A device front-end module

Abstract

This invention discloses a front-end module for a device, including a frame and a wafer loading device. The frame houses a robotic arm and a buffer device. The buffer device includes a support frame with an inlet / outlet at the front. Air intake components, capable of ejecting gas onto the support frame, are located on the left and right sides of the inlet / outlet. Each air intake component includes a base plate with an air intake channel. The air channel includes an inlet channel, an outlet channel, a guide section, and a first opening. The guide section connects the inlet and outlet channels, and the first opening connects to the outlet channel and is located in front of the inlet / outlet. An adjusting pipe rotates within the outlet channel. The adjusting pipe includes a closed area, an adjusting area, a guiding area, and a second opening arranged sequentially along the circumference. An adjusting hole is provided in the adjusting area. By centrally arranging the air intake components in the buffer device to supply gas to the support frame, the wafers within the support frame are purified. Furthermore, the structure of the air intake components allows for adjustment of the ejected gas flow rate, conserving the purification gas.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and more particularly to a front-end module for such equipment. Background Technology

[0002] The Equipment Front End Module (EFEM) is used for wafer transfer between the wafer cassette and the process stage. After certain processing steps, residual process gases on the wafer surface can cause damage. Before placing the wafer into the wafer cassette for transfer, the EFEM typically needs to protect and purify it with clean gas. However, uneven purification can occur during this process, or the wafer may achieve a relatively clean purification but consume a large amount of expensive gas. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the present invention aims to provide a front-end module for a device, in which an air intake component is centrally arranged in the buffer device to supply air to the support frame, thereby purifying the wafers inside the support frame. At the same time, the structure of the air intake component can adjust the flow rate of the ejected gas, thus saving the gas used for purification.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a front-end module of a device, comprising a frame and a wafer loading device docked with the frame, wherein a robotic arm and a buffer device are disposed within the frame, the buffer device comprising a support frame, the support frame comprising an inlet and outlet at the front, and air intake components capable of ejecting gas are disposed on the left and right sides of the inlet and outlet, the air intake components comprising:

[0005] Seat plate, the seat plate being fixed to the outside of the side plate of the support frame; A gas channel is provided on the base plate. The gas channel includes a vertically arranged inlet channel, an outlet channel, a guide section, and a first opening. The guide section connects the inlet channel and the outlet channel. The first opening connects to the outlet channel and is located in front of the inlet and outlet. The regulating pipe rotates within the air outlet channel. The regulating pipe includes a closed area, an regulating area, a guide area, and a second opening arranged sequentially along the circumference. An regulating hole is provided on the regulating area. When the adjustment area rotates to the guide section, the second opening rotates to the first opening, and the adjustment hole adjusts the air flow rate at the first opening by changing the alignment area with the guide section; when the closing area closes the guide section, the flow guiding area closes the first opening.

[0006] Furthermore, the angle between the vertical plane where the first opening is located and the vertical plane where the inlet and outlet are located is not less than 90°, the width of the second opening is less than the width of the first opening, and the overlapping area of ​​the first opening and the second opening forms an air outlet. When the adjustment hole is fully aligned with the guide portion, the first opening is partially blocked and the second opening serves as the air outlet, and the air outlet direction of the air outlet is tilted forward relative to the inlet and outlet. When the adjusting hole is aligned with the guiding part, the larger the area of ​​the adjustment hole and the guiding part, the wider the air outlet opening, and the air outlet opening's air outlet direction is inclined forward relative to the inlet and outlet or parallel to the inlet and outlet.

[0007] Furthermore, the flow guiding area also includes an arc-shaped guide portion located at the second opening. When the closed area closes the guiding portion and the adjusting hole is fully aligned with the guiding portion, the arc-shaped guide portion abuts against the two side walls of the first opening, respectively.

[0008] Furthermore, the adjustment holes are evenly arranged in the vertical direction, and each adjustment hole includes multiple hole bodies evenly distributed along the circumference of the adjustment tube.

[0009] Furthermore, the adjustment holes are evenly distributed along the vertical direction, and the adjustment holes are waist-shaped holes extending circumferentially along the adjustment tube.

[0010] Furthermore, the intake assembly also includes a rotary drive component, which is fixed to the base plate and used to drive the regulating pipe to rotate.

[0011] Furthermore, the buffer device also includes an oxygen sensor located within the support frame, in the rear region of the support frame. The oxygen sensor is used to collect the oxygen content within the support frame, and the rotation drive is linked to the oxygen sensor.

[0012] Furthermore, the base plate is provided with an air supply port that communicates with the air intake channel, and the gas enters the air intake channel from the air supply port.

[0013] Furthermore, the buffer device also includes an exhaust assembly, which includes an adapter fixed to the rear plate of the support frame. The adapter and the rear plate of the support frame form an exhaust channel, and the rear plate has an exhaust port that communicates with the exhaust channel.

[0014] Furthermore, an air intake is provided at the bottom of the frame. Attached Figure Description

[0015] Figure 1This is a schematic diagram of the structure of the device front-end module in an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of the cache device in an embodiment of the present invention; Figure 3 This is a schematic diagram of a cache rack after being partially cut in an embodiment of the present invention; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is a schematic diagram of the air intake channel structure in an embodiment of the present invention; Figure 6 This is a schematic diagram of the adjusting component structure in an embodiment of the present invention; Figure 7 This is a schematic diagram of the adjusting member closing the first opening in an embodiment of the present invention; Figure 8 for Figure 7 Enlarged view at point B in the middle; Figure 9 This is a schematic diagram of the adjusting component in the exhaust state in an embodiment of the present invention; Figure 10 for Figure 9 Enlarged view at point C; Figure 11 This is a schematic diagram of the adjusting component in a low-flow inflation state in an embodiment of the present invention; Figure 12 for Figure 11 Larger image at point D; Figure 13 This is a schematic diagram of the adjusting component in a high-flow inflation state in an embodiment of the present invention; Figure 14 for Figure 13 Enlarged view of point E in the middle.

[0016] In the picture: 100. Frame; 101. Air intake; 200. Wafer loading device; 300. Robotic arm; 400. Cache device; 1. Support frame; 11. Inlet / outlet; 12. Side panel; 13. Rear panel; 131. Air outlet; 14. Support assembly; 15. Receiving cavity; 2. Intake assembly; 21. Seat plate; 22. Gas passage; 221. Intake passage; 2211. Air supply port; 2212. Pipe connector; 222. Exhaust passage; 223. Conductor; 224. First opening; 23. Adjusting pipe; 231. Enclosed area; 232. Adjustment area; 2321. Adjustment hole; 23211. First hole; 23212. Second hole; 23213. Third hole; 233. Guide area; 234. Second opening; 2341. Arc-shaped guide; 24. Rotary drive component; 25. Exhaust opening; 3. Oxygen sensor; 4. Exhaust assembly; 41. Adapter; 411. Exhaust passage; 42. Exhaust pipe; 51. Bracket; 52. Connecting plate; 6. Wafer. Detailed Implementation

[0017] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0018] See appendix Figure 1 As shown, a device front-end module includes a frame 100 and a wafer loading device 200 docked with the frame 100. The wafer loading device 200 is used to load wafer cassettes. A robot arm 300 and a buffer device 400 are provided inside the frame 100. The robot arm 300 transfers wafers 6 between the process station docked with the device front-end module and the wafer cassettes on the wafer loading device 200. The wafers 6 can be buffered in the buffer device 400.

[0019] See appendix Figure 2 and attached Figure 3 As shown, the buffer device includes a carrier frame 1, which includes a rear plate 13 and two side plates 12 in the left and right directions. The rear plate 13 and the side plates 12 define a receiving cavity 15. An inlet / outlet 11 for the wafer 6 to enter and exit the receiving cavity 15 is provided at the front of the carrier frame 1. A support assembly 14 is provided inside the receiving cavity 15. The support assembly 14 includes slots evenly distributed in the vertical direction, and each slot can accommodate one wafer 6.

[0020] The wafer 6, after being processed at the process station, is cached in the cache device 400. Process gases may remain on the wafer 6, so the wafer 6 in the cache device 400 needs to be purified.

[0021] In one embodiment, see Appendix Figure 3 and attached Figure 4As shown, the buffer device 400 also includes an air intake assembly 2 capable of ejecting gas. The air intake assembly 2 is located on the left and right sides of the inlet and outlet 11. The gas ejected by the air intake assembly 2 can purify the wafer 6 in the receiving cavity 15. The air intake assembly 2 includes a base plate 21, a gas channel 22, and a regulating pipe 23. The regulating pipe 23 rotates within the gas channel 22 to regulate the final air flow rate of the air intake assembly 2.

[0022] The mounting plate 21 is fixed to the outside of the side plate 12 of the support frame 1, and will not affect the entry and exit of the wafer 6 into the receiving cavity 15. Gas channels 22 are formed on the mounting plate 21, see attached diagram. Figure 5 As shown, the gas channel 22 includes a vertically arranged inlet channel 221, an outlet channel 222, a guide section 223, and a first opening 224. Gas directly enters the inlet channel 221. The guide section 223 connects the inlet channel 221 and the outlet channel 222. The first opening 224 connects the outlet channel 222. The first opening 224 is located in front of the inlet / outlet 11 and faces the support frame 1.

[0023] See appendix Figure 6 As shown, the regulating pipe 23 is a hollow tubular structure. The regulating pipe 23 includes a closed region 231, an regulating region 232, a guiding region 233, and a second opening 234 arranged sequentially along the circumference. At this time, the regulating pipe 23 forms a C-shape in its cross-section along the horizontal plane, and the air outlet channel is connected to the hollow cavity of the regulating pipe 23. An regulating hole 2321 is provided on the regulating region 232. When the regulating region 232 rotates to the guiding part 223, the second opening 234 rotates to the first opening 224. The regulating hole 2321 adjusts the airflow at the first opening 224 by changing the alignment area with the guiding part 223. When the closed region 231 closes the guiding part 223, the guiding region 233 closes the first opening 224.

[0024] The gas in the intake passage 221 passes through the guide section 223 and the regulating pipe 23 to enter the exhaust passage 222. When it is not necessary to purify the wafer 6 in the support frame 1, see Appendix. Figure 7 and attached Figure 8 As shown, when the regulating tube 23 rotates to the closed position of the closed region 231 and the closed conduction part 223, the guide region 233 closes the first opening 224, and the gas in the gas channel 22 will not be ejected from the first opening 224. This forms two seals on the path of the gas flowing out of the gas channel 22, achieving a double seal and reducing gas loss. When it is necessary to purify the wafer 6 in the support frame 1, the regulating tube 23 rotates to the alignment position of the regulating region 232 and the conduction part 223. At this time, by changing the rotation angle of the regulating tube 23, the alignment area between the regulating hole 2321 and the conduction part 223 is changed, thereby adjusting the gas flow rate in the gas channel 22, supplying gas as needed, and reducing gas waste.

[0025] The combination of regulating pipe 23 and gas channel 22 can control the outflow of gas from the air intake component. At the same time, it can double seal the path of gas channel 22 when gas is not needed, and adjust the opening and closing and flow of gas according to usage requirements, thus saving gas consumption.

[0026] In this embodiment, according to the processing requirements of wafer 6, the gas is nitrogen, and the wafer 6 is purified by blowing nitrogen onto the surface of wafer 6.

[0027] In one embodiment, see Appendix Figure 4 and attached Figure 5 As shown, the intake channel 221 and the exhaust channel 222 form an 8-shaped cross-sectional area in the horizontal plane. The intersection of the intake channel 221 and the exhaust channel 222 forms the guide section 223. At this time, there is no need to open an additional channel as the guide section 223, which can reduce the space occupied by the gas channel 22 and simplify the processing technology.

[0028] The intake passage 221 and the exhaust passage 222 are cylindrical structures, with partial overlap. The outer diameter of the regulating pipe 23 is the same as or slightly smaller than the diameter of the exhaust passage 222, allowing the regulating pipe 23 to rotate within the exhaust passage 222. Meanwhile, the closed area 231 enters the intake passage 221 to block the guide portion 223. Simultaneously, the size of the regulating pipe 23 reduces the gap between the regulating pipe 23 and the sidewall of the exhaust passage 222, minimizing gas escape from the gap within the intake passage and improving gas utilization.

[0029] In this embodiment, by cooperating with the rotating regulating tube 23 and the gas channel 22, the gas channel 22 can be blocked and the final gas flow rate of the gas channel 22 can be adjusted according to the usage requirements. While satisfying the purification of the wafer 6 in the support frame 1, the waste of gas is reduced and the gas has a higher utilization efficiency.

[0030] In one embodiment, see Appendix Figure 3 and attached Figure 4 As shown, the angle between the vertical plane containing the first opening 224 and the vertical plane containing the inlet / outlet 11 is not less than 90°. The width of the second opening 234 is less than the width of the first opening 224. The overlapping area of ​​the first opening 224 and the second opening 234 forms the air outlet 25. During rotation, the regulating pipe 23 can adjust the air outlet direction of the air outlet 25 through the overlapping area of ​​the first opening 224 and the second opening 234. In this embodiment, the air intake assembly 2 can not only adjust the gas flow rate as needed, but also adjust the air outlet direction.

[0031] When the regulating hole 2321 is fully aligned with the guide section 223, the gas flow rate is at its maximum. The first opening 224 is partially blocked by the regulating pipe 23. At this time, the second opening 234 completely overlaps with the first opening 224 and becomes the gas outlet 25. The gas outlet 25 is inclined forward relative to the inlet and outlet 11. At this time, the gas outlet 25 is open to the outside of the support frame 1 and is also at its maximum, allowing the gas in the gas channel 22 to be quickly discharged. When the regulating hole 2321 is aligned with the guide part 223, the larger the area of ​​the regulating hole 2321 and the guide part 223, the smaller the area of ​​the first opening 224 blocked by the regulating tube 23. At this time, the area of ​​the regulating hole 2321 and the guide part 223 is proportional to the area of ​​the air outlet 25. The larger the area of ​​the regulating hole 2321 and the guide part 223, the larger the air outlet 25, and the greater the air flow rate. The air outlet direction of the air outlet 25 is inclined forward relative to the inlet and outlet 11 or parallel to the inlet and outlet 11.

[0032] See appendix Figure 4 As shown, the base plate 21 has an air supply port 2211 that communicates with the air intake channel 221, and gas enters the air intake channel 221 from the air supply port 2211. A pipe connector 2212 is connected to the air supply port 2211, and the pipe connector 2212 is connected to an external nitrogen supply device through a pipe, and nitrogen enters the gas channel 22 through the air supply port 2211.

[0033] The number of air supply ports 2211 is relatively small; for example, there are two air supply ports 2211 in the vertical direction. The regulating holes 2321 are evenly distributed in the vertical direction. At this time, the gas in the air intake channel 221 enters the air outlet channel 222 through the evenly distributed regulating holes 2321, making the gas in the air outlet channel 222 more uniform and the gas output from the air outlet 25 more uniform in the vertical direction, reducing the problem of high gas concentration near the air supply port 2211.

[0034] See appendix Figure 3 As shown, the buffer device 400 also includes an exhaust assembly 4, which includes an adapter 41 fixed to the rear plate 13 of the support frame 1. The adapter 41 and the rear plate 13 of the support frame 1 form an exhaust channel 411. The rear plate 13 has an exhaust port 131 that communicates with the exhaust channel 411. The exhaust channel 411 is connected to an air pump outside the buffer device 400 through an exhaust pipe 42. When the air pump is working, it can draw gas from the receiving cavity 15, draw the gas ejected from the air intake assembly 2 into the receiving cavity 15 and discharge it from the receiving cavity 15, allowing the gas to pass through the wafer 6 to purify the wafer 6.

[0035] In one embodiment, each adjustment hole 2321 includes a plurality of hole bodies evenly distributed along the circumference of the adjustment tube 23. The hole bodies can be round holes, square holes, diamond-shaped holes, etc., and the shape of the hole bodies is not limited. For example, there are three hole bodies, all of which are round holes, and the three hole bodies are the first hole 23211, the second hole 23212, and the third hole 23213.

[0036] When the cache device 400 does not contain wafer 6, refer to the attached document. Figure 7 and attached Figure 8 As shown, when the regulating pipe 23 is rotated to the position shown in the figure, the closed area 231 of the regulating pipe 23 seals the guide section 223, preventing gas from entering the outlet channel 222 from the inlet channel 221. At the same time, it can be seen that the first hole 23211, the second hole 23212, the third hole 23213, and the second opening 234 are all aligned with the side wall of the outlet channel 222. The first hole 23211, the second hole 23212, the third hole 23213, and the second opening 234 lose their connection with the outside. The guide area 233 seals the first opening 224. At this time, the regulating pipe 23 and the outlet channel 222 together form a closed space, which creates two seals on the path of gas flowing out of the inlet channel 221, reducing gas loss.

[0037] Before placing wafer 6 into the receiving cavity 15, gases with insufficient cleanliness in the gas channel 22 need to be expelled to avoid contaminating wafer 6 inside the receiving cavity 15. (See attached document) Figure 9 and attached Figure 10 As shown, when the regulating tube 23 is rotated to the position shown in the figure, it can be seen that the first hole 23211, the second hole 23212, and the third hole 23213 are all connected to the air inlet channel 221, and the second opening 234 completely coincides with the first opening 224. The air outlet 25 is the second opening 234. At this time, the air outlet 25 is at its maximum and the air outlet direction of the air outlet 25 is tilted forward. The gas with low purity in the gas channel 22 can quickly flow out to the front of the support frame 1 without contaminating the receiving cavity 15 of the support frame 1. An air intake 101 is provided at the bottom of the frame 100. The gas discharged from the gas channel 22 will be sucked away by the air intake 101 and will not enter the receiving cavity 15.

[0038] After the gas with low purity in the intake passage 221 is discharged, there is no need for a large displacement to quickly exhaust the gas. Therefore, rotate the regulating pipe 23 so that the regulating hole 2321 and the guide part 223 partially overlap. The gas flow rate of the exhaust opening 25 is adjusted by adjusting the overlapping area of ​​the regulating hole 2321 and the guide part 223.

[0039] For example, when a large amount of nitrogen is needed to quickly purge the existing gas in the cavity 15, the regulating tube 23 can be directly rotated to the adjacent position. Figure 13 and attached Figure 14At the indicated position, the first hole 23211 and the second hole 23212 of the regulating pipe 23 are connected to the air intake channel 221. At this time, the second opening 234 and the first opening 224 completely overlap, and the air outlet 25 is the second opening 234. The air outlet 25 is oriented towards the inlet / outlet 11 of the support frame and is tilted forward. The opening of the air outlet 25 is at its maximum, and a large amount of nitrogen can be discharged from the regulating pipe 23 to the inlet / outlet 11 of the support frame 1. The nitrogen can cover a large area in the left and right directions of the inlet / outlet 11 of the support frame 1. The exhaust pipe 42 sucks away the gas with low purity in the receiving cavity 15, and the large amount of nitrogen at the inlet / outlet 11 can quickly fill the receiving cavity 15. When the receiving cavity 15 of the support frame is full of nitrogen, the robot arm 300 places the wafer 6 to be cleaned into the receiving cavity 15. In this state, the angle of inclination of the air outlet 25 towards the left and right directions is smaller than the angle of inclination of the air outlet 25 towards the left and right directions when the adjustment hole 2321 and the guide part 223 are fully aligned.

[0040] Since the cavity 15 is already filled with nitrogen, only a portion of the nitrogen will leak out during the handling process by the robotic arm 300 due to the open support frame 1. Therefore, there is no need to quickly replenish the nitrogen. At this time, the intake speed of the exhaust pipe 42 can be reduced, and the nitrogen demand can be reduced. This can be achieved by rotating the regulating pipe 23 to the attached position. Figure 11 and attached Figure 12 The location shown is in Figure 12 As can be seen from the position, only the first hole 23211 is connected to the air inlet channel 221. The second hole 23212 and the third hole 23213 are rotated to the side wall of the air outlet channel 222 and are closed. The guide area 233 partially blocks the first opening 224. The second opening 234 only partially overlaps with the first opening 224. The air outlet 25 is smaller than the second opening 234. The air outlet 25 is directly opposite the left and right ends of the inlet and outlet 11. The air outlet direction of the air outlet 25 is along the left and right direction. The nitrogen in the air inlet channel 221 enters the air outlet channel 222 through the first hole 23211 in sequence, and then passes through the smaller air outlet 25. This ensures that the small amount of nitrogen ejected from the air outlet 25 has a certain ejection pressure. The nitrogen can cover a large area of ​​the inlet and outlet 11 in the left and right direction, reducing the amount of air mixed into the receiving cavity 15 of the support frame from the middle area of ​​the inlet and outlet 11.

[0041] The regulating hole 2321 can also be an oblong hole extending circumferentially along the regulating tube 23. In this case, it is not necessary to set multiple hole bodies. Since it is an oblong hole, rotating the regulating tube 23 can steplessly adjust the size of the area where the oblong hole communicates with the guide portion 223. For example, when the oblong hole is rotated to the side wall position of the air outlet channel 222, the oblong hole loses communication with the outside, and the closed area 231 closes the guide portion 223. When the regulating tube 23 is rotated, the oblong hole is fully or mostly connected to the guide portion 223, and unclean gas can be quickly discharged to the outside of the support frame 1. When the regulating tube 23 is rotated to the point where most of the oblong hole is blocked and a small part is connected to the guide portion 223, a small amount of nitrogen gas sprayed from the air intake component 2 can replenish the nitrogen gas lost from the receiving cavity 15. When the regulating tube 23 is rotated to the point where a small part of the oblong hole is blocked and most of it is connected to the guide portion 223, a large amount of nitrogen gas sprayed out can quickly discharge unclean gas in the receiving cavity 15, protecting and cleaning the wafer 6.

[0042] In this embodiment, the larger the alignment area between the adjusting hole 2321 and the guiding part 223, the greater the air flow rate of the air outlet 25. At this time, the greater the forward tilt angle of the air outlet 25 relative to the left and right directions. Thus, the smaller the air flow rate of the air outlet 25, the closer the air outlet 25 is to the inlet and outlet 11, and the faster it can be drawn into the receiving cavity 15 by the exhaust assembly 4.

[0043] In one embodiment, see Appendix Figure 6 As shown, the flow guiding area 233 also includes an arc-shaped guide portion 2341 located at the second opening 234. The arc-shaped guide portion 2341 guides the ejected gas, allowing the gas to flow along the direction of the arc-shaped guide portion 2341. On the other hand, the arc-shaped guide portion 2341 also acts as a limit. When the closed area 231 closes the conduction portion 223 and the adjustment hole 2321 is fully aligned with the conduction portion 223, the arc-shaped guide portion 2341 abuts against the two side walls of the first opening 224 respectively. The arc-shaped guide portion 2341 limits the rotation angle of the adjustment tube 23, allowing the adjustment tube 23 to rotate only within a specified angle to meet the gas adjustment requirements.

[0044] See appendix Figure 3 As shown, the intake assembly 2 also includes a rotary drive 24, which is fixed on the base plate 21 and used to drive the regulating pipe 23 to rotate. For example, the rotary drive 24 is a motor, which is fixed to the lower end of the base plate 21. When the rotating shaft of the motor rotates, it drives the regulating pipe 23 to rotate around its own axis.

[0045] The buffer device 400 also includes an oxygen sensor 3 located within the support frame 1. The oxygen sensor 3 is situated in the rear region of the support frame 1 and is used to collect the oxygen content within the support frame 1. Because the rear region of the support frame 1 has the least amount of nitrogen, the nitrogen content there is sufficient, and the nitrogen content in other regions will inevitably meet the purification requirements. Therefore, by placing the oxygen sensor 3 in the rear region, when the oxygen sensor 3 detects a high oxygen concentration, it indicates that the nitrogen is insufficient and a large amount of nitrogen needs to be added.

[0046] The rotary drive component 24 is linked to the oxygen sensor 3. When the oxygen concentration is high, it indicates that a large amount of air has entered the receiving cavity 15 of the support frame. At this time, the controller controls the motor to rotate the regulating tube 23 to the adjacent position. Figure 14 The indicated position allows for the supply of a larger amount of nitrogen to the receiving cavity 15 of the support frame 1; when the oxygen concentration is too low, it indicates that excessive nitrogen is being supplied, resulting in a waste of expensive nitrogen. The controller then controls the motor to rotate the regulating tube 23 to the position indicated by the position. Figure 12 At the location shown, a small amount of nitrogen can be used to appropriately replenish the nitrogen lost from the receiving cavity 15 of the support frame 1.

[0047] See appendix Figure 2 As shown, the support frame 1 is connected to the connecting plate 52 via the bracket 51. The connecting plate 52 is connected to the frame 100. The bracket 51 raises the height of the support frame. The support frame 1 can be fixed at a certain height above the ground. The height of the support frame 1 makes it convenient for the robot arm 300 to pick up and put down the wafer 6.

[0048] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A device front-end module, characterized in that: The device includes a frame and a wafer loading device that docks with the frame. A robotic arm and a buffer device are disposed within the frame. The buffer device includes a support frame with an inlet / outlet at the front. Air intake components capable of ejecting gas into the support frame are disposed on the left and right sides of the inlet / outlet. The air intake components include: Seat plate, the seat plate being fixed to the outside of the side plate of the support frame; A gas channel is provided on the base plate. The gas channel includes a vertically arranged inlet channel, an outlet channel, a guide section, and a first opening. The guide section connects the inlet channel and the outlet channel. The first opening connects to the outlet channel and is located in front of the inlet and outlet. The regulating pipe rotates within the air outlet channel. The regulating pipe includes a closed area, an regulating area, a guide area, and a second opening arranged sequentially along the circumference. An regulating hole is provided on the regulating area. When the adjustment area rotates to the guide section, the second opening rotates to the first opening, and the adjustment hole adjusts the air flow rate at the first opening by changing the alignment area with the guide section; when the closing area closes the guide section, the flow guiding area closes the first opening. The angle between the vertical plane where the first opening is located and the vertical plane where the inlet and outlet are located is not less than 90°. The width of the second opening is less than the width of the first opening. The overlapping area of ​​the first opening and the second opening forms an air outlet. When the regulating pipe is rotated, the air outlet direction of the air outlet can be adjusted. When the adjusting hole is fully aligned with the conductive part, the first opening is partially blocked and the second opening serves as the air outlet. The air outlet direction is tilted forward relative to the inlet and outlet. When the adjusting hole is partially aligned with the conductive part, the air outlet direction is tilted forward relative to the inlet and outlet or parallel to the inlet and outlet. The larger the area of ​​the adjustment hole and the conductive part, the wider the air outlet, and the greater the tilt angle of the air outlet direction forward relative to the left and right directions. Before the wafer is placed into the housing cavity, the adjustment hole and the conductive part are fully aligned, the gas outlet is the second opening, and the gas outlet direction is tilted forward. When a large amount of nitrogen is required in the housing cavity, the adjustment hole and the conductive part are partially aligned, and the gas outlet is the second opening. At this time, the gas outlet direction is tilted forward, and the tilt angle is smaller than before the wafer is placed into the housing cavity. When the housing cavity is already filled with nitrogen, the adjustment hole and the conductive part are partially aligned, and the alignment area is smaller than when a large amount of nitrogen is required in the housing cavity. The gas outlet is smaller than the second opening, and the gas outlet direction is along the left and right direction.

2. The device front-end module according to claim 1, characterized in that: The flow guiding area also includes an arc-shaped guide portion located at the second opening. When the closed area closes the guiding portion and the adjusting hole is fully aligned with the guiding portion, the arc-shaped guide portion abuts against the two side walls of the first opening.

3. The device front-end module according to claim 1, characterized in that: The adjustment holes are evenly arranged in the vertical direction, and each adjustment hole includes multiple hole bodies evenly distributed along the circumference of the adjustment tube.

4. The device front-end module according to claim 1, characterized in that: The adjustment holes are evenly arranged in the vertical direction, and the adjustment holes are waist-shaped holes extending circumferentially along the adjustment tube.

5. The device front-end module according to claim 1, characterized in that: The intake assembly also includes a rotary drive component, which is fixed to the base plate and used to drive the regulating pipe to rotate.

6. The device front-end module according to claim 5, characterized in that: The buffer device also includes an oxygen sensor located within the support frame, in the rear region of the support frame. The oxygen sensor is used to collect the oxygen content within the support frame, and the rotary drive is linked to the oxygen sensor.

7. The device front-end module according to claim 1, characterized in that: The base plate has an air supply port that is connected to the air intake channel, and the gas enters the air intake channel from the air supply port.

8. The device front-end module according to any one of claims 1-7, characterized in that: The buffer device further includes an exhaust assembly, which includes an adapter fixed to the rear plate of the support frame. The adapter and the rear plate of the support frame form an exhaust channel, and the rear plate has an exhaust port that communicates with the exhaust channel.

9. The device front-end module according to claim 8, characterized in that: An air intake is provided at the bottom of the frame.

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