Power module and electronic device

Abstract

The application relates to the technical field of semiconductor devices, in particular to a power module and electronic equipment, wherein the power module comprises a substrate, a circuit carrier, a power device, a first power terminal, a second power terminal and a plastic package. The first power terminal is electrically connected with the power device through a first electrode. The second power terminal is electrically connected with the power device through a second electrode. Since the first power terminal and the second power terminal adopt a laminated design form, the path of the current loop is greatly shortened by means of a first bending part and a second bending part, thereby the loop inductance can be greatly reduced, so that the electrical performance of the power module is guaranteed, the voltage peak generated in the switching process is reduced, and the reliability and service life of the power device are improved. The plastic package plays a role in isolating the first power terminal and the second power terminal, the insulation effect is better, the supporting effect is better, the insulation effect is not easy to fail, and the reliability is higher.

Description

Technical Field

[0001] This application relates to the field of semiconductor devices, and in particular to a power module and electronic device. Background Technology

[0002] A power module is a power semiconductor integrated device that integrates one or more power devices (such as switching transistors and diodes) with drive circuits, protection circuits, heat dissipation substrates, etc. through packaging technology to form a standardized and modular unit for realizing the conversion and control of electrical energy.

[0003] The power terminals of existing power modules are located in the same plane and interconnected by wire bonding or metal blocks.

[0004] The existing technical solutions described above have the following drawbacks: When the power terminals of the power module are arranged in the same plane, a loop path will be formed between the power terminals when the current flows. The larger the area of ​​this loop path, the larger the loop inductance. In addition, the arrangement in the same plane may cause current paths to intersect, further increasing the loop inductance. As an important parameter, loop inductance directly affects the electrical performance of the power module. Summary of the Invention

[0005] To reduce loop inductance, this application provides a power module and electronic device.

[0006] The primary objective of this application is to provide a power module that reduces loop inductance, employing the following technical solution: A power module, comprising: substrate; A circuit carrier is mounted on a substrate; a first electrode and a second electrode are formed on the circuit carrier. The power device is mounted on the circuit carrier and connected to the first electrode and the second electrode, respectively. The first power terminal is bent at both ends to form a first bent portion at each end; the first bent portion at each end is connected to the first electrode at the corresponding end, and a accommodating cavity is formed between the middle portion and the circuit carrier. The second power terminal has one end bent to form a second bend at one end; the second bend extends into the receiving cavity and is connected to the second electrode. A plastic encapsulation is applied to the circuit carrier, the first power terminal, and the second power terminal to isolate the first power terminal and the second power terminal.

[0007] By adopting the above technical solution, the substrate is used to dissipate heat from the circuit carrier and power devices, avoiding excessive local temperature rise and extending the service life of the power module. The first power terminal is electrically connected to the power device through the first electrode, and the second power terminal is electrically connected to the power device through the second electrode. The first and second power terminals adopt a stacked design, which, with the help of the first and second bends, greatly shortens the current loop path, thereby significantly reducing the loop inductance. This ensures the electrical performance of the power module, helps reduce voltage spikes generated during switching, and improves the reliability and service life of the power devices. The encapsulation isolates the first and second power terminals. Compared with the use of insulating sheets for isolation, it has better insulation and support, is less prone to insulation failure, and has higher reliability.

[0008] This application further specifies that: the distance between the two opposite sides of the middle portion of the first power terminal is greater than or equal to the distance between the two opposite sides of either end; And / or, there are two second bends, arranged side by side; the distance between the opposite sides of the end of the second power terminal away from the first power terminal is greater than the distance between the opposite sides of any one of the second bends.

[0009] By adopting the above technical solution, when the middle part of the first power terminal and the end of the second power terminal that is far away from the first power terminal are relatively wide, it is beneficial to improve the current carrying capacity of the first power terminal and the second power terminal to reduce the return inductance, and also beneficial to increase the contact area when the first power terminal / second power terminal is connected to the external terminal, thereby improving the stability and convenience of the connection between the first power terminal / second power terminal and the external terminal.

[0010] This application further specifies that the bottom ends of the first bends at both ends are bent toward each other or backwards.

[0011] By adopting the above technical solution, on the one hand, the contact area when the first power terminal is connected to the circuit carrier is guaranteed, thereby improving the stability and reliability of the connection between the first power terminal and the circuit carrier; on the other hand, the current carrying capacity at the connection point is improved, thereby reducing the return inductance.

[0012] This application is further configured such that a through hole is formed on the first power terminal.

[0013] By adopting the above technical solution, the through hole facilitates the flow of the encapsulated material through the through hole into the receiving cavity, which can improve the insulation effect and ensure the encapsulation effect.

[0014] This application further specifies that a third electrode is formed on the circuit carrier; Also includes: The third power terminal is connected to the third electrode.

[0015] By adopting the above technical solution, the third power terminal facilitates the input and output of AC power.

[0016] This application is further configured such that: the top surface of the middle part of the first power terminal is higher than, lower than or flush with the top surface of the encapsulation in the vertical direction; And / or, the top surface of the end of the second power terminal away from the first power terminal is higher, lower, or flush with the top surface of the encapsulation in the vertical direction; And / or, the top surface of the third power terminal is higher, lower, or flush with the top surface of the encapsulation in the vertical direction.

[0017] By adopting the above technical solution, when the top surface of the middle part of the first power terminal, the top surface of the end of the second power terminal furthest from the first power terminal, and the top surface of the third power terminal are lower than or flush with the top surface of the encapsulation, it is beneficial to reasonably control the overall height of the power module. Conversely, when the top surface of the middle part of the first power terminal, the top surface of the end of the second power terminal furthest from the first power terminal, and the top surface of the third power terminal are higher than the top surface of the encapsulation, it is more conducive to connection with external terminals. Furthermore, different heights are suitable for different connection conditions.

[0018] This application is further configured such that: a first connection hole for connecting to a circuit carrier is formed on the second power terminal; And / or, a second connection hole for connection with the encapsulation is formed on the second power terminal; And / or, a third connection hole for connection with the circuit carrier is formed on the third power terminal; And / or, a fourth connection hole for connection with the encapsulation is formed on the third power terminal.

[0019] By adopting the above technical solution, the connection hole facilitates the connection between the second power terminal / third power terminal and the circuit carrier / encapsulation, thereby facilitating the replacement of the second power terminal / third power terminal.

[0020] This application further includes: There are two first connection pins, which are respectively located on the inner side of the first bend at both ends and can be connected to the first electrode. The second connection pin consists of two pins, which are respectively located on the outer side of the first bend at both ends and can be connected to the first electrode. There are two position adjustment mechanisms; one position adjustment mechanism is connected to one of the first connection pins and one of the second connection pins respectively, and is used to adjust the position of the corresponding first connection pin and the second connection pin; the other position adjustment mechanism is connected to another first connection pin and another second connection pin respectively, and is used to adjust the position of the corresponding first connection pin and the second connection pin.

[0021] By adopting the above technical solution, the vertical positions of the corresponding first and second connecting pins are first adjusted using two position adjustment mechanisms. Then, the lower-positioned first or second connecting pin is connected to the first electrode on the circuit carrier, so that the first bent portions at both ends are electrically connected to the corresponding first electrodes. In this way, the magnitude of the loop inductance can be controlled as needed.

[0022] This application further specifies that each position adjustment mechanism includes: The rocker arm has one end hinged to the top of the first connecting pin and the other end hinged to the top of the second connecting pin. Adjusting bolts are used to rotate the middle part of the connecting rod and the bottom end of the first bend.

[0023] By adopting the above technical solution, the rocker arm is rotated by the adjusting bolt, thereby moving the first connecting pin and the second connecting pin, and thus adjusting the position of the first connecting pin and the second connecting pin.

[0024] The second objective of this application is to provide an electronic device with low loop inductance, employing the following technical solution: An electronic device includes the power module described above.

[0025] In summary, the beneficial technical effects of this application are as follows: 1. Because the first and second power terminals adopt a stacked design, the current loop path is greatly shortened by the first and second bends, thereby significantly reducing the loop inductance. This ensures the electrical performance of the power module, helps reduce voltage spikes during switching, and improves the reliability and lifespan of the power devices. The plastic encapsulation isolates the first and second power terminals. Compared to using insulating sheets for isolation, it provides better insulation, better support, is less prone to insulation failure, and has higher reliability. 2. When the middle part of the first power terminal and the end of the second power terminal that is far from the first power terminal are relatively wide, it is beneficial to improve the current carrying capacity of the first power terminal and the second power terminal to reduce the return inductance, and it is also beneficial to increase the contact area when the first power terminal / second power terminal is connected to the external terminal, thereby improving the stability and convenience of connecting the first power terminal / second power terminal to the external terminal. 3. The through-hole on the first power terminal facilitates the flow of the encapsulant through the through-hole into the receiving cavity, which can improve the insulation effect and ensure the encapsulation effect. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of one embodiment of the power module; Figure 2 yes Figure 1 The exploded view of the power module shown; Figure 3 yes Figure 2 The diagram shows the combined structure of the first power terminal and the second power terminal in the power module. Figure 4 This is a schematic diagram of the structure of the first embodiment of the first power terminal; Figure 5 This is a schematic diagram of the structure of the second embodiment of the first power terminal; Figure 6 This is a structural schematic diagram of the third embodiment of the first power terminal; Figure 7 This is a schematic diagram of the structure of the fourth embodiment of the first power terminal; Figure 8 This is a schematic diagram of the structure of the fifth embodiment of the first power terminal; Figure 9 This is a schematic diagram of the structure of the sixth embodiment of the first power terminal; Figure 10 This is a schematic diagram of another embodiment of the power module; Figure 11 yes Figure 10 The exploded view of the power module is shown.

[0027] Reference numerals: 110, substrate; 120, circuit carrier; 130, power device; 140, first power terminal; 141, first bend; 142, through hole; 143, accommodating cavity; 150, second power terminal; 151, second bend; 152, first connecting hole; 153, second connecting hole; 160, encapsulation; 170, third power terminal; 171, third connecting hole; 172, fourth connecting hole; 181, first connecting pin; 182, second connecting pin; 190, position adjustment mechanism; 191, rocker arm; 192, adjusting bolt. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-11 This application will be described in further detail.

[0029] Reference Figure 1 , Figure 2 and Figure 3This application discloses a power module, including a substrate 110, a circuit carrier 120, a power device 130, a first power terminal 140, a second power terminal 150, and a molding compound 160. The circuit carrier 120 is mounted on the substrate 110. The substrate 110 is used to dissipate heat from the circuit carrier 120 and the power device 130, avoiding excessive local temperature rise and extending the service life of the power module. Heat dissipation fins can be provided on the bottom surface of the substrate 110 to further improve heat dissipation efficiency. A first electrode (not shown) and a second electrode (not shown) are formed on the circuit carrier 120. The power device 130 is mounted on the circuit carrier 120 and electrically connected to the first electrode and the second electrode, respectively. The opposite ends of the first power terminal 140 are bent to form first bent portions 141 at opposite ends of the first power terminal 140. The first bent portions 141 at both ends are electrically connected to the first electrode at the corresponding ends. The first power terminal 140 is electrically connected to the power device 130 through the first electrode. A cavity 143 is formed between the middle portion of the first power terminal 140 and the circuit carrier 120. One end of the second power terminal 150 is bent to form a second bend 151 at one end of the second power terminal 150. The second bend 151 extends into the cavity 143 and is electrically connected to the second electrode. The second power terminal 150 is electrically connected to the power device 130 through the second electrode. A molding compound 160 covers the circuit carrier 120, the first power terminal 140, and the second power terminal 150 to isolate the first power terminal 140 and the second power terminal 150. A clearance hole is formed in the molding compound 160 corresponding to the middle portion of the first power terminal 140 to facilitate connection between an external terminal and the first power terminal 140. The end of the second power terminal 150 away from the first power terminal 140 extends to the outside of the molding compound 160 to facilitate connection between an external terminal and the second power terminal 150. Because the first power terminal 140 and the second power terminal 150 adopt a stacked design, the current loop path is greatly shortened by the first bending portion 141 and the second bending portion 151, thereby significantly reducing the loop inductance. This ensures the electrical performance of the power module, helps reduce voltage spikes generated during switching, and improves the reliability and service life of the power device 130. The molding compound 160 isolates the first power terminal 140 and the second power terminal 150. Compared with the method of using an insulating sheet for isolation, it has better insulation effect, better support effect, is less prone to insulation failure, and has higher reliability.

[0030] In one embodiment, such as Figure 4 As shown, the distance between the two opposite sides of the middle portion of the first power terminal 140 is equal to the distance between the two opposite sides of either end. That is, the width of the middle portion of the first power terminal 140 is the same as the width of either end. This facilitates molding and processing.

[0031] In another embodiment, such as Figure 5 and Figure 6 As shown, the distance between the two opposite sides of the middle portion of the first power terminal 140 is greater than the distance between the two opposite sides of either end. That is, the width of the middle portion of the first power terminal 140 is greater than the width of either end. This not only improves the current-carrying capacity of the first power terminal 140, thus reducing the return inductance, but also increases the contact area when connecting the first power terminal 140 to external terminals, thereby improving the stability and convenience of connecting the first power terminal 140 to external terminals.

[0032] like Figure 3 As shown, there are two second bends 151 arranged side by side. The distance between the opposite sides of the end of the second power terminal 150 away from the first power terminal 140 is greater than the distance between the opposite sides of any one of the second bends 151. That is, the width of the end of the second power terminal 150 away from the first power terminal 140 is greater than the width of any one of the second bends 151. This not only helps to improve the current carrying capacity of the second power terminal 150 to reduce the return inductance, but also helps to increase the contact area when the second power terminal 150 is connected to the external terminal, thereby improving the stability and convenience of connecting the second power terminal 150 to the external terminal.

[0033] In one embodiment, such as Figure 4 As shown, the bottom ends of the first bending portions 141 at both ends are bent in the opposite direction, which ensures the contact area when the first power terminal 140 is connected to the circuit carrier 120, thereby improving the stability and reliability of the connection between the first power terminal 140 and the circuit carrier 120; on the other hand, it improves the current carrying capacity at the connection, thereby reducing the return inductance.

[0034] In another embodiment, such as Figure 8 As shown, the bottom ends of the first bends 141 at both ends are bent towards each other. This ensures the contact area when the first power terminal 140 is connected to the circuit carrier 120, thereby improving the stability and reliability of the connection between the first power terminal 140 and the circuit carrier 120; on the other hand, it increases the current carrying capacity at the connection point, thereby reducing the return inductance. At the same time, it further reduces the path of the return circuit.

[0035] like Figure 7 As shown, one or more through holes 142 are formed on the first power terminal 140, which facilitates the flow of the encapsulated body 160 through the through holes 142 to reach the receiving cavity 143, thereby improving the insulation effect and ensuring the encapsulation effect.

[0036] like Figure 1 and Figure 2As shown, a third electrode (not shown) is also formed on the circuit carrier 120. The power module also includes a third power terminal 170. The third power terminal 170 is electrically connected to the third electrode.

[0037] It should be noted that both the first power terminal 140 and the second power terminal 150 are DC power terminals. When the first power terminal 140 is used to connect to the DC positive electrode, the second power terminal 150 is used to connect to the DC negative electrode. Conversely, when the first power terminal 140 is used to connect to the DC negative electrode, the second power terminal 150 is used to connect to the DC positive electrode. The third power terminal 170 is an AC power terminal, facilitating the input and output of AC power.

[0038] Depending on the connection requirements, the top surface of the middle portion of the first power terminal 140 is vertically higher, lower, or flush with the top surface of the molding compound 160. And / or, the top surface of the end of the second power terminal 150 furthest from the first power terminal 140 is vertically higher, lower, or flush with the top surface of the molding compound 160. And / or, the top surface of the third power terminal 170 is vertically higher, lower, or flush with the top surface of the molding compound 160. When the top surface of the middle portion of the first power terminal 140, the top surface of the end of the second power terminal 150 furthest from the first power terminal 140, and the top surface of the third power terminal 170 are lower or flush with the top surface of the molding compound 160, it is beneficial to reasonably control the overall height of the power module. Conversely, when the top surface of the middle portion of the first power terminal 140, the top surface of the end of the second power terminal 150 furthest from the first power terminal 140, and the top surface of the third power terminal 170 are higher than the top surface of the molding compound 160, it is more conducive to connection with external terminals. At the same time, different heights are suitable for different connection conditions.

[0039] In one embodiment, such as Figure 1 and Figure 3As shown, the first power terminal 140 is non-detachably connected to the circuit carrier 120. The second power terminal 150 and the third power terminal 170 are detachably connected to the circuit carrier 120 and the substrate 110, facilitating their assembly and disassembly, and consequently, their replacement. The second power terminal 150 has a first connection hole 152 for connection to the circuit carrier 120. And / or, the second power terminal 150 has a second connection hole 153 for connection to the molding compound. And / or, the third power terminal 170 has a third connection hole 171 for connection to the circuit carrier 120. And / or, the third power terminal 170 has a fourth connection hole 172 for connection to the molding compound 160. The first connection hole 152 and the third connection hole 171 can be circular holes or oblong holes. The second connecting hole 153 and the fourth connecting hole 172 are round holes or semi-circular holes.

[0040] In another embodiment, the first power terminal 140, the second power terminal 150, and the third power terminal 170 are connected to the circuit carrier 120 in a non-detachable manner. This connection can be achieved using methods such as welding, sintering, laser welding, or ultrasonic welding. The second power terminal 150 and the third power terminal 170 are detachably connected to the substrate 110.

[0041] It should be noted that the power module can be any of MOS, IGBT, Diode, or GaN. The circuit carrier 120 is manufactured using processes such as direct sintering copper plating or active metal brazing.

[0042] Reference Figure 9The power module also includes two first connection pins 181, two second connection pins 182, and two position adjustment mechanisms 190. The two first connection pins 181 are respectively located inside the first bends 141 at both ends and can be connected to the first electrode. The two second connection pins 182 are respectively located outside the first bends 141 at both ends and can be connected to the first electrode. One position adjustment mechanism 190 is connected to one of the first connection pins 181 and one of the second connection pins 182, respectively, for adjusting the positions of the corresponding first connection pin 181 and second connection pin 182; the other position adjustment mechanism 190 is connected to the other first connection pin 181 and the other second connection pin 182, respectively, for adjusting the positions of the corresponding first connection pin 181 and second connection pin 182. First, the vertical positions of the corresponding first connecting pin 181 and second connecting pin 182 are adjusted using two position adjustment mechanisms 190. Then, the lower-positioned first connecting pin 181 or second connecting pin 182 is connected to the first electrode on the circuit carrier 120, so that the first bent portions 141 at both ends are electrically connected to the corresponding first electrodes. This allows control of the circuit inductance as needed. Each position adjustment mechanism 190 includes a rocker arm 191 and an adjusting bolt 192. One end of the rocker arm 191 is hinged to the top of the first connecting pin 181, and the other end is hinged to the top of the second connecting pin 182. The adjusting bolt 192 is used to rotate the middle of the rocker arm 191 and the bottom of the first bent portion 141. The adjusting bolt 192 drives the rocker arm 191 to rotate, thereby moving the first connecting pin 181 and second connecting pin 182 and adjusting their positions.

[0043] Reference Figure 10 and Figure 11 The top surface of the third power terminal 170 is higher than the top surface of the encapsulation 160 in the vertical direction. This makes it easier to connect to external terminals.

[0044] The implementation principle of this embodiment is as follows: The first power terminal 140 and the second power terminal 150 adopt a stacked design. With the help of the first bending portion 141 and the second bending portion 151, the current loop path is greatly shortened, thereby significantly reducing the loop inductance. This ensures the electrical performance of the power module, helps reduce voltage spikes generated during switching, and improves the reliability and service life of the power device 130. The molding compound 160 isolates the first power terminal 140 and the second power terminal 150. Compared with using an insulating sheet for isolation, it provides better insulation, better support, and is less prone to insulation failure, resulting in higher reliability.

[0045] This application also discloses an electronic device, including a power module.

[0046] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made to the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention. This application discloses a power module and a loading / unloading device.

Claims

1. A power module, characterized in that, include: substrate(110); A circuit carrier (120) is mounted on the substrate (110); a first electrode and a second electrode are formed on the circuit carrier (120); A power device (130) is mounted on the circuit carrier (120) and connected to the first electrode and the second electrode, respectively; The first power terminal (140) is bent at both ends to form a first bent portion (141) at each end; the first bent portion (141) at each end is connected to the first electrode at the corresponding end, and a receiving cavity (143) is formed between the middle part and the circuit carrier (120). The second power terminal (150) is bent at one end to form a second bend (151) at one end of the second power terminal (150); the second bend (151) extends into the receiving cavity (143) and is connected to the second electrode. A molding compound (160) is applied to the circuit carrier (120), the first power terminal (140), and the second power terminal (150) to isolate the first power terminal (140) and the second power terminal (150). There are two first connection pins (181), which are respectively located on the inner side of the first bent portion (141) at both ends and can be connected to the first electrode. There are two second connection pins (182), which are respectively located on the outside of the first bent portion (141) at both ends and can be connected to the first electrode. There are two position adjustment mechanisms (190); one of the position adjustment mechanisms (190) is connected to one of the first connection pins (181) and one of the second connection pins (182) respectively, and is used to adjust the position of the corresponding first connection pin (181) and second connection pin (182); the other position adjustment mechanism (190) is connected to another first connection pin (181) and another second connection pin (182) respectively, and is used to adjust the position of the corresponding first connection pin (181) and second connection pin (182); firstly, the two position adjustment mechanisms (190) are used to adjust the position of the corresponding first connection pin (181) and second connection pin (182) in the vertical direction, and then the lower first connection pin (181) or second connection pin (182) is connected to the first electrode on the circuit carrier (120) so that the first bending portion (141) at both ends is electrically connected to the first electrode at the corresponding end; Each of the position adjustment mechanisms (190) includes: The rocker arm (191) is hinged at one end to the top of the first connecting pin (181) and at the other end to the top of the second connecting pin (182). Adjusting bolt (192) is used to rotatably connect the middle part of the rocker arm (191) and the bottom end of the first bend (141).

2. The power module according to claim 1, characterized in that, The distance between the two opposite sides of the middle portion of the first power terminal (140) is greater than or equal to the distance between the two opposite sides of either end; And / or, there are two second bends (151), arranged side by side; the distance between the opposite sides of the end of the second power terminal (150) away from the first power terminal (140) is greater than the distance between the opposite sides of any one of the second bends (151).

3. The power module according to claim 1, characterized in that, A through hole (142) is formed on the first power terminal (140).

4. The power module according to claim 1, characterized in that, A third electrode is also formed on the circuit carrier (120); Also includes: The third power terminal (170) is connected to the third electrode.

5. The power module according to claim 4, characterized in that, The top surface of the middle portion of the first power terminal (140) is higher, lower, or flush with the top surface of the encapsulation (160) in the vertical direction; And / or, the top surface of the end of the second power terminal (150) away from the first power terminal (140) is higher, lower or flush with the top surface of the encapsulation (160) in the vertical direction; And / or, the top surface of the third power terminal (170) is higher, lower, or flush with the top surface of the encapsulation (160) in the vertical direction.

6. The power module according to claim 4, characterized in that, The second power terminal (150) has a first connection hole (152) for connecting to the circuit carrier (120); And / or, a second connection hole (153) is formed on the second power terminal (150) for connection with the encapsulation body (160); And / or, a third connection hole (171) for connecting to the circuit carrier (120) is formed on the third power terminal (170); And / or, a fourth connection hole (172) is formed on the third power terminal (170) for connection with the encapsulation body (160).

7. An electronic device, characterized in that, Includes the power module as described in any one of claims 1 to 6.

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