A semiconductor panel level package bonding production line and method of use

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By designing a semiconductor panel-level packaging and bonding production line, the collaborative work of multiple mechanisms was achieved, solving the problems of low efficiency and unstable product quality in existing technologies, and improving production efficiency and product quality.

CN120998825BActive Publication Date: 2026-06-19SHENZHEN 80 UNITED EQUIP CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Patents(China)
Current Assignee / Owner: SHENZHEN 80 UNITED EQUIP CO LTD
Filing Date: 2025-09-19
Publication Date: 2026-06-19

AI Technical Summary

Technical Problem

In existing semiconductor panel-level packaging bonding technologies, the lack of coordination among multiple individual mechanical devices leads to low work efficiency. Manual handling causes product wear and reduced purity, resulting in low bonding accuracy and weak product bonding, which poses a risk of detachment.

Method used

A semiconductor panel-level packaging bonding production line was designed, comprising a worktable, movable claws, a product placement mechanism, an alignment mechanism, a flipping mechanism, a bonding mechanism, a preheating mechanism, a heating and cooling mechanism, and a testing mechanism. Through the coordinated operation of these mechanisms, the precise positioning, preheating, bonding, cooling, and testing of the product are achieved, reducing human interference.

Benefits of technology

It improved production efficiency, enhanced product robustness and stability, improved output quality and yield, and reduced product damage and contamination caused by human error.

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Abstract

This invention relates to the field of semiconductor technology, specifically to a semiconductor panel-level packaging bonding production line and its usage method. The line includes a worktable and movable claws that can slide back and forth on the worktable. The outer wall of the worktable is circumferentially arranged with a product placement mechanism, an alignment mechanism, a flipping mechanism, a bonding mechanism, a preheating mechanism, a heating and cooling mechanism, and a detection mechanism. The movable claws are used to remove and place products from the product placement mechanism, alignment mechanism, flipping mechanism, two-way bonding mechanism, preheating mechanism, heating and cooling mechanism, and detection mechanism. This invention is applicable to large-size wafer bonding processing. Through the close coordination of the movable claws, placement mechanism, alignment mechanism, flipping mechanism, two-way bonding mechanism, preheating mechanism, heating and cooling mechanism, and detection mechanism, the production cycle is greatly shortened, work efficiency is improved, and the produced products have better robustness and stability, significantly improving product quality.

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Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a semiconductor panel-level packaging bonding production line and its usage method. Background Technology

[0002] In the field of semiconductor panel-level packaging and bonding, the size of panel-level packages is usually large, with common sizes including 18-inch by 24-inch, 20-inch by 20-inch, 510mm by 515mm, 600mm by 600mm, and even 700mm by 700mm. These sizes are 3-7 times the wafer area, allowing panel-level packages to accommodate more chips, which helps improve production efficiency and reduce costs. However, in the current panel-level packaging and bonding technology field, when performing packaging and bonding work on large-size wafers, it is often done by sequentially packaging and bonding products using multiple single machines or by manually handling products for packaging and bonding.

[0003] The lack of coordination and overall practicality of multiple individual machines, the excessive distance between them, the lack of close coordination between their operations, and the uncertainty of the working intervals between multiple individual machines all affect work efficiency and production efficiency.

[0004] Furthermore, manual handling of products incurs high labor costs, and the process may cause unnecessary wear and tear or damage to the products. Manual contact with the products may also reduce their purity and affect work efficiency. This kind of manual work is slow and has excessively high production costs.

[0005] Meanwhile, in some individual mechanical parts, such as bonding equipment, the lack of an alignment process before bonding results in low precision after bonding, leading to product waste. Alternatively, the lack of heating and cooling equipment after bonding results in products that are not firmly attached and are prone to detaching from the chip. Summary of the Invention

[0006] To address the aforementioned problems in the prior art, this invention provides a semiconductor panel-level packaging bonding production line and its usage method. The technical problem to be solved by this invention is achieved through the following technical solution:

[0007] One aspect of the present invention provides a semiconductor panel-level packaging bonding production line, including a worktable and a movable claw that can slide back and forth on the worktable. The outer wall of the worktable is circumferentially arranged with a product placement mechanism, an alignment mechanism, a flipping mechanism, a two-bonding mechanism, a preheating mechanism, a heating and cooling mechanism, and a detection mechanism. The movable claw is used to remove and place products. The product placement mechanism includes a product 1 placement body and a product 2 placement body connected to the worktable. The alignment mechanism includes an alignment box connected to the worktable, and an alignment device is fixed inside the alignment box for aligning and positioning the products. The flipping mechanism includes a flipping mechanism connected to the worktable. The rotating housing includes a flipping device fixed inside, used for flipping the products; the bonding mechanism includes a bonding housing connected to the worktable, with a bonding device fixed inside, used for bonding products; the preheating mechanism includes a preheating housing connected to the worktable, with two preheating chambers fixed inside, each preheating chamber having a preheating opening facing the worktable, a preheating transfer door assembly for opening and closing the preheating openings on the front side of the preheating chamber, an upper preheating pin assembly at the top of the preheating chamber extending into the preheating chamber, and a lower preheating pin assembly at the bottom of the preheating chamber. The hot PIN assembly extends into the preheating chamber. A preheating assembly is positioned at the top of the preheating chamber, above the lower preheating PIN assembly. Both preheating chambers have connecting air pipes on their side walls, each with a silencer. A main air pipe connects to the bottom of the connecting air pipe, and a vacuum valve is installed at one end of the main air pipe. The preheating transfer door assembly includes a fixed plate fixedly connected to the preheating chamber. A lifting cylinder is mounted on one side of the fixed plate, and a connecting block is fitted onto the extension rod of the lifting cylinder. A sealing door is fixedly connected to the connecting block facing the preheating chamber. The upper preheating PIN assembly includes several upper guide posts installed at the top of the preheating chamber. Upper guide posts are fixedly connected to upper... The preheating plate has an upper lifting motor mounted on it. The upper driving plate is fitted with a lead screw of the upper lifting motor and can slide on the outer ring wall of the upper guide post. Several upper PIN support rods are provided at the bottom of the upper driving plate and can slide through the preheating cavity. The lower preheating PIN assembly includes several lower guide posts installed at the bottom of the preheating cavity. A lower preheating plate is fixedly connected to the bottom of the lower guide posts. A lower lifting motor is mounted on the lower preheating plate. The lower driving plate is fitted with a lead screw of the lower lifting motor and can slide on the outer ring wall of the lower guide post. Several lower PIN support rods are provided at the top of the lower driving plate and can slide through the preheating cavity.

[0008] Further description: Both the upper PIN support rod and the lower PIN support rod are fitted with vacuum bellows.

[0009] Further description: The heating and cooling mechanism includes a heating and cooling box connected to the worktable. Two heating and cooling components are fixed inside the heating and cooling box. Each heating and cooling component includes a heating chamber and a cooling chamber stacked sequentially from bottom to top. The heating chamber has a heating opening facing the worktable, and a heating flipping component that can open and close the heating opening is provided on the front side of the heating chamber. The cooling chamber has a cooling opening facing the worktable, and a cooling rotation component that can open and close the cooling opening is provided on the front side of the cooling chamber. A heating pin component is provided at the bottom of the heating chamber, and a heating component is provided at the bottom inside the heating chamber. A cooling pin support rod is installed at the bottom inside the cooling chamber. The heating flipping component includes... A heating frame is fixedly connected to the heating chamber, and a rotating shaft is rotatably connected inside the heating frame. A heating flip door is fitted on the rotating shaft. The cooling rotation assembly includes a cooling frame fixedly connected to the cooling chamber, and a rotating shaft is rotatably connected inside the cooling frame. A cooling flip door is fitted on the rotating shaft. The heating pin assembly includes several heating guide pillars installed at the bottom of the heating chamber. A support plate is fixedly connected to the bottom of the heating guide pillars. A heating lifting motor is installed on the support plate. The lead screw of the heating lifting motor is equipped with a heating drive plate. The heating drive plate can slide on the outer ring wall of the heating guide pillars. Several heating pin support rods are provided on the top of the heating drive plate. The heating pin support rods can slide through the heating chamber.

[0010] Further description: The detection mechanism includes a detection housing connected to a workbench, a support frame fixed inside the detection housing, a support platform mounted on top of the support frame, a rotating assembly mounted on the support platform, four sets of alignment and tensioning assemblies arranged around the rotating assembly on the support platform, a support frame mounted on the support platform, a pressing assembly arranged on one side of the support frame above the rotating assembly, and detection assemblies arranged on both sides of the rotating assembly; the rotating assembly includes a rotating motor fixedly connected to the support frame, a rotating platform fitted onto the end of the rotating shaft of the rotating motor, and the detection platform fixedly connected to the rotating platform via several rotating guide pillars, with several suction holes opened on the detection platform; the alignment and tensioning assembly includes a first connecting plate installed on the bottom edge of the rotating platform, a tensioning cylinder arranged at the bottom of the first connecting plate, a second connecting plate sleeved on the telescopic rod of the tensioning cylinder, and a fixed side of the second connecting plate. The system includes a positioning cylinder, a third connecting plate sleeved on the telescopic rod of the positioning cylinder, a positioning rod on the top of the third connecting plate, and a tension bearing on the top of the positioning rod. The pressing assembly includes a pressing slide table mounted on a support frame, and two pressing slide rails on both sides of the pressing slide table. A pressing slide block that slides up and down is provided on the pressing slide table. A pressing plate is fixedly connected to one side of the pressing slide block, and pressing sliders that slide in coordination with the pressing slide rails are provided at both ends of one side of the pressing plate. Several equally spaced pressing blades are provided on the other side of the pressing slide block, and a pressing pin support rod is provided at the bottom of each pressing blade. The detection assembly includes an upper camera and a lower camera. A camera frame is mounted on one side of the upper camera and fixed to one side of the support frame. A first L-shaped connecting plate is mounted on one side of the lower camera. A second L-shaped connecting plate is connected to the short side of the first L-shaped connecting plate, and the top of the second L-shaped connecting plate is fixedly connected to the detection table surface.

[0011] Further description: The preheating component and the heating component both include a heating plate, a graphite layer and a fixture plate stacked sequentially from bottom to top. The heating plate, the graphite layer and the fixture plate are all provided with clearance holes that cooperate with the lower PIN support rod and the heating PIN support rod. The lower PIN support rod and the heating PIN support rod can slide up and down through the clearance holes.

[0012] Further description: a spacer plate is fixedly connected between the pressing blades, and several pressing partitions are fixedly connected to one side of the outermost pressing blade. Two pressing PIN support rods are provided at the bottom of each pressing partition, and a pressure sensor is provided on the outer ring wall of the pressing PIN support rod.

[0013] Further description: The worktable is provided with a slide rail mechanism, and the movable claw slides back and forth on the slide rail mechanism.

[0014] Another aspect of the present invention provides a method of using a semiconductor panel-level packaging bonding production line, comprising the following steps:

[0015] Step 01: The movable claw docks with the product 1 placement body and the product 2 placement body, and picks up product 1 and product 2, moves them to the alignment mechanism, docks with the alignment mechanism, and puts product 1 and product 2 into the alignment device for calibration and alignment.

[0016] Step 02: Take out the aligned Product 1 and Product 2, move them to the flipping mechanism, connect them to the flipping mechanism, put Product 1 into the flipping device to flip it, then move them to the preheating mechanism, connect them to the preheating mechanism, put Product 2 into the preheating mechanism for preliminary preheating and baking, heat Product 2 to the preset temperature that can melt the glue, and at the same time evaporate the moisture inside Product 2.

[0017] Step 03: Take out the flipped product 1 and the preheated product 2, move them to the bonding mechanism, align them with the bonding mechanism, and put product 1 and product 2 into the bonding mechanism in sequence for bonding;

[0018] Step 04: After removing the bonded product 1 and product 2, move it to the heating and cooling mechanism, align it with the heating and cooling mechanism, and place the bonded product 1 and product 2 into the heating and cooling mechanism for secondary heating to remove the adhesive, while evaporating the internal moisture of the bonded product. Then, cool it quickly to make the bonded product 1 and product 2 more firmly bonded.

[0019] Step 05: Take out the cooled product 1 and product 2 together, move it to the testing agency, dock it with the testing agency, put the product 1 and product 2 together into the testing agency, and perform precision testing on the surface and edges of the product 1 and product 2 together to test whether the product 1 and product 2 together are qualified.

[0020] Step 06: Take out the tested product 1 and product 2 together, move it to the product 1 and product 2 placement area, align the product 1 and product 2 placement areas, place the qualified product together in the empty space of product 2 placement area; place the unqualified product together in the empty space of product 1 placement area.

[0021] In further description, during steps 01 to 06, the moving claw can skip the waiting time of the alignment mechanism, flipping mechanism, bonding mechanism, preheating mechanism, heating and cooling mechanism, and detection mechanism, and directly proceed to the next step.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] This invention is applicable to large-size wafer bonding processing. Through the coordinated operation of the moving claw, placement mechanism, alignment mechanism, flipping mechanism, two bonding mechanism, preheating mechanism, heating and cooling mechanism and detection mechanism, the close cooperation between the various mechanisms greatly shortens the product production cycle and greatly improves work efficiency.

[0024] This invention uses a preheating mechanism and a heating and cooling mechanism to preheat and glue the product, heat to remove the glue, and cool to solidify it, resulting in a product with better firmness and stability, and greatly improving the quality of the product.

[0025] This invention, through the design of a preheating mechanism and a heating and cooling mechanism, allows the moisture inside the product to be evaporated. The product transfer process is free from manual interference, resulting in products with better cleanliness and a high yield. Attached Figure Description

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a schematic plan view of the entire semiconductor panel-level packaging bonding production line of the present invention;

[0028] Figure 2 This is a schematic elevation view of the overall structure of a semiconductor panel-level packaging bonding production line according to the present invention.

[0029] Figure 3 This is a partial elevation view of the preheating mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0030] Figure 4 This is a partial front view schematic diagram of the preheating mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0031] Figure 5 This is another front view schematic diagram of a partial structure of the preheating mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0032] Figure 6 This is a schematic elevation view of the overall structure of the heating and cooling mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0033] Figure 7 This is a partial elevation view of the heating and cooling mechanism of a semiconductor panel-level packaging bonding production line according to the present invention.

[0034] Figure 8 This is a partial front view schematic diagram of the heating and cooling mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0035] Figure 9 This is another front view schematic diagram of a partial structure of the heating and cooling mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0036] Figure 10This is a partial cross-sectional schematic diagram of the preheating component and heating component of a semiconductor panel-level packaging bonding production line according to the present invention.

[0037] Figure 11 This is a schematic elevation view of the overall structure of the detection mechanism of a semiconductor panel-level packaging bonding production line according to the present invention.

[0038] Figure 12 This is a partial elevation view of the inspection mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0039] Figure 13 This is a partial structural diagram of another elevation view of the detection mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0040] Figure 14 This is a partial front view schematic diagram of the detection mechanism of a semiconductor panel-level packaging bonding production line according to the present invention;

[0041] Figure 15 This is a schematic elevation view of an alignment and tensioning component of a testing mechanism for a semiconductor panel-level packaging bonding production line according to the present invention.

[0042] Figure label:

[0043] 1. Workbench; 11. Slide rail mechanism;

[0044] 2. Movable claw;

[0045] 3. Product placement mechanism; 31. Product 1 placement body; 32. Product 2 placement body;

[0046] 4. Alignment mechanism; 41. Alignment housing;

[0047] 5. Flipping mechanism; 51. Flipping box;

[0048] 6. Bonding mechanism; 61. Bonding housing;

[0049] 7. Preheating mechanism; 71. Preheating chamber; 72. Preheating cavity; 721. Preheating opening; 73. Preheating transfer door assembly; 731. Fixing plate; 732. Lifting cylinder; 733. Connecting block; 734. Sealing door; 74. Upper preheating pin assembly; 741. Upper guide column; 742. Upper preheating plate; 743. Upper lifting motor; 744. Upper drive plate; 745. Upper pin support rod; 75. Lower preheating pin assembly; 751. Lower guide column; 752. Lower preheating plate; 753. Lower lifting motor; 754. Lower drive plate; 755. Lower pin support rod; 76. Preheating assembly; 77. Connecting air pipe; 771. Silencer; 78. Main air pipe; 781. Vacuum switch valve; 79. Vacuum bellows;

[0050] 8. Heating and cooling mechanism; 81. Heating and cooling chamber; 82. Heating and cooling assembly; 821. Heating chamber; 8211. Heating opening; 822. Cooling chamber; 8221. Cooling opening; 83. Heating flip assembly; 831. Heating frame; 832. Heating flip door; 84. Cooling rotation assembly; 841. Cooling frame; 842. Cooling flip door; 85. Heating pin assembly; 851. Heating guide column; 852. Support plate; 853. Heating lifting motor; 854. Heating drive plate; 855. Heating pin support rod; 86. Heating assembly; 87. Cooling pin support rod;

[0051] 9. Testing mechanism; 91. Testing chamber; 92. Support frame; 93. Support platform; 94. Support frame; 95. Rotating assembly; 951. Rotating motor; 952. Rotating platform; 953. Rotating guide column; 954. Testing platform; 9541. Adsorption hole; 96. Alignment and tensioning assembly; 961. First connecting plate; 962. Tensioning cylinder; 963. Second connecting plate; 964. Alignment cylinder; 965. Third connecting plate; 966. Alignment rod; 967. Pulling... 97. Pressing bearing; 971. Pressing slide; 972. Pressing slide rail; 973. Pressing slide block; 974. Pressing plate; 975. Pressing slider; 976. Pressing blade; 977. Pressing pin support rod; 978. Spacer plate; 979. Pressing partition plate; 980. Pressure sensor; 98. Detection assembly; 981. Upper camera; 982. Lower camera; 983. Camera frame; 984. First L-shaped connecting plate; 985. Second L-shaped connecting plate;

[0052] 100. Heating plate; 200. Graphite layer; 300. Fixture plate; 400. Product. Detailed Implementation

[0053] The details are clearly presented. Through the description of specific embodiments, a more in-depth and specific understanding can be gained of the technical means and effects adopted by the present invention to achieve the intended purpose. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the technical solutions of the present invention.

[0054] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes said element. Words such as "connected" or "linked" are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships, which change accordingly when the absolute position of the described objects changes.

[0055] like Figures 1-2 As shown, this embodiment provides a semiconductor panel-level packaging bonding production line, including a worktable 1 and a movable claw 2 that can slide back and forth on the worktable 1. The worktable 1 is provided with a slide rail mechanism 11, and the movable claw 2 slides back and forth on the slide rail mechanism 11. The outer wall of the worktable 1 is provided with a product placement mechanism 3, an alignment mechanism 4, a flipping mechanism 5, two bonding mechanisms 6, a preheating mechanism 7, a heating and cooling mechanism 8, and a detection mechanism 9 in sequence.

[0056] Specifically, the slide rail mechanism 11 is existing technology, such as slide table, slide rail and other devices that can slide back and forth, which will not be described in detail here;

[0057] The movable gripper 2 is a dual-arm mechanical gripper of the prior art (for specific working technology, please refer to patent application numbers: CN202410143570.X or CN202410239387.X). The movable gripper 2 is a dual mechanical gripper. One mechanical gripper is used to transport product 2, and the other mechanical gripper can be used to transport product 2 and move product 1 and product 2 to the placement mechanism, alignment mechanism 4, flipping mechanism 5, two bonding mechanisms 6, preheating mechanism 7, heating and cooling mechanism 8 and detection mechanism 9 for taking out and putting in, which will not be described in detail here;

[0058] Product placement mechanism 3 includes a product 1 placement body 31 and a product 2 placement body 32 connected to the workbench 1. Both product 1 placement body 31 and product 2 placement body 32 are used to place products. Product 1 placement body 31 and product 2 placement body 32 are existing technologies, such as wafer placement bodies, wafer placement boxes and other equipment that can place wafer products, which will not be described in detail here.

[0059] Specifically, two product placement bodies 31 and 32 are provided. The two product placement bodies are designed to facilitate the replacement of products in product placement bodies 31 and 32 after they are filled with qualified and unqualified products, thereby improving work efficiency.

[0060] The alignment mechanism 4 includes an alignment box 41 connected to the worktable 1. An alignment device is fixed inside the alignment box 41. The alignment device is used to align and position the product. The alignment device is existing technology, such as equipment that can perform preliminary alignment and positioning of wafer products, which will not be described in detail here.

[0061] The flipping mechanism 5 includes a flipping box 51 connected to the worktable 1. A flipping device is fixed inside the flipping box 51. The flipping device is used to flip the product 400. The flipping device is existing technology, such as a device that can flip the wafer product 400 (for specific working technology, please refer to patent application number: CN201720304992.6), which will not be elaborated on here.

[0062] Two bonding mechanisms 6 are set at one end of the workbench 1. Since the bonding time is too long, multiple sets of bonding mechanisms 6 can be set to improve work efficiency. The bonding mechanism 6 includes a bonding box 61 connected to the workbench 1. A bonding device is fixed inside the bonding box 61. The bonding device is used for bonding products 400. The bonding device is prior art (for specific working technology, please refer to patent application number: 202411839615.3), which will not be elaborated on here.

[0063] like Figures 3-5As shown, the preheating mechanism 7 includes a preheating chamber 71 connected to the workbench 1. Two preheating chambers 72 are fixed inside the preheating chamber 71. Each preheating chamber 72 has a preheating opening 721 facing the workbench 1. A preheating transfer door assembly 73, capable of opening and closing the preheating opening 721, is provided on the front side of each preheating chamber 72. An upper preheating pin assembly 74 is provided at the top of each preheating chamber 72, extending into the preheating chamber 72. A lower preheating pin assembly 75 is provided at the bottom of each preheating chamber 72, extending into the preheating chamber 72. A preheating assembly 76 is provided at the top of each preheating chamber 72, above the lower preheating pin assembly 75. Connecting air pipes 77 are provided on both side walls of the two preheating chambers 72, and silencers 771 are provided on the connecting air pipes 77. The vacuum inside the preheating chamber 72 is controlled by... Noise is generated during release. A silencer 771 is used to reduce the noise generated, effectively reducing environmental noise pollution. The bottom of the connecting air pipe 77 is connected to the main air pipe 78. A vacuum switch valve 781 is installed at one end of the main air pipe 78. The vacuum switch valve 781 is used to switch on and off the evacuation of air from the preheating chamber 72. The preheating transfer door assembly 73 is used to open and close the preheating chamber 72. The preheating assembly 76 is used to heat the product 400 placed at the bottom of the preheating chamber 72 to a temperature that can melt the specific glue. The vacuum switch valve 781 is used to evacuate the air from the preheating chamber 72, so that a sealed vacuum state is formed inside the preheating chamber 72 to avoid the chemical reaction between impurities in the air and the product 400 during the heating process, thereby improving the purity of the product 400 and improving the quality of the final product 400.

[0064] The lower preheating PIN assembly 75 is used to support the placed product 400 and to lift and place the product 400 on the preheating assembly 76. The upper preheating PIN assembly 74 is used to apply pressure to the product 400 so that the product 400 is in full contact with the preheating assembly 76 and is heated evenly, while preventing the product 400 from deviating during the vacuuming process.

[0065] Specifically, the preheating transfer door assembly 73 includes a fixed plate 731 fixedly connected to the preheating chamber 72. A lifting cylinder 732 is provided on one side of the fixed plate 731. A connecting block 733 is fitted onto the telescopic rod of the lifting cylinder 732. A sealing door 734 is fixedly connected to the side of the connecting block 733 facing the preheating chamber 72. The lifting cylinder 732 drives the connecting block 733 to rise and fall, thereby opening and closing the preheating chamber 72 by raising and lowering the sealing door 734.

[0066] The upper preheating PIN assembly 74 includes several upper guide posts 741 installed on the top of the preheating chamber 72. An upper preheating plate 742 is fixedly connected to the top of the upper guide posts 741. An upper lifting motor 743 is installed on the upper preheating plate 742. An upper drive plate 744 is sleeved on the lead screw of the upper lifting motor 743. The upper drive plate 744 can slide on the outer wall of the upper guide posts 741. Several upper PIN support rods 745 are provided at the bottom of the upper drive plate 744. The upper PIN support rods 745 can slide through the preheating chamber 72. The upper drive plate 744 is driven to slide up and down by the upper lifting motor 743. The upper drive plate 744 drives the upper PIN support rods 745 to slide up and down, thereby realizing the up and down sliding of the upper PIN support rods 745 and realizing the pressure and release of the upper PIN support rods 745 on the product 400. Among them, the upper guide posts 741 play a guiding role, making the operation stable.

[0067] The lower preheating PIN assembly 75 includes several lower guide posts 751 installed at the bottom of the preheating chamber 72. A lower preheating plate 752 is fixedly connected to the bottom of the lower guide posts 751. A lower lifting motor 753 is installed on the lower preheating plate 752. A lower drive plate 754 is sleeved on the lead screw of the lower lifting motor 753. The lower drive plate 754 can slide on the outer ring wall of the lower guide posts 751. Several lower PIN support rods 755 are provided on the top of the lower drive plate 754. The lower PIN support rods 755 can slide through the preheating chamber 72. The lower drive plate 754 is driven to slide up and down by the lower lifting motor 753. The lower drive plate 754 drives the lower PIN support rods 755 to slide up and down, thereby realizing the up and down sliding of the lower PIN support rods 755, supporting the product 400, and realizing the up and down movement of the product 400, so that the product 400 can be placed and removed from the preheating assembly 76. The upper guide post 741 plays a guiding role to ensure the stability of the operation.

[0068] Specifically, both the upper PIN support rod 745 and the lower PIN support rod 755 are fitted with vacuum bellows 79. The vacuum bellows 79 seal the upper PIN support rod 745 and the lower PIN support rod 755 that pass through the preheating cavity 72 to prevent external gas from leaking into the preheating cavity 72.

[0069] The preheating assembly 76 includes a heating plate 100, a graphite layer 200, and a fixture plate 300 stacked sequentially from bottom to top inside the preheating cavity 72. Each of the heating plate 100, graphite layer 200, and fixture plate 300 has clearance holes that mate with a lower PIN support rod 755. The lower PIN support rod 755 can slide up and down through the clearance holes. The heating plate 100 is a material that provides heat; this material can be metal, ceramic, or composite. The graphite layer is a heat-conducting material attached between the heating plate 100 and the fixture plate 300, used for heat transfer between them, and has high-temperature resistance and heat conduction properties. The fixture plate 300 is a high-temperature resistant and oxidation-resistant metal material, which, while providing heat transfer, also prevents chemical reactions with the placed product 400.

[0070] like Figures 6-9 As shown, the heating and cooling mechanism 8 includes a heating and cooling box 81 connected to the worktable 1. Two heating and cooling components 82 are fixed inside the heating and cooling box 81. Each heating and cooling component 82 includes a heating chamber 821 and a cooling chamber 822 stacked sequentially from bottom to top. The heating chamber 821 has a heating opening 8211 facing the worktable 1. A heating flipping component 83 is provided on the front side of the heating chamber 821 to open and close the heating opening 8211. The cooling chamber 822 has a cooling opening 8221 facing the worktable 1. A cooling rotation component 84 is provided on the front side of the cooling chamber 822 to open and close the cooling opening 8221. A heating pin component 85 is provided at the bottom of the heating chamber 821. The unit is equipped with a heating component 86, and a cooling pin support rod 87 is installed at the bottom of the cooling chamber 822. The cooling pin support rod 87 is fixed. The heating flipping component 83 is used to open and close the heating chamber 821, and the cooling rotation component 84 is used to open and close the cooling chamber 822. The heating component 86 is used to perform secondary heating on the product 400 placed at the bottom of the heating chamber 821, so that the residual adhesive inside the product 400 falls off. The cooling chamber 822 is connected to an external cooling air pipe, which is used to introduce cold air into the cooling chamber 822 to quickly cool the heated product 400, thereby achieving a tempering effect, making the product 400 more solid, and helping to improve the bonding quality between products 400.

[0071] Specifically, the heating flip assembly 83 includes a heating frame 831 fixedly connected to the heating cavity 821. A rotating shaft is rotatably connected inside the heating frame 831, and a heating flip door 832 is sleeved on the rotating shaft. An external motor connected to the rotating shaft drives the rotating shaft to rotate forward and backward, thereby causing the heating flip door 832 to flip up and down, so as to open and close the heating opening 8211 of the heating cavity 821 through the heating flip door 832.

[0072] The cooling rotation assembly 84 includes a cooling frame 841 fixedly connected to the cooling chamber 822. A rotating shaft is rotatably connected inside the cooling frame 841, and a cooling flip door 842 is sleeved on the rotating shaft. An external motor connected to the rotating shaft drives the rotating shaft to rotate forward and backward, thereby causing the cooling flip door 842 to flip up and down, so as to open and close the cooling opening 8221 of the cooling chamber 822 through the cooling flip door 842.

[0073] The heating PIN assembly 85 includes several heating guide posts 851 installed at the bottom of the heating chamber 821. A support plate 852 is fixedly connected to the bottom of the heating guide posts 851. A heating lifting motor 853 is installed on the support plate 852. The lead screw of the heating lifting motor 853 is equipped with a heating drive plate 854. The heating drive plate 854 can slide on the outer ring wall of the heating guide posts 851. Several heating PIN support rods 855 are provided on the top of the heating drive plate 854. The heating PIN support rods 855 can slide through the heating chamber 821. The heating drive plate 854 is driven to slide up and down by the heating lifting motor 853. The heating drive plate 854 drives the heating PIN support rods 855 to slide up and down, thereby realizing the up and down sliding of the heating PIN support rods 855, supporting the product 400, and realizing the up and down movement of the product 400, so that the product 400 can be placed and removed from the heating assembly 86. The heating guide posts 851 play a guiding role, making the operation stable.

[0074] like Figure 10 As shown, the heating assembly 86 and the preheating assembly 76 are made of the same material. They include a heating plate 100, a graphite layer 200, and a fixture plate 300 stacked sequentially from bottom to top inside the heating chamber 821. The heating plate 100, the graphite layer 200, and the fixture plate 300 are all provided with clearance holes that cooperate with the heating PIN support rod 855. The heating PIN support rod 855 can slide up and down through the clearance holes. That is, the lower PIN support plate 852 and the heating PIN support rod 855 drive the product 400 to move downwards, and finally the product 400 is placed on the fixture plate 300.

[0075] like Figures 11-15As shown, the testing mechanism 9 includes a testing box 91 connected to the workbench 1. A support frame 92 is fixed inside the testing box 91. A support platform 93 is installed on the top of the support frame 92. A rotating component 95 is installed on the support platform 93. Four sets of alignment and tensioning components 96 are arranged around the rotating component 95 on the support platform 93. A support frame 94 is installed on the support platform 93. A pressing component 97 is arranged on one side of the support frame 94 above the rotating component 95. Testing components 98 are arranged on both sides of the rotating component 95. The rotating component 95 is used to rotate the product 400 to detect different positions of the middle and edges of the product 400. The alignment and tensioning components 96 are used to align and correct the placement position of the product 400 and tighten and fix the product 400 to prevent the product 400 from shifting when rotating. The pressing components 97 are used to fix the product 400 and detect the stress on each surface of the product 400. The testing components 98 are used to detect whether the adhesion between the products 400 and the product 400 is qualified.

[0076] Specifically, the rotating assembly 95 includes a rotating motor 951 fixedly connected to the support frame 92. A rotating platform 952 is fitted onto the end of the rotating shaft of the rotating motor 951. The rotating platform 952 is fixedly connected to a detection table 954 via several rotating guide pillars 953. Several adsorption holes 9541 are provided on the detection table 954, and the adsorption holes 9541 are connected to an external air pipe for adsorbing the product 400. The rotating platform 952 is driven to rotate by the rotating motor 951, and the rotating platform 952 drives the several guide pillars and the detection table 954 to rotate.

[0077] Specifically, the testing platform 954 has two slots to facilitate the vertical passage of the movable claw 2;

[0078] The alignment and tensioning assembly 96 includes a first connecting plate 961 installed on the bottom edge of the rotating platform 952. A tensioning cylinder 962 is installed at the bottom of the first connecting plate 961. A second connecting plate 963 is sleeved on the telescopic rod of the tensioning cylinder 962. An alignment cylinder 964 is fixedly connected to one side of the second connecting plate 963. A third connecting plate 965 is sleeved on the telescopic rod of the alignment cylinder 964. An alignment rod 966 is installed on the top of the third connecting plate 965. A tensioning bearing 967 is sleeved on the top of the alignment rod 966. Four sets of alignment and tensioning assemblies 96 are respectively arranged around the rotating platform 952. The second connecting plate 963 is driven to move horizontally in a linear direction by the tensioning cylinder 962. The second connecting plate 963 drives the alignment cylinder 964 to move horizontally in a linear direction. The alignment cylinder 964 drives the third connecting plate 965 to move vertically in a linear direction. The third connecting plate 965 drives the alignment rod 966 to move vertically in a linear direction, thereby realizing the horizontal and vertical linear movement of the alignment rod 966. The tension bearing 967 is used to abut against the product 400, so that the product 400 is initially fixed by alignment and tension by the tension bearing 967 on the alignment rod 966 driven by the tension cylinder 962. That is, the product 400 is pressed by the tension bearing 967 on the alignment rod 966 driven by the alignment cylinder 964. The product 400 is aligned or aligned by the tension bearing 967 on the alignment rod 966.

[0079] It should be noted that the horizontal and vertical straight line directions mentioned above can be understood as the horizontal straight line direction being the direction on the X-axis or Y-axis, and the vertical straight line direction being the direction on the Z-axis.

[0080] The pressing assembly 97 includes a pressing slide 971 mounted on a support frame 94, and two pressing slide rails 972 disposed on both sides of the pressing slide 971. A pressing slide 973 that slides up and down is disposed on the pressing slide 971. A pressing plate 974 is fixedly connected to one side of the pressing slide 973. Pressing sliders 975 that slide in cooperation with the pressing slide rails 972 are disposed at both ends of one side of the pressing plate 974. A number of pressing blades 976 that are equally spaced are disposed on the other side of the pressing slide 973. A pressing pin support rod 977 is disposed at the bottom of the pressing blade 976.

[0081] Specifically, a spacer plate 978 is fixedly connected between the pressing blades 976 and the pressing blades 976. Several pressing partitions 979 are fixedly connected to one side of the outermost pressing blade 976. Two pressing PIN support rods 977 are provided at the bottom of each pressing partition 979. A pressure sensor 980 is provided on the outer ring wall of the pressing PIN support rod 977. The spacer plate 978 is beneficial to the working stability between the pressing blades. At the same time, the pressing partitions 979 extending to the periphery are beneficial to contacting the outer force-bearing surface of the product 400. The pressure sensor 980 is used to detect whether the force on the surface of the product 400 is uniform and can detect whether there is a warping problem on the surface of the product 400. At the same time, the pressure sensor 980 can also prevent the pressing PIN support rods 977 from applying excessive pressure to compensate for and reduce the applied pressure of the pressing PIN support rods 977.

[0082] Meanwhile, the pressing slide 973 slides up and down under the drive of the pressing slide 971. The pressing slide 973 drives the pressing plate 974 to slide up and down. The pressing plate 974 drives several pressing blades 976, spacers 978 and pressing partitions 979 to slide up and down, thereby driving the pressing PIN support rod 977 to slide up and down.

[0083] The detection component 98 includes an upper camera 981 and a lower camera 982. A camera frame 983 is mounted on one side of the upper camera 981 and is fixed to one side of the support frame 94. A first L-shaped connecting plate 984 is mounted on one side of the lower camera 982. A second L-shaped connecting plate 985 is connected to the short side of the first L-shaped connecting plate 984 and the top of the second L-shaped connecting plate 985 is fixedly connected to the detection table surface 954. The upper camera 981 detects the surface of the product 400 and the lower camera 982 detects the edges of the product 400.

[0084] In this embodiment, the present invention also provides a method for using a semiconductor panel-level packaging bonding production line, specifically including the following steps:

[0085] The following understanding needs to be added: Product 1 is a substrate tape product, and Product 2 is a wafer tape chip material. This work requires bonding Product 1 and Product 2 to form a final product community.

[0086] Step 01: The movable claw 2 docks with the product 1 placement body 31 and the product 2 placement body 32, and lifts up product 1 and product 2. It moves to the alignment mechanism 4, docks with the alignment mechanism 4, and places product 1 and product 2 into the alignment device for calibration and alignment.

[0087] Step 02: Take out the aligned product 1 and product 2, move them to the flipping mechanism 5, connect with the flipping mechanism 5, put product 1 into the flipping device to flip it, then move them to the preheating mechanism 7, connect with the preheating mechanism 7, put product 2 into the preheating mechanism 7 for preliminary preheating and baking, heat product 2 to the preset temperature that can melt the glue, and at the same time evaporate the moisture inside product 2.

[0088] Step 03: Take out the flipped product 1 and the preheated product 2, move them to the bonding mechanism 6, align them with the bonding mechanism 6, and put product 1 and product 2 into the bonding mechanism 6 in sequence for bonding;

[0089] Step 04: After removing the bonded product 1 and product 2, move it to the heating and cooling mechanism 8, align it with the heating and cooling mechanism 8, and place the bonded product 1 and product 2 into the heating and cooling mechanism 8 for secondary heating to remove the adhesive, while evaporating the internal moisture of the bonded product 1 and product 2. Then, cool it quickly to make the bonded product 1 and product 2 more firmly bonded.

[0090] Step 05: Take out the cooled product 1 and product 2 together, move it to the testing mechanism 9, connect it to the testing mechanism 9, put the product 1 and product 2 together into the testing mechanism 9, and perform precision testing on the surface and edges of the product 1 and product 2 together to check whether the product 1 and product 2 together are qualified.

[0091] Step 06: Take out the tested product 1 and product 2 together, move it to the product 1 placement body 31 and product 2 placement body 32, align product 1 placement body 31 and product 2 placement body 32, put the qualified product together into the empty space of product 2 placement body 32; put the unqualified product together into the empty space of product 1 placement body 31.

[0092] Specifically, during steps 01 to 06, the movable claw 2 can skip the waiting time of the alignment mechanism 4, flipping mechanism 5, bonding mechanism 6, preheating mechanism 7, heating and cooling mechanism 8 and detection mechanism 9, and directly proceed to the next step.

[0093] For example, during step 03 when bonding is in progress and a waiting period is required, during which time the moving claw 2 can move to the product 1 placement body 31 and product 2 placement body 32 to extract products 1 and 2 and place them into the alignment device for calibration. Alternatively, the claw 2 can extract the finished product 1 and place it in the empty space of product 2 placement body 32 or product 1 placement body 31 to continue other work. After bonding is completed, the moving claw 2 returns to perform the next step. This working method can greatly improve production efficiency and effectively reduce the working interval between mechanisms.

[0094] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A semiconductor panel-level packaging bonding production line body, characterized in that, It includes a worktable (1) and a movable claw (2) that can slide back and forth on the worktable (1). The outer wall of the worktable (1) is arranged in a ring with a product placement mechanism (3), an alignment mechanism (4), a flipping mechanism (5), a two-bonding mechanism (6), a preheating mechanism (7), a heating and cooling mechanism (8), and a detection mechanism (9). The movable claw (2) is used to take out and put in products. The product placement mechanism (3) includes a product 1 placement body (31) and a product 2 placement body (32) connected to the workbench (1). The alignment mechanism (4) includes an alignment box (41) connected to the worktable (1), and an alignment device is fixed inside the alignment box (41). The alignment device is used for aligning and positioning the product. The flipping mechanism (5) includes a flipping box (51) connected to the workbench (1), and a flipping device is fixed inside the flipping box (51) for flipping the product. The bonding mechanism (6) includes a bonding box (61) connected to the worktable (1), and a bonding device is fixed inside the bonding box (61). The bonding device is used to bond products together. The preheating mechanism (7) includes a preheating box (71) connected to the workbench (1). Two preheating cavities (72) are fixed inside the preheating box (71). Each preheating cavity (72) has a preheating opening (721) facing the workbench (1). A preheating transfer door assembly (73) is provided on the front side of the preheating cavity (72) to open and close the preheating opening (721). An upper preheating pin assembly (74) is provided on the top of the preheating cavity (72), extending into the preheating cavity (72). (72) A lower preheating PIN assembly (75) is provided at the bottom. The lower preheating PIN assembly (75) extends into the preheating chamber (72). A preheating assembly (76) is provided at the top of the preheating chamber (72) above the lower preheating PIN assembly (75). Both sides of the two preheating chambers (72) are provided with connecting air pipes (77). A silencer (771) is provided on the connecting air pipes (77). The bottom of the connecting air pipes (77) is connected to a main air pipe (78). A vacuum switch valve (781) is provided at one end of the main air pipe (78). The preheating transmission door assembly (73) includes a fixed plate (731) fixedly connected to the preheating cavity (72). A lifting cylinder (732) is provided on one side of the fixed plate (731). A connecting block (733) is fitted on the telescopic rod of the lifting cylinder (732). A sealing door (734) is fixedly connected to the side of the connecting block (733) facing the preheating cavity (72). The upper preheating PIN assembly (74) includes several upper guide posts (741) installed on the top of the preheating cavity (72). An upper preheating plate (742) is fixedly connected to the top of the upper guide posts (741). An upper lifting motor (743) is installed on the upper preheating plate (742). The lead screw of the upper lifting motor (743) is sleeved with an upper drive plate (744). The upper drive plate (744) can slide on the outer ring wall of the upper guide posts (741). Several upper PIN support rods (745) are provided at the bottom of the upper drive plate (744). The upper PIN support rods (745) can slide through the preheating cavity (72). The lower preheating PIN assembly (75) includes several lower guide posts (751) installed at the bottom of the preheating cavity (72). A lower preheating plate (752) is fixedly connected to the bottom of the lower guide posts (751). A lower lifting motor (753) is installed on the lower preheating plate (752). A lower drive plate (754) is sleeved on the lead screw of the lower lifting motor (753). The lower drive plate (754) can slide on the outer ring wall of the lower guide posts (751). Several lower PIN support rods (755) are provided on the top of the lower drive plate (754). The lower PIN support rods (755) can slide through the preheating cavity (72).

2. The semiconductor panel level package bonding production line body according to claim 1, wherein, Both the upper PIN support rod (745) and the lower PIN support rod (755) are fitted with vacuum bellows (79).

3. The semiconductor panel level package bonding production line body according to claim 1, wherein, The heating and cooling mechanism (8) includes a heating and cooling box (81) connected to the workbench (1). Two heating and cooling components (82) are fixed inside the heating and cooling box (81). The heating and cooling components (82) include a heating chamber (821) and a cooling chamber (822) stacked from bottom to top. The heating chamber (821) has a heating opening (8211) facing the workbench (1). A heating flipping component (83) that can open and close the heating opening (8211) is provided on the front side of the heating chamber (821). The cooling chamber (822) has a cooling opening (8221) facing the workbench (1). A cooling rotation component (84) that can open and close the cooling opening (8221) is provided on the front side of the cooling chamber (822). A heating pin component (85) is provided at the bottom of the heating chamber (821). A heating component (86) is provided at the bottom inside the heating chamber (821). A cooling pin support rod (87) is installed at the bottom inside the cooling chamber (822). The heating flipping assembly (83) includes a heating frame (831) fixedly connected to the heating chamber (821), a rotating shaft is rotatably connected inside the heating frame (831), and a heating flipping door (832) is sleeved on the rotating shaft. The cooling rotating assembly (84) includes a cooling frame (841) fixedly connected to the cooling chamber (822), a rotating shaft is rotatably connected inside the cooling frame (841), and a cooling flip door (842) is sleeved on the rotating shaft. The heating PIN assembly (85) includes several heating guide posts (851) installed at the bottom of the heating chamber (821). A support plate (852) is fixedly connected to the bottom of the heating guide posts (851). A heating lifting motor (853) is installed on the support plate (852). The lead screw of the heating lifting motor (853) is provided with a heating drive plate (854). The heating drive plate (854) can slide on the outer ring wall of the heating guide posts (851). Several heating PIN support rods (855) are provided on the top of the heating drive plate (854). The heating PIN support rods (855) can slide through the heating chamber (821).

4. The semiconductor panel-level packaging bonding production line according to claim 1, characterized in that, The testing mechanism (9) includes a testing box (91) connected to the workbench (1), a support frame (92) fixed inside the testing box (91), a support platform (93) installed on the top of the support frame (92), a rotating component (95) installed on the support platform (93), four sets of alignment and tensioning components (96) arranged around the rotating component (95) on the support platform (93), a support frame (94) installed on the support platform (93), a pressing component (97) arranged on one side of the support frame (94) above the rotating component (95), and testing components (98) arranged on both sides of the rotating component (95). The rotating assembly (95) includes a rotating motor (951) fixedly connected to the support frame (92). The rotating platform (952) is fitted at the end of the rotating shaft of the rotating motor (951). The rotating platform (952) is fixedly connected to a detection table (954) through several rotating guide columns (953). Several adsorption holes (9541) are opened on the detection table (954). The alignment and tensioning assembly (96) includes a first connecting plate (961) installed on the bottom edge of the rotating platform (952), a tensioning cylinder (962) is provided at the bottom of the first connecting plate (961), a second connecting plate (963) is sleeved on the telescopic rod of the tensioning cylinder (962), an alignment cylinder (964) is fixedly connected to one side of the second connecting plate (963), a third connecting plate (965) is sleeved on the telescopic rod of the alignment cylinder (964), an alignment rod (966) is provided at the top of the third connecting plate (965), and a tensioning bearing (967) is sleeved at the top of the alignment rod (966). The pressing assembly (97) includes a pressing slide (971) mounted on a support frame (94) and two pressing slide rails (972) on both sides of the pressing slide (971). The pressing slide (971) is provided with a pressing slide seat (973) that slides up and down. A pressing plate (974) is fixedly connected to one side of the pressing slide seat (973). Pressing sliders (975) that slide in cooperation with the pressing slide rails (972) are provided at both ends of one side of the pressing plate (974). A number of pressing blades (976) arranged at equal intervals are provided on the other side of the pressing slide seat (973). A pressing PIN support rod (977) is provided at the bottom of the pressing blade (976). The detection component (98) includes an upper camera (981) and a lower camera (982). A camera frame (983) is installed on one side of the upper camera (981), and the camera frame (983) is fixed to one side of the support frame (94). A first L-shaped connecting plate (984) is installed on one side of the lower camera (982). A second L-shaped connecting plate (985) is connected to the short side of the first L-shaped connecting plate (984), and the top of the second L-shaped connecting plate (985) is fixedly connected to the detection table (954).

5. A semiconductor panel-level packaging bonding production line according to claim 1, characterized in that, The preheating component (76) and the heating component (86) both include a heating plate (100), a graphite layer (200) and a fixture plate (300) stacked sequentially from bottom to top. The heating plate (100), the graphite layer (200) and the fixture plate (300) are all provided with clearance holes that cooperate with the lower PIN support rod (755) and the heating PIN support rod (855). The lower PIN support rod (755) and the heating PIN support rod (855) can slide up and down through the clearance holes.

6. A semiconductor panel-level packaging bonding production line according to claim 4, characterized in that, A spacer plate (978) is fixedly connected between the pressing blade plate (976) and the pressing blade plate (976). Several pressing partition plates (979) are fixedly connected to one side of the outermost pressing blade plate (976). Two pressing PIN support rods are provided at the bottom of each pressing partition plate (979). A pressure sensor (980) is provided on the outer ring wall of the pressing PIN support rod (977).

7. A semiconductor panel-level packaging bonding production line according to claim 1, characterized in that, The workbench (1) is provided with a slide rail mechanism (11), and the movable claw (2) slides back and forth on the slide rail mechanism (11).

8. A method of using the semiconductor panel-level packaging bonding production line of claim 1, characterized in that, Includes the following steps: Step 01: The moving claw (2) docks with the product 1 placement body (31) and the product 2 placement body (32), and removes product 1 and product 2, moves them to the alignment mechanism (4), docks with the alignment mechanism (4), and puts product 1 and product 2 into the alignment device for calibration and alignment; Step 02: Take out the aligned product 1 and product 2, move them to the flipping mechanism (5), connect the flipping mechanism (5), put product 1 into the flipping device for flipping, then move them to the preheating mechanism (7), connect the preheating mechanism (7), put product 2 into the preheating mechanism (7) for preliminary preheating and baking, heat product 2 to the preset temperature that can melt the glue, and at the same time evaporate the moisture inside product 2; Step 03: Take out the flipped product 1 and the preheated product 2, move them to the bonding mechanism (6), align them with the bonding mechanism (6), and put product 1 and product 2 into the bonding mechanism (6) in sequence for bonding; Step 04: After taking out the bonded product 1 and product 2, move it to the heating and cooling mechanism (8), align it with the heating and cooling mechanism (8), put the product 1 and product 2 into the heating and cooling mechanism (8), perform secondary heating to remove the adhesive, evaporate the internal moisture of the bond, and then cool it quickly to make the bond of product 1 and product 2 more firmly attached. Step 05: Take out the cooled product 1 and product 2 together, move it to the testing mechanism (9), dock the testing mechanism (9), put the product 1 and product 2 together into the testing mechanism (9), perform precision testing on the surface and edge of the product 1 and product 2 together, and test whether the product 1 and product 2 together are qualified. Step 06: Take out the tested product 1 and product 2 together, move it to the product 1 placement body (31) and product 2 placement body (32), connect the product 1 placement body (31) and product 2 placement body (32), put the qualified product together into the empty space of product 2 placement body (32); put the unqualified product together into the empty space of product 1 placement body (31).

9. The method of using a semiconductor panel-level packaging bonding production line according to claim 8, characterized in that, During steps 01 to 06, the moving claw (2) can skip the waiting time of the alignment mechanism (4), the flipping mechanism (5), the bonding mechanism (6), the preheating mechanism (7), the heating and cooling mechanism (8), and the detection mechanism (9) and proceed directly to the next step.