A high-speed, high-precision needle-punch die bonder and its control method

Abstract

This invention discloses a high-speed, high-precision needle-type die bonder and its control method, belonging to the field of semiconductor packaging equipment technology. It includes a first driving mechanism connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The second driving mechanism includes a second voice coil motor connected to a first needle. The first needle is connected to a second needle via a second connecting structure. The second needle is connected to an elastic fixing mechanism. Piezoelectric ceramics are disposed on both the first and second needles. This invention employs the aforementioned high-speed, high-precision needle-type die bonder and its control method. The first and second driving mechanisms, as well as the first and second needles, are designed with lightweight features, overcoming the efficiency bottleneck of the transmission mechanical structure. Path planning algorithms and vibration suppression technology are used to achieve high-speed, high-precision collaborative operation. An FPGA+PLC dual-controller architecture is adopted to improve system response speed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, and in particular to a high-speed, high-precision needle-type die bonder and its control method. Background Technology

[0002] Traditional single-head needle-type die bonders are limited in efficiency due to the low frequency of the voice coil motor on the needle head, typically less than or equal to 100Hz, making it difficult to meet the high-volume demands of LED and IC chip packaging. Traditional multi-head swing-arm die bonders are limited by the reciprocating motion mode of the swing arm, resulting in low single-head efficiency (below 10Hz), low overall efficiency, motion path conflicts (limited by the motor's acceleration; for larger substrates, such as approximately 12-inch substrates, efficiency drops by about 30%), and accumulated needle positioning errors, all of which lead to actual efficiency falling short of theoretical values. Summary of the Invention

[0003] The purpose of this invention is to provide a high-speed, high-precision needle-type die bonder and its control method. The first and second drive mechanisms, as well as the first and second needles, are designed with lightweight features to overcome the efficiency bottleneck of the transmission mechanical structure. By utilizing path planning algorithms and vibration suppression technology, high-speed and high-precision collaborative operation is achieved. An FPGA+PLC dual-controller architecture is adopted to improve the response speed of the motion control system.

[0004] To achieve the above objectives, the present invention provides a high-speed, high-precision needle-type die bonder and its control method, comprising a first driving mechanism connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The second driving mechanism includes a second voice coil motor connected to a first needle. The first needle is connected to a second needle through a second connecting structure. The second needle is connected to an elastic fixing mechanism. Piezoelectric ceramics are provided on both the first and second needles.

[0005] Preferably, an acceleration sensor is installed on the first needle tip, and the second connection structure is a high-precision movable linkage mechanism, with the piezoelectric ceramic being electrically connected to the piezoelectric ceramic controller.

[0006] Preferably, the first and second needles are made of lightweight carbon fiber material.

[0007] Preferably, the first drive mechanism and the second drive mechanism are connected to the motion control system, which is an FPGA+PLC dual controller architecture, and an adaptive filter is embedded in the motion control system.

[0008] This invention provides a control method for a high-speed, high-precision needle-punch die bonder, comprising the following steps:

[0009] S1. A UV film is laid on top of the LED / IC device. The motion control system controls the first voice coil motor to move the first and second needles above the LED / IC device based on the time-optimal trajectory planning algorithm.

[0010] S2. Start the second voice coil motor. The second voice coil motor drives the first and second needles to move up and down alternately through the second connection structure. The adaptive filter collects acceleration sensor data in real time to suppress high-frequency mechanical vibration. The motion control system uses a feedforward compensation algorithm to offset the inertial impact during the start-up and stop phase of the second voice coil motor.

[0011] S3. When the needle tip deviates, the piezoelectric ceramic controller controls the piezoelectric ceramic to fine-tune the second needle tip to compensate for the positioning deviation caused by mechanical vibration.

[0012] Therefore, the present invention employs the above-mentioned high-speed, high-precision needle-punch die bonder and its control method, which has the following beneficial effects:

[0013] (1) The first and second drive mechanisms, as well as the first and second needles, are designed to be lightweight to reduce motion inertia. The double-headed needle release mechanism is designed in an integrated manner to shorten the pickup-release cycle to less than 5ms, thus breaking through the efficiency bottleneck of the transmission mechanical structure.

[0014] (2) By using path planning algorithms and vibration suppression technology, high-frequency mechanical vibrations are suppressed to achieve high-speed and high-precision collaborative operation;

[0015] (3) The FPGA+PLC dual controller architecture is adopted to improve the response speed of the motion control system, realize the parallel operation of motion control and logic processing, and shorten the control cycle to 0.1ms;

[0016] (4) Set up piezoelectric ceramics and piezoelectric ceramic controllers to compensate for positioning deviations caused by mechanical vibration and control the accuracy of the first and second needles.

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a high-speed, high-precision needle-punching die bonder according to the present invention;

[0019] Figure 2 This is a schematic diagram of the first use process of a high-speed, high-precision needle-type die bonder according to the present invention;

[0020] Figure 3 This is a schematic diagram of the second use process of a high-speed, high-precision needle-type die bonder according to the present invention.

[0021] Figure Labels

[0022] 1. Second voice coil motor; 2. First needle; 3. Second connecting structure; 4. Second needle; 5. Elastic fixing mechanism; 6. Piezoelectric ceramic; 7. Piezoelectric ceramic controller; 8. UV film; 9. LED / IC device; 10. Accelerometer. Detailed Implementation

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] Example 1

[0026] like Figures 1 to 3 As shown, the present invention provides a high-speed and high-precision needle-type die bonder and its control method, including a first driving mechanism connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The first voice coil motor drives the second driving mechanism to move through the first connecting structure, thereby controlling the X-axis movement of the first needle 2 and the second needle 4.

[0027] The second drive mechanism includes a second voice coil motor 1, which is connected to the first needle 2. The second voice coil motor 1 can drive the second needle 4 to move in the Z direction. The first needle 2 is connected to the second needle 4 through a second connecting structure 3, which is a high-precision movable linkage mechanism. The second needle 4 is connected to an elastic fixing mechanism 5. The first needle 2 and the second needle 4 can achieve alternating reciprocating motion through the elastic fixing mechanism 5, which elastically fixes the second needle 4. The integrated design of the dual-head needle release mechanism can shorten the pick-up-release cycle to less than 5ms.

[0028] Both the first needle 2 and the second needle 4 are provided with piezoelectric ceramics 6. The piezoelectric ceramics 6 are electrically connected to the piezoelectric ceramic controller 7. The piezoelectric ceramic controller 7 can control the piezoelectric ceramics 6 to perform reverse compensation on the first needle 2 and the second needle 4 to ensure the accuracy of the first needle 2 and the second needle 4.

[0029] An acceleration sensor 10 is installed on the first needle 2. The acceleration sensor 10 can detect the acceleration of the first needle 2 during die bonding. By comparing the feedback acceleration data during die bonding with the die bonding result, acceleration feedforward compensation is performed on the second voice coil motor 1 during the next die bonding.

[0030] The first needle 2 and the second needle 4 are made of lightweight carbon fiber material, which can reduce the moment of inertia and improve the crystal bonding efficiency.

[0031] The first and second drive mechanisms are connected to the motion control system, which employs an FPGA+PLC dual-controller architecture to achieve parallel computation of motion control and logic processing, thereby improving the response speed of the motion control system and shortening the control cycle to 0.1ms. An adaptive filter is embedded in the motion control system to collect data from the accelerometer 10 in real time and suppress high-frequency mechanical vibrations.

[0032] This invention provides a control method for a high-speed, high-precision needle-punch die bonder, comprising the following steps:

[0033] S1. A UV film 8 is laid on top of the LED / IC device 9. The motion control system controls the first voice coil motor to move the first needle 2 and the second needle 4 to the top of the LED / IC device 9 based on the time-optimal trajectory planning algorithm.

[0034] S2. Start the second voice coil motor 1. The second voice coil motor 1 drives the first needle 2 and the second needle 4 to move up and down alternately through the second connection structure 3. The adaptive filter collects data from the acceleration sensor 10 in real time to suppress high-frequency mechanical vibration. The motion control system uses a feedforward compensation algorithm to offset the inertial impact during the start-up and stop phase of the second voice coil motor 1.

[0035] S3. When the needle tip deviates, the piezoelectric ceramic controller 7 controls the piezoelectric ceramic 6 to fine-tune the second needle tip 4 to compensate for the positioning deviation caused by mechanical vibration.

[0036] This invention provides a high-speed, high-precision needle-type die bonder with improved efficiency: die bond speed up to 200Hz; guaranteed precision: placement position error ≤ ±15μm; compatibility: suitable for various packaging scenarios such as LED, Mini LED, and IC chips.

[0037] Experimental data shows that the dual-head collaborative efficiency stably reaches 200Hz, with a yield ≥99.995%. With subsequent die bonding operations increasing and parameter optimization, the expected yield is over 99.999%, as shown in Table 1.

[0038] Table 1 Die-bonding data

[0039]

[0040] The cost of grounding, water, electricity and gas for the needle-type die bonder using this die bonder is reduced by 50% compared to the traditional needle-type die bonder, and by more than 70% compared to the traditional swing-arm die bonder. The energy consumption of water, electricity and gas is reduced by more than 60%. Under the same production capacity, the investment cost of die bonder for manufacturers is reduced by more than 30%, and the number of operators is reduced by 40%.

[0041] Therefore, this invention adopts the above-mentioned high-speed and high-precision needle-type die bonder and its control method. The first driving mechanism and the second driving mechanism, as well as the first needle and the second needle, are designed with lightweight features to overcome the efficiency bottleneck of the transmission mechanical structure. By using path planning algorithms and vibration suppression technology, high-speed and high-precision collaborative operation is achieved. The FPGA+PLC dual controller architecture is used to improve the response speed of the motion control system.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A high-speed, high-precision needle-punch die bonder, characterized in that: It includes a first driving mechanism, which is connected to a second driving mechanism. The first driving mechanism includes a first voice coil motor and a first connecting structure. The second driving mechanism includes a second voice coil motor, which is connected to a first needle. The first needle is connected to the second needle through the second connecting structure. The second needle is connected to an elastic fixing mechanism. Piezoelectric ceramics are provided on both the first and second needles. The first and second needles can be alternately reciprocated through a flexible fixing mechanism; The first needle tip is equipped with an acceleration sensor, the second connection structure is a high-precision movable linkage mechanism, and the piezoelectric ceramic is electrically connected to the piezoelectric ceramic controller. The first and second drive mechanisms are connected to the motion control system, which is an FPGA+PLC dual controller architecture and incorporates an adaptive filter. The first and second needles are made of lightweight carbon fiber material.

2. The control method for a high-speed, high-precision needle-type die bonder according to claim 1, characterized in that: Includes the following steps: S1. A UV film is laid on top of the LED / IC device. The motion control system controls the first voice coil motor to move the first and second needles above the LED / IC device based on the time-optimal trajectory planning algorithm. S2. Start the second voice coil motor. The second voice coil motor drives the first and second needles to move up and down alternately through the second connection structure. The adaptive filter collects acceleration sensor data in real time to suppress high-frequency mechanical vibration. The motion control system uses a feedforward compensation algorithm to offset the inertial impact during the start-up and stop phase of the second voice coil motor. S3. When the needle tip deviates, the piezoelectric ceramic controller controls the piezoelectric ceramic to fine-tune the second needle tip to compensate for the positioning deviation caused by mechanical vibration.

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