows: (1) Eliminate the static correction structural terms of converted waves by the layer leveling method to overcome the limitation of the basic level of the layer. First, pick the structural layers with high signal-to-noise ratio of PP wave CMP superposition and calculate the layer flattening projection time difference. Use the projection time difference to "flatten" the pre-stack data; (2) Convert the layer flattening data to the co-detector point domain and re-complete the PP wave velocity analysis of the co-detector point to make the velocity of each trace of the co-detector point gather the same, eliminate the inter-trace dynamic correction error caused by the drastic change of lateral velocity in complex structures and the low accuracy of velocity analysis. This can not only make the co-detector points in phase superposition and improve the signal-to-noise ratio, but also reduce the impact of low velocity accuracy on the remaining static correction amount of seismic traces; (3) Convert the projection time difference of PP wave structural layer flattening to the P-SV domain to flatten the P-SV wave pre-stack data. Re-complete the P-SV wave co-detector point velocity analysis in the co-detector point domain to improve the signal-to-noise ratio and resolution of the P-SV wave co-detector point gather superposition profile, and finally improve the accuracy and efficiency of picking the superposition layer of the P-SV wave co-detector point gather. By constructing stratigraphic flattening and performing common receiver point domain velocity analysis, and then utilizing the PP wave construction constraint converted wave static correction method, the calculation accuracy and efficiency of converted wave static correction for complex structures can be improved.

[0005] In summary, while existing technologies offer numerous solutions for converted wave static correction, a specific approach and method for addressing multi-wave static correction problems by directly picking the first arrival of shear waves and using this first arrival to establish a shear wave surface model is not documented in the existing technologies, particularly for the specific application of converted wave seismic data. Therefore, there is an urgent need to provide a converted wave static correction solution applicable to the field of geophysical exploration technology. Summary of the Invention

[0006] This application discloses a method and apparatus for convertible wave static correction of seismic data.

[0007] In a first aspect, this application discloses a converted wave static correction method for seismic data, the method comprising: Obtain a 3D SPS file of seismic data within the target work area. The 3D SPS file includes at least a receiver point file, a shot point file, and a relation file. Collect and organize P-wave surface survey data, S-wave surface survey data, and VSP P-wave and S-wave velocity data in the target work area to obtain P-wave surface velocity and depth data and S-wave surface velocity and depth data, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area. Vector rotation is performed on the X and Y component seismic data of each shot to generate R and T component seismic data; Based on the defined offset range, the initial arrival time of the longitudinal wave for each shot is picked up for the Z component. The parameters of the low-pass filter are set according to the dominant frequencies of the P-wave and S-wave of the converted wave, and the R-component seismic data are subjected to low-pass filtering. Based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point.

[0008] Optionally, the step of acquiring a 3D SPS file of seismic data within the target work area, wherein the 3D SPS file includes at least a receiver point file, a shot point file, and a relation file, includes: The receiver point files are sorted and indexed in ascending order by receiver point station number; The blast point files are sorted in ascending order by blast point station number.

[0009] Optionally, the first detector index in the detector file is 1, and the detector index increment is 1; the first shot index in the shot file is 1, and the shot index increment is 1.

[0010] Optionally, the step of setting the parameters of the low-pass filter based on the dominant P-wave and S-wave frequencies of the converted wave, and performing low-pass filtering on the R-component seismic data, includes: A low-pass filter is generated based on the preset P-wave and S-wave spectra, and the cutoff frequency of the low-pass filter is determined according to the following expression. :

[0011] in, This is the cutoff frequency of the low-pass filter; This is the dominant frequency of the longitudinal wave; This is the dominant frequency of the transverse wave; is a coefficient, and its value ranges from 0.3 to 0.7.

[0012] Optionally, the step of generating a low-pass filter based on preset longitudinal wave and transverse wave spectra includes: For seismic data containing the converted wave Z component, one of the first arrival waves of the P-wave is selected for spectral analysis to obtain the dominant P-wave frequency. ; For the converted wave R-component seismic data, based on wave characteristics, apparent velocity, and comparison with the Z-component seismic data from the same shot point, the first arrival wave of the shear wave in the R-component seismic data is determined. Then, one or more time windows are selected in the shear wave first arrival region for spectral analysis to obtain the dominant frequency of the shear wave. .

[0013] Optionally, the step of vector rotation of the X and Y component seismic data of each shot to generate R and T component seismic data includes: The trace headers of the R-component and T-component seismic data are consistent with the trace headers of the Z-component seismic data at the corresponding shot points.

[0014] Optionally, before setting the parameters of the low-pass filter based on the dominant P-wave and S-wave frequencies of the converted wave, and before performing low-pass filtering on the R-component seismic data, the method further includes: Determine the offset range, pick the first arrival time of each shot in the Z component seismic data, remove abnormal first arrivals, generate the Z component first arrival data file, and obtain the P-wave first arrival time.

[0015] Optionally, the step of calculating the static P-wave correction at the shot point and the static P-wave correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity includes: Based on the picked P-wave first arrival, the P-wave velocity model is inverted using the tomographic inversion method, and the high-velocity top interface of the P-wave surface model is determined based on the P-wave surface velocity and depth data. Based on the aforementioned reference plane elevation and P-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point.

[0016] Optionally, the step of calculating the static P-wave correction at the shot point and the static P-wave correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity includes: The velocity and physical point delay time of the P-wave high-velocity layer were analyzed using the refraction analysis method, and a P-wave surface model was established by inversion based on the P-wave surface data. Based on the reference plane elevation and P-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point.

[0017] Optionally, after calculating the static P-wave correction at the shot point and the static P-wave correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity, the method further includes: The R-component seismic data is filtered according to the low-pass filter to obtain filtered R-component seismic data. Based on the filtered R-component seismic data, determine the offset range for picking the first arrival; pick the first arrival of the shear wave on the filtered R-component seismic data to obtain the first arrival data of the shear wave. Based on the initial arrival of the shear wave, the shear wave velocity model is inverted using the tomographic inversion method. The high-velocity top interface of the shear wave surface model is determined based on the shear wave surface velocity and depth data or the ray density data obtained from the tomographic inversion. Based on the reference surface elevation and the shear wave filling velocity, the static shear wave correction at the shot point and the static shear wave correction at the receiver point are calculated. Based on the P-wave static correction at the shot point and the S-wave static correction at the receiver point, the R-component seismic data is processed to obtain R-component seismic imaging data; based on the P-wave static correction at the shot point and the S-wave static correction at the receiver point, the T-component seismic data is processed to obtain T-component seismic imaging data.

[0018] Secondly, this application discloses a converted wave static correction device for seismic data, characterized in that the device comprises: The seismic data file acquisition module is used to acquire three-dimensional SPS files of seismic data within the target work area. The three-dimensional SPS files include at least receiver point files, shot point files, and relation files. The data collection and processing module is used to collect and organize P-wave surface survey data, S-wave surface survey data, and VSP P-wave and S-wave velocity data in the target work area, obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area. The vector rotation module is used to perform vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data. The P-wave first arrival pickup module is used to pick up the P-wave first arrival time of each shot for the Z component based on a defined offset range. The low-pass filter module is used to set the parameters of the low-pass filter based on the dominant P-wave and S-wave frequencies of the converted wave, and to perform low-pass filtering on the R-component seismic data. The P-wave static correction module is used to calculate the P-wave static correction at the shot point and the P-wave static correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity.

[0019] Thirdly, this application discloses an electronic device comprising: a processor; and a memory for storing processor-executable instructions; wherein the processor is configured to perform the method as described in any of the preceding aspects.

[0020] Fourthly, this application discloses a non-transitory computer-readable storage medium in which, when the instructions in the storage medium are executed by a processor of an electronic device, enable the electronic device to perform the methods described in any of the preceding aspects.

[0021] Fifthly, this application discloses a computer program product in which, when the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is enabled to perform the method described in any of the preceding aspects.

[0022] The technical solution provided in this application may include the following beneficial effects: The scheme provided in this application establishes an accurate shear wave surface model and has high accuracy in static correction of shear waves at receiver points. It can improve the seismic imaging quality of the converted wave R and T components and has wide applicability and versatility in converted wave seismic exploration.

[0023] Figure 7 The model shows the transverse wave velocity and the transverse wave surface high-velocity top interface retrieved from the SLG region. It can be seen that an accurate transverse wave surface model can be established using this method. Figure 11 This is the original single-shot record of the R component of a survey line in the SLG area. Figure 12 yes Figure 11 A comparison of single-shot records of shear wave static correction at the receiver point using the method of this application shows that the shear wave static correction calculated by this method is accurate, the converted wave first arrival is smoother, and the hyperbolic characteristics of the shear wave reflection are better. Figure 13 It is a superimposed profile of the SLG region using static elevation correction. Figure 14 This is a statically corrected superimposed profile of the SLG region using the method of this application. It can be seen that after applying the converted wave static correction of this method, the influence of long wavelengths is eliminated. The seismic superimposed profile of this application has good imaging quality, high accuracy, enhanced continuity of reflected waves, and more accurate structural morphology. Attached Figure Description

[0024] Figure 1 A flowchart of a converted wave static correction method for seismic data provided in this application; Figure 2 This refers to the Z-component seismic data and analysis window for the SLG region; Figure 3 yes Figure 1 The spectrum of seismic data within a time window; Figure 4 This refers to the R-component seismic data and analysis window for the SLG region; Figure 5 yes Figure 3 The spectrum of seismic data within a time window; Figure 6 It is the P-wave velocity model and the P-wave surface high-velocity top interface retrieved from the SLG region; Figure 7 It is the shear wave velocity model and the shear wave surface high-velocity top interface retrieved in the SLG region; Figure 8 This is a comparison diagram of the longitudinal wave surface thickness and the transverse wave surface thickness of a survey line in the SLG area. Figure 9 This is a comparison curve of the static correction values ​​of longitudinal wave and static correction value of transverse wave at a receiver point of a certain survey line in the SLG area. Figure 10 This is a curve showing the ratio of shear wave static correction to longitudinal wave static correction at a receiver point on a certain survey line in the SLG region. Figure 11 This is the original single-shot record of the R component of a survey line in the SLG area; Figure 12 yes Figure 10 Single-shot record with static correction of shear wave at the receiver point using the method of this application; Figure 13 It is a superimposed profile of the SLG region using static elevation correction; Figure 14 It is a superimposed profile of statically corrected data in the SLG region using the method of this application; Figure 15 A structural diagram of a converted wave static calibration device for seismic data provided in this application; Figure 16 A block diagram of an electronic device provided in this application; Figure 17 A block diagram of another electronic device provided in this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] To address the problems of difficult static correction calculations, low accuracy, and insufficient imaging quality in existing converted-wave seismic exploration technologies, this application aims to establish a more accurate shear wave surface model and improve the accuracy of shear wave static correction at receiver points, thereby ensuring the imaging quality and accuracy of converted-wave seismic data.

[0027] The converted wave static correction device method for seismic data provided in this application is described below. Please refer to [link / reference]. Figures 1 to 14 .

[0028] Example 1 Reference Figure 1 This is a flowchart of a converted wave static calibration device method for seismic data provided in this application. This method can be applied to electronic devices, and specifically includes the following steps: Step S101: Obtain the three-dimensional SPS file of the seismic data within the target work area. The three-dimensional SPS file includes at least the receiver point file, shot point file, and relation file.

[0029] Step S102: Collect and organize the surface survey data of P-wave, surface survey data of S-wave, and VSP P-wave and S-wave velocity data in the target work area to obtain the surface velocity and depth data of P-wave and S-wave, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area.

[0030] Step S103: Perform vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data. It should be noted that the trace headers of the R and T component seismic data are consistent with the trace headers of the corresponding Z component seismic data for each shot point.

[0031] Step S104: Based on the determined offset range, pick the first arrival time of the longitudinal wave for each shot of the Z component.

[0032] Step S105: Set the parameters of the low-pass filter according to the dominant P-wave and S-wave frequencies of the converted wave, and perform low-pass filtering on the R-component seismic data.

[0033] Step S106: Calculate the static correction of the P-wave at the shot point and the static correction of the P-wave at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity.

[0034] In step S101, the geophone point file is sorted and indexed in ascending order of geophone point station numbers; the shot point file is sorted in ascending order of shot point station numbers. In one specific implementation, the first geophone point index in the geophone point file is 1, and the geophone point index increment is 1; the first shot point index in the shot point file is 1, and the shot point index increment is 1.

[0035] In step S105, a low-pass filter is generated based on the preset longitudinal wave spectrum and transverse wave spectrum, and the cutoff frequency of the low-pass filter is determined according to the following expression. :

[0036] in, This is the cutoff frequency of the low-pass filter; This is the dominant frequency of the longitudinal wave; This is the dominant frequency of the transverse wave; is a coefficient, and its value ranges from 0.3 to 0.7.

[0037] Furthermore, for the converted wave Z-component seismic data, one of the first arrival waves of the P-wave was selected for spectral analysis to obtain the dominant P-wave frequency. For the converted wave R-component seismic data, based on wave characteristics, apparent velocity, and comparison with the Z-component seismic data from the same shot point, the first arrival wave of the shear wave in the R-component seismic data is determined. Then, one or more time windows are selected in the shear wave first arrival wave region for spectral analysis to obtain the dominant frequency of the shear wave. .

[0038] Furthermore, before step S105, the method includes determining the offset range, picking the first arrival time of each shot of the Z component seismic data, removing abnormal first arrivals, generating a Z component first arrival data file, and obtaining the first arrival time of the P-wave.

[0039] In step S106, based on the picked P-wave first arrival, the P-wave velocity model is inverted using the tomographic inversion method, and the high-velocity top interface of the P-wave surface model is determined based on the P-wave surface velocity and depth data; based on the reference elevation and P-wave filling velocity, the shot point P-wave static correction and receiver point P-wave static correction are calculated.

[0040] In one embodiment of this application, the static P-wave correction at the shot point and the static P-wave correction at the receiver point can be calculated as follows: the velocity of the high-velocity P-wave layer and the physical point delay time are analyzed using refraction analysis, and a P-wave surface model is established by inversion based on the P-wave surface data; the static P-wave correction at the shot point and the static P-wave correction at the receiver point are calculated based on the reference plane elevation and the P-wave filling velocity.

[0041] Furthermore, after step S106, the process may further include: filtering the R-component seismic data using the low-pass filter to obtain filtered R-component seismic data; determining the offset range for picking first arrivals based on the filtered R-component seismic data; picking shear wave first arrivals on the filtered R-component seismic data to obtain shear wave first arrival data; inverting the shear wave velocity model using tomographic inversion based on the shear wave first arrivals; determining the high-velocity top interface of the shear wave surface model based on the shear wave surface velocity and depth data or the ray density data obtained from tomographic inversion; calculating the shot point shear wave static correction and the receiver point shear wave static correction based on the reference elevation and shear wave filling velocity; processing the R-component seismic data based on the shot point P-wave static correction and the receiver point shear wave static correction to obtain R-component seismic imaging data; and processing the T-component seismic data based on the shot point P-wave static correction and the receiver point shear wave static correction to obtain T-component seismic imaging data.

[0042] In summary, the scheme provided in this application establishes an accurate shear wave surface model and has high accuracy in static correction of shear waves at receiver points, which can improve the seismic imaging quality of the converted wave R and T components and has wide applicability and versatility in converted wave seismic exploration.

[0043] in addition, Figure 7The model shows the transverse wave velocity model and the transverse wave surface high-velocity top interface retrieved from the SLG region. It can be seen that an accurate transverse wave surface model can be established using this method. Figure 11 This is the original single-shot record of the R component of a survey line in the SLG area. Figure 12 yes Figure 11 A comparison of single-shot records of shear wave static correction at the receiver point using the method of this application shows that the shear wave static correction calculated by this method is accurate, the converted wave first arrival is smoother, and the hyperbolic characteristics of the shear wave reflection are better. Figure 13 It is a superimposed profile of the SLG region using static elevation correction. Figure 14 This is a statically corrected superimposed profile of the SLG region using the method of this application. It can be seen that after applying the converted wave static correction of this method, the influence of long wavelengths is eliminated. The seismic superimposed profile of this application has good imaging quality, high accuracy, enhanced continuity of reflected waves, and more accurate structural morphology.

[0044] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions involved are not necessarily required by this application.

[0045] The following section provides a detailed explanation of the converted wave static correction method for seismic data provided in this application, using a specific example.

[0046] Step (1): Based on field production, organize the 3D SPS files, namely the receiver point file, shot point file, and relation file. The receiver point file is sorted in ascending order by receiver point station number and indexed, with the first receiver point indexed as 1 and the receiver point index increment as 1; the shot point file is sorted in ascending order by shot point station number, with the first shot point indexed as 1 and the shot point index increment as 1.

[0047] Step (2): Collect and organize the surface survey data of P-wave, surface survey data of S-wave, and VSP P-wave and S-wave velocity data in the target work area to obtain the surface velocity and depth data of P-wave and S-wave; specify the reference elevation of this area as 1350m, the P-wave filling velocity as 2500m / s, and the S-wave filling velocity as 1350m / s.

[0048] Step (3): Perform vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data. The trace headers of the R and T component seismic data are consistent with the trace headers of the Z component seismic data of the corresponding shot points.

[0049] Step (4): Specify the offset range as 0-6000m, pick up the first arrival time of each shot of the Z component, remove obvious abnormal first arrivals, and generate the first arrival data file of the Z component, thus obtaining the first arrival time of the P-wave.

[0050] Step (5): Based on the P-wave first arrivals picked up in step (4), the P-wave velocity model is inverted using the tomographic inversion method. The high-velocity top interface of the P-wave surface model is defined based on the P-wave surface velocity and depth data or the ray density data obtained from the tomographic inversion described in step (2). Then, based on the reference elevation and P-wave filling velocity described in step (2), the static correction of the P-wave at the shot point and the static correction of the P-wave at the receiver point are calculated.

[0051] Step (6): On the Z-component seismic data, select one first arrival wave of the P-wave and perform spectral analysis to obtain the dominant frequency of the P-wave. It is 26Hz.

[0052] Step (7): Based on the wave characteristics, apparent velocity, and comparison with the Z-component seismic data of the same shot point, determine the first arrival wave of the shear wave in the R-component seismic data; and select one or more time windows in the shear wave first arrival wave region to perform spectral analysis and obtain the dominant frequency of the shear wave. It is 10Hz.

[0053] Step (8): Based on the longitudinal wave spectrum and transverse wave spectrum described in steps (6) and (7), design a set of low-pass filters, with the cutoff frequency of the low-pass filters being... for:

[0054] =10+0.5*(26-10) =18 (Hz) in, The cutoff frequency of the designed low-pass filter; The longitudinal wave dominant frequency described in step (6); The shear wave dominant frequency described in step (7); The coefficient is 0.3, and its value is between 0.3 and 0.7. Here, we take 0.5.

[0055] Step (9): According to the low-pass filter (0Hz, 18 Hz) described in step (8), the R component seismic data described in step (3) is filtered to obtain new R component seismic data.

[0056] Step (10): Based on the new R-component seismic data described in step (9), define the offset range for picking the first arrival as 0-4000m, and pick the first arrival of the shear wave on the new R-component seismic data to obtain the first arrival data of the shear wave.

[0057] Step (11): Based on the first arrival of the shear wave described in step (10), the shear wave velocity model is inverted using the tomographic inversion method. Based on the shear wave surface velocity and depth data or the ray density data obtained from the tomographic inversion described in step (2), the high-velocity top interface of the shear wave surface model is defined. Then, based on the reference surface elevation and shear wave filling velocity described in step (2), the static shear wave correction at the shot point and the static shear wave correction at the receiver point are calculated.

[0058] Step (12): Based on the static correction of the P-wave at the shot point described in step (5) and the static correction of the S-wave at the receiver point described in step (11), the R-component seismic data processing described in step (3) is used to obtain the R-component seismic imaging data; the static correction of the P-wave at the shot point and the static correction of the S-wave at the receiver point can also be used for the seismic data processing of the T-component described in step (3) to obtain the T-component seismic imaging data.

[0059] Example 2 Reference Figure 15 This is a structural diagram of a converted wave static calibration device for seismic data provided in this application. The device includes: The seismic data file acquisition module 210 is used to acquire a three-dimensional SPS file of seismic data within the target work area. The three-dimensional SPS file includes at least a receiver point file, a shot point file, and a relation file. The data collection and processing module 220 is used to collect and organize the P-wave surface survey data, S-wave surface survey data, and VSP P-wave and S-wave velocity data in the target work area, obtain the P-wave surface velocity and depth data and the S-wave surface velocity and depth data, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area. Vector rotation module 230 is used to perform vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data. The P-wave first arrival pickup module 240 is used to pick up the P-wave first arrival time of each shot of the Z component based on a defined offset range. The low-pass filter module 250 is used to set the parameters of the low-pass filter according to the P-wave dominant frequency and S-wave dominant frequency of the converted wave, and to perform low-pass filtering processing on the R-component seismic data. The P-wave static correction module 260 is used to calculate the P-wave static correction at the shot point and the P-wave static correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity.

[0060] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0061] Example 3 Optionally, this application also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the various processes of the above method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0062] This application also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described method embodiments and achieves the same technical effects. To avoid repetition, it will not be described again here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0063] Figure 16 This application provides a block diagram of an electronic device 800. For example, the electronic device 800 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0064] Reference Figure 16 The electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0065] Processing component 802 typically controls the overall operation of electronic device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0066] Memory 804 is configured to store various types of data to support the operation of device 800. Examples of this data include instructions for any application or method operating on electronic device 800, contact data, phonebook data, messages, images, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0067] Power supply component 806 provides power to various components of electronic device 800. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 800.

[0068] Multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0069] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when electronic device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0070] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0071] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of electronic device 800. For example, sensor assembly 814 may detect the on / off state of device 800, the relative positioning of components such as the display and keypad of electronic device 800, changes in position of electronic device 800 or a component of electronic device 800, the presence or absence of user contact with electronic device 800, orientation or acceleration / deceleration of electronic device 800, and temperature changes of electronic device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0072] Communication component 816 is configured to facilitate wired or wireless communication between electronic device 800 and other devices. Electronic device 800 can access wireless networks based on communication standards, such as WiFi, carrier networks (such as 2G, 3G, 4G, or 5G), or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast operation information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0073] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0074] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, which can be executed by a processor 820 of an electronic device 800 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0075] Example 4 Figure 17A block diagram of another electronic device 1900 provided for this application. For example, electronic device 1900 may be provided as a server.

[0076] Reference Figure 17 The electronic device 1900 includes a processing component 1922, which further includes one or more processors, and memory resources represented by memory 1932 for storing instructions, such as application programs, that can be executed by the processing component 1922. The application programs stored in memory 1932 may include one or more modules, each corresponding to a set of instructions. Furthermore, the processing component 1922 is configured to execute instructions to perform the methods described above.

[0077] Electronic device 1900 may also include a power supply component 1926 configured to perform power management of electronic device 1900, a wired or wireless network interface 1950 configured to connect electronic device 1900 to a network, and an input / output (I / O) interface 1958. Electronic device 1900 can operate on an operating system stored in memory 1932, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™, or similar.

[0078] Example 5 Fifthly, this application discloses a computer program product in which, when the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is enabled to perform the method described in any of the preceding aspects.

[0079] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0080] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0081] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0082] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this application can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0083] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0084] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0085] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0086] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0087] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for convertible wave static correction of seismic data, characterized in that, The method includes: Obtain a 3D SPS file of seismic data within the target work area. The 3D SPS file includes at least a receiver point file, a shot point file, and a relation file. Collect and organize P-wave surface survey data, S-wave surface survey data, and VSP P-wave and S-wave velocity data in the target work area to obtain P-wave surface velocity and depth data and S-wave surface velocity and depth data, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area. Vector rotation is performed on the X and Y component seismic data of each shot to generate R and T component seismic data; Based on the defined offset range, the initial arrival time of the longitudinal wave for each shot is picked up for the Z component. The parameters of the low-pass filter are set according to the dominant frequencies of the P-wave and S-wave of the converted wave, and the R-component seismic data are subjected to low-pass filtering. Based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point. The R-component seismic data is filtered according to the low-pass filter to obtain filtered R-component seismic data. Based on the filtered R-component seismic data, determine the offset range for picking the first arrival; pick the first arrival of the shear wave on the filtered R-component seismic data to obtain the first arrival data of the shear wave. Based on the initial arrival of the shear wave, the shear wave velocity model is inverted using the tomographic inversion method. The high-velocity top interface of the shear wave surface model is determined based on the shear wave surface velocity and depth data or the ray density data obtained from the tomographic inversion. Based on the reference surface elevation and the shear wave filling velocity, the static shear wave correction at the shot point and the static shear wave correction at the receiver point are calculated. Based on the static P-wave correction at the shot point and the static S-wave correction at the receiver point, the R-component seismic data is processed to obtain R-component seismic imaging data; based on the static P-wave correction at the shot point and the static S-wave correction at the receiver point, the T-component seismic data is processed to obtain T-component seismic imaging data.

2. The converted wave static correction method for seismic data according to claim 1, characterized in that, The step of acquiring a 3D SPS file of seismic data within the target work area, wherein the 3D SPS file includes at least a receiver point file, a shot point file, and a relation file, includes: The receiver point files are sorted and indexed in ascending order by receiver point station number; The blast point files are sorted in ascending order by blast point station number.

3. The converted wave static correction method for seismic data according to claim 1, characterized in that: The first detector point index in the detector point file is 1, and the detector point index increment is 1. The first shot point index in the shot point file is 1, and the shot point index increment is 1.

4. The converted wave static correction method for seismic data according to claim 1, characterized in that, The step of setting the parameters of the low-pass filter based on the dominant P-wave and S-wave frequencies of the converted wave, and performing low-pass filtering on the R-component seismic data, includes: A low-pass filter is generated based on the preset P-wave and S-wave spectra, and the cutoff frequency of the low-pass filter is determined according to the following expression. : in, This is the cutoff frequency of the low-pass filter; This is the dominant frequency of the longitudinal wave; This is the dominant frequency of the transverse wave; is a coefficient, and its value ranges from 0.3 to 0.

7.

5. The converted wave static correction method for seismic data according to claim 4, characterized in that, The step of generating a low-pass filter based on preset longitudinal wave and transverse wave spectra includes: For seismic data containing the converted wave Z component, one of the first arrival waves of the P-wave is selected for spectral analysis to obtain the dominant P-wave frequency. ; For the converted wave R-component seismic data, based on wave characteristics, apparent velocity, and comparison with the Z-component seismic data from the same shot point, the first arrival wave of the shear wave in the R-component seismic data is determined. Then, one or more time windows are selected in the shear wave first arrival region for spectral analysis to obtain the dominant frequency of the shear wave. .

6. The converted wave static correction method for seismic data according to claim 4, characterized in that, The step of vector rotation of the X and Y component seismic data of each shot to generate R and T component seismic data includes: The trace headers of the R-component and T-component seismic data are consistent with the trace headers of the Z-component seismic data at the corresponding shot points.

7. The converted wave static correction method for seismic data according to claim 4, characterized in that, Before setting the parameters of the low-pass filter based on the dominant frequencies of the P-wave and S-wave of the converted wave, and before performing low-pass filtering on the R-component seismic data, the following steps are also included: Determine the offset range, pick the first arrival time of each shot in the Z component seismic data, remove abnormal first arrivals, generate the Z component first arrival data file, and obtain the P-wave first arrival time.

8. The converted wave static correction method for seismic data according to claim 1, characterized in that, The steps of calculating the static P-wave correction at the shot point and the static P-wave correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity include: Based on the picked P-wave first arrival, the P-wave velocity model is inverted using the tomographic inversion method, and the high-velocity top interface of the P-wave surface model is determined based on the P-wave surface velocity and depth data. Based on the aforementioned reference plane elevation and P-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point.

9. The converted wave static correction method for seismic data according to claim 1, characterized in that, The steps of calculating the static P-wave correction at the shot point and the static P-wave correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity include: The velocity and physical point delay time of the P-wave high-speed layer were analyzed using the refraction analysis method, and a P-wave surface model was established by inversion based on the P-wave surface data. Based on the reference plane elevation and P-wave filling velocity, calculate the static P-wave correction at the shot point and the static P-wave correction at the receiver point.

10. A converted wave static correction device for seismic data, characterized in that, The device includes: The seismic data file acquisition module is used to acquire three-dimensional SPS files of seismic data within the target work area. The three-dimensional SPS files include at least receiver point files, shot point files, and relation files. The data collection and processing module is used to collect and organize P-wave surface survey data, S-wave surface survey data, and VSP P-wave and S-wave velocity data in the target work area, obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine the reference surface elevation, P-wave filling velocity, and S-wave filling velocity in the target work area. The vector rotation module is used to perform vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data. The P-wave first arrival pickup module is used to pick up the P-wave first arrival time of each shot for the Z component based on a defined offset range. The low-pass filter module is used to set the parameters of the low-pass filter based on the dominant P-wave and S-wave frequencies of the converted wave, and to perform low-pass filtering on the R-component seismic data. The P-wave static correction module is used to calculate the P-wave static correction at the shot point and the P-wave static correction at the receiver point based on the reference plane elevation, the P-wave filling velocity, and the S-wave filling velocity. The R-component seismic data is filtered according to the low-pass filter to obtain filtered R-component seismic data. Based on the filtered R-component seismic data, determine the offset range for picking the first arrival; pick the first arrival of the shear wave on the filtered R-component seismic data to obtain the first arrival data of the shear wave. Based on the initial arrival of the shear wave, the shear wave velocity model is inverted using the tomographic inversion method. The high-velocity top interface of the shear wave surface model is determined based on the shear wave surface velocity and depth data or the ray density data obtained from the tomographic inversion. Based on the reference surface elevation and the shear wave filling velocity, the static shear wave correction at the shot point and the static shear wave correction at the receiver point are calculated. Based on the static P-wave correction at the shot point and the static S-wave correction at the receiver point, the R-component seismic data is processed to obtain R-component seismic imaging data; based on the static P-wave correction at the shot point and the static S-wave correction at the receiver point, the T-component seismic data is processed to obtain T-component seismic imaging data.

11. An electronic device, characterized in that, include: A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the method as described in any one of claims 1 to 7.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method as described in any one of claims 1 to 7.

13. A computer program product, characterized in that, When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device implements the method as described in any one of claims 1 to 7.

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